Method for manufacturing heat sink devices

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a method for manufacturing heat sink devices, more specifically to manufacture a heat sink device of which the heat-sinking fins are integrally formed with the base.

2. Description of the Prior Art

A CPU undoubtedly is a necessity in a computer or an electronic instrument; while in high-speed operation, it will inevitably generate high heat; and with the prolonged time of operation, the heat will be eventually accumulated too much to mal-operate the CPU or even burn it down. Thus, to keep the CPU at steady working temperatures, heat sinks devices are used. Some of other electronic and machinery devices also need heat sink.

FIG. 8 is shown a convention heat sink device “A” normally seen in the markets. The heat sink device “A” is made by extrusion of aluminum, or made by milling/cutting with a mother working-machine. The heat-sinking fins “B” formed thereof can only be arrayed in one direction with equal spaces. Thus, because of the limitation of this method of processing, the mode of arraying of the heat-sinking fins “B” is therefore quite limited, and this restricts the development for high efficiencies of the heat sink devices.

Another conventional manufacturing method includes a proceeding of welding as shown in FIG. 9. However, during the process of welding heat-sinking fins “C” to a base “D”, by the fact that the ingredients of the solder “E” and the heat-sinking fins “C” as well as the base “D” of the heat sink devices are different, when the heat-sinking fins “C” and the base “D” are jointed by welding, it will be caused that not only the welding spots have low strength and are subjected to breaking, but also high efficiency of heat sinking can not achieve because of the heat conductibility of the solder “E” and the heat sink are different.

In view of the above defects, the inventor develops the present invention based on his professional experience and study to provide a new method for manufacturing heat sink devices.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a method of manufacturing heat sink devices, to position the heat-sinking fins by a holding member so that a plurality of heat-sinking fins can be arranged in pursuance of various modes.

Another object of the present invention is to provide a method of manufacturing heat sink devices, to have the lower ends of the heat-sinking fins integrally formed with the base, thereby heat can be fast dissipated and the heat sinking efficiency can be increased.

To achieve the objects, a method for manufacturing heat sink devices according to the present invention comprises the steps of:

• • a. positioning a plurality of heat-sinking fins by a holding member after they are arranged and assembled;
  • b. casting a metallic solution into a die;
  • c. locating a plurality of heat-sinking fins to have lower ends of them in the metallic solution; and
  • d. cooling the metallic solution to form a base and further to have the base to integrate with the lower ends of the heat-sinking fins.

With the same technical features, another method is to have the lower ends of heat-sinking fins molten to form a metallic solution. It is also implementable to include a conductive base, and have the lower ends of heat-sinking fins and the upper end of the conductive base contacted and further molten to form a metallic solution. After cooling the metallic solution, the heat-sinking fins and the base can be integrated with each other.

The other features of the present invention will be apparent after reading the detailed description of the preferred embodiments thereof in reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flow chart showing steps of the first embodiment of the present invention;

FIG. 2 is a schematic view showing the first and second steps “A” and “B” of the first embodiment of the present invention;

FIG. 3 is another schematic view showing that a heat sink device made by the first embodiment of the present invention is being released from a die;

FIG. 4 is a perspective view showing an appearance of an implementable heat sink device according to the first embodiment of the present invention;

FIG. 5 is a flow chart showing steps of the second embodiment of the present invention;

FIG. 6 is a flow chart showing steps of the third embodiment of the present invention;

FIG. 7 is a perspective schematic view showing the third embodiment of the present invention;

FIG. 8 is a perspective view showing an appearance of the conventional heat sink device made by aluminum extrusion; and

FIG. 9 is a side view of a conventional heat sink device made by the process of welding.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

FIGS. 1-3 are shown the first embodiment of the method according to the present invention. A heat sink device 1 made by the present invention includes a plurality of heat-sinking fins 2 and a base 3. The manufacturing method mainly comprises the steps of:

• • a. positioning a plurality of heat-sinking fins 2 by a holding member 4 after they are arranged and assembled;
  • b. casting a metallic solution into a die 5;
  • c. locating a plurality of heat-sinking fins 2 to have the lower ends of them in the metallic solution; and
  • d. cooling the metallic solution to form a base 3 and further to have the base 3 to integrate with the lower ends of the heat-sinking fins 2.

The die 5 in the step b is a box having a receiving chamber 51 therewithin for receiving the metallic solution. After cooling the metallic solution, a base 3 is therefore formed therein.

After cooling, the heat-sinking fins 2 and the base 3 can be released from the die 5 as shown in FIG. 3. Since the heat-sinking fins 2 and the base 3 are integrated with each other, it is not necessary to use any welder that will hinder heat conducting. In using, the base 3 is placed to contact with the heated portion of electronic or machinery devices. The heat will be fast dissipated upwardly with high heat sinking efficiency.

FIG. 4 is shown an appearance of another heat sink device 6 made by the above stated steps, wherein plurality of heat-sinking fins 61 are arranged in a staggering mode. The heat-sinking fins can also be allocated in different ways in pursuance of requirements, flexible for arrangement according to the present invention.

FIG. 3 and FIG. 5 show the second embodiment of the method according to present invention. The method of manufacturing heat sink devices comprises the steps of:

• • a. positioning a plurality of heat-sinking fins 2 by a holding member 4 after they are arranged and assembled;
  • b. locating a plurality of heat-sinking fins 2 to have the lower ends of them in a die 5;
  • c. melting the lower ends of the plurality of heat-sinking fins 2 to be a metallic solution; and
  • d. cooling the metallic solution to form a base integrally with the heat-sinking fins 2.

In the above step “c”, after the lower ends of the heat-sinking fins 2 being heated and molten to a metallic solution in the die, it has the same function as the metallic solution cast into die 5 in the step “b” of the first embodiment.

FIGS. 6 and 7 show the third embodiment of the present invention. The method comprises the steps of:

• • a. positioning a plurality of heat-sinking fins 7 by a holding member 4 after they are arranged and assembled;
  • b. contacting lower ends of the heat-sinking fins 7 with upper end of a heat conductive base 72;
  • c. melting the lower ends of the plurality of heat-sinking fins 7 and partially upper end of the heat conductive base 72 at the same time to be a metallic solution; and
  • d. cooling the metallic solution to be solid, thereby to integrate the heat-sinking fins with the base each other.

The partially melting of the lower ends of the heat-sinking fins 7 and the upper end of the heat conductive base 72 can have the same effect as those of the above stated two embodiments. This method can be applied to integrate heat-sinking fins 7 of different arrangement and allocation and a heat conductive base 72.

Obviously, the present invention has the following advantages:

• 1. By using a holding member, the method of present invention can be applied to the mode of conventional heat-sinking fins, or to the mode of heat-sinking fins arranged in different ways of allocation (such as the mode of staggering). Therefore, the present invention can overcome the limitation to the mode of conventional methods.
• 2. Heat sink devices made by the method according to the present invention can have the lower ends of its heat-sinking fins and the upper end of its base integrated with each other, and thus heat can be directly and fast dissipated from the base to the heat-sinking fins, thus increasing the heat sinking efficiency.

In conclusion, the present invention can achieve the expected objects mentioned above, providing a new method of manufacturing heat sink devices which have industrial value. Having thus described my invention, what I claim as new and desire to be secured by Letters Patent of the United States are: