SUBSTRATE HOLDER, PLATING APPARATUS, AND SUBSTRATE POSITIONING METHOD

Description

TECHNICAL FIELD

The present invention relates to a substrate holder, a plating apparatus, and a substrate positioning method.

BACKGROUND ART

To form a thin metal film on a surface of a substrate, a plating apparatus is used. In the plating apparatus, a substrate holder that releasably holds a substrate such as a semiconductor wafer may be used. Then, in the plating apparatus, the substrate held by the substrate holder is immersed in a plating solution, and a voltage is applied to the substrate, so that the surface of the substrate is plated.

An example of the substrate holder is described in PTL 1. PTL 1 discloses, as shown in FIG. 15 thereof, a substrate holder including a first holding member 31, and a second holding member 32 that sandwiches and holds a substrate Wf with the first holding member 31. The second holding member 32 includes a positioning member 70 for positioning the substrate Wf at a predetermined position. The first holding member 31 includes a protrusion 90. Then, when the first holding member 31 and second holding member 32 sandwich and hold the substrate Wf, the protrusion 90 contacts the positioning member 70 to move the positioning member 70 to a first position. As a result, the positioning member 70 contacts the substrate Wf to position the substrate Wf.

Furthermore, as shown in FIG. 14, the second holding member 32 includes a plurality of power supply contacts 50 for supplying power to the substrate Wf in contact with an outer peripheral portion of the substrate Wf. Thus, the substrate holder of PTL 1 can supply power to the substrate Wf via the power supply contacts 50.

CITATION LIST

Patent Literature

• • PTL 1: Japanese Patent Laid-Open No. 2018-9215

SUMMARY OF INVENTION

Technical Problem

As described above, in a substrate holder 30 of PTL 1, a first holding member 31 and a second holding member 32 sandwich a substrate Wf to hold the substrate Wf. That is, the first holding member 31 and the second holding member 32 engage with each other to hold the substrate Wf. In general, for two members to be engaged, clearance is provided so that the two members do not interfere. Consequently, the first holding member 31 may deviate by an amount of clearance from a designed position relative to the second holding member 32.

Furthermore, as described above, in the substrate holder 30 of PTL 1, a protrusion 90 included in the first holding member 31 contacts a positioning member 70 included in the second holding member 32 to move the positioning member 70. Consequently, if the first holding member 31 deviates from the designed position relative to the second holding member 32 due to the clearance between the first holding member 31 and the second holding member 32 during positioning of the substrate Wf, the protrusion 90 pushes the positioning member 70 excessively, and the positioning member 70 may be moved closer to the center of the substrate Wf than the designed position. As a result, there is concern that the positioning member 70 pushes the substrate Wf farther toward the center than the designed position, and the position of the positioned substrate Wf relative to the second holding member 32 may change. That is, with respect to the second holding member 32, there is concern that the substrate Wf deviates from a position at which the substrate should be disposed.

Furthermore, in this case, there is concern that power supply contacts 50 included in the second holding member 32 cannot contact a predetermined location of the substrate Wf due to the deviation of the substrate Wf. As a result, there is concern that a problem may occur in supplying power to the substrate Wf.

For these reasons, a substrate holder is required in which the positioning member 70 does not push the substrate Wf any farther toward the center than the designed position, even if the first holding member 31 deviates from the designed position relative to the second holding member 32, when positioning the substrate Wf.

Therefore, in view of the above-described problems, one object of the present disclosure is to provide a substrate holder, a plating apparatus and a substrate positioning method in which a centering pin (positioning member 70) does not push a substrate (substrate Wf) any farther toward the center than a designed position, even if a first holding member (first holding member 31) deviates from the designed position relative to a second holding member (second holding member 32), when positioning the substrate.

Solution to Problem

A substrate holder according to one embodiment includes a first holding member and a second holding member that sandwiches and holds a substrate with the first holding member, the second holding member including a positioning member for positioning the substrate at a predetermined position, and a stopper, the positioning member includes a centering pin movable between a first position and a second position, and is configured so that, when the centering pin moves from the second position to the first position, the centering pin contacts a peripheral edge of the substrate to position the substrate at the predetermined position, the first holding member includes a driving member configured to bias the centering pin toward the first position, when the first holding member and the second holding member hold the substrate, and the stopper is configured to contact the centering pin to stop the centering pin at the first position.

A plating apparatus according to one embodiment is a plating apparatus including a plating tank configured to store a plating solution, the above substrate holder, and a lifting mechanism configured to raise and lower the substrate holder. The substrate holder is configured to hold the substrate having a surface to be plated being directed downward, the second holding member is a support mechanism configured to support an outer peripheral portion of the surface to be plated of the substrate, and the first holding member is a back plate assembly disposed on a back side of the surface to be plated of the substrate, and configured to sandwich and hold the substrate with the support mechanism.

