Magnetic reader having a nonmagnetic insertion layer for the pinning layer

Description

BACKGROUND

FIG. 1 depicts an air-bearing surface (ABS) view of a conventional read transducer used in magnetic recording technology applications. The conventional read transducer 10 includes shields 12 and 18, insulator 14, magnetic bias structures 16, and sensor 20. The read sensor 20 is typically a giant magnetoresistive (GMR) sensor or tunneling magnetoresistive (TMR) sensor. The read sensor 20 includes an antiferromagnetic (AFM) layer 22, a pinned layer 24, a nonmagnetic spacer layer 26, and a free layer 28. Also shown is a capping layer 30. In addition, seed layer(s) may be used. The free layer 28 has a magnetization sensitive to an external magnetic field. Thus, the free layer 28 functions as a sensor layer for the magnetoresistive sensor 20. If the sensor 20 is to be used in a current perpendicular to plane (CPP) configuration, then current is driven in a direction substantially perpendicular to the plane of the layers 22, 24, 26, and 28. Conversely, in a current-in-plane (CIP) configuration, then conductive leads (not shown) would be provided on the magnetic bias structures 16. The magnetic bias structures 16 are used to magnetically bias the free layer 28. The pinned layer 26 adjoins, or shares an interface, with the AFM layer 22. This allows for the pinned layer 26 magnetic moment to be exchange coupled with the magnetic moments AFM layer 22. Consequently, the pinned layer magnetic moment is fixed, or pinned, using the AFM layer 22.

Although the conventional transducer 10 functions, there are drawbacks. In particular, the read sensor 20 may be subject to noise. For example, there may be instabilities in the orientation of the pinned layer magnetic moment with respect to the free layer magnetic moment. The conventional read sensor 20 may not thus adequately read high density media.

BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 depicts an ABS view of a conventional magnetic recording read transducer.

FIGS. 2A-2B depict side and ABS views of an exemplary embodiment of a portion of a magnetic read apparatus.

FIG. 3A-3B are graphs depicting the magnetic moment versus field and the ratio of the exchange field to the coercivity of the pinned layer versus thickness of the magnetic insertion layer.

FIG. 4 depicts another exemplary embodiment of a portion of a magnetic read sensor.

FIG. 5 depicts another exemplary embodiment of a portion of a magnetic read sensor.

FIG. 6 depicts another exemplary embodiment of a portion of a magnetic read sensor.

FIG. 7 is flow chart depicting an exemplary embodiment of a method for providing a magnetic recording read apparatus.

FIG. 8 is flow chart depicting another exemplary embodiment of a method for providing a magnetic recording read transducer.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIGS. 2A-2B depict side and ABS views of an exemplary embodiment of a portion of a magnetic recording apparatus 100. For clarity, FIGS. 2A-2B are not to scale. Further, only a portion of the components of the magnetic apparatus 100 are depicted. The magnetic recording apparatus 100 depicted is a disk drive including media 101 and a slider 102 having a writer 104 and a read transducer 110 fabricated thereon. The write transducer 104 includes at least a write pole 106 and coil(s) 108 for energizing the pole 106. The write transducer 104 may be a perpendicular magnetic recording (PMR) writer, a heat assisted magnetic recording (HAMR) writer or another writer. In other embodiments, the write transducer 104 might be omitted.

The read transducer 110 includes a read sensor 120 and may include soft magnetic shields 112 and 114. The shields 112 and 114 may be formed of NiFe or another soft magnetic material. The read transducer 110 may also include insulating layer 116 and magnetic bias structures 118. The insulating layer 116 separates the magnetic bias structures 118 from the read sensor 120 and, in the embodiment shown, from the shield 112. The magnetic bias structures 118 may be soft magnetic bias structures, hard magnetic bias structures and/or other magnetic bias structures. In other embodiments, other structures may be included and/or structures 112, 114, 116 and/or 118 may be omitted.

The read sensor 120 includes at least a pinning layer 130, a nonmagnetic insertion layer 140 and a pinned layer 150. In the embodiment shown, the read sensor 120 also includes a nonmagnetic spacer layer 160 and a free layer 170. The nonmagnetic spacer layer may be a conductor, such as Cu, or an insulating tunneling barrier layer, such as crystalline MgO. Thus, the sensor 120 may be a GMR sensor or a TMR sensor.

The pinning layer 130 is used to fix, or pin, the magnetic moment of the pinned layer 150. The pinning layer 130 may thus be an antiferromagnetic (AFM) layer 130. For example, the pinning layer 130 might be an IrMn layer, a PtMn layer, an FeMn layer or an analogous structure. The pinned layer 150 is ferromagnetic and may include sublayers that are magnetic and/or nonmagnetic. Note that in some embodiments, a nonmagnetic layer (not shown) and a ferromagnetic layer (not shown) may be between the pinned layer 150 and the nonmagnetic spacer layer 160. In some such embodiments, the magnetic moments of the pinned layer 150 and the additional ferromagnetic layer may be antiferromagnetically coupled through the nonmagnetic layer. Thus, the pinned layer 150 may be part of a structure such as a synthetic antiferromagnetic (SAF) structure.

The nonmagnetic insertion layer 140 has a location selected from a first location and a second location. The first location, shown in the embodiment depicted in FIG. 2B, is between the pinning layer 130 and the pinned layer 150. In some embodiments, the nonmagnetic insertion layer 140 adjoins both the pinning layer 130 and the pinned layer 150. Thus, the nonmagnetic insertion layer 140 may share one interface with the pinning layer 130 and the opposite interface with the pinned layer 150. The second location is within the pinning layer 130. In an alternate embodiment, multiple nonmagnetic insertion layers could be included. In such an embodiment, one insertion layer would be in the first location (between the layers 130 and 150) and another insertion layer would be in the second location (within the layer 150). In some embodiments, the nonmagnetic insertion layer 140 includes at least one of Ag, Mg, Mn, Ir, Pt, Cr, Ti, Si, C, Al, Ru and Au. In some such embodiments, the nonmagnetic insertion layer 140 consists of Ag, Mg, Mn, Ir, Pt, Cr, Ti, Si, C, Al, Ru and/or Au. The nonmagnetic insertion layer 140 may also be desired to be thin. In some embodiments, therefore, the thickness of the nonmagnetic insertion layer 140 may be at least one Angstrom and not more than five Angstroms in some embodiments. For example, the thickness of the nonmagnetic insertion layer 140 may be at least one Angstroms and not more than three Angstroms. The nonmagnetic insertion layer 140 may thus be a dusting layer. In some embodiments, the nonmagnetic insertion layer 140 may be discontinuous.

The nonmagnetic insertion layer 140 is configured to affect the magnetic coupling between the pinning layer 130 and the pinned layer 150. This effect may be seen in FIGS. 3A-3B. FIGS. 3A and 3B are graphs 200 and 210, respectively, depicting the magnetic moment versus field for the pinned layer 150 and the ratio of the exchange field to the coercivity versus the thickness of the insertion layer 140. FIGS. 3A-3B are not to scale and are for explanatory purposes only. Thus, actual data is not meant to be represented in the graphs 200 and 210.

As can be seen in FIG. 3A, the magnetic moment of the pinned layer 150 exhibits a hysteresis loop 202 with respect to magnetic field. The hysteresis loop 202 is shifted from being centered at a zero applied magnetic field because of the magnetic coupling between the pinning layer 130 and the pinned layer 150. The shift in the center of the hysteresis loop is the exchange field, Hex, due to the coupling between the pinning layer 130 and the pinned layer 150. The coercivity, Hcp, relates to the applied field which will cause the magnetic moment of the pinned layer 150 to go to zero as part of a transition from a positive moment to a negative moment or vice versa. Because the hysteresis loop is shifted, the coercivity is based on the width of the loop (2*Hcp=width of loop). The coercivity is a measure of the fraction of unstable grains in the pinning layer 130.

The ratio of the exchange field to the coercivity (Hex/Hcp) may be considered both a measure of the strength and stability of the magnetic coupling between the pinning layer 130 and the pinned layer 150 and a measure of the fraction of unstable grains in the pinning layer 130. As can be seen in the graph 210 of FIG. 3B, the use of the nonmagnetic insertion layer 140 changes this ratio. Curves 212, 214 and 216 depict the ratio Hex/Hcp versus insertion layer thickness for various materials. Note that a zero thickness for the nonmagnetic insertion layer 140 means that no nonmagnetic insertion material is present. Thus, the curves 212, 214 and 216 meet at a zero insertion layer thickness. Curve 212 is the generally expected result of adding the nonmagnetic insertion layer 140, particularly between the pinned layer 150 and the pinning layer 130. For the material corresponding to the curve 212, the presence of any nonmagnetic material reduces the exchange coupling. Such a curve is typical for the insertion of a nonmagnetic material between the layers 130 and 150. Thus, for most materials, the relationship between insertion layer thickness and Hex/Hcp would follow the curve 212. Curves 214 and 216, in contrast, indicate that the ratio of Hex to Hcp may actually increase for small thicknesses of certain materials. For some such materials, the exchange field may increase for small thicknesses (e.g. less than ten Angstroms) while the coercivity decreases or remains constant. Alternatively, the coercivity may decrease and the exchange field may be constant for the small thicknesses. Other combinations of possibilities result in a maximum in Hex/Hcp that occurs at a nonzero thickness of the nonmagnetic insertion layer 140. Thus, for appropriate selection of materials and location, Hex/Hcp increases or remains constant for nonzero insertion layer thicknesses. Materials such as Ag, Mg, Mn, Ir, Pt, Cr, Ti, Si, C, Al, Ru and/or Au used as the insertion layer allow for an increase (or constant) Hex/Hcp for the pinned layer 150 and pinning layer 130 at small thicknesses of nonmagnetic insertion layer. For larger thicknesses of the nonmagnetic insertion layer 140, the magnetic coupling between the layers 130 and 150 decreases. Thus, the nonmagnetic insertion layer 140 is configured such that the Hex/Hcp for the pinned layer 150 has a maximum for a nonzero thickness of the insertion layer 140. Stated differently, the nonmagnetic insertion layer 140 is configured such that Hex/Hcp increases or remains constant for some small thicknesses of the nonmagnetic insertion layer 140.

It is believed that the nonmagnetic insertion layer 140 operates in the following manner. However, the benefits and use of the magnetic devices described herein are independent of a particular physical mechanism. Because the nonmagnetic insertion layer 140 is thin and may be made of particular materials, it is believed that the materials in the nonmagnetic insertion layer 140 migrate to the grain boundaries of the grains of the pinning layer 140 during fabrication. Thus, although depicted as a single layer, the nonmagnetic insertion layer 140 may be discontinuous or reside only in certain areas (e.g. grain boundaries at and near the interface of the pinning layer 130. The presence of the nonmagnetic insertion layer 140 at the grain boundaries of smaller, less stable grains may decouple these grains from the pinned layer 150. Thus, if the magnetic moment of the pinned layer 150 switches direction, the less stable grains of the pinning layer 130 may be less likely to change direction. Thus, these less stable grains are thus less likely to provide a magnetic bias in a direction opposite to the desired direction of magnetization. The pinned layer 150 magnetic moment may more readily return to the desired direction. The coercivity of the pinned layer 150 may thus be reduced. The stability of the magnetic moment of the pinned layer 150 may be enhanced. Stated differently, the coupling between the pinning layer 130 and the pinned layer 150 that pins the magnetic moment of the pinned layer 150 in the desired direction may be improved.

Regardless of the physical mechanism, the ratio of the exchange field and the coercivity may be improved. Consequently, the stability of the coupling between the pinned layer 150 and the pinning layer 130 may be enhanced. Noise due to instabilities in the magnetic moment of the pinned layer 130 may thus be removed. Performance of the magnetic device may thereby be improved.

FIG. 4 depicts another embodiment of a magnetic read sensor 120′. For clarity, FIG. 4 is not to scale. The read sensor 120′ may be part of a read transducer and/or magnetic recording apparatus such as the read transducer 110 and magnetic recording apparatus 100. The transducer of which the read sensor 120′ may be a part is part of a disk drive having a media, a slider and the head coupled with the slider. The read sensor 120′ corresponds to the read sensor 120. Consequently, analogous components are labeled similarly. For example, the read sensor 120′ includes a pinning/AFM layer 130, a nonmagnetic insertion layer 140′, a pinned layer 150, a nonmagnetic spacer or tunneling barrier layer 160 and a free layer 170 that are analogous to the a pinning/AFM layer 130, the nonmagnetic insertion layer 140, the pinned layer 150, the nonmagnetic spacer or tunneling barrier layer 160 and the free layer 170 that are part of the read sensor 120 and thus part of the magnetic recording apparatus 100. Thus, the components 120′, 130, 140′, 150, 160 and 170 have a similar structure and function to the components 120, 130, 140, 150, 160 and 170, respectively, depicted in FIGS. 2A-2B. Thus, the nonmagnetic insertion layer 140′ is configured such that Hex/Hcp increases or remains constant for some small thicknesses of the nonmagnetic insertion layer 140′. In some embodiments, the nonmagnetic insertion layer 140′ includes at least one of Ag, Mg, Mn, Ir, Pt, Cr, Ti, Si, C, Al, Ru and Au. In some such embodiments, the nonmagnetic insertion layer 140′ consists of Ag, Mg, Mn, Ir, Pt, Cr, Ti, Si, C, Al, Ru and/or Au. The nonmagnetic insertion layer 140′ may also be desired to be thin. The nonmagnetic insertion layer 140′ may have a thickness of not more than five Angstroms. In some such embodiments, the thickness of the nonmagnetic insertion layer 140′ may be not more than three Angstroms. The nonmagnetic insertion layer 140′ may also have a thickness of at least one Angstrom.

In the embodiment shown in FIG. 4, the nonmagnetic insertion layer 140′ is explicitly discontinuous. In some embodiments, the nonmagnetic insertion layer 140′ at least one Angstrom thick. Other thicknesses are, however, possible. In the embodiment shown, the nonmagnetic insertion layer 140′ is in the first location: between the pinned layer 150 and the pinning layer 130. Also in the embodiment shown, the nonmagnetic insertion layer 140′ shares interfaces with the pinning layer 130 and an opposite interface with the pinned layer 150. Note that in some embodiments, the nonmagnetic insertion layer 140′ may reside at the grain boundaries of the pinning layer 130. Thus, the top surface of the nonmagnetic insertion layer 140′ may be substantially coplanar with the top surface of the pinning layer 130. The nonmagnetic insertion layer 140′ is, however, still considered to be at the first location: between the pinned layer 150 and the pinning layer 130. In another embodiment, the nonmagnetic insertion layer 140′ might be located within the pinning layer 130.

The read sensor 120′ shares the benefits of the read sensor 120. The use of the nonmagnetic insertion layer 140′ may allow for a maximum in the Hex/Hcp for nonzero thicknesses of the nonmagnetic insertion layer 140′. Thus, the coupling between the pinning layer 130 and pinned layer 150 may be improved. The improved stability in the coupling between the pinned layer 150 and the pinning layer 130 may reduce noise during operation of the read sensor 120′.

