Refrigerator with thermal-electric semiconductor

Description

FIELD OF THE INVENTION

The present invention relates to refrigerators, and in particular to a refrigerator with thermal-electric semiconductor. No compressor, evaporator and condenser is used so that the cost is lowered and the volume is reduced. It can be assembled easily and no refrigerant is required.

BACKGROUND OF THE INVENTION

The conventional refrigerator has a compressor, an evaporator and a condenser. The compressor compresses refrigerant so as to transfer energy to the refrigerant to be as high temperature and high pressure gas. Then the refrigerant flows to a condenser for condensing so as to be as a high pressure and low temperature liquid. Then the refrigerant flows to an evaporator for expansion and evaporation to absorb heat so as to be as a low temperature and low pressure gas. Then the refrigerant flows to the compressor. However, the prior art is low efficiency, has a complicated structure and many parts are required and the cost is high. Thereby a greater volume is required, while it is heavy. However, this is not matched to the current requirement of compact size and light.

SUMMARY OF THE INVENTION

Accordingly, the primary object of the present invention is to provide a refrigerator with thermal-electric semiconductor. No compressor, evaporator and condenser is used so that the cost is lowered and the volume is reduced. It can be assembled easily and no refrigerant is required.

To achieve above objects, the present invention provides a refrigerator with thermal-electric semiconductor comprising: a power supply, a thermal-electric semiconductor, a cooling water box, a cyclic water box, and a low temperature heat transfer unit; the cooling water box being a hollow box with cooling water therein; the cooling water box having a water inlet tube and a water outlet tube; the water inlet tube and water outlet tube being connected to the cyclic water box; a fan can be used to blow the cyclic water box for reducing the temperature thereof; a cold surface of the thermal-electric semiconductor being adhered to one side of the low temperature heat transfer unit; another side of the low temperature heat transfer unit entering into a body of a refrigerator; the low temperature heat transfer unit separating the refrigerator into a freezer and a freezing compartment; the low temperature heat transfer unit being with a temperature sensor and a temperature control circuit for controlling temperature.

The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawing.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a structural schematic view of the present invention.

FIG. 2 shows another embodiment of the present invention.

FIG. 3 shows the application of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

In order that those skilled in the art can further understand the present invention, a description will be provided in the following in details. However, these descriptions and the appended drawings are only used to cause those skilled in the art to understand the objects, features, and characteristics of the present invention, but not to be used to confine the scope and spirit of the present invention defined in the appended claims.

Referring to FIG. 1, the thermal-electric semiconductor refrigerator of the present invention is illustrated. The present invention comprises: a power supply 1, a thermal-electric semiconductor 2, a cooling water box 3, a cyclic water box 4, and a low temperature heat transfer unit 5. The power supply 1 has a switch 15 for selecting DC (direct current) input 13 or AC (alternative current) input 10 so that the refrigerator can be used at home or in a car. An output end 11 of the power supply 1 is a 12 Volt DC output. The output end 11 is connected to the thermal-electric semiconductor 2. One side of the thermal-electric semiconductor 2 is a cold surface 21 which is opposite to and face to a hot surface 23. The heat surface 23 is adhered to a cooling water box 3. The cooling water box 3 is a hollow box with cooling water therein. The cooling water box 3 has a water inlet tube 31 and a water outlet tube 32. The water inlet tube 31 and water outlet tube 32 are connected to the cyclic water box 4 so as to have better effects. A fan can be used to blow the cyclic water box 4 for reducing the temperature thereof. The cold surface 21 of the thermal-electric semiconductor 2 is adhered to one side of the low temperature heat transfer unit 5 which is made of metal with preferred heat transfer, such as aluminum. Another side of the low temperature heat transfer unit 5 enters into a body of a refrigerator. The low temperature heat transfer unit 5 separates a freezer and a freezing compartment which is smaller than the freezer. In the freezing compartment, the low temperature heat transfer unit 5 is curled as a hollow box so as to make the temperature of the low temperature heat transfer unit 5 being low. The freezer is cooled by the low temperature of the freezing compartment.

In the present invention, the power supply 1, cooling water box 3 and cyclic water box 4 have small volumes so that they are installed at the backside of the refrigerator. The whole refrigerator has a small volume so that it can be carried conveniently.

In the present invention, the lateral side of the low temperature heat transfer unit 5 is further installed with a temperature sensor 61 so that the temperature can be transferred to a temperature control circuit to decide whether the thermal-electric semiconductor 2 is necessary to be operated continuously. In the present invention, the cooling water box 3 and cyclic water box 4 can be replaced by other way, as illustrated in FIG. 2, the hot surface 23 of the thermal-electric semiconductor 2 can be adhered with heat dissipating fin set for saving volume and cost.

Referring to FIG. 3, the application of the present invention is illustrated. In the present invention, the refrigerator body 8 has a freezing compartment 81 and a freezer 82. The lower temperature of the freezer 82 induced by cold air from the freezing compartment 81. The freezer 82 is installed with spacers 83 for placing objects.

In the present invention, the thermal-electric semiconductor 2 is a cooling chip.

Advantages of the present invention are that: the present invention has a smaller volume, high efficiency, lower cost and without refrigerant.

The present invention is thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the present invention, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims.