Patent application title:

SYSTEM FOR CONVERTING CRYOCOOLED REFRIGERATION PLATFORMS TO CRYOGENIC PLANT-BASED COOLING

Publication number:

US20250389463A1

Publication date:
Application number:

19/247,923

Filed date:

2025-06-24

Smart Summary: A new system helps change regular refrigerators into ones that use plant-based cooling. It includes a special module that can be added to the fridge, which has connections for bringing in and sending out coolant. This module also has a part for exchanging heat to keep things cold. There are pipes that connect this module to a plant that provides the coolant. Overall, it makes refrigeration more environmentally friendly by using natural cooling methods. 🚀 TL;DR

Abstract:

Embodiments are directed to a system for retrofitting a cooling system that includes an interface module configured to be installed in a refrigerator, comprising an inlet connection, outlet connection, and heat exchange vessel, along with an inlet line connecting the interface module to a coolant plant, and a return line connecting the interface module to the coolant plant.

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Classification:

F25B41/40 »  CPC main

Fluid-circulation arrangements Fluid line arrangements

F25B9/10 »  CPC further

Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point with several cooling stages

F25B9/12 »  CPC further

Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using He-He dilution

F25B2400/21 »  CPC further

General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of Modules for refrigeration systems

Description

CROSS REFERENCE TO RELATED PATENT APPLICATIONS

This patent application claims the priority and benefit under 35 U.S.C. § 119(e) of U.S. Provisional Patent Application Ser. No. 63/663,353 filed Jun. 24, 2024, entitled “SYSTEM FOR CONVERTING CRYOCOOLED REFRIGERATION PLATFORMS TO CRYOGENIC PLANT-BASED COOLING”. U.S. Provisional Patent Application Ser. No. 63/663,353 is herein incorporated by reference in its entirety.

STATEMENT OF GOVERNMENT RIGHTS

The invention described in this patent application was made with Government support under the Fermi Research Alliance, LLC, Contract Number DE-AC02-07CH11359 awarded by the U.S. Department of Energy, as well as under the FERMI FORWARD DISCOVERY GROUP, LLC, Contract Number 89243024CSC000002 awarded by the U.S. Department of Energy. The Government has certain rights in the invention.

TECHNICAL FIELD

The embodiments are generally related to the field of cooling. Embodiments are also related to the field of cryogenic refrigeration. Embodiments further relate to the field of ultra-low temperature cooling. Embodiments are further related to conversion of cryocooler-based refrigeration to cryogenic cooling. Embodiments are further related to methods and associated systems for retrofitting cooling systems. Embodiments are related to cooling systems for applications that require ultra-low temperatures including cryogenic photon detectors and quantum computing applications. Embodiments are further related to conversion of cryocooler-based refrigeration platforms to cryogenic plant-based cooling, with particular application to dilution refrigerators.

BACKGROUND

As computing applications continue to move toward quantum processing, there is an increasing need for ultra-low temperature cooling systems. Certain aspects of a quantum computing assembly must operate below a temperature of 1 Kelvin. However, it is impossible to operate a quantum computing assembly below 1 Kelvin directly from room temperature.

Instead, some form of tiered cooling can be used. For example, a first stage can be cooled to a temperature of nominally 70K and then further cooled to nominally 4K before additional stages provide cooling below 1 Kelvin.

Likewise, certain types of photon detectors require operating temperatures below 1 Kelvin. This can include, but is not limited to, high energy physics applications or experiments.

Cooling system technology developments have been dominated by the rise of commercial, off the shelf ultra-low temperature refrigerators, known as dilution refrigerators. These ultra-low temperature refrigerators have revolutionized several industries, and are commonly used for computing or scientific applications where lower temperature processes are required. It is not uncommon for a single laboratory or facility to have numerous ultra-low temperature dilution refrigerators.