FIG. 5 depicts another embodiment of a magnetic read sensor 120″. For clarity, FIG. 5 is not to scale. The read sensor 120″ may be part of a read transducer and/or magnetic recording apparatus such as the read transducer 110 and magnetic recording apparatus 100. The transducer of which the read sensor 120″ may be a part is part of a disk drive having a media, a slider and the head coupled with the slider. The read sensor 120″ corresponds to the read sensor(s) 120 and/or 120′. Consequently, analogous components are labeled similarly. For example, the read sensor 120″ includes a pinning/AFM layer 130, a nonmagnetic insertion layer 140/140′, a pinned layer 150, a nonmagnetic spacer or tunneling barrier layer 160 and a free layer 170 that are analogous to the a pinning/AFM layer 130, the nonmagnetic insertion layer 140/140′, the pinned layer 150, the nonmagnetic spacer or tunneling barrier layer 160 and the free layer 170 that are part of the read sensor 120 and thus part of the magnetic recording apparatus 100. Thus, the components 120′, 130, 140/140′, 150, 160 and 170 have a similar structure and function to the components 120, 130, 140/140′, 150, 160 and 170, respectively, depicted in FIGS. 2A-2B and 4. Thus, the nonmagnetic insertion layer 140/140′ is configured such that Hex/Hcp increases or remains constant for some small thicknesses of the nonmagnetic insertion layer 140/140′. In some embodiments, the nonmagnetic insertion layer 140/140′ includes at least one of Ag, Mg, Mn, Ir, Pt, Cr, Ti, Si, C, Al, Ru and Au. In some such embodiments, the nonmagnetic insertion layer 140/140′ consists of Ag, Mg, Mn, Ir, Pt, Cr, Ti, Si, C, Al, Ru and/or Au. The nonmagnetic insertion layer 140/140′ may also be desired to be thin. The nonmagnetic insertion layer 140/140′ may have a thickness of not more than five Angstroms. In some such embodiments, the thickness of the nonmagnetic insertion layer 140/140′ may be not more than three Angstroms. The nonmagnetic insertion layer 140/140′ may also have a thickness of at least one Angstrom.

In the embodiment shown in FIG. 5, the read sensor 120″ includes a nonmagnetic layer 180 and a reference layer 190. The nonmagnetic layer 180 is conductive and may include a material such as Ru. The reference layer 190 is ferromagnetic and may include sublayers. The reference layer 190 and the pinned layer 150 are coupled through the nonmagnetic layer 180. For example, the coupling may be an RKKY coupling. Thus, the layers 150, 180 and 190 form a synthetic antiferromagnet (SAF).

The read sensor 120″ shares the benefits of the read sensor(s) 120/120′. The use of the nonmagnetic insertion layer 140/140′ may allow for a maximum in the Hex/Hcp for nonzero thicknesses of the nonmagnetic insertion layer 140/140′. Thus, the coupling between the pinning layer 130 and pinned layer 150 may be improved. The improved stability in the coupling between the pinned layer 150 and the pinning layer 130 may reduce noise during operation of the read sensor 120″.

FIG. 6 depicts another embodiment of a magnetic read sensor 120″. For clarity, FIG. 6 is not to scale. The read sensor 120′″ may be part of a read transducer and/or magnetic recording apparatus such as the read transducer 110 and magnetic recording apparatus 100. The transducer of which the read sensor 120′″ may be a part is part of a disk drive having a media, a slider and the head coupled with the slider. The read sensor 120′″ corresponds to the read sensor(s) 120, 120′ and/or 120″. Consequently, analogous components are labeled similarly. For example, the read sensor 120′″ includes a pinning/AFM layer 130′, a nonmagnetic insertion layer 140/140′, a pinned layer 150, a nonmagnetic spacer or tunneling barrier layer 160 and a free layer 170 that are analogous to the a pinning/AFM layer 130, the nonmagnetic insertion layer 140/140′, the pinned layer 150, the nonmagnetic spacer or tunneling barrier layer 160 and the free layer 170 that are part of the read sensor 120 and thus part of the magnetic recording apparatus 100. The read sensor 120′″ also may include optional reference layer 190 and optional nonmagnetic layer 180. The pinned layer 150′, optional nonmagnetic spacer layer 180 and optional reference layer 190′ may form an optional SAF 192.

Thus, the components 120′″, 130′, 140/140′, 150, 160, 170, 180, and 170 have a similar structure and function to the components 120/120′/120″, 130, 140/140′, 150, 160 and 170, respectively, depicted in FIGS. 2A-2B and 4. Thus, the nonmagnetic insertion layer 140/140′ is configured such that Hex/Hcp increases or remains constant for some small thicknesses of the nonmagnetic insertion layer 140/140′. In some embodiments, the nonmagnetic insertion layer 140/140′ includes at least one of Ag, Mg, Mn, Ir, Pt, Cr, Ti, Si, C, Al, Ru and Au. In some such embodiments, the nonmagnetic insertion layer 140/140′ consists of Ag, Mg, Mn, Ir, Pt, Cr, Ti, Si, C, Al, Ru and/or Au. The nonmagnetic insertion layer 140/140′ may also be desired to be thin. The nonmagnetic insertion layer 140/140′ may have a thickness of not more than five Angstroms. In some such embodiments, the thickness of the nonmagnetic insertion layer 140/140′ may be not more than three Angstroms. The nonmagnetic insertion layer 140/140′ may also have a thickness of at least one Angstrom.

In the embodiment shown in FIG. 6, the nonmagnetic insertion layer 140/140′ is explicitly within the pinning layer 130′. Thus the pinning layer 130′ includes a pinning layer A 132 and a pinning layer 134 between which is the nonmagnetic insertion layer 140/140′. Although depicted as midway through the pinning layer 130′, the nonmagnetic insertion layer 140/140′ may reside elsewhere. For example, the nonmagnetic insertion layer 140/140′ may be closer to the interface between the layers 130′ and 150′ than to the bottom surface of the pinning layer 130′. Further, even if the nonmagnetic insertion layer 140/140′ is deposited in the middle of the AFM layer 130′ as shown, the nonmagnetic insertion layer 140/140′ may migrate during fabrication of the read sensor 120′″. Thus, the nonmagnetic insertion layer 140/140′ may be closer to the pinned layer 150 and may or may not be continuous.

The read sensor 120′″ shares the benefits of the read sensor(s) 120/120′/120′. The use of the nonmagnetic insertion layer 140/140′ may allow for a maximum in the Hex/Hcp for nonzero thicknesses of the nonmagnetic insertion layer 140/140′. Thus, the coupling between the pinning layer 130′ and pinned layer 150 may be improved. The improved stability in the coupling between the pinned layer 150 and the pinning layer 130′ may reduce noise during operation of the read sensor 120″.

The read sensors 120, 120′, 120″ and 120′″ have been shown in various configurations to highlight particular features, such as differences in geometries. One of ordinary skill in the art will readily recognize that two or more of these features may be combined in various manners consistent with the method and system described herein that are not explicitly depicted in the drawings.

FIG. 7 is an exemplary embodiment of a method 300 for providing a read transducer. For simplicity, some steps may be omitted, interleaved, combined, have multiple substeps and/or performed in another order unless otherwise specified. The method 300 is described in the context of providing a magnetic recording apparatus 100, transducer 110 and read sensor 100. However, the method 300 may be used in fabricating the read sensor 120, 120′, 120″ and/or 120″. The method 300 may be used to fabricate multiple magnetic read heads at substantially the same time. The method 300 may also be used to fabricate other magnetic recording transducers. The method 300 is also described in the context of particular layers. A particular layer may include multiple materials and/or multiple sub-layers. The method 300 is described in the context of a disk drive. However, the method may be used in other applications employing a magnetoresistive and bias structures. The method 300 also may start after formation of other portions of the magnetic recording transducer.

The bottom shield 112 is provided, via step 302. Step 302 may include depositing a magnetic material, such as NiFe and patterning the shield.

The read sensor 120 is provided, via step 304. Step 304 may include depositing a stack of layers for the read sensor 120 and defining the read sensor in the cross-track and stripe height directions. Further, the nonmagnetic insertion layer 140 is provided in the first or second location. Thus, the nonmagnetic insertion layer 140 may be placed between the pinned layer 150 and the pinning layer 140 or may be placed within the AFM. Thus, the read sensor 120, 120′, 120″ or 120′″ may be provided.

