Eagle, Idaho
United States
9
2013-02-14
The entities that hold a legal rights for patent applications filed by inventor Hiatt Mark:
Mark Hiatt from Eagle, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Signal delivery in stacked device
#2 | 2011-09-29Through-wafer interconnects for photoimager and memory wafers
#3 | 2011-08-25Semiconductor substrates comprising through substrate interconnects that are visible on the substrate backside
#4 | 2010-07-08Through-wafer interconnects for photoimager and memory wafers
#5 | 2010-03-11Signal delivery in stacked device
#6 | 2008-05-15Through-wafer interconnects for photoimager and memory wafers
#7 | 2007-11-22Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices
#8 | 2006-03-02Through-wafer interconnects for photoimager and memory wafers
#9 | 2005-04-19Configuration and a method for reducing contamination with particles on a substrate in a process tool
82671 ⎘