Method for fabricating a magnetic write pole having an improved sidewall angle profile

Description

BACKGROUND

FIGS. 1A, 1B and 1C depict ABS, yoke and side views of a conventional magnetic recording head 10. The conventional magnetic recording transducer 10 may be a part of a merged head including the write transducer 10 and a read transducer (not shown). Alternatively, the magnetic recording head may be a write head including only the write transducer 10. Although termed a yoke view, the view shown in FIG. 1B is taken along the surface parallel to the ABS a distance x1 from the ABS. This surface is depicted as a dotted line in FIG. 1C.

The main pole 20 resides on an underlayer 12 and includes sidewalls 22 and 24. The sidewalls 22 and 24 of the conventional main pole 20 form an angle α0 with the down track direction at the ABS and an angle α1 with the down track direction at the distance x1 from the ABS. As can be seen in FIGS. 1A and 1B, portions of the main pole 20 recessed from the ABS in the stripe height direction are wider in the cross track direction than at the ABS. In addition, the angle between the sidewalls 22 and 24 and the down track direction increases. Thus, α1 is greater than α0. For example, if α0 is on the order of 13°, then α1 may be 25°.

Although the conventional magnetic recording head 10 functions, there are drawbacks. In particular, the conventional magnetic recording head 10 may not perform sufficiently at higher recording densities. For example, the write field of the conventional main pole 20 may not have a sufficiently high magnitude write field to meet particular standards. Accordingly, what is needed is a method for improving the performance of a magnetic recording head.

BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS

FIGS. 1A-1C depict ABS, yoke and side view of a conventional magnetic recording head.

FIG. 2 is a flow chart depicting an exemplary embodiment of a method for providing a magnetic recording apparatus.

FIG. 3 depicts a side view of a magnetic recording apparatus during fabrication using the method.

FIGS. 4A-4C depict ABS, recessed and yoke views of a magnetic recording apparatus during fabrication using the method.

FIGS. 5A-5C depict ABS, recessed and yoke views of a magnetic recording apparatus during fabrication using the method.

FIG. 6 depicts another exemplary embodiment of a method for providing a magnetic recording transducer.

FIGS. 7A-7D through 17A-17D depict various views of a magnetic recording apparatus during fabrication using the method

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 2 depicts an exemplary embodiment of a method 100 for providing a magnetic recording apparatus. For simplicity, some steps may be omitted, interleaved, combined, have multiple substeps and/or performed in another order unless otherwise specified. FIGS. 3 through 5A-5C depict an exemplary embodiment of a magnetic recording apparatus 200 during fabrication using the method 100. Referring to FIGS. 2-5C, the method 100 is described in the context of providing a magnetic recording disk drive and transducer 200. The method 100 may be used to fabricate multiple magnetic recording heads at substantially the same time. The method 100 may also be used to fabricate other magnetic recording devices. The method 100 is also described in the context of particular layers. A particular layer may include multiple materials and/or multiple sub-layers. The method 100 also may start after formation of other portions of the magnetic recording transducer. For example, the method 100 may start after a read transducer and/or other structures have been fabricated. For example, the method 100 may start after the underlying structures, including an underlayer, have been provided. For example, the underlayer may include a leading shield, a seed layer an etch stop layer and/or additional etchable layer(s).

An intermediate layer is provided on the underlayer or substrate, via step 102. The substrate/underlayer may be considered to include the structures fabricated prior to the pole. In some embodiments, the underlayer may include an etchable layer, such as silicon oxide, that is on an etch stop layer. A metallic layer may also be provided under the etch stop layer. The intermediate layer provided in step 102 is also an etchable layer. For example, the intermediate layer may be removed by reactive ion etches (RIEs) having the appropriate chemistries. The intermediate layer also includes at least two sublayers at least in the region in which the main pole is to be formed. The first sublayer includes the ABS location. The ABS location is the surface at which the ABS will be located after fabrication of the magnetic device is completed. The second sublayer is recessed from the ABS location such that a portion of the first sublayer is between the second sublayer and the ABS location. The first and second sublayers are both etchable and may be nonmagnetic. However, different etch chemistries may be used to etch the sublayers. The first sublayer has a rear surface oriented at an angle of greater than zero degrees and less than ninety degrees from a surface perpendicular to the ABS location. Step 102 may include full-film depositing the material(s) for the first sublayer. A portion of the layer formed by these material(s) is removed such that the angle of the rear surface is formed. The region behind the first sublayer may then be refilled using the material(s) for the second sublayer.

FIG. 3 depicts an apex view of the transducer 200 after step 102 is performed. Thus, the intermediate layer 210 is formed on the underlayer 202. The underlayer 202 may include an etch stop layer, an etchable layer and/or other structures. The intermediate layer 210 includes a first sublayer 212 and a second sublayer 214. The sublayers 212 and 214 are etchable. However, one sublayer 212/214 may act as a stop layer for the other sublayer 214/212 given the proper etch chemistry. For example, the first sublayer 212 may be aluminum oxide while the second sublayer 214 may be silicon oxide. The rear surface of the first sublayer 212 forms an angle, θ, with a surface perpendicular to the ABS location. In this embodiment, the angle θ is between the bottom of the first sublayer 212 and the rear surface of the sublayer 212. The angle, θ, is greater than zero degrees and less than ninety degrees. Thus, the rear surface of the first sublayer 212 is neither parallel to nor perpendicular to the ABS location. For example, in some embodiments, the angle, θ, is at least fifty degrees and not more than eighty degrees. In some such embodiments, this angle is at least sixty degrees and not more than seventy degrees. The ABS location, a transition region including the rear surface of the first sublayer 212 and a yoke region which is within the second sublayer 214 are also indicated in FIG. 3 by dashed lines.

A trench is formed in the intermediate layer, via step 104. In some embodiments, step 102 includes performing multiple RIEs. The trench corresponds to a main pole. Step 104 may include forming a mask that has an aperture therein. The apertures has a shape (footprint) and location corresponding to the trench. Multiple etches are performed with the mask in place. A first etch removes a portion of the second sublayer, recessed from the ABS location. A second etch removes at least a portion of the first sublayer, including a portion at the ABS location. In some embodiments, the first etch is performed before the second etch. In alternate embodiments, the second etch is performed before the first etch.

FIGS. 4A-4C depict ABS location, recessed/transition and yoke views of the magnetic recording apparatus 200 after step 104 has been performed. The views in FIGS. 4A, 4B and 4C are thus taken at the dashed lines in FIG. 3. A trench 216 has been formed in the intermediate layer 210. The sidewalls of the trench form a sidewall angle with a direction perpendicular to the bottom of the trench. The sidewall angle has value α0 at the ABS location (FIG. 4A), α1 at a transition location in the rear surface of the first sublayer 212 (FIG. 4B) and a value α2 in the yoke region (FIG. 4C). Thus, the sidewall angle decreases in the yoke direction perpendicular to the ABS location. Thus, the angle α2 in the yoke region is smaller than the angle α0 at the ABS location. The angle α0 is at least ten degrees and not more than twenty degrees in some embodiments. The angle α2 may be at least zero degrees and not more than five degrees. In some embodiments, α2 is not more than three degrees. The angle α1 is between α0 and α2. In other words, α0>α1>α2. In some embodiments, the sidewall angle decreases smoothly along the rear surface of the first sublayer 212. For example, the sidewall angle α2 may decrease linearly along the rear surface, in accordance with the square of the distance from the ABS location, or in another manner.

A main pole is provided in the trench, via step 106. In some embodiments, step 106 may include electroplating one or more layers. Other deposition methods may be used in addition to or in lieu of plating. The pole material(s) may also be planarized. The main pole material(s) have a high saturation magnetization and thus may include material(s) such as CoFe. Step 106 may also include depositing a seed layer and forming leading and/or trailing bevels.

FIGS. 5A-5C depict ABS location, recessed/transition and yoke views of the magnetic recording apparatus 200 after step 106 has been performed. The views in FIGS. 5A, 5B and 5C are thus taken at the dashed lines in FIG. 3. The pole 220 has been formed. In the regions shown, the main pole 220 has a profile that matches that of the sidewalls of the trench 216. Thus, the pole sidewalls form sidewall angles with a direction perpendicular to the bottom of the pole 220. The sidewall angle has value α0 at the ABS location (FIG. 5A), α1 at a transition location in the rear surface of the first sublayer 212 (FIG. 5B) and a value α2 in the yoke region (FIG. 5C). Thus, the sidewall angle decreases in the yoke direction perpendicular to the ABS location. Thus, the angle α2 in the yoke region is smaller than the angle α0 at the ABS location. The angle α0 is at least ten degrees and not more than twenty degrees in some embodiments. The angle α2 may be at least zero degrees and not more than five degrees. The angle α1 is between α0 and α2. In some embodiments, the sidewall angle decreases smoothly along the rear surface of the first sublayer 212. For example, the sidewall angle may increase linearly along the rear surface, in accordance with the square of the distance from the ABS location, or in another manner.