The side bias structures 118 are provided, via step 306. Step 306 is performed after the read sensor 120 is defined in the cross-track direction. Thus, at least part of step 304 is performed before step 306. Step 306 may include depositing the insulating layer 116, depositing the material(s) for the magnetic bias structures 118 and depositing a top nonmagnetic layer. A mill step and planarization, such as a chemical mechanical planarization (CMP) may also be performed.

The top shield 114 is provided, via step 308. Step 208 may include depositing, planarizing and patterning soft magnetic layer, such as a NiFe layer.

Using the method 300, the transducer 110 and the read sensor 120, 120′, 120″ and/or 120′″ may be fabricated. Thus, the benefits of one or more of the read sensor 120, 120′, 120″ and/or 120′″ may be achieved. Consequently, performance of the magnetic recording apparatus may be improved.

FIG. 8 is an exemplary embodiment of a method 310 for providing a read sensor such as the read sensor 120, 120′, 120″ and/or 120′″. For simplicity, some steps may be omitted, interleaved, combined, have multiple substeps and/or performed in another order unless otherwise specified. The method 310 is described in the context of providing a magnetic recording disk drive 100 and transducer 110. However, the method 310 may be used in fabricating another magnetic recording device. The method 310 may be used to fabricate multiple magnetic read sensors at substantially the same time. The method 310 is also described in the context of particular layers. A particular layer may include multiple materials and/or multiple sub-layers.

The pinning layer 130/130′ is deposited, via step 312. Step 312 may include heating the substrate such that the materials for the pinning layer are deposited above the ambient temperature. For example, the IrMn or other AFM used for the pinning layer 130/130′ may be deposited above room temperature.

The nonmagnetic insertion layer 140/140′ is provided via step 314. Step 314 may include controlling the temperature of the substrate. Thus, the substrate may be heated such that the material(s) for the nonmagnetic insertion layer are deposited at a temperature above the ambient temperature. For example, the nonmagnetic insertion layer 140/140′ may be sputtered above room temperature. In such embodiments, the atoms for the nonmagnetic insertion layer 140/140′ may be more mobile. These atoms may more readily migrate, for example to grain boundaries of the pinning layer 130/130′. In other embodiments, step 314 may include cooling the substrate such that the nonmagnetic insertion layer 140/140′ is deposited at temperatures below the ambient temperature. For example, the substrate may be cooled (e.g. via water cooling, liquid nitrogen cooling or physical connection to another heat sink) below the ambient temperature during deposition. For example, the material(s) for the nonmagnetic insertion layer 140/140′ may be sputtered below room temperature. In such embodiments, the atoms for the nonmagnetic insertion layer may be less likely to migrate. In other embodiments, no attempt may be made to control the temperature of the substrate during deposition. Further, if the pinning layer 130′ is used, then steps 312 and 314 are interleaved such that the nonmagnetic insertion layer 140/140′ is deposited within the pinning layer 130′.

The pinned layer 150 is deposited, via step 316. Step 316 may include depositing multiple ferromagnetic layers. Nonmagnetic layer(s) may also be provided within the pinned layer. In some embodiments, the nonmagnetic layer 180 and reference layer 190 are deposited in steps 320 and 322, respectively.

The nonmagnetic spacer layer 160 is deposited, via step 322. For example, a conductive layer or tunneling barrier layer may be provided in step 322. The free layer 170 is deposited, via step 324. Step 324 may include depositing multiple ferromagnetic layers. Nonmagnetic layer(s) may also be provided within the free layer 170.

The edges of the read sensor 120, 120′, 120″ and/or 120′″ are defined, via step 324. Step 324 may include providing a mask on the read sensor stack deposited in the previous steps and ion milling the exposed regions. The read sensor 120, 120′, 120″ and/or 120′″ may be defined in the cross-track and stripe height (perpendicular to the ABS) directions. Fabrication of the read sensor may then be completed. For example, anneals, capping layer depositing, and/or other processing steps may be performed.

Using the method 310, the read sensor(s) 120, 120′, 120″ and/or 120′″ may be fabricated. Thus, the benefits of one or more of the read sensor(s) 120, 120′, 120″ and/or 120′″ may be achieved.