THREE-DIMENSIONAL VAPOR CHAMBER COOLING DEVICE

Description

BACKGROUND

Technical Field

The disclosure relates to a three-dimensional vapor chamber, particularly to a three-dimensional vapor chamber cooling device having a planarly extended structure and a close arrangement.

Related Art

A three-dimensional vapor chamber (3D vapor chamber) is a phase change heat transfer device. Its structure is a combination of a vapor chamber and a heat pipe. Its internal chambers are communicated, so that the internal gas and liquid substances that exchange each other can directly move freely inside the two chambers to achieve a better cooling effect. However, such a three-dimensional vapor chamber requires a large amount of space to have vertical heat pipes and cooling fins on the vapor chamber, which limits the applications of the three-dimensional vapor chambers to the use space, and is especially difficult to apply to flat spaces.

In view of this, the inventors have devoted themselves to the above-mentioned prior art, researched intensively and cooperated with the application of science to try to solve the above-mentioned problems. Finally, the invention which is reasonable and effective to overcome the above drawbacks is provided.

SUMMARY

The disclosure provides a three-dimensional vapor chamber cooling device having a heat pipe extended parallelly to the lateral direction of the bottom plate and arranged closely.

The disclosure provides a three-dimensional vapor chamber cooling device including a body, a heat pipe, a fin assembly and a working fluid. The body includes a bottom plate and an upright plate. The upright plate is upright arranged on the bottom plate. A first chamber is encompassed in the bottom plate. A second chamber is encompassed in the upright plate. The first chamber communicates with the second chamber. The heat pipe is extended from a side of the upright plate and communicates with the second chamber. The fin assembly is disposed on the heat pipe. The working fluid is filled in the bottom plate in a liquid state. The working fluid can flow to the upright plate and the heat pipe when vaporizing.

In an embodiment of the disclosure, the heat pipe is parallel to the bottom plate.

In an embodiment of the disclosure, a first wick structure is attached on an inner wall of the bottom plate. A second wick structure is attached on an inner wall of the upright plate, and the first wick structure is connected to the second wick structure. A third wick structure is attached on an inner wall of the heat pipe, and the second wick structure is connected to the third wick structure.

In an embodiment of the disclosure, the second chamber is extended with a buffer space.

The first chamber communicates with the buffer space.

In an embodiment of the disclosure, the upright plate is disposed on a side of an edge of the bottom plate.

In an embodiment of the disclosure, a side of the bottom plate is extended with another heat pipe, and the another heat pipe communicates with the first chamber. The another heat pipe is disposed with another fin assembly.

In an embodiment of the disclosure, the body includes another upright plate, the upright plate and the another upright plate are upright disposed on the bottom plate and oppositely disposed on two sides of the bottom plate, and the heat pipe is connected between the upright plate and the another upright plate.

The upright plate of the three-dimensional vapor chamber cooling device of the disclosure is laterally extended with the heat pipe to make the heat pipe able to be arranged parallelly to the bottom plate so as to prevent the overall height of the three-dimensional vapor chamber cooling device from being overhigh.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective schematic view of the three-dimensional vapor chamber cooling device of the first embodiment of the disclosure;

FIG. 2 is an exploded schematic view of the three-dimensional vapor chamber cooling device of the first embodiment of the disclosure;

FIGS. 3 and 4 are cross-sectional views of the three-dimensional vapor chamber cooling device of the first embodiment of the disclosure;

FIG. 5 is a cross-sectional view of the three-dimensional vapor chamber cooling device of the second embodiment of the disclosure;

FIG. 6 is a cross-sectional view of the three-dimensional vapor chamber cooling device of the third embodiment of the disclosure;

FIG. 7 is a cross-sectional view of the three-dimensional vapor chamber cooling device of the fourth embodiment of the disclosure; and

FIG. 8 is a cross-sectional view of the three-dimensional vapor chamber cooling device of the fifth embodiment of the disclosure.

