Heat dissipating device

Description

TECHNICAL FIELD

The present invention relates to heat dissipating devices, and particularly to a heat dissipating device incorporating heat pipes for improving heat dissipating efficiency thereof.

BACKGROUND

As computer technology continues to advance, electronic components such as central processing units (CPUs), are made to provide faster operational speeds and greater functional capabilities. When a CPU operates at a high speed in a computer enclosure, its temperature frequently increases greatly. It is desirable to dissipate the generated heat of the CPU quickly, for example, by using a heat sink attached to the CPU in the enclosure.

A conventional heat sink comprises a base and a plurality of spaced fins integrally formed with the base by extrusion. The base is used for contacting with an electronic component. Heat generated by the electronic component is transferred to the base and then to the fins where heat is dissipated. However, the ratio of the height of the fins to the width of the space is limited by extrusion technology. That is, heat dissipation surface area unit volume is limited. Thus, when heat dissipation surface area is increased for meeting the increasing requirement of heat dissipation of the electronic component the volume of the heat sink is inevitably increased, which is converse to the trend toward miniaturization in computer industry.

Thus, a type of heat sink incorporating a plurality of fins stacked along a heat pipe has been developed. FIG. 3 shows a conventional heat dissipating device incorporating heat pipes. The heat dissipating device comprises a base 1′, stacked fins 2′ and heat pipes 3′. Each heat pipe 3′ comprises a heat evaporative section 30′, a condensative section 32′ and a curved section 34′ connected between the evaporative section 30′ and the condensative section 32′. The fins 2′ define aligned holes 20′ for receiving the condensative sections 32′. The holes 20′ are of uniform size and shape. The diameter of the holes 20′ are the same as that of the heat pipes 3′. Therefore, when the curved sections 34′ of the heat pipes 3 are received in the holes 20′ of the fins 2′ the curved sections 34′ will interfere with some of the fins 2′ located adjacent the heat evaporative sections 30′ at the holes 20′, which results in those some of the fins 2′ deforming. To avoid the interference, the heat pipes 3′ can be removed upward relative to the fins 2′ to cause the curved sections 34′ to locate above the topmost fin 2′ and out of the holes 20′. However, the heat pipes 3′ moving upward relative to the fins 2′ will result in the heat dissipating device incompact and occupying larger space, which runs counter to the trend toward miniaturization in the computer industry.

SUMMARY OF THE INVENTION

Accordingly, an object of a preferred embodiment of the present invention is to provide a heat dissipating device incorporating heat pipes which will not interfere with fins of the heat dissipating device in assembly.

Another object of a preferred embodiment of the present invention is to provide a heat dissipating device with a compact structure.

To achieve the above-mentioned objects, a heat dissipating device in accordance with a preferred embodiment of the present invention comprises a heat receiver, a fin member comprising a plurality of spaced fins defining aligned holes, and at least one heat pipe connecting the heat receiver with the fin member. Some of the fins adjacent the heat receiver define enlarged openings each communcating with a corresponding hole. The at least one heat pipe forms a curved section received in the enlarged openings of the fins.

Other objects, advantages and novel features of the present invention will be drawn from the following detailed description of a preferred embodiment of the present invention with attached drawings, in which:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded view of a heat dissipating device in accordance with a preferred embodiment of the present invention;

FIG. 2 is an assembled veiw of FIG. 1; and

FIG. 3 is an exploded view of a conventional heat dissipating device.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENT

FIGS. 1-2 show a heat dissipating device in accordance with a preferred embodiment of the present invention. The heat dissipating device comprises a heat receiver 10, two pairs of U-shaped heat pipes 20, 30 and a fin member 40.

The heat receiver 10 is rectangular and has a top surface for absorbing heat from a heat source (not shown), a bottom surface defining a plurality of parallel grooves 12.

The first pair of heat pipes 20 each comprises an evaporative section 22, a pair of condensative sections 24 extending from opposite ends of the evaporative section 22, and a pair of curved sections 23 connecting the evaporative section 22 with the condensative sections 24. The second pair of heat pipes 30 each comprises an evaporative section 32, a pair of condensative sections 34, and a pair of curved sections 33 connecting the evaporative section 32 with the condensative sections 34. The evaporative sections 22, 32 of the heat pipes 20, 30 are fixedly received in the corresponding grooves 12 of the heat receiver 10 by welding or other conventional ways.

The fin member 40 comprises a plurality of parallel fins each defining two pairs of first holes 26 and two pairs of second holes 36. The first holes 26 of each fin are aligned with the corresponding first holes 26 of the other fins for receiving the condensative sections 24 of the first heat pipes 20. The second holes 36 of each fin are aligned with the corresponding second holes 36 of the other fins for receiving the condensative sections 34 of the second heat pipes 30. The first holes 26 and the corresponding adjacent second holes 36 offset from each other in the direction of the evaporative sections 22, 32 of the heat pipes 20, 30. Some of the fins adjacent the heat receiver 10 further defines enlarged openings 28, 38 communicating with the corresponding holes 26, 36 for receiving the curved sections 23, 33 of the heat pipes 20, 30.

In the preferred embodiment of the present invention, some of the fins adjacent the heat receiver 10 defines enlarged openings 28, 38 communicating with the corresponding holes 26, 36. Thus, when the condensative sections 24, 34 of the heat pipes 20, 30 are received in the holes 26, 36 in assembly, the curved sections 23, 33 of the heat pipes 20, 30 are received in the corresponding enlarged openings 28, 38 of the fins to thereby avoid interference between the curved sections 23, 33 of the heat pipes 20, 30. There is no need to remove the heat pipes 20, 30 upward relative to the fins to cause the curved sections 23, 33 to locate above the topmost fin, which ensure the heat dissipating device to have a compact structure.

It is understood that the invention may be embodied in other forms without departing from the spirit thereof. Thus, the present example and embodiment is to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the details given herein.