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Inventor profile of:

Daisuke Ejima

City:

Kanagawa

Country:

Japan

Published Applications:

7

Last publication date:

2014-11-27

Top Assignees for applications by Daisuke Ejima

The entities that hold a legal rights for patent applications filed by inventor Ejima Daisuke:

Ajinomoto Co., Inc. 3 Tokyo, Japan
NEC ELECTRONICS CORPORATION 2 Kanagawa, Japan
NED ELECTRONICS CORPORATION 1 Kawasaki, Japan
NEC Electronics Corporation 1 Kawasaki, Japan

Recent patent applications by Ejima Daisuke

Daisuke Ejima from Kanagawa, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-11-27

US20140349371A1

Chemistry; metallurgy

Protein Refolding Method

#2 | 2012-06-07

US20120142901A1

Chemistry; metallurgy

Purification method which prevents denaturation of an antibody

#3 | 2008-10-23

US20080258317A1

Semiconductor device

#4 | 2007-12-06

US20070278677A1

Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of passive element device

#5 | 2007-10-25

US20070246818A1

Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of electronic device containing additional metal powder component

#6 | 2007-07-19

US20070164445A1

Substrate and semiconductor device

#7 | 2005-08-11

US20050176109A1

Chemistry; metallurgy

Purification method which prevents denaturation of an antibody

InventorID:

983328 ⎘