Inventor profile of:

Lars Kohlmann

City:

Berlin

Country:

Germany

Published Applications:

15

Last publication date:

2025-01-30

Top Assignees for applications by Lars Kohlmann

The entities that hold a legal rights for patent applications filed by inventor Kohlmann Lars:

Recent patent applications by Kohlmann Lars

Lars Kohlmann from Berlin, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-01-30
US20250034718A1
Chemistry; metallurgy

USE OF AN AQUEOUS ALKALINE COMPOSITION FOR THE ELECTROLESS DEPOSITION OF A METAL OR METAL ALLOY ON A METAL SURFACE OF A SUBSTRATE

#2 | 2023-07-13
US20230220558A1
Chemistry; metallurgy

AN AQUEOUS BASIC ETCHING COMPOSITION FOR THE TREATMENT OF SURFACES OF METAL SUBSTRATES

#3 | 2020-07-23
US20200231565A1
Chemistry; metallurgy

Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths

#4 | 2019-05-16
US20190144667A1
Chemistry; metallurgy

Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions

#5 | 2018-08-09
US20180223442A1
Chemistry; metallurgy

Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate

#6 | 2017-11-16
US20170327954A1
Chemistry; metallurgy

Plating bath compositions for electroless plating of metals and metal alloys

#7 | 2017-10-17
US15666649
Chemistry; metallurgy

3-(carbamoyl) pyridinium-1-YL-propane-1-sulfonates useful in electroplating baths

#8 | 2016-02-25
US20160053395A1
Chemistry; metallurgy

Galvanic nickel electroplating bath for depositing a semi-bright nickel

#9 | 2015-10-22
US20150299883A1
Chemistry; metallurgy

Copper plating bath composition

#10 | 2014-05-08
US20140124376A1
Chemistry; metallurgy

Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloys

#11 | 2012-06-28
US20120160698A1
Chemistry; metallurgy

Polymers having terminal amino groups and use thereof as additives for zinc and zinc alloy electrodeposition baths

#12 | 2010-12-30
US20100326838A1
Chemistry; metallurgy

PYROPHOSPHATE-CONTAINING BATH FOR CYANIDE-FREE DEPOSITION OF COPPER-TIN ALLOYS

#13 | 2010-12-02
US20100300890A1
Chemistry; metallurgy

Pyrophosphate-based bath for plating of tin alloy layers

#14 | 2010-09-23
US20100236936A1
Chemistry; metallurgy

Aqueous,alkaline,cyanide-free bath for the galvanic deposition of zinc and zinc alloy coatings

#15 | 2010-06-24
US20100155257A1
Chemistry; metallurgy

Aqueous, alkaline, cyanide-free bath for the galvanic deposition of zinc alloy coatings

InventorID:

750368 ⎘