Fabrication of the transducer may then be completed, via step 108. For example, a write gap, a trailing shield and/or at least one side shield may be provided. In addition, the slider may be lapped and the device otherwise completed.

Using the method 100, a magnetic apparatus 200 having improved performance may be fabricated. The magnetic transducer 200 may exhibit improved performance. Because of the variation in the sidewall angle, the magnetic field generated by the main pole 220 and used to write to the media may be enhanced. The reverse overwrite gain may also be improved. The gradient in the magnetic field may also be improved while maintaining substantially the same side fields. As a result, adjacent track interference may not be adversely affected. Further, the pole tip region of the main pole 220 may have an increased magnetic volume. As a result, the cross track magnetic anisotropy may be improved and domain lockup issues mitigated. Thus, performance of the magnetic writer 200 may be improved. Thus, using the method 100 a pole having the desired performance may be fabricated.

FIG. 6 depicts an exemplary embodiment of a method 150 for providing a magnetic recording transducer having a varying sidewall angle. For simplicity, some steps may be omitted, interleaved, performed in another order and/or combined. FIGS. 7A-7D though FIGS. 17A-17D depict an exemplary embodiment of a magnetic transducer 250 during fabrication using the method 150. Referring to FIGS. 6-17D, the method 150 may be used to fabricate multiple magnetic recording heads at substantially the same time. The method 150 may also be used to fabricate other magnetic recording transducers. The method 150 is also described in the context of particular layers. A particular layer may include multiple materials and/or multiple sub-layers. The method 150 also may start after formation of other portions of the magnetic recording transducer. For example, the method 150 may start after a read transducer, return pole/shield and/or other structure have been fabricated.

A first silicon oxide layer is provided, via step 152. The silicon oxide layer may be formed on an etch stop layer, such as an aluminum oxide layer. The etch stop layer may be formed on a metal layer such as Ru or NiFe. An aluminum oxide layer is deposited on the silicon oxide layer, via step 154. FIGS. 7A, 7B, 7C and 7D depict apex, ABS location, transition and yoke views of the magnetic recording transducer 300 after step 154 is performed. Thus, FIGS. 7B-7D depict the surfaces at the dashed lines shown in FIG. 7A. Thus, the silicon dioxide layer 311 on the etch stop layer 302 is shown. In some embodiments, the first silicon oxide layer 311 has a thickness of at least sixty and not more than eighty nanometers. The etch stop layer 302 may be aluminum oxide and may be nominally twenty nanometers thick. The aluminum oxide layer 312 resides on the silicon oxide layer 311. In some embodiments, the aluminum oxide layer 312 is at least two hundred and forty and not more than two hundred and sixty nanometers thick. However, other thicknesses for the layers 302, 311 and 312 are possible.

A mask is provided, via step 156. The mask used in step 156 is a hard mask utilized for ion milling. Thus, the mask covers the ABS location as well as a portion of the aluminum oxide layer recessed from the ABS. FIGS. 8A, 8B, 8C and 8D depict apex, ABS location, transition and yoke views of the magnetic recording transducer 300 after step 156 is performed. Thus, the mask 330 is shown. In the embodiment shown, the mask 330 is a dual layer hard mask. Thus, the mask 330 includes a bottom layer 332 and a top layer 334. The bottom layer 332 may be formed of amorphous carbon. The top layer 334 may be formed of Ta.

An ion mill or other process for removing an exposed portion of the aluminum oxide layer 312 is performed, via step 158. The ion mill is performed at a nonzero angle from the ABS location. For example, the ion mill may be performed at an angle of fifty through eighty degrees from perpendicular to the ABS location. In some embodiments, the angle is at least sixty degrees and not more than seventy degrees from a perpendicular to the ABS location.

FIGS. 9A, 9B, 9C and 9D depict apex, ABS location, transition and yoke views of the magnetic recording transducer 300 after step 158 is performed. Thus, FIGS. 9B-9D depict the surfaces at the dashed lines shown in FIG. 9A. In FIG. 9A, the arrows depict the direction of the ion mill performed in step 158. The direction is indicated by the angle, γ, having the values described above. Thus, a portion of the aluminum oxide layer 312 has been removed and the rear surface 313 has been formed. The rear surface 313 is at an angle θ from a direction perpendicular to the ABS location. The angle, θ, may be at least fifty degrees and not more than eighty degrees. In some such embodiments, this angle is at least sixty degrees and not more than seventy degrees. The layer 312 has also been overmilled, ensuring the rear surface 313 is shaped as desired. Thus, a portion of the underlying silicon oxide layer 311 has been removed. The aluminum oxide layer 312 remaining forms the first sublayer for the intermediate layer.

A second silicon oxide layer is deposited on the remaining aluminum oxide layer 312 and an exposed portion of the first silicon oxide layer 311, via step 160. Step 160 may also include removing a remaining portion of the mask 330. FIGS. 10A, 10B, 10C and 10D depict apex, ABS location, transition and yoke views of the magnetic recording transducer 300 after step 160 is performed. Thus, FIGS. 10B-10D depict the surfaces at the dashed lines shown in FIG. 10A. Thus, the silicon oxide layer 314 is shown. The silicon oxide layer 314 covers the aluminum oxide layer 312 and the underlying silicon oxide layer 311.

The second silicon oxide layer 314 is planarized, via step 162. Thus a portion of the second silicon oxide layer 314 is removed. In some embodiments, step 162 includes performing a chemical mechanical planarization (CMP). FIGS. 11A, 11B, 11C and 11D depict apex, ABS location, transition and yoke views of the magnetic recording transducer 300 after step 162 is performed. Thus, FIGS. 11B-11D depict the surfaces at the dashed lines shown in FIG. 11A. Because of the planarization, the top surfaces of the aluminum oxide layer 312 and the second silicon oxide layer are substantially planar. The layers 312 and 314 together from an etchable intermediate layer 310. The remaining portion of the aluminum oxide layer 312 forms the first sublayer discussed above. Similarly, the remaining portion of the silicon oxide layer 314 forms the second sublayer discussed above.

A mask for forming a trench in the intermediate layer is provided, via step 164. Step 164 generally has multiple substeps. For example, a first hard mask layer, such as Cr or Ru, may be deposited. A photoresist mask having the shape and location corresponding to the trench is formed. An additional hard mask layer, such as Ta may then be deposited. A lift-off of the photoresist is performed. As a result, the remaining Ta mask has an aperture corresponding to the aperture desired for trench formation. A portion of the underlying first mask layer is then removed, using the Ta mask as the mask. Thus, the hard mask is formed. For example, FIGS. 12A, 12B, 12C and 12D depict apex, ABS location, transition and yoke views of the magnetic recording transducer 300 after the mask layers have been deposited in step 164. FIGS. 12B-12D depict the surfaces at the dashed lines shown in FIG. 12A. Thus, a first mask layer 342, a photoresist mask 344 and a top mask layer 346 are shown. FIGS. 13A, 13B, 13C, 13D and 13E depict apex, ABS location, transition, yoke and plan views of the magnetic recording transducer 300 after the lift off of step 164 is performed. Thus, FIGS. 13B-13D depict the surfaces at the dashed lines shown in FIGS. 13A and 13E. Because the lift off has been completed, the photoresist mask 344 is no longer present. Instead, the top hard mask 346 has an aperture therein. FIGS. 14A, 14B, 14C, 14D and 14E depict apex, ABS location, transition, yoke and plan views of the magnetic recording transducer 300 after step 164 is completed. Thus, FIGS. 14B-14D depict the surfaces at the dashed lines shown in FIGS. 14A and 14E. Consequently, the mask 340 has an aperture 347 therein. The shape and location of the aperture 347 correspond to the desired footprint and location of the trench in the intermediate layer 310.

A first etch, silicon oxide, is performed, via step 166. The first etch is configured to remove the second sublayer. Stated differently, the first etch performed in step 166 may be an RIE having a chemistry appropriate for removal of silicon oxide. FIGS. 15A, 15B, 15C, 15D and 15E depict apex, ABS location, transition, yoke and plan views of the magnetic recording transducer 300 after step 166 is completed. Thus, FIGS. 15B-15D depict the surfaces at the dashed lines shown in FIGS. 15A and 15E. Thus, a portion of the silicon oxide layer 311 has been removed. As can be seen in FIGS. 15A and 15B, the aluminum oxide layer 312 may be a stop layer for such a silicon oxide etch. Thus, the aluminum oxide layer 312 is not removed in this area at and near the ABS. In contrast, in the yoke and transition regions of FIGS. 15C-15C, the silicon oxide layer 314 has been removed. In some cases, the first silicon oxide layer 311 is etched through to the etch stop layer, as shown in FIG. 15D.

A second etch, aluminum oxide, is performed, via step 168. The second etch is configured to remove the first sublayer. Stated differently, the second etch performed in step 168 may be an RIE having a chemistry appropriate for removal of aluminum oxide. In some embodiments, the second etch is performed after the first etch. In alternate embodiments, the second etch may be performed before the first etch. FIGS. 16A, 16B, 16C, 16D and 16E depict apex, ABS location, transition, yoke and plan views of the magnetic recording transducer 300 after step 168 is completed. Thus, FIGS. 16B-16D depict the surfaces at the dashed lines shown in FIGS. 16A and 16E. Thus, a portion of the aluminum oxide layer 312 has been removed. Thus, the trench 348 has been formed by the first and second etches. The trench 348 has a bottom, a top wider than the bottom and sidewalls. The sidewalls form a first angle with a direction perpendicular to the bottom at the ABS location at the ABS location (e.g. shown in FIG. 16B). This angle is at least ten degrees and not more than twenty degrees. In some embodiments, the angle is nominally thirteen degrees. Note that in the embodiment shown in FIG. 16B, the trench 348 is triangular at the ABS location. In addition, the bottom of the trench lies within the aluminum oxide layer 312. In other embodiments, the trench 348 could have another shape, such as a trapezoid. In addition, the trench 348 could have its bottom within the layer 311. The sidewalls form a second angle with the direction perpendicular to the bottom in a portion of the second sublayer 314. This is depicted in FIG. 16D. The second angle in this region is at least zero degrees and not more than five degrees. In the embodiment shown in FIG. 16D, the sidewall angle is zero degrees, which correspond to vertical sidewalls. In the region of the rear surface of the first sublayer/aluminum oxide layer 312, the sidewall angle between the plurality of sidewalls and the surface perpendicular to the bottom varies along the rear surface of the aluminum oxide layer 312. In some embodiments, the sidewall angle varies smoothly. In some cases the variation could be linear or higher order. In other embodiments, the sidewall angle might vary in another manner.

A main pole is provided in the trench 348, via step 170. Step 170 may include depositing a nonmagnetic seed layer, such as Ru, and plating the high saturation magnetization materials for the main pole. A planarization such as a CMP may also be performed. A nonmagnetic write gap may be formed on the pole, via step 172. Trailing and/or side shields may also be formed, via step 174.

FIGS. 17A, 17B, 17C and 17D depict apex, ABS location, transition, and yoke views of the magnetic recording transducer 300 after step 172 is completed. Thus, FIGS. 17B-17D depict the surfaces at the dashed lines shown in FIG. 17A. Thus, a pole 360 having the desired geometry has been formed. Also shown are seed 350 that may form a side gap. A write gap 352 and optional shields 370 and 380 have been formed. In other embodiments, the shield 370 and/or 380 may be omitted or configured in another manner.

Using the method 150, a main pole 360 having improved performance may be fabricated. Because of the variation in the sidewall angle, the magnetic field generated by the main pole 360 and used to write to the media may be enhanced. The reverse overwrite gain may also be improved. The gradient in the magnetic field may also be improved while maintaining substantially the same side fields. As a result, adjacent track interference may not be adversely affected. Further, the pole tip region of the main pole 360 may have an increased magnetic volume. As a result, the cross track magnetic anisotropy may be improved and domain lockup issues mitigated. Thus, performance of the magnetic writer 300 may be improved. Thus, using the method 150 a transducer the desired performance may be fabricated.