DETAILED DESCRIPTION

In the description of the present disclosure, it should be understood that the terms “front side”, “rear side”, “left side”, “right side”, “front end”, “rear end”, “distal end”, “longitudinal”, “transverse”, “vertical”, “top”, “bottom”, etc., which are used to indicate the orientations or positional relationships, are based on the orientations or positional relationships shown in the drawings. They are only for the convenience of describing the present disclosure and simplifying the description, and do not express or imply that the indicated devices or elements must be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the disclosure.

As used herein and not otherwise encompassed, the terms “substantially” and “approximately” are used to depict and describe small changes. When used in connection with an event or situation, the terms may include the precise moment at which the event or situation occurs, as well as the event or situation occurring to a close approximation. For example, when combined with a numerical value, the terms may include a range of variation less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.

The technical contents of this disclosure will become apparent with the detailed description of embodiments accompanied with the illustration of related drawings as follows. It is intended that the embodiments and drawings disclosed herein are to be considered illustrative rather than restrictive.

Please refer to FIGS. 1-4. The disclosure provides a three-dimensional vapor chamber cooling device, which includes a body 100, at least one heat pipe 200, at least one fin assembly 300 and a working fluid (not shown).

In the embodiment, the body 100 includes a bottom plate 110 and an upright plate 120. The upright plate 120 is upright arranged on the top surface of the bottom plate 110. In detail, the upright plate 120 is disposed on a side of an edge of the bottom plate 110. The bottom plate 110 appears to be hollow and a first chamber 101 is encompassed therein. The upright plate 120 appears to be hollow and a second chamber 102 is encompassed therein. The first chamber 101 communicates with the second chamber 102. A first wick structure 111 is attached on the inner wall of the bottom plate 110. A second wick structure 121 is attached on the inner wall of the upright plate 120. The first wick structure 111 is connected to the second wick structure 121.

In the embodiment, part of the upright plate 120 may be optionally disposed to appear to be of a stage shape to form a buffer space 103 therein. The buffer space 103 is extended from the second chamber 102. The first chamber 101 may be optionally disposed to communicate with the buffer space 103.

In the simplest embodiment, disposing only one heat pipe 200 may accomplish the functions of the disclosure, and the heat pipe 200 is extended from a side of the upright plate 120 and communicates with the second chamber 102. In the embodiment, the heat pipe 200 is parallel to the bottom plate 110 to be extended outside the boundary of the bottom plate 110, but the disclosure is not limited to this. A third wick structure 201 is attached on the inner wall of the heat pipe 200. The second wick structure 121 is connected to the third wick structure 201. The fin assembly 300 is disposed on the outer wall of the heat pipe 200. In the embodiment, multiple heat pipes 200 with the same structure and function are disposed on the same face of the upright plate 120, but the disclosure does not limit the amount of the heat pipe 200.

The working fluid is filled in the bottom plate 110 in a liquid state. The working fluid can flow to the upright plate 120 and the heat pipe 200 when vaporizing. When using the three-dimensional vapor chamber cooling device of the embodiment, the bottom side of the bottom plate 110 is used for contacting a heat source (not shown). Generally speaking, the heat source is disposed on a circuit board (not shown), and the bottom plate 110 of the three-dimensional vapor chamber cooling device is superposed on the circuit board. After the bottom plate 110 absorbs heat from the heat source, the working fluid is vaporized in the first chamber 101 by being heated, the vaporized working fluid can flow into the second chamber 102 and the heat pipe 200. The buffer space 103 may be used to regulate the gas working fluid to prevent the gas working fluid which suddenly increases from being unable to enter the heat pipe 200 in time to cause poor cooling when the heating power of the heat source suddenly rises. The gas working fluid in the heat pipe 200 is condensed into a liquid state by dissipating heat through the fin assembly 300. The liquid working fluid in the heat pipe 200 will flow back to the first chamber 101 through the second wick structure 121 and the first wick structure 111 after being absorbed by the third wick structure 201.

The upright plate 120 of the three-dimensional vapor chamber cooling device of the disclosure is laterally extended with the heat pipe 200 to make the heat pipe 200 able to be arranged parallelly to the circuit board so as to prevent the overall height of the three-dimensional vapor chamber cooling device from being overhigh. According to different arrangement requirements, the three-dimensional vapor chamber cooling device of the disclosure may have various possible arrangement variations as follows.

Please refer to FIG. 5, which shows the second embodiment of the disclosure. The three-dimensional vapor chamber cooling device of the embodiment includes a body 100, multiple heat pipes 200, multiple fin assemblies 300 and a working fluid. The body 100 has a bottom plate 110 as the abovementioned first embodiment. However, the upright plate 120a in this embodiment is upright disposed at the middle portion of the body 100, each of two sides of the upright plate 120a is disposed with a heat pipe 200, and all the heat pipes 200 of two sides of the upright plate 120a communicate with the second chamber 102. In the embodiment, each heat pipe 200 is extended parallelly to the bottom plate 110, and at least part of each heat pipe 200 is stacked on the bottom plate 110. A third wick structure 201 is attached on the inner wall of each heat pipe 200. The second wick structure 121 in the upright plate 120a is connected to each third wick structure 201. The fin assemblies 300 are separately disposed on two sides of the upright plate 120a. Each heat pipe 200 is separately connected to the corresponding fin assembly 300, so that the spaces on two sides of the upright plate 120a may be effectively utilized to dispose the heat pipe 200 and the fin assembly 300.

In the embodiment, part of the upright plate 120a may be optionally disposed with a buffer space 103 as the first embodiment, and part of the heat pipe 200 may also directly communicate with the buffer space 103.

Please refer to FIG. 6, which shows the third embodiment of the disclosure. The three-dimensional vapor chamber cooling device of the embodiment includes a body 100, multiple heat pipes 200b, a fin assembly 300b and a working fluid. The body 100 has a bottom plate 110 as the abovementioned first embodiment and an upright plate 120b. The structure of each heat pipe 200b is the same as the above embodiment and the heat pipe 200b is disposed on one side of the upright plate 120b. In the embodiment, each heat pipe 200b is extended parallelly to the bottom plate 110, and at least part of each heat pipe 200b is stacked on the bottom plate 110. Each heat pipe 200 is separately connected to the fin assembly 300b so as to make the heat pipe 200b, the fin assembly 300b and the bottom plate 110 closely arranged. In the embodiment, part of the upright plate 120 may be optionally disposed to appear to be of a stage shape to form a buffer space 103 therein. The buffer space 103 is extended from the second chamber 102. The buffer space 103 and the heat pipes 200b are separately disposed on two sides of the upright plate 120b to effectively utilize the spaces on the two sides of the upright plate 120b.

Please refer to FIG. 7, which shows the fourth embodiment of the disclosure. The three-dimensional vapor chamber cooling device of the embodiment includes a body 100, multiple heat pipes 200, 200c, multiple fin assemblies 300, 300c and a working fluid. The body 100 has a bottom plate 110 as the abovementioned first embodiment. However, the body 100 of the embodiment has a pair of upright plates 120c. The pair of upright plates 120c is oppositely disposed on two sides of the bottom plate 110. The heat pipes 200, 200c are separately extended parallelly to the bottom plate 110 from the two sides of each upright plate 120c. In detail, some of the heat pipes 200b are connected between the pair of upright plates 120c to be stacked on the bottom plate 110. The other heat pipes 200 are separately extended from each upright plate 120c to the outside of the bottom plate 110. The fin assemblies 300, 300c are separately disposed on two sides of each upright plate 120c. In other words, some fin assemblies 300c are disposed between the two upright plates 120c, and the other fin assemblies 300 are separately disposed on two opposite sides outside the bottom plate 110. Also, each heat pipe 200, 200c is connected to the corresponding fin assembly 300, 300c. The embodiment makes the heat pipes 200, 200c and the fin assemblies 300, 300c obtain maximum extension in the direction parallel to the bottom plate 110.

Please refer to FIG. 8, which shows the fifth embodiment of the disclosure. The structure of the three-dimensional vapor chamber cooling device of the embodiment is substantially the same as the first embodiment, but the top surface of the bottom plate 110 may be additionally disposed with a heat pipe 200a and a fin assembly 300a to directly dissipate heat of the bottom plate 110 according to the cooling requirement.

While this disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of this disclosure set forth in the claims.