CRYOGENIC REFRIGERATION INSTALLATION

Description

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of priority under 35 U.S.C. § 119 and (b) to French patent application No. FR2406177, filed Jun. 11, 2024, which is herein incorporated by reference in its entirety.

FIELD OF THE INVENTION

The present invention relates to a cryogenic refrigeration installation which is capable of providing cooling powers at temperatures less than 100K and in particular which is capable of cooling or pre-cooling the different stages of a subkelvin refrigerator.

BACKGROUND OF THE INVENTION

Subkelvin refrigerators are refrigerators which enable temperatures less than 1K to be reached. Dilution refrigerators, he-3 or he-4 Joule-Thomson refrigerators and adiabatic demagnetization refrigerators are examples of this. They enable temperatures in the order of 10 mK or less to be reached.

Subkelvin refrigerators and in particular dilution refrigerators require cooling powers at least up to 4.2 K in order to function. This cooling power is generally provided either by pulse tubes, Gifford MacMahon, cryorefrigerators or other equivalent devices, or from cryogenic or liquid helium. In the first instance, “dry” dilution is referred to, whilst, in the second case, “wet” dilution is referred to.

Typically, subkelvin refrigerators comprise a chamber, such as a cryostat, and a cooling box which is thermally insulated and in which the coldest part of the process is accommodated and in which one or more plates which are cooled to decreasing temperatures are located. To this end, there is installed in the chamber and there is associated with the plates one or more pulse tubes or equipment items which enable cryogenic or liquid helium to be conveyed.

With the development of the technology, users of subkelvin refrigerators require more and more cooling power at temperatures less than 20 mK which involves also increasing the cooling power provided up to 4.2 K. The levels of power provided by the pulse tubes are limited and will soon no longer be suitable for the requirements of subkelvin refrigerators, and in particular dilution refrigerators.

A known solution for increasing the cooling power provided to 4.2 K involves increasing the number of pulse tubes installed in the chamber. However, this approach involves increasing the size of the chamber (in order to accommodate all the pulse tubes), whilst reducing the experimental surface, that is to say the surface of the plates available for accommodating devices to be cooled, since the association of the pulse tubes with the plates requires a significant surface. Furthermore, the pulse tubes generate mechanical vibrations that are unacceptable, which requires a decoupling system to be installed, copper braiding, for example, which further reduces the available surface and even further impairs the thermal performance levels.

On the other hand, the use of “wet” dilutions requires significant times for cooling and reheating the refrigerators, which is not suitable for the current applications of dilution refrigerators. Furthermore, the transfer of liquid helium in order to recharge the chamber brings about thermal disturbances in the assembly of the chamber, which reduces the useful operating time of the refrigerators.

This technology enables significant cooling powers combined with significant exchange surfaces and efficient thermalization. However, the volume of 4-He to be stored inside the chamber may be problematic in terms of handling cryogenic liquid and complexity of production.

For dilution refrigerators with significant powers, one of the critical requirements is to pre-cool several thousands of components. This power may be provided via heat exchange structures which are installed on-board the plates. The thermalization of the components may be further ensured by the use of pulse tubes which are connected to the plate to be thermalized via copper or graphene braiding. In the two cases, the thermal connection device (braid, exchange structure or the like) may occupy a significant surface which consequently remains unused and unusable, that is to say that the plate surface occupied by the connection device cannot be used to receive devices to be thermalized.

In a refrigeration installation which comprises a subkelvin refrigerator, the following problems are not currently solved or not in a satisfactory manner.

Providing a cooling power at a plurality of different temperatures in the range between 2 K and 300 K, in particular at temperatures less than or equal to 150 K, less than or equal to 77 K, less than or equal to 50 K, less than or equal to 6 K, less than or equal to 5 K, less than or equal to 3 K or 2.8 K, less than or equal to 2 K or 1.8 K.

Rapidly cooling the refrigerator. That is to say the step of cooling the chamber, required to begin the subkelvin refrigeration process, still requires a very long time.

Optimizing the experimental surface available in the refrigerator, that is to say increasing the surfaces of the plates which can effectively be used to receive the devices to be cooled and to reduce the surface occupied by the thermal connection devices.

Enabling a quantity of energy to be exchanged which is very much greater than for conventional solutions, in particular compared with pulsed tubes.

Replacing the mechanical cooling systems of the pulse tube or Gifford MacMahon type with more efficient, more powerful and less bulky systems.

Limiting the handling operations of cryogenic liquid and cryogenic liquid transfers between the outer side and the chamber, and vice-versa.

SUMMARY OF THE INVENTION

In certain embodiments, the present invention intends to effectively overcome these disadvantages by providing a cryogenic refrigeration installation which comprises a refrigerator comprising a cryogenic cycle fluid, a chamber which delimits a sealed volume under reduced pressure, at least one thermally conductive plate which is accommodated in the chamber, at least one heat exchanger which is distinct from the plate(s) and which is associated with one of the plates, the exchanger having a volume which is delimited by a working surface, a fastening surface and a fluid connection surface, a cooling circuit which ensures a circulation of the cycle fluid inside the volume of the exchanger(s) for a heat exchange of the cycle fluid with the plates via the exchangers, the working surface of the exchangers being configured to receive at least a portion of a device to be thermalized.

Certain embodiments of the invention thus enable the overall energy efficiency of the system to be improved, whilst simplifying the user experience and increasing the experimental surface available.

According to one embodiment, the cooling circuit comprises one or more channel(s) which is/are integrated in the volume of the exchangers and which is/are configured to distribute the cycle fluid in the volume of the exchangers.

According to one embodiment, the surface-area of the working surface is greater than the surface-area of the fluid connection surface, in particular the surface-area of the working surface is at least five times greater than the surface-area of the fluid connection surface.

According to one embodiment, the installation comprises fixing members which are associated with each exchanger and which are configured to establish and maintain contact between a device to be cooled and the exchanger.

According to one embodiment, the fixing members comprise one or more fastening structures which are configured to cooperate with combined structures of a device to be cooled in order to enable removable fixing of the device to be cooled to the exchanger, the fastening structure being in particular selected from: a tapping, a threading, a hole, a groove, a pin, a pressure system, a spring clamp.

According to one embodiment, the fixing members comprise at least one housing which is recessed in the working surface and which is configured to accommodate at least a portion of a device to be cooled.

According to one embodiment, the working surface comprises a first portion which is provided with fixing members and a second portion which has no fixing members and which is configured to be in direct contact with a device to be cooled when it is held in contact with the exchanger by the fixing members, the thickness of the wall of the exchanger being greater in the region of the first portion than in the region of the second portion.

According to one embodiment, the refrigerator is configured to cool the cycle fluid outside the chamber and the cooling circuit is configured to convey the cooled cycle fluid inside the chamber and to remove the heated cycle fluid from the chamber.

According to one embodiment, the plate(s) is/are horizontal in a configuration for use and the heat exchangers are fixed to the upper face and/or to the lower face of the plates.

According to one embodiment, the fastening surface of the exchangers is substantially planar and fixed to the corresponding plate in order to be in direct contact with the surface of the plate.

According to one embodiment, the working surface of the exchanger comprises one or more planes which are parallel with the fastening surface and which are each arranged at a different respective distance from the fastening surface.

According to one embodiment, the working surface of the exchanger comprises one or more planes which is/are inclined relative to the fastening surface.

According to one embodiment, the cooling circuit comprises pipes which comprise a first portion which extends from the fluid connection surface of an exchanger in a direction orthogonal or oblique relative to the surface.

According to one embodiment, the pipes comprise a second portion which is parallel with the fluid connection surface of the exchanger, the first and the second pipe portions being connected to each other by means of a bend.

According to one embodiment, the installation comprises at least one thermal screen which is fixedly joined to the one of the plates, the thermal screen defining a volume which is thermalized at a predetermined temperature.

According to one embodiment, the installation comprises at least two plates and the cooling circuit comprises pipes which connect the heat exchangers to each other, the pipes being configured to supply the exchangers with cryogenic cycle fluid in series or in parallel.

According to one embodiment, the cooling circuit comprises pipes which extend through at least one of the plates or at least one of the thermal screens, in particular via openings which comprise local contacts.

According to one embodiment, the installation comprises at least one subkelvin refrigerator, in particular a dilution refrigerator, which is fixedly joined to at least one of the plates.

According to one embodiment, the exchangers comprise fluid connections which enable them to be connected to the cooling circuit and which have a relatively greater height in the region of these connections relative to the height of the exchangers in the region of the free surface.

According to one embodiment, a section of the exchanger in a plane parallel with the fastening surface has a rectangular, diamond, round, elliptical or polygonal shape.

According to one embodiment, the surface-area of the fastening surface is greater than the surface-area of the fluid connection surface, in particular the surface-area of the fastening surface is at least five times greater than the surface-area of the fluid connection surface.

The invention further relates to a method for cooling a device that produces heat to be dissipated, the method using an installation as described in the present application, and comprising a step of fixing at least a portion of the power producing device to the working surface of a heat exchanger in order to dissipate the power produced by the device via the exchanger.

The invention may also relate to any alternative device or method comprising any combination of the features above or below, notably within the scope of the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features, aspects, and advantages of the present invention will become better understood with regard to the following description, claims, and accompanying drawings. It is to be noted, however, that the drawings illustrate only several embodiments of the invention and are therefore not to be considered limiting of the invention's scope as it can admit to other equally effective embodiments.

The invention will be understood more clearly from a reading of the following description and from studying the accompanying figures. These figures are provided purely by way of illustration and do not in any way limit the invention.

FIG. 1 shows a schematic and partial illustration of an embodiment of an installation according to the invention,

FIG. 2 shows a schematic and partial illustration of a detail of an embodiment of an installation according to the invention,

FIG. 3 shows a schematic and partial illustration of a detail of an embodiment of an installation according to the invention,

FIG. 4 shows a schematic and partial illustration of a first embodiment of a heat exchanger according to the invention,

FIG. 5 shows a schematic and partial illustration of a second embodiment of a heat exchanger according to the invention,

FIG. 6 shows a schematic and partial illustration of a third embodiment of a heat exchanger according to the invention,

FIG. 7 shows a schematic and partial illustration of a fourth embodiment of a heat exchanger according to the invention,

FIG. 8 shows a schematic and partial illustration of a fourth embodiment of a heat exchanger according to the invention,

FIG. 9 shows a schematic and partial illustration of a detail of a first embodiment of an installation according to the invention,

FIG. 10 shows a schematic and partial illustration of a detail of a first embodiment of an installation according to the invention,

FIG. 11 shows a schematic and partial illustration of a fifth embodiment of a heat exchanger according to the invention,

FIG. 12 shows a schematic and partial illustration of a detail of a first embodiment of an installation according to the invention,

FIG. 13 shows a schematic and partial illustration of a detail of a first embodiment of an installation according to the invention,

FIG. 14 shows a schematic and partial illustration of a detail of a first embodiment of an installation according to the invention,

FIG. 15 shows a schematic and partial illustration of a detail of a first embodiment of an installation according to the invention,

FIG. 16 shows a schematic and partial illustration of a detail of a first embodiment of an installation according to the invention,

FIG. 17 shows a schematic and partial illustration of a detail of an embodiment of an installation according to the invention,

FIG. 18 shows a schematic and partial illustration of a detail of an embodiment of an installation according to the invention,

FIG. 19 shows a schematic and partial illustration of a detail of an embodiment of an installation according to the invention,

DETAILED DESCRIPTION OF THE INVENTION

With reference to [FIG. 1], the cryogenic refrigeration installation 1 according to a first embodiment comprises a refrigerator 5 and a chamber 2 which delimits a sealed volume under vacuum which is preferably closed by a cover. The refrigerator 5 comprises a cryogenic cycle fluid and may be accommodated, completely or partially, inside or outside the chamber. The refrigerator 5 may in particular be of the type which subjects a cycle fluid to a sequence of compression, heat exchange and expansion.

For example, the refrigerator 5 may comprise a cycle for refrigeration of a cycle fluid. The refrigerator 5 thus comprises a cycle circuit composed of the following elements which are arranged in series: a mechanism for compressing the cycle fluid, at least one member for cooling the cycle fluid, a mechanism for expanding the cycle fluid, and at least one member for heating the expanded cycle fluid.

The cycle fluid may comprise at least one of the following: helium, hydrogen, nitrogen, neon, argon. The cycle circuit is configured to subject the cycle fluid to a thermodynamic cycle which brings the cycle fluid at at least one end of the cycle circuit to a predetermined cold temperature.

The installation 1 comprises at least one thermally conductive plate 3, 4 which is accommodated in the chamber 2, and at least one heat exchanger 6 which is distinct from the plates and which is associated with one of the plates 3, 4.

In [FIG. 1], an exchanger 6 is associated with each plate 3, 4. At least one of the plates 3,4 could be associated with at least two exchangers 6.

The flow of cycle fluid is in heat exchange with the plates 3, 4 via the exchanger(s) 6 and comprises the cycle fluid at the cold temperature. The installation comprises an assembly of pipe(s) 50 for conveying at least some of the cycle fluid of the cycle circuit toward the exchanger 6 and for returning the fluid from the exchanger 6 to the circuit cycle of the refrigerator 5.

The cycle circuit can be configured to subject the cycle fluid to a thermodynamic cycle which brings the cycle fluid to a plurality of different cold temperatures at a plurality of ends of the cycle circuit, respectively. A plurality of different flows of the cycle fluid at different cold temperatures are then placed in heat exchange with at least two different plates 3, 4, respectively, via at least two respective exchangers 6.

The cycle fluid is or preferably contains predominantly helium, the cycle circuit being configured to bring the cycle fluid to at least one of the following cold temperatures: approximately 80 K, between 20 and 70 K, between 1.5 K and 5 K, and/or in a supercritical and/or diphase state.

The refrigerator 5 may comprise a reserve of liquefied cryogenic gas, for example, liquid nitrogen and/or liquid helium and/or liquid hydrogen and/or liquid neon and/or a mixture of the above. This store of liquefied cryogenic gas is preferably located outside the chamber 2. In such a case, the installation 1 comprises an assembly of pipes for conveying liquefied cryogenic gas from the store to the exchanger(s) 6.

As illustrated in [FIG. 2] and [FIG. 3] the exchanger 6 has a volume which is delimited by a working surface 61, a fastening surface 62 and a fluid connection surface 63. The term “working surface 61” is intended to refer to all of the surfaces which are exposed to the atmosphere of the chamber and which are available for the user of the installation to cool devices to be thermalized. The fastening surface 62 is all of the surfaces of the exchanger which are in contact with the plates 3, 4 and which are used in particular to mechanically attach the exchanger to the plate. The fluid connection surface 63 is all the surfaces where an interface with the cooling circuit is located as defined above. The fastening surfaces 62 and fluid connection surfaces 63 are not available for, nor usable by the user of the installation in order to cool the devices to be thermalized.

The exchanger 6 can be disassembled, that is to say it can be associated or installed on a plate 3, 4 and then be removed or uninstalled from the plate 3, 4. The exchanger 6 enables more flexibility in the design of the installation, in the selection of the positions where the cooling power is conveyed or zones to be cooled. The dimensions and the shape of the exchanger 6 can thus be selected more freely at the time of the design of the installation.

The installation 1 comprises a cooling circuit 50 which ensures a circulation of cycle fluid inside the volume of the exchanger(s) 6 for a heat exchange of the cycle fluid with the plates 3, 4 via the exchangers 6.

The working surface 61 of the exchangers 6 is configured to receive at least a portion of a device 7 to be thermalized (that is to say to be cooled to a predetermined temperature). This may in particular be a device for dissipating heat which is intended to be discharged. For example, the device 7 may be an electronic device such as an amplifier, an attenuator, a sensor, or any other electronic or microelectronic circuit, or a portion of an electric cable.

This enables the size of the plates to be reduced and enables use of the volume and spatial requirement of the installation to be optimized. With a constant plate size, this enables the working surface available for the user to be increased.

This solution also provides the flexibility of being able to develop the installation over time and/or to adapt and improve existing installations.

The exchanger 6 may also be used to cool a device in which a fluid to be cooled is circulating, in particular 3-He, 4-He, and/or a mixture of the two.

It will be understood that the exchanger 6 thermalizes the plate 3, 4 via the fastening surface 62. The plate(s) 3, 4 are part of the installation 1 and are not considered, in the context of the invention, to be devices 7 to be thermalized.

According to one embodiment, the cooling circuit 50 comprises one or more channels or chambers 56 which are integrated in the volume of the exchangers 6 and which are configured to distribute the cycle fluid in the volume of the exchangers 6. Examples are illustrated in [FIG. 4], [FIG. 5], [FIG. 6], [FIG. 7], [FIG. 8] and [FIG. 11].

According to one embodiment, the surface-area of the working surface 61 is larger than the surface-area of the fluid connection surface 63. In particular, the surface-area of the working surface 61 is at least five times greater than the surface-area of the fluid connection surface 63, preferably at least ten times, even more preferably at least twenty times.

According to one embodiment, the surface-area of the fastening surface 62 is greater than the surface-area of the fluid connection surface 63, in particular the surface-area of the fastening surface 62 is at least five times greater than the surface-area of the fluid connection surface 63, preferably at least ten times, even more preferably at least twenty times.

In this instance, the installation 1 provides the most space possible for the needs of the user.

According to one embodiment, the installation 1 comprises fixing members 70 which are associated, for example, mechanically (attachment or the like) to each exchanger 6 and configured to establish and maintain contact between a device 7 to be cooled and the exchanger 6. The fixing members 70 may be located on and/or may be included in the exchanger 6; they may also be different from it, for example, a clamp or a vice structure.

This enables a thermal contact to be established between the device to be cooled and the exchanger. Preferably, the fixing is removable and enables the device to be cooled to be changed and/or removed, for example, in the case of replacement or maintenance.

According to one embodiment, the fixing members 70 comprise one or more fastening structures which are configured to cooperate with combined structures of a device 7 to be cooled in order to enable removable fixing of the device 7 to be cooled to the exchanger 6. The fastening structure may, for example, be selected from: a tapping, a threading, a hole, a groove, a pin, a pressure system, a spring clamp.

When the fastening structure is a threading or a tapping, several may be present. They may be organized in a uniform network or screen over all or part of the working surface, for example, as illustrated in [FIG. 4] and [FIG. 5]. For example, one or more screws or threaded rods 70, or equivalent solutions, may be used to fasten the device 7.

A vice fastening structure may be produced using two plates which are held together by one or more rods.

Any other means of applying orthogonal pressure to the working surface may be used as a fastening structure. [FIG. 6] shows an example of such a structure.

According to one embodiment, the fixing members 70 comprise at least one housing 64 which is recessed in the working surface 61 and configured to accommodate at least a portion of a device 7 to be cooled.

This enables the device to be cooled to be installed more easily, for example, by introducing the device with force or by driving it into the housing.

According to one embodiment, the working surface 61 comprises a first portion 611 which is provided with fixing members and a second portion 612 which has no fixing members. The second portion 612 is configured to be in direct contact with a device 7 to be cooled when it is held in contact with the exchanger by the fixing members.

The thickness of the wall of the exchanger may be greater in the region of the first portion 611 than in the region of the second portion 612 of the working surface 61.

This enables the thermal exchanges through the thinner wall of the portion 612 to be improved, whilst ensuring an efficient fixing to a thicker wall of the portion 611.

According to one embodiment, the refrigerator 5 is configured to cool the cycle fluid outside the chamber 2 and the cooling circuit 50 is configured to convey the cooled cycle fluid inside the chamber 2 and to remove from the chamber 2 the heated cycle fluid after it has circulated in the exchanger 6.

This enables the production of the cold to be separated from its use and enables the use of the inner volume of the chamber to be optimized. This also enables the vibrations which are generated by the refrigerator and which may be transmitted via the exchanger 6 to the plate(s) 3, 4 to be reduced or eliminated.

The installation is thus configured to reduce or eliminate the transmission in the chamber of the vibrations generated by the refrigerator.

According to one embodiment, the plates 3, 4 are horizontal in a configuration of use and the heat exchangers 6 are fixed to an upper face 31 and/or to a lower face 32 of the plates.

This enables the useful surface for the user of the installation to be maximized.

According to one embodiment, as illustrated, for example, in [FIG. 3], at least one of the plates 3,4 may comprise a housing 33 which is intended to receive a heat exchanger 6 so that the working surface 61 of the exchanger 6 is located at the same level as the surface 31, 32 of the plate.

As illustrated in [FIG. 3], [FIG. 9], [FIG. 10], [FIG. 12], [FIG. 13], [FIG. 14], [FIG. 15] and [FIG. 16], threadings or tappings 70 may also be provided on the upper surface 31 or lower surface 32 of the plates 3, 4.

If necessary, this enables a device 7 to be thermalized to be fixed “straddling” between the exchanger 6 and the plate 3, 4. That is to say that the device 7 to be thermalized may be installed so that one portion is in direct contact with the exchanger 6 whilst another portion is in direct contact with the plate 3, 4.

It should be noted that, in other configurations, the device 7 to be thermalized may be installed so that one portion is in direct contact with the exchanger 6 whilst another portion is in direct contact with the plate 3, 4, by providing fastening structures 70 only in the region of the exchanger 6 or only in the region of the plate 3, 4.

According to one embodiment, the fastening surface 62 of the exchangers 6 is substantially planar and fixed to the corresponding plate 3, 4 so as to be in direct contact with the surface of the plate 3, 4.

An effective thermal contact is thus produced, enabling the cooling power to be transferred to the plate.

In an embodiment, the working surface 61 of the exchanger 6 comprises one or more planes 613, 614 which are parallel with the fastening surface 62 and which are each arranged at a different respective distance from the fastening surface 62.

This enables the devices 7 to be thermalized to be received, which devices 7 comprise portions which have to be positioned at different levels.

In an embodiment, the working surface 61 of the exchanger 6 comprises one or more planes 615 which are inclined relative to the fastening surface 62.

This enables devices 7 to be thermalized to be received, which devices 7 need to be operated on an inclination or on several inclinations.

According to one embodiment, the cooling circuit 50 comprises pipes 53 which comprise a first portion which extends from the fluid connection surface 63 of an exchanger 6 in a direction orthogonal or oblique with respect to the fluid connection surface 63.

The pipes 53 may comprise a second portion which is parallel with the fluid connection surface 63 of the exchanger 6, the first and the second pipe portion being connected to each other by means of a bend.

This ensures a controlled distance between the pipe 53 and the working surface 61 of the exchanger 6 and enables the surface available for the user of the installation for receiving devices 7 to be cooled to be increased.

Of course, different orientations of the pipe 53 could also enable the effect of moving the pipe 53 away from the surface of the exchanger 6 to be obtained and could thus increase the working surface available for the user,

According to one embodiment, the installation comprises at least one thermal screen 9 which is fixedly joined to one of the plates 3, 4, the thermal screen 9 defining a volume which is thermalized at a predetermined temperature.

According to one embodiment, the installation comprises at least two plates 3, 4 and the cooling circuit 50 comprises pipes 51 which connect the heat exchangers to each other. The pipes 51 may be configured to supply the exchangers 6 with cryogenic cycle fluid in series or in parallel. The exchangers may be located on the same plate 3, 4 or on different plates 3, 4.

According to one embodiment, the cooling circuit 50 comprises pipes 51, 52 which extend through at least one of the plates 3, 4 or at least one of the thermal screens 9. The pipes 51, 52 may extend through the plates 3, 4 and/or the screens 9 via openings 8 which comprise local contacts 80. The thermal losses via conduction are thus limited.

According to one embodiment, the installation comprises at least one subkelvin refrigerator 10 which is fixedly joined to at least one of the plates 3, 4. The subkelvin refrigerator may be a dilution refrigerator, an He-3 or He-4 Joule-Thomson refrigerator, an adiabatic demagnetization refrigerator, or any other device which enables cold to be produced at a temperature less than 1 K, preferably less than 100 mK

In the case of a dilution refrigerator, this may in particular be configured to produce cold power at temperatures less than 20 mK, preferably less than 10 mK.

According to one embodiment, the exchangers 6 comprise fluid connections which enable them to be connected to the cooling circuit 50. The fluid connections are located in the region of the fluid connection surface 63.

The exchangers 6 may have a relatively greater height in the region of the fluid connections relative to the height of the exchangers in the region