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Patent application title:

Structure of heat sink

Publication number:

US20050115698A1

Publication date:
Application number:

10/724,757

Filed date:

2003-12-02

Abstract:

An improved structure of heat sink is combined with the base and the structure of closed pipeline. By way of the cooling effect produced when solution in the pipeline of the structure of closed mini pipeline inside the base circulate and change mutually in the liquid state and steam, which makes some machine elements in machinery or electronic products running to cause waste heat cooling.

Inventors:

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Classification:

  1. Mechanical engineering
  2. Heat exchange in general

F28D15/0266 »  CPC main

Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers

H01L23/427 »  CPC further

Details of semiconductor or other solid state devices; Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements; Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling Cooling by change of state, e.g. use of heat pipes

F28D2021/0029 »  CPC further

Heat-exchange apparatus not covered by any of the groups  - ; Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices Heat sinks

H01L2924/0002 »  CPC further

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and

H01L2924/00 »  CPC further

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an improved structure of heat sink. Particularly, it relates to an improved structure of heat sink in some machine elements of machinery or electronic products running to cause waste heat.

2. Prior Art

Look into former heat sink used in some machine elements while machinery or electronic products run to cause waste heat; some of them are made into layer built or multiple needle-pillar type of lead-heat panel by pure aluminum with high heat conduction to contact some machine elements causing waste heat for conducting heat produced as some machine elements cause waste heat. Further, setting an electric fan device in the lead-heat panel to continuously bring heat into ambient air giving off via airflow that avoids to influence the effects of some machine elements when they cause waste heat and make their working temperature too high. No matter what the structures of heat sink are used habitually mentioned above, it is hard for them to achieve the ideal effect at last.

OBJECTS OF THE INVENTION

The primary purpose of the present invention is to solve the problems mentioned above and to provide an improved structure of heat sink that relates to heating solution in the liquid state of the closed mini pipeline to evaporate as gas and bring away heat produced when some machine elements cause waste heat. Gas will condense into liquid again and give off heat; in this case, continuous circulating changing in the closed mini pipeline produces the cooling effect to lower the ideal working temperature of some machine elements when they cause waste heat and then produce heat.

BRIEF DESCRIPTION OF THE DRAWING

FIG. 1 is a perspective view of the analyzed structure of the present invention.

FIG. 2 is a perspective view of the structure of the closed mini pipeline of the present invention.

DESCRIPTION OF THE FREFERRED EMBODIMENT

As showing in FIGS. 1 and 2, an improved structure of heat sink (1) of the present invention is combined with the base (2) and the structure of the closed mini pipeline (3). Within the length and width of the base (2) are in accordance with some machine elements (4) causing waste heat for connecting closely with said machine elements (4) as a whole. By way of the cooling effect produced when the solution in the pipeline of the structure of closed mini pipeline (3) connecting with the base (2) circulate and change mutually in the liquid state and steam, which makes some machine elements (4) in machinery or electronic products running to produce waste heat cooling.

As showing in FIG. 2, the structure of the closed mini pipeline (3) of the present invention is a circulating network of the closed mini pipeline. Within the liquid tank of concentrated solution (5) contains the mini liquid (6) low the atmosphere pressure is through the generator (7). Liquid in the pipeline is heating to the state of boiling and giving off heat through central processing device to make part of liquid be vapor (10) by gasification and get t into the condenser (8). Some of liquid (6) having no gasification flows back in the liquid tank of concentrated solution (5) to be used circularly again via the first mini pipeline (9). Vapor (10) getting into the condenser (8) mentioned above will condensate to be liquid (6) and release heat into the air. At the same time, liquid (6) getting into the evaporator (11) will evaporate to bring away the heat and produce the cooling effect; besides, it goes back separately to the liquid tank of concentrated solution (5) via the second and the third mini pipeline (12) (13) in the state of vapor (10). In this case, continuous circulating operation achieves the effect of making some machine elements (4) causing waste heat radiate heat.

Claims

1. An improved structure of heat sink is combined with the base and the structure of the closed mini pipeline; the length and width of said base are in accordance with some machine elements causing waste heat for connecting closely with said machine elements as a whole; by way of the cooling effect produced when the solution in the pipeline of the structure of closed mini pipeline connecting with said base circulate and change manually in the liquid state and steam, which makes some machine elements causing waste heat cooling.

Resources

Images & Drawings included:

Fig. 01 - Structure of heat sink
Fig. 01
Fig. 02 - Structure of heat sink
Fig. 02
Fig. 03 - Structure of heat sink
Fig. 03

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