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Inventor profile of:

Philipp LECHNER

City:

München

Country:

Germany

Published Applications:

1

Last publication date:

2025-10-02

Recent patent applications by LECHNER Philipp

Philipp LECHNER from München, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-10-02

US20250303464A1

Performing operations; transporting

METHOD AND DEVICE FOR MOLDING A HARDENABLE MOLDING COMPOUND

InventorID:

7585919 ⎘