A substrate positioning method according to an embodiment is a method of positioning a substrate with the above substrate holder, the method including a step in which the first holding member and the second holding member sandwich and hold the substrate, a step in which the driving member moves the centering pin from the second position to the first position, a step in which the centering pin positions the substrate at the predetermined position, and a step in which the stopper contacts the centering pin to stop the centering pin at the first position.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view showing an overall configuration of a plating apparatus of the present embodiment.

FIG. 2 is a plan view showing the overall configuration of the plating apparatus of the present embodiment.

FIG. 3 is a vertical sectional view schematically showing a configuration of a plating module of the present embodiment.

FIG. 4 is a perspective view schematically showing a configuration of a substrate holder of the present embodiment.

FIG. 5 is a perspective view schematically showing a part of the substrate holder of the present embodiment in an enlarged manner.

FIG. 6 is a plan view of a support mechanism of the substrate holder of the present embodiment.

FIG. 7 is a perspective view of the support mechanism of the substrate holder of the present embodiment.

FIG. 8 is a perspective view of a positioning member of the present embodiment.

FIG. 9 is a perspective view schematically showing a part of the substrate holder of the present embodiment in an enlarged manner.

FIG. 10 is a cross-sectional view schematically showing a part of the substrate holder of the present embodiment in an enlarged manner.

FIG. 11 is a cross-sectional view schematically showing a part of the substrate holder of the present embodiment in an enlarged manner.

DESCRIPTION OF EMBODIMENTS

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components are denoted with the same reference signs and duplicate descriptions are omitted.

<Overall Configuration of Plating Apparatus>

FIG. 1 is a perspective view showing the overall configuration of a plating apparatus of the present embodiment. FIG. 2 is a plan view showing the overall configuration of the plating apparatus of the present embodiment. As shown in FIGS. 1 and 2, a plating apparatus 1000 includes a load port 100, a transfer robot 110, an aligner 120, a pre-wet module 200, a pre-soak module 300, a plating module 400, a cleaning module 500, a spin rinse dryer 600, a transfer device 700, and a control module 800.

The load port 100 is a module for transferring a substrate stored in a cassette such as a FOUP (not shown) into the plating apparatus 1000 and transferring the substrate from the plating apparatus 1000 out to the cassette. In the present embodiment, four load ports 100 are arranged side by side in a horizontal direction, and the number and arrangement of the load ports 100 are arbitrary. The transfer robot 110 is a robot for transferring the substrate and is configured to receive and deliver the substrate among the load ports 100, the aligner 120, the pre-wet module 200, and the spin rinse dryer 600. When the transfer robot 110 and the transfer device 700 receive and deliver the substrate between the transfer robot 110 and the transfer device 700, the substrate can be received and delivered via a temporary stand (not shown).

The aligner 120 is a module for aligning an orientation flat, a notch, or the like of the substrate in a predetermined direction. In the present embodiment, the two aligners 120 are arranged side by side in the horizontal direction, and the number and arrangement of the aligners 120 are arbitrary. The pre-wet module 200 replaces air inside a pattern formed on the surface of the substrate with a treatment solution, by wetting the surface to be plated of the substrate prior to a plating process, with the treatment solution, such as pure water or degassed water. The pre-wet module 200 is configured to perform a pre-wet process that facilitates supplying of a plating solution into the pattern, by replacing the treatment solution inside the pattern with the plating solution during plating. In the present embodiment, two pre-wet modules 200 are arranged side by side in a vertical direction, and the number and arrangement of the pre-wet modules 200 are arbitrary.

The pre-soak module 300 is, for example, configured to perform a pre-soak process of etching and removing, with a treatment solution such as sulfuric acid or hydrochloric acid, an oxide film having a large electrical resistance and present on the surface of a seed layer or the like formed on the surface to be plated of the substrate prior to the plating process to clean or activate a plating base surface. In the present embodiment, two pre-soak modules 300 are arranged side by side in the vertical direction, and the number and arrangement of the pre-soak modules 300 are arbitrary. The plating module 400 plates the substrate. The present embodiment includes two sets of 12 plating modules 400 including three plating modules arranged side by side in the vertical direction and four plating modules arranged side by side in the horizontal direction, so that 24 plating modules 400 in total are provided, and the number and arrangement of the plating modules 400 are arbitrary.

The cleaning module 500 is configured to perform a cleaning process on the substrate to remove the plating solution or the like remaining on the substrate after the plating process. In the present embodiment, two cleaning modules 500 are arranged side by side in the vertical direction, and the number and arrangement of the cleaning modules 500 are arbitrary. The spin rinse dryer 600 is a module for drying the substrate after the cleaning process by rotating the substrate at a high speed. In the present embodiment, two spin rinse dryers are arranged side by side in the vertical direction, and the number and arrangement of the spin rinse dryers are arbitrary. The transfer device 700 is a device for transferring the substrate among a plurality of modules in the plating apparatus 1000. The control module 800 is configured to control a plurality of modules of the plating apparatus 1000 and can include a general computer or a dedicated computer including an input/output interface to and from an operator, for example.

An example of a series of plating processes by the plating apparatus 1000 will be described. First, the substrate stored in the cassette is transferred into the load port 100. Subsequently, the transfer robot 110 takes the substrate out of the cassette of the load port 100 and transfers the substrate to the aligner 120. The aligner 120 aligns the orientation flat, notch, or the like of the substrate in the predetermined direction. The transfer robot 110 receives and delivers the substrate oriented by the aligner 120 to the pre-wet module 200.

The pre-wet module 200 performs a pre-wet process on the substrate. The transfer device 700 transfers the substrate subjected to the pre-wet process to the pre-soak module 300. The pre-soak module 300 performs a pre-soak process on the substrate. The transfer device 700 transfers the substrate subjected to the pre-soak process to the plating module 400. The plating module 400 plates the substrate.

The transfer device 700 transfers the substrate subjected to the plating process to the cleaning module 500. The cleaning module 500 performs the cleaning process on the substrate. The transfer device 700 transfers the substrate subjected to the cleaning process to the spin rinse dryer 600. The spin rinse dryer 600 performs a drying process on the substrate. The transfer robot 110 receives the substrate from the spin rinse dryer 600 and transfers the substrate subjected to the drying process to the cassette of the load port 100. Finally, the cassette containing the substrate is transferred out of the load port 100.

<Configuration of Plating Module>

Next, a configuration of the plating module 400 will be described. The 24 plating modules 400 in the present embodiment include the same configuration, and hence only one plating module 400 will be described. FIG. 3 is a vertical sectional view schematically showing the configuration of the plating module 400. As shown in FIG. 3, the plating module 400 includes a plating tank 410 for storing the plating solution. The plating module 400 includes a membrane 420 that separates an interior of the plating tank 410 in the vertical direction. The interior of the plating tank 410 is divided into a cathode region 422 and an anode region 424 by the membrane 420. The cathode region 422 and the anode region 424 are each filled with the plating solution. An anode 430 is provided on a bottom surface of the plating tank 410 in the anode region 424. A resistor 450 is disposed opposed to the membrane 420 in the cathode region 422. The resistor 450 is a member for uniformizing the plating process on a surface to be plated (surface to be treated) Wf-a of the substrate Wf and is composed of a plate-shaped member in which multiple holes are formed.

Furthermore, the plating module 400 includes a substrate holder 440 for holding the substrate Wf having the surface to be plated Wf-a directed downward. The plating module 400 includes a lifting mechanism 442 for raising and lowering the substrate holder 440. The lifting mechanism 442 can be implemented, for example, by a known mechanism such as a motor. The plating module 400 is configured to perform the plating process on the surface to be plated Wf-a of the substrate Wf, by immersing the substrate Wf in the plating solution of the cathode region 422 with the lifting mechanism 442 and applying a voltage between the anode 430 and the substrate Wf.

Furthermore, the plating module 400 includes a rotating mechanism 446 for rotating the substrate holder 440 so that the substrate Wf rotates about a virtual axis of rotation extending perpendicularly in the center of the surface to be plated Wf-a. The rotating mechanism 446 can be implemented, for example, by a known mechanism such as a motor.

<Configuration of Substrate Holder>

Next, details of the substrate holder 440 of the present embodiment will be described. FIG. 4 is a perspective view schematically showing the configuration of the substrate holder of the present embodiment. FIG. 5 is a perspective view schematically showing a part of the substrate holder of the present embodiment in an enlarged manner.

As shown in FIGS. 4 and 5, the substrate holder 440 includes a support mechanism (second or first holding member) 460 for supporting an outer peripheral portion of the surface to be plated Wf-a of the substrate Wf, a back plate assembly (first or second holding member) 470 for holding the substrate Wf, and a rotary shaft 448 extending vertically upward from the back plate assembly 470.

The back plate assembly 470 includes a disc-shaped floating plate 472 for sandwiching and holding the substrate Wf with the support mechanism 460. The floating plate 472 is disposed on a back side of the surface to be plated Wf-a of the substrate Wf. Furthermore, the back plate assembly 470 includes a floating mechanism 490 for biasing the floating plate 472 in a direction away from the back surface of the substrate Wf, and a pressing mechanism 480 for pressing the floating plate 472 onto the back surface of the substrate Wf against a biasing force applied by the floating mechanism 490.

The pressing mechanism 480 includes a disc-shaped back plate 474 disposed above the floating plate 472 and a flow path 476 formed inside the back plate 474. The flow path 476 includes a first flow path 476-1 extending radially from the center of the back plate 474 to an outer peripheral portion thereof, and a second flow path 476-2 extending in the vertical direction to open from the first flow path 476-1 to a lower surface of the back plate 474. The pressing mechanism 480 includes a diaphragm 484 disposed in the second flow path 476-2. The diaphragm 484 is a thin film member. The diaphragm 484 has an outer peripheral portion fixed to the lower surface of the back plate 474 by a fixing member 483. The pressing mechanism 480 includes a rod 482 as a form of the pressing member disposed between the diaphragm 484 and the floating plate 472. The rod 482 has a lower surface fixed to the floating plate 472 by a bolt 481, and the rod 482 has an upper surface in contact with a lower surface of the diaphragm 484. The rod 482 has an upper part covered with a cap 485 via the diaphragm 484. The diaphragm 484 has a center sandwiched between the cap 485 and the rod 482. A plurality of diaphragms 484, rods 482 and caps 485 are provided along a circumferential direction of the back plate assembly 470. In the present embodiment, an example in which the rod 482 as a separate member from the floating plate 472 is fixed to an upper surface of the floating plate 472 has been described and is not limited thereto and, for example, a protrusion may be formed along the circumferential direction on the upper surface of the floating plate 472. In this case, the protrusion will have a function as a pressing member similarly to the rod 482.

The pressing mechanism 480 includes a fluid source 488 for supplying fluid to the diaphragm 484. The fluid may be a gas such as air or a liquid such as water. In the rotary shaft 448, a flow path 449 extending along the vertical direction is formed, and the fluid source 488 is connected to an upper end of the flow path 449. A lower end of the flow path 449 is connected to the first flow path 476-1 formed in the back plate 474. The first flow path 476-1 extends radially from the center of the back plate 474 and communicates with an upper surface of the cap 485 via the second flow path 476-2. The fluid source 488 supplies fluid to the diaphragm 484 via the flow paths 449 and 476. Then, the cap 485 and the rod 482 are pressed downward, thereby pressing the floating plate 472 downward.

The support mechanism 460 includes an annular support member 462 for supporting the outer peripheral portion of the surface to be plated Wf-a of the substrate Wf. The support member 462 includes a flange 462a that protrudes to an outer peripheral portion of a lower surface of the back plate assembly 470. An annular sealing member 464 is disposed on the flange 462a. The sealing member 464 is a member having elasticity. The support member 462 supports the outer peripheral portion of the surface to be plated Wf-a of the substrate Wf via the sealing member 464. By sandwiching and holding the substrate Wf between the sealing member 464 and the floating plate 472, a gap between the support member 462 and the substrate Wf is sealed. The sealing member 464 having elasticity is collapsed and has change in thickness a under a pressing force of the pressing mechanism 480 onto the substrate Wf.

The support mechanism 460 includes an annular clamper 466 held on the support member 462. The clamper 466 can raise and lower the back plate assembly 470 relative to the support mechanism 460 when installing and removing the substrate Wf in and from the substrate holder 440. The clamper 466 can regulate the back plate 474 moving upward (away from the back surface of the substrate Wf) when fluid is supplied from the fluid source 488 to the diaphragm 484. This respect will be described below.

The back plate assembly 470 includes a slide ring 478 provided in an annular shape on an outer peripheral portion of an upper surface of the back plate 474. The slide ring 478 is movable in a circumferential direction independently of the back plate 474. The back plate assembly 470 includes a slide plate 479 protruding from the slide ring 478 toward the clamper 466.

For the clamper 466, a hook-shaped cutout 466d is formed on a surface facing the slide ring 478. The hook-shaped cutout 466d includes a first groove 466a extending in the vertical direction so that the slide plate 479 can rise and lower, and a second groove 466b that communicates with the first groove 466a and that extends along the circumferential direction of the clamper 466. On an upper surface of the second groove 466b, an abutment surface 466c is formed to abut on an upper surface of the slide plate 479 that moves with the upward movement of the back plate 474 when fluid is supplied from the fluid source 488 to the diaphragm 484. A plurality of slide plates 479 and cutouts 466d are provided along the circumferential direction of the substrate holder 440.

When the substrate Wf is installed relative to the substrate holder 440, the back plate assembly 470 is located above the support mechanism 460. When the substrate Wf is placed relative to the support mechanism 460 in this state, the slide plate 479 is aligned with the first groove 466a in the circumferential direction, and the back plate assembly 470 can be accordingly lowered relative to the support mechanism 460. After lowering the back plate assembly 470, the slide ring 478 is rotated in the circumferential direction to fit the slide plate 479 in the second groove 466b. Consequently, the slide plate 479 is opposed to the abutment surface 466c, and the upward movement of the back plate assembly 470 is accordingly regulated.

The floating mechanism 490 includes a shaft 492 extending upward from the floating plate 472 through a through hole 474a of the back plate 474. The shaft 492 has a lower end fixed to the floating plate 472. The floating mechanism 490 includes a flange 495 attached to an upper portion of the shaft 492 above the back plate 474. The flange 495 is attached to an upper end of the shaft 492 with a bolt 493. The floating mechanism 490 includes a guide 494 provided in the through hole 474a. The guide 494 has a hole slightly larger than an outer diameter of the shaft 492 and is attached to an upper end of the through hole 474a. The guide 494 is configured to guide movement of the shaft 492 in a lifting direction. By providing the guide 494, radial misalignment of the floating plate 472 and the back plate 474 can be inhibited from being caused.

The floating mechanism 490 includes a compression spring 496 attached to an upper surface of the guide 494 and a lower surface of the flange 495. The compression spring 496 may be provided between the upper surface of the back plate 474 and the lower surface of the flange 495. The compression spring 496 has a biasing force to lift the flange 495 upward and therefore biases the floating plate 472 in a direction away from the back surface of the substrate Wf via the shaft 492.

When fluid is supplied from the fluid source 488, the pressing mechanism 480 presses the substrate Wf to the sealing member 464 with a force stronger than the biasing force applied by the floating mechanism 490. The pressing mechanism 480 can change a holding position of the substrate Wf depending on a pressure of the fluid supplied from the fluid source 488.

As the pressure of the fluid supplied from the fluid source 488 increases, a collapsing amount of the sealing member 464 increases, and the sealing member 464 therefore has a thickness that decreases in proportion to increase in pressure of the fluid supplied from the fluid source 488. The decrease in thickness of the sealing member 464 indicates that the holding position of the substrate Wf moves downward and therefore indicates that a distance between the anode 430 and the substrate Wf shortens. That is, the distance between the anode 430 and the substrate Wf can be adjusted by adjusting a flow rate of the fluid supplied from the fluid source 488. Therefore, according to the present embodiment, uniformity of a plating film thickness on the surface to be plated Wf-a can be improved by adjusting the distance between the anode 430 and the substrate Wf depending on a type of substrate Wf. Furthermore, as shown in FIG. 5, the substrate holder 440 includes a peeling mechanism 471 configured to apply a force to the back surface of the surface to be plated Wf-a of the substrate Wf for peeling the substrate Wf from the back plate assembly 470.

FIG. 6 is a plan view of the support mechanism 460 of the substrate holder 440 of the present embodiment. FIG. 7 is a perspective view of the support mechanism 460 of the substrate holder 440 of the present embodiment. As shown in FIGS. 6 and 7, the support mechanism 460 includes a plurality of electrical contacts 902 and a positioning member 920.

Each electrical contact 902 is configured to supply power to the substrate Wf, in contact with the outer peripheral portion of the substrate Wf, when the substrate holder 440 holds the substrate Wf (see FIG. 9). These electrical contacts 902 are attached substantially around an entire circumference of the support mechanism 460 (see FIG. 6). The electrical contact 902 is preferably made of a spring material such as stainless steel. As an example, the electrical contact 902 is configured to elastically contact the outer peripheral portion of the substrate Wf, when the substrate Wf is held with the substrate holder 440. Specifically, the electrical contacts 902 contact the outer peripheral portion of the substrate Wf while deflecting, when the substrate Wf is held with the substrate holder 440. Consequently, the electrical contacts 902 can apply a force due to elasticity to the outer peripheral portion of the substrate Wf and securely contact the substrate Wf. Furthermore, as an example, the electrical contacts 902 contact the substrate Wf as much as 95% or more of the substrate Wf in the circumferential direction.

The positioning member 920 is configured to position the substrate Wf at a predetermined position. In the present embodiment, four positioning members 920 are arranged at equal intervals on the circumference of the support mechanism 460 (see FIG. 6). However, in another embodiment of the present disclosure, the number and arrangement of the positioning members 920 are arbitrary. It is particularly preferable that three or more positioning members 920 are arranged at equal intervals on the circumference of the support mechanism 460. Hereinafter, the positioning member 920 will be described in detail. Note that “positioning” means herein that what is not located at the predetermined position is moved to approach the predetermined position.

FIG. 8 is a perspective view of the positioning member 920 of the present embodiment. FIG. 9 is a perspective view schematically showing a part of the substrate holder 440 of the present embodiment in an enlarged manner. FIG. 10 is a cross-sectional view schematically showing a part of the substrate holder 440 of the present embodiment in an enlarged manner, when a centering pin 930 is at a second position. FIG. 11 is a cross-sectional view schematically showing a part of the substrate holder 440 of the present embodiment in an enlarged manner, when the centering pin 930 is at a first position.

Referring to FIG. 8, the positioning member 920 includes the centering pin 930, a bearing 940, an elastic member 950, and two fastening members 922. As shown in FIG. 9, the positioning member 920 is fixed to the support member 462 of the support mechanism 460 with the two fastening members 922.

The centering pin 930, as an example, is a rigid body made of a PEEK material. As shown in FIG. 10, the centering pin 930 includes a base 931 extending in a front-rear direction, a claw 932 extending downward from front of the base 931, and an extension 933 extending upward from rear of the base 931. Furthermore, as shown in FIG. 9, the centering pin 930 includes a rotary shaft 934 extending horizontally from the base 931. The bearing 940 is then configured to rotatably support the rotary shaft 934. Consequently, the centering pin 930 can rotate about the rotary shaft 934. The centering pin 930 is then configured to rotatably move between the first position and the second position. In other words, the positioning member 920 includes the centering pin 930 movable between the first position and the second position.

On the claw 932, a contact surface 935 for contacting a peripheral edge of the substrate Wf is formed (see FIG. 10). As a result, when the centering pin 930 moves between the first position and the second position, the contact surface 935 contacts the substrate Wf to push the substrate Wf. That is, when the centering pin 930 contacts the peripheral edge of the substrate Wf to push the substrate, the positioning member 920 positions the substrate Wf at the predetermined position.

Referring to FIG. 11, the back plate assembly 470 includes a driving member 990. Furthermore, the centering pin 930 has a surface to be pressed 938 located on an upper side of the extension 933. The driving member 990 is, as an example, a plunger with an elastic body (spring) and is fixed to the back plate 474. In other words, the driving member 990 includes a spring 991. The driving member 990 is configured to push the surface to be pressed 938 and to bias the centering pin 930 toward the first position, when holding the substrate Wf with the back plate assembly 470 and the support mechanism 460. Consequently, the centering pin 930 moves from the second position to the first position during holding of the substrate Wf.

Furthermore, as an example, the surface to be pressed 938 is parallel to the surface to be plated Wf-a of the substrate Wf (see FIG. 11). The driving member 990 is also configured to press the surface to be pressed 938 in a pressing direction perpendicular to the surface to be plated Wf-a of the substrate Wf. That is, the surface to be pressed 938 is orthogonal to the pressing direction of the driving member 990. Thus, the driving member 990 can apply, to the surface to be pressed 938, only a force in an orientation substantially orthogonal to the surface to be pressed 938. Consequently, when the driving member 990 applies the force to the surface to be pressed 938, the driving member 990 is unlikely to slip on the surface to be pressed 938.

If the driving member 990 slips on the surface to be pressed 938, the driving member 990 and the surface to be pressed 938 rub against each other, and the driving member 990 and the surface to be pressed 938 may be worn. Then, if the driving member 990 or the surface to be pressed 938 is worn, the driving member 990 may not allow the centering pin 930 to move to the first position. Furthermore, particulates may be generated due to friction between the driving member 990 and the surface to be pressed 938. However, in the present embodiment, as described above, when the driving member 990 applies the force to the surface to be pressed 938, the driving member 990 is unlikely to slip on the surface to be pressed 938. As a result, wear on the driving member 990 and surface to be pressed 938 is reduced. Furthermore, the generation of particulates due to the friction between the driving member 990 and the surface to be pressed 938 is also reduced.

Referring to FIG. 10, the elastic member 950 extends through a stopper 980 and is located inside a hole 936 provided in the base 931 and a hole 463 provided in the support member 462. The elastic member 950 is, as an example, a coil spring. The elastic member 950 is configured to bias a bottom surface 937 of the base 931 upward. That is, the elastic member 950 biases the centering pin 930 toward the second position. Consequently, when the driving member 990 does not move the centering pin 930 to the first position, the centering pin 930 is automatically moved to the second position by the elastic member 950.

As shown in FIG. 10, the support mechanism 460 further includes the stopper 980. The stopper 980 is located under the base 931 of the centering pin 930 and has an abutment surface 982. When the centering pin 930 is located at the first position, the abutment surface 982 configured to contact a lower surface 939 of the centering pin 930. That is, the stopper 980 is configured to contact the centering pin 930 to stop the centering pin 930 at the first position.

<Method of Holding Substrate Wf of Substrate Holder 440>

Next, an example of a method of holding the substrate Wf of the substrate holder 440 will be described. First, the substrate Wf is mounted on a sealing member 264 (see FIG. 10). Next, the back plate assembly 470 lowers from above the support member 462 toward the support member 462 to sandwich and hold the substrate Wf with the substrate holder 440. Next, the driving member 990 pushes the surface to be pressed 938 and biases the centering pin 930 toward the first position (see FIG. 11). Thus, the centering pin 930 moves from the second position toward the first position. As a result, the centering pin 930 contacts the peripheral edge of the substrate Wf to push the substrate Wf. Thus, the substrate Wf moves to a position at which the substrate is to be positioned. In this way, the positioning by the centering pin 930 is performed. In principle, the positioning by the centering pin 930 is completed before the centering pin 930 contacts the stopper 980. In other words, when the centering pin 930 is between the first position and the second position, the positioning of the substrate Wf is completed. Alternatively, the positioning of the substrate Wf may be completed, when the centering pin 930 contacts the stopper 980 and the centering pin 930 stops at the first position.

The back plate assembly 470 then lowers to and stops at the predetermined position. The slide ring 478 then rotates, and the slide plate 479 of the slide ring 478 fits into the second groove 466b (see FIG. 4). This regulates the upward movement of the back plate assembly 470. The fluid source 488 then supplies fluid to the diaphragm 484 via the flow paths 449 and 476. Consequently, the floating plate 472 moves downward, and the substrate Wf is sandwiched, held and fixed between the floating plate 472 and the sealing member 464. That is, the substrate Wf is sandwiched and held between the support mechanism 460 and the back plate assembly 470. In this way, the substrate holder 440 holds the substrate Wf.

As described above, in the substrate holder 440, when the support mechanism 460 and the back plate assembly 470 sandwich and hold the substrate Wf, the positioning member 920 can position the substrate Wf at the predetermined position.

Furthermore, in the substrate holder 440, the centering pin 930 moves from the second position to the first position, when positioning the substrate Wf. In this case, since the stopper 980 is provided, the centering pin 930 is securely stopped at the first position. Since the stopper 980 is provided in the support mechanism 460, the first position at which the centering pin 930 stops does not change relative to the support mechanism 460. Consequently, in the substrate holder 440, the centering pin 930 does not push the substrate Wf any farther toward the center than a designed position, even if the floating plate 472 deviates from the designed position relative to the support mechanism 460, when positioning the substrate Wf. That is, the substrate holder 440 can prevent the substrate Wf from deviating from the position at which the substrate is to be placed relative to the support mechanism 460 due to the centering pin 930 pushing the substrate Wf excessively.

Furthermore, as described above, the support mechanism 460 includes the plurality of electrical contacts 902. Consequently, there is no deviation of the contact position of the electrical contact 902 due to the centering pin 930 pushing the substrate Wf farther toward the center than the designed position. That is, the substrate holder 440 can prevent the contact position of the electrical contact 902 from deviating due to the centering pin 930 excessively pushing the substrate Wf.

Furthermore, as described above, the driving member 990 includes the spring 991. Consequently, after the centering pin 930 is moved to the first position, the spring 991 is compressed, and the driving member 990 does not further push the centering pin 930. As a result, the driving member 990, the centering pin 930 and the stopper 980 are prevented from being disrupted due to excessive force applied to these components. Furthermore, when the substrate Wf is large, the spring 991 of the driving member 990 functions as a cushion, and the substrate Wf is not damaged by the excess force acting on the substrate Wf. That is, the substrate holder 440 can prevent the substrate Wf from being damaged.

[Supplements]

A part of or all the above embodiments may also be described in supplements as follows and are not limited thereto.

(Supplement 1)

A substrate holder according to Supplement 1 includes a first holding member, and a second holding member that sandwiches and holds a substrate with the first holding member, the second holding member including a positioning member for positioning the substrate at a predetermined position, and a stopper, wherein the positioning member includes a centering pin movable between a first position and a second position, and is configured so that, when the centering pin moves from the second position to the first position, the centering pin contacts a peripheral edge of the substrate to position the substrate at the predetermined position, the first holding member includes a driving member configured to bias the centering pin toward the first position, when the first holding member and the second holding member hold the substrate, and the stopper is configured to contact the centering pin to stop the centering pin at the first position.

Since the substrate holder according to Supplement 1 includes the stopper, the centering pin securely stops at the first position. Since the stopper is provided in the second holding member, the first position at which the centering pin stops does not change relative to the second holding member. That is, in this substrate holder, the centering pin does not push the substrate any farther toward the center than a designed position, even if the first holding member deviates from the designed position relative to the second holding member, when positioning the substrate.

(Supplement 2)

A substrate holder according to Supplement 2 is the substrate holder according to Supplement 1, wherein the second holding member further includes electrical contacts that contact the substrate to supply power to the substrate.

The substrate holder according to Supplement 2 can prevent deviation of contact positions of the electrical contacts from being caused by the centering pin pushing the substrate farther toward the center than the designed position.

(Supplement 3)

A substrate holder according to Supplement 3 is the substrate holder according to Supplement 1 or 2, wherein the positioning member includes an elastic member for biasing the centering pin toward the second position.

In the substrate holder according to Supplement 3, when the driving member does not move the centering pin to the first position, the centering pin is automatically moved to the second position by the elastic member.

(Supplement 4)

A substrate holder according to Supplement 4 is the substrate holder according to any one of Supplements 1 to 3, wherein the driving member includes a plunger with a spring or with an elastic body for biasing the centering pin toward the first position.

In the substrate holder according to Supplement 4, when positioning the substrate, the plunger with the spring or with the elastic body moves the centering pin from the second position to the first position.

(Supplement 5)

The substrate holder according to Supplement 5 is the substrate holder according to any one of Supplements 1 to 4, wherein the centering pin has a surface to be pressed, the driving member is configured to press the surface to be pressed in a pressing direction perpendicular to a surface to be treated of the substrate, when the first holding member and the second holding member hold the substrate, and the surface to be pressed is orthogonal to the pressing direction.

In the substrate holder according to Supplement 5, the driving member applies a force oriented orthogonally to the surface to be pressed to the surface to be pressed. Consequently, when the driving member applies the force to the surface to be pressed, the driving member is unlikely to slip on the surface to be pressed. As a result, wear on the driving member or the surface to be pressed is reduced. Furthermore, generation of particulates due to friction between the driving member and the surface to be pressed can be reduced.

(Supplement 6)

A substrate holder according to Supplement 6 is the substrate holder according to any one of Supplements 1 to 5, wherein the centering pin includes a rotary shaft, the positioning member includes a bearing that supports the rotary shaft, and the centering pin rotates about the rotary shaft to move between the first position and the second position.

(Supplement 7)

A substrate holder according to Supplement 7 is the substrate holder according to any one of Supplements 1 to 6, wherein the second holding member includes four positioning members.

In the substrate holder according to Supplement 7, the four positioning members can position the substrate.

(Supplement 8)

A plating apparatus according to Supplement 8 is a plating apparatus including a plating tank configured to store a plating solution, the substrate holder according to any one of Supplements 1 to 7, and a lifting mechanism configured to raise and lower the substrate holder, wherein the substrate holder is configured to hold the substrate having a surface to be plated being directed downward, the second holding member is a support mechanism configured to support an outer peripheral portion of the surface to be plated of the substrate, and the first holding member is a back plate assembly disposed on a back side of the surface to be plated of the substrate, and configured to sandwich and hold the substrate with the support mechanism.

The plating apparatus of Supplement 8 has the same effect as the substrate holder of Supplement 1. That is, in the plating apparatus of Supplement 8, even if the first holding member deviates from the designed position relative to the second holding member when positioning the substrate, the centering pin does not push the substrate any farther toward the center than the designed position.

(Supplement 9)

A substrate positioning method according to Supplement 9 is a method of positioning a substrate with the substrate holder according to any one of Supplements 1 to 7, the method including a step in which the first holding member and the second holding member sandwich and hold the substrate, a step in which the driving member moves the centering pin from the second position to the first position, a step in which the centering pin positions the substrate at the predetermined position, and a step in which the stopper contacts the centering pin to stop the centering pin at the first position.

The substrate positioning method of Supplement 9 has the same effect as the substrate holder of Supplement 1. That is, in the substrate positioning method of Supplement 9, even if the first holding member deviates from the designed position relative to the second holding member when positioning the substrate, the centering pin does not push the substrate any farther toward the center than the designed position.

REFERENCE SIGNS LIST

• • 264 sealing member
  • 400 plating module
  • 410 plating tank
  • 440 substrate holder
  • 442 lifting mechanism
  • 460 support mechanism
  • 462 support member
  • 470 back plate assembly
  • 472 floating plate
  • 474 back plate
  • 902 electrical contact
  • 920 positioning member
  • 930 centering pin
  • 934 rotary shaft
  • 935 contact surface
  • 938 surface to be pressed
  • 940 bearing
  • 950 elastic member
  • 980 stopper
  • 982 abutment surface
  • 990 driving member
  • 1000 plating apparatus
  • Wf substrate