While the dilution refrigerators are incredibly useful, they also have some notable downsides. For example, such cooling elements are not nearly as efficient as, for example, large scale liquid helium plants used for larger cooling applications. In addition, these cooling elements do not provide as much cooling power as larger liquid helium cryogenic plants. As such, operating multiple ultra-low temperature refrigerators is not cost effective and provides limited cooling powers, particularly in facilities where other more efficient and powerful cooling systems are available.

As such, it would be advantageous to have a means for leveraging larger plant-based cooling systems where available. Accordingly, there is a need in the art for methods and systems for connecting refrigerators (e.g., dilution refrigerators) to larger scale cooling systems as disclosed herein.

SUMMARY

The following summary is provided to facilitate an understanding of some of the innovative features unique to the embodiments disclosed and is not intended to be a full description. A full appreciation of the various aspects of the embodiments can be gained by taking the entire specification, claims, drawings, and abstract as a whole.

It is, therefore, one aspect of the disclosed embodiments to provide an improved system and method for cooling.

It is another aspect of the disclosed embodiments to provide improved ultra-low cooling applications.

It is another aspect of the disclosed embodiments for retrofitting cooling systems.

It is another aspect of the disclosed embodiments to provide cooling systems for applications that require ultra-low temperatures including particle accelerator applications and quantum computing application.

It is yet another aspect to provide systems and methods for conversion of cryocooler-based refrigeration platforms to cryogenic plant-based cooling, with particular application to dilution refrigerators.

The aforementioned aspects and other objectives and advantages can now be achieved as described herein. In an embodiment, a system comprises an interface module configured to be installed in a refrigerator, an inlet line connecting the interface module to a coolant plant, and a return line connecting the interface module to the coolant plant. In an embodiment, the system comprises an inlet bayonet connection configured to connect to the inlet line and an outlet bayonet connection configured to connect to the return line. In an embodiment, the interface module further comprises a vacuum flange. In an embodiment, the interface module further comprises a heat exchanger vessel. In an embodiment, the heat exchanger vessel further comprises a plurality of heat exchanger fins and a heat exchanger coil. In an embodiment, the interface module comprises one of a liquid helium interface module and a liquid nitrogen interface module.

In certain embodiments a system comprises an interface module configured to be installed in a refrigerator, an inlet line connecting the interface module to a coolant plant, and a return line connecting the interface module to at least one of the coolant plant or a vent. In an embodiment, the system further comprises an inlet connection configured to connect to the inlet line and an outlet connection configured to connect to the return line. In an embodiment, the inlet connection comprises a bayonet inlet connection, and the outlet connection comprises a bayonet outlet connection. In an embodiment, the interface module further comprises a vacuum flange. In an embodiment, the interface module further comprises a heat exchanger vessel. In an embodiment, the heat exchanger vessel further comprises a heat exchanging surface and a heat exchanger coil. In an embodiment, the heat exchanging surface comprises a plurality of heat exchanger fins. In an embodiment, the interface module comprises a liquid helium interface module. In an embodiment, the interface module comprises a liquid nitrogen interface module. In an embodiment, the liquid nitrogen interface module is configured to operate with gaseous helium between 30-100 Kelvin.

In another embodiment, a cooling system comprises a two stage cryocooler refrigerator, a first interface module installed in one stage of the two stage cryocooler, a second interface module installed in another stage of the two stage cryocooler, a first inlet line connecting the first interface module to a first coolant source, a second inlet line connecting the second interface module to a second coolant source, a first return line connecting the first interface module to at least one of the first coolant source or a vent, and a second return line connecting the second interface module to the second coolant source. In an embodiment, the cooling system further comprises a first inlet connection configured to connect to the first inlet line, a first outlet connection configured to connect to the first return line, a second inlet connection configured to connect to the second inlet line, and a second outlet connection configured to connect to the second return line. In an embodiment, each of the first inlet connection and second inlet connection comprises bayonet inlet connections, and each of the first outlet connection and second outlet connection comprise a bayonet outlet connections. In an embodiment, the first interface module further comprises a vacuum flange. In an embodiment, the second interface module further comprises a heat exchanger vessel. In an embodiment, the heat exchanger vessel further comprises a heat exchanging surface, a heat exchanger coil, and a plurality of heat exchanger fins. In an embodiment, the second interface module comprises a liquid helium interface module. In an embodiment, the first interface module comprises a liquid nitrogen interface module. In an embodiment, the liquid nitrogen interface module is configured to operate with gaseous helium between 30-100 Kelvin.

In another embodiment, a retrofit dilution refrigerator comprises a two stage cryocooler refrigerator, a first interface module installed in one stage of the two stage cryocooler, the first interface module comprising a liquid nitrogen interface module, a second interface module installed in another stage of the two stage cryocooler, the second interface module comprising a liquid helium interface module, a first inlet line connecting the first interface module to a liquid nitrogen source, a second inlet line connecting the second interface module to a liquid helium source, a first return line connecting the first interface module to at least one of the first coolant source or a vent, and a second return line connecting the second interface module to the second coolant source.

BRIEF DESCRIPTION OF THE FIGURES

The accompanying figures, in which like reference numerals refer to identical or functionally similar elements throughout the separate views and which are incorporated in and form a part of the specification, further illustrate the embodiments and, together with the detailed description, serve to explain the embodiments disclosed herein.

FIG. 1 illustrates an exemplary prior art dilution refrigerator;

FIG. 2 illustrates a schematic diagram of a cooling system, in accordance with the disclosed embodiments;

FIG. 3A illustrates a liquid helium (LHe) interface module, in accordance with the disclosed embodiments;

FIG. 3B illustrates another view of an LHe interface module, in accordance with the disclosed embodiments;

FIG. 4 illustrates aspects of a heat exchanger vessel, in accordance with the disclosed embodiments;

FIG. 5A illustrates a liquid nitrogen (LN) interface module, in accordance with the disclosed embodiments;

FIG. 5B illustrates another view of an LN interface module, in accordance with the disclosed embodiments;

FIG. 6 illustrates a LHe interface module and LN interface module installed in a retrofit dilution refrigerator, in accordance with the disclosed embodiments; and

FIG. 7 illustrates steps associated with a method for retrofitting a dilution refrigerator, in accordance with the disclosed embodiments.

DETAILED DESCRIPTION

The particular values and configurations discussed in the following non-limiting examples can be varied, and are cited merely to illustrate one or more embodiments, and are not intended to limit the scope thereof.

Example embodiments will now be described more fully hereinafter with reference to the accompanying drawings, in which illustrative embodiments are shown. The embodiments disclosed herein can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the embodiments to those skilled in the art. Like reference numerals refer to like elements throughout.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” a used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

Throughout the specification and claims, terms may have nuanced meanings suggested or implied in context beyond an explicitly stated meaning. Likewise, the phrase “in one embodiment” as used herein does not necessarily refer to the same embodiment and the phrase “In another embodiment” as used herein does not necessarily refer to a different embodiment. It is intended, for example, that claimed subject matter include combinations of example embodiments in whole or in part.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

It is contemplated that any embodiment discussed in this specification can be implemented with respect to any method, kit, reagent, or composition of the invention, and vice versa. Furthermore, compositions of the invention can be used to achieve methods of the invention.

It will be understood that particular embodiments described herein are shown by way of illustration and not as limitations. The principal features can be employed in various embodiments without departing from the scope disclosed herein. Those skilled in the art will recognize, or be able to ascertain, using no more than routine experimentation, numerous equivalents to the specific procedures described herein. Such equivalents are considered to be within the scope of the disclosed embodiments and are covered by the claims.

The use of the word “a” or “an” when used in conjunction with the term “comprising in the claims and/or the specification may mean “one,” but it is also consistent with the meaning of “one or more,” at “at least one,” and “one or more than one.” The use of the term “or” in the claims is used to mean “and/or” unless explicitly indicated to refer to alternatives only or the alternatives are mutually exclusive, although the disclosure supports a definition that refers to only alternatives and “and/or.” Throughout this application, the term “about” is used to indicate that a value includes the inherent variation of error for the device, the method being employed to determine the value, or the variation that exists among the study subjects.

As used in this specification and claim(s), the words “comprising” (and any form of comprising, such as “comprise” and “comprises”), “having” (and any form of “having,” such as “have” and “has”), “including” (and any form of “including,” such as “includes” and “include”) or “containing” (and any form of “containing,” such as “contains” and “contain”) are inclusive or open-ended and do not exclude additional, un-recited elements or method steps.

All of the compositions and/or methods disclosed and claimed herein can be made and executed without undue experimentation in light of the present disclosure. While the compositions and methods have been described in terms of preferred embodiments, it will be apparent to those of skill in the art that variations may be applied to the compositions and/or methods and in the steps, or in the sequence of steps, of the method described herein without departing from the concept, spirit, and scope of the disclosed embodiments. All such similar substitutes and modifications apparent to those skilled in the art are deemed to be within the spirit, scope and concept as defined by the appended claims.

The embodiments disclosed herein are directed to systems and methods for converting a cryostat, dilution refrigerator, or other cooling system based on a mechanical cold head, to operate with cryogenic liquid or cryogenic gas supplied by a cryogenic plant, coolant storage tank, or other such external source, by replacing the cold head with an assembly incorporating heat exchanger(s) and connections to a transfer line or other external refrigerant supply.

FIG. 1 illustrates an exemplary prior art dilution refrigerator 100, before retrofitting as disclosed herein. The dilution refrigerator 100 can generally comprise a two stage cryocooler. In certain embodiments, the two stage cryocooler can comprise a pulse tube cooler or other such device. The dilution refrigerator further includes an additional heat exchanger. The system includes additional stages operating at lower temperatures, including but not limited to a 1 K pot and still.

FIG. 2 illustrates a block diagram of a system 200 for connecting a liquid nitrogen storage vessel/plant 205 and/or a liquid helium vessel/plant 210 to one or more dilution refrigerators 215 or other such device, disposed in a facility 255. It should be appreciated that the phrase storage vessel/plant can generally refer to any structure or system used to generate or store associated coolants. Collectively these can also be referred to as a coolant source. The storage vessel 205 can be fluidically connected to a supply line 220 which can connect to a refrigerator 215, and a return line 225 from a refrigerator 215 to the storage vessel 205. In certain embodiments, the return line 225 can also connect to, or otherwise comprise a vent line 255 configured to vent to the exterior of the facility 255.

Similarly, a liquid helium plant 210 can be fluidically connected to a supply line 230 which can connect to a refrigerator 215, and a return line 235 from a refrigerator 215 to the liquid helium plant 210.

It should be appreciated that in some embodiments, the system does not need to be connected to liquid nitrogen. Instead, in certain embodiments, the end user can alternatively connect a nominally liquid nitrogen device to a 50 Kelvin gas feed of helium.

In certain embodiments, the system 200 is premised on the use of a liquid nitrogen (LN) interface module 240, and/or a liquid Helium (LHe) interface module 245. It should be understood that the LN interface module can provide cooling to temperatures on the order of 80 Kelvin, and the LHe interface module can provide cooling to temperatures on the order of 4 Kelvin.

The LN interface module 240 comprises a drop-in replacement module configured to replace a cooling apparatus in a stage of the prior art dilution refrigerator 100. Similarly, the LHe interface module 245 is configured to replace a cooling apparatus in a stage of the prior art dilution refrigerator 100. In this way, the system 200 can operate with cooling provided by the LN storage vessel 205 or LHe plant 210, without replacing the dilution refrigerators already disposed in a facility 255. The LHe plant can be configured to supply gaseous helium between 30-100 Kelvin.

FIG. 3A and FIG. 3B illustrate aspects of an LHe interface module 245 in accordance with the disclosed embodiments. The LHe interface module 245 can generally comprise a connection assembly 315 further comprising an inlet connection 305 and an outlet connection 310. The inlet connection 305 can comprise a bayonet inlet connection and the outlet connection 310 can comprise a bayonet outlet connection. The bayonet inlet connection 305 is configured to connect to supply line 230, and the bayonet outlet connection 310 is configured to connect to the return line 235. The LHe interface module 245 further includes a vacuum flange 320 and a heat exchanger vessel 325.

FIG. 4 illustrates aspects of the heat exchanger vessel 325. The heat exchanger vessel 325 comprises a vessel body 405. The vessel body 405 houses a heat exchanger surface 410. In certain embodiments the heat exchanger surface can comprise a plurality of heat exchanger fins 410 configured around a concentrically located heat exchanger coil 415. The heat exchanger coil 415 can be configured to accept liquid helium, or other such cooling liquid.

FIG. 5A and FIG. 5B illustrate aspects of an LN interface module 240 in accordance with the disclosed embodiments. The LN interface module 240 can generally comprise a connection assembly 515 further comprising a bayonet inlet connection 505 and a bayonet outlet connection 510. The bayonet inlet connection 505 is configured to connect to supply line 220, and the bayonet outlet connection 510 is configured to connect to the return line (or vent) 225. The LN interface module 240 further includes a vacuum flange 520. The system further comprises a heat exchanger vessel 525.

FIG. 6 illustrates a retrofit dilution refrigerator system 600, in accordance with the disclosed embodiments. The system 600 includes an LHe interface module 245 and the LN interface module 240 installed in a dilution refrigerator 615, where stock cooling elements of various stages have been removed.

In this embodiment, the LN interface module 240 is used to cool the first stage 605. Liquid Nitrogen, supplied by a liquid Nitrogen plant or storage vessel is used as the coolant provided to the LN interface module 240 to provide cooling in the first stage 605.

Similarly, the LHe interface module 245 is used to cool the second stage 610. Liquid Helium, supplied by a liquid helium plant, is used as the coolant provided to the LHe interface module 245 to provide cooling to the second stage 610. In this way, a standard dilution refrigerator can be retrofit to be cooled using a supply of cryogenic liquid.

It should be appreciated that this exemplary embodiment shows the use of an LN2 interface module 240 and a LHe interface module 245 in a single dilution refrigerator (in different stages), but in other embodiments, the system can be configured to supply coolant to multiple dilution refrigerators in a facility, in accordance with the disclosed embodiments. In addition, in certain embodiments, the system can be connected within a dilution refrigerator as well, depending on how many access ports the dilution refrigerator has. If the dilution refrigerator has x number of ports, x modules can be inserted into the dilution refrigerator.

FIG. 7 illustrates steps associated with a method 700 for retrofitting a dilution refrigerator (or other such cooling system) to operate with coolant supplied by a cooling plant, in accordance with the disclosed embodiments. The method starts at step 705.

At step 710 a dilution refrigerator can be selected for retrofitting. In exemplary embodiments, this may be one or more dilution refrigerators in a facility with a cold plant. In certain embodiments, this may include a dilution refrigerator used for quantum computing applications, or other such applications requiring cooling.

The cooling apparatus in the selected dilution refrigerator can be removed as illustrated at step 715. This can include removing multiple stages in a single dilution refrigerator if multiple stages in the dilution refrigerator will be cooled with the coolant from the cooling plant. At step 720 an interface module can be installed in place of the cooling apparatus in the dilution refrigerator. The interface module is configured as a drop in replacement for the cooling apparatus. At step 725 an inlet and outlet in the interface module can be connected to a supply line and return line connected to the cooling plant.

Once the interface module is installed in the dilution refrigerator, and the supply lines are properly connected, coolant can be flowed to the cooling stage in the retrofitted dilution refrigerator at step 730. The system is now ready for application in cooling as required, and the method ends at step 735.

It should be appreciated that the exemplary method disclosed above is directed to retrofitting a dilution refrigerator. In other embodiments, the embodiments disclosed herein can be used to allow operation of refrigerators with either liquid cryogens or cryogen-free cooling without altering the design of the refrigerator itself.

Based on the foregoing, it can be appreciated that a number of embodiments are disclosed herein. In an embodiment, a system comprises an interface module configured to be installed in a refrigerator, an inlet line connecting the interface module to a coolant plant, and a return line connecting the interface module to the coolant plant. In an embodiment, the system comprises an inlet bayonet connection configured to connect to the inlet line and an outlet bayonet connection configured to connect to the return line. In an embodiment, the interface module further comprises a vacuum flange. In an embodiment, the interface module further comprises a heat exchanger vessel. In an embodiment, the heat exchanger vessel further comprises a plurality of heat exchanger fins and a heat exchanger coil. In an embodiment, the interface module comprises one of a liquid helium interface module and a liquid nitrogen interface module.

In certain embodiments a system comprises an interface module configured to be installed in a refrigerator, an inlet line connecting the interface module to a coolant plant, and a return line connecting the interface module to at least one of the coolant plant or a vent. In an embodiment, the system further comprises an inlet connection configured to connect to the inlet line and an outlet connection configured to connect to the return line. In an embodiment, the inlet connection comprises a bayonet inlet connection, and the outlet connection comprises a bayonet outlet connection. In an embodiment, the interface module further comprises a vacuum flange. In an embodiment, the interface module further comprises a heat exchanger vessel. In an embodiment, the heat exchanger vessel further comprises a heat exchanging surface and a heat exchanger coil. In an embodiment, the heat exchanging surface comprises a plurality of heat exchanger fins. In an embodiment, the interface module comprises a liquid helium interface module. In an embodiment, the interface module comprises a liquid nitrogen interface module. In an embodiment, the liquid nitrogen interface module is configured to operate with gaseous helium between 30-100 Kelvin.

In another embodiment, a cooling system comprises a two stage cryocooler refrigerator, a first interface module installed in one stage of the two stage cryocooler, a second interface module installed in another stage of the two stage cryocooler, a first inlet line connecting the first interface module to a first coolant source, a second inlet line connecting the second interface module to a second coolant source, a first return line connecting the first interface module to at least one of the first coolant source or a vent, and a second return line connecting the second interface module to the second coolant source. In an embodiment, the cooling system further comprises a first inlet connection configured to connect to the first inlet line, a first outlet connection configured to connect to the first return line, a second inlet connection configured to connect to the second inlet line, and a second outlet connection configured to connect to the second return line. In an embodiment, each of the first inlet connection and second inlet connection comprises bayonet inlet connections, and each of the first outlet connection and second outlet connection comprise a bayonet outlet connections. In an embodiment, the first interface module further comprises a vacuum flange. In an embodiment, the second interface module further comprises a heat exchanger vessel. In an embodiment, the heat exchanger vessel further comprises a heat exchanging surface, a heat exchanger coil, and a plurality of heat exchanger fins. In an embodiment, the second interface module comprises a liquid helium interface module. In an embodiment, the first interface module comprises a liquid nitrogen interface module. In an embodiment, the liquid nitrogen interface module is configured to operate with gaseous helium between 30-100 Kelvin.

In another embodiment, a retrofit dilution refrigerator comprises a two stage cryocooler refrigerator, a first interface module installed in one stage of the two stage cryocooler, the first interface module comprising a liquid nitrogen interface module, a second interface module installed in another stage of the two stage cryocooler, the second interface module comprising a liquid helium interface module, a first inlet line connecting the first interface module to a liquid nitrogen source, a second inlet line connecting the second interface module to a liquid helium source, a first return line connecting the first interface module to at least one of the first coolant source or a vent, and a second return line connecting the second interface module to the second coolant source.

In an embodiment, a system comprises an interface module configured to be installed in a refrigerator, an inlet line connecting the interface module to a coolant plant, and a return line connecting the interface module to the coolant plant. In an embodiment, the system comprises an inlet bayonet connection configured to connect to the inlet line and an outlet bayonet connection configured to connect to the return line. In an embodiment, the interface module further comprises a vacuum flange. In an embodiment, the interface module further comprises a heat exchanger vessel. In an embodiment, the heat exchanger vessel further comprises a plurality of heat exchanger fins and a heat exchanger coil. In an embodiment, the interface module comprises one of a liquid helium interface module and a liquid nitrogen interface module.

It will be appreciated that variations of the above-disclosed and other features and functions, or alternatives thereof, may be desirably combined into many other different systems or applications. Also, various presently unforeseen or unanticipated alternatives, modifications, variations, or improvements therein may be subsequently made by those skilled in the art which are also intended to be encompassed by the following claims.

Claims

What is claimed is:

1. A system comprising:

an interface module configured to be installed in a refrigerator;

an inlet line connecting the interface module to a coolant plant; and

a return line connecting the interface module to at least one of the coolant plant or a vent.

2. The system of claim 1 further comprising:

an inlet connection configured to connect to the inlet line; and

an outlet connection configured to connect to the return line.

3. The system of claim 2 wherein the inlet connection comprises a bayonet inlet connection, and the outlet connection comprises a bayonet outlet connection.

4. The system of claim 1 wherein the interface module further comprises:

a vacuum flange.

5. The system of claim 1 wherein the interface module further comprises:

a heat exchanger vessel.

6. The system of claim 5 wherein the heat exchanger vessel further comprises:

a heat exchanging surface; and

a heat exchanger coil.

7. The system of claim 6 wherein the heat exchanging surface comprises:

a plurality of heat exchanger fins.

8. The system of claim 1 wherein the interface module comprises a liquid helium interface module.

9. The system of claim 1 wherein the interface module comprises a liquid nitrogen interface module.

10. The system of claim 9 wherein the liquid nitrogen interface module is configured to operate with gaseous helium between 30-100 Kelvin.

11. A cooling system comprising:

a two stage cryocooler;

a first interface module installed in one stage of the two stage cryocooler;

a second interface module installed in another stage of the two stage cryocooler;

a first inlet line connecting the first interface module to a first coolant source;

a second inlet line connecting the second interface module to a second coolant source;

a first return line connecting the first interface module to at least one of the first coolant source or a vent; and

a second return line connecting the second interface module to the second coolant source.

12. The cooling system of claim 11 further comprising:

a first inlet connection configured to connect to the first inlet line;

a first outlet connection configured to connect to the first return line;

a second inlet connection configured to connect to the second inlet line; and

a second outlet connection configured to connect to the second return line.

13. The cooling system of claim 12 wherein each of the first inlet connection and second inlet connection comprises bayonet inlet connections, and each of the first outlet connection and second outlet connection comprise a bayonet outlet connections.

14. The cooling system of claim 11 wherein the first interface module further comprises:

a vacuum flange.

15. The cooling system of claim 11 wherein the second interface module further comprises:

a heat exchanger vessel.

16. The cooling system of claim 15 wherein the heat exchanger vessel further comprises:

a heat exchanging surface;

a heat exchanger coil; and

a plurality of heat exchanger fins.

17. The cooling system of claim 11 wherein the second interface module comprises a liquid helium interface module.

18. The cooling system of claim 11 wherein the first interface module comprises a liquid nitrogen interface module.

19. The cooling system of claim 18 wherein the liquid nitrogen interface module is configured to operate with gaseous helium between 30-100 Kelvin.

20. A retrofit dilution refrigerator comprising:

a two stage cryocooler;

a first interface module installed in one stage of the two stage cryocooler, the first interface module comprising a liquid nitrogen interface module;

a second interface module installed in another stage of the two stage cryocooler, the second interface module comprising a liquid helium interface module;

a first inlet line connecting the first interface module to a liquid nitrogen source;

a second inlet line connecting the second interface module to a liquid helium source;

a first return line connecting the first interface module to at least one of the liquid nitrogen source or a vent; and

a second return line connecting the second interface module to the liquid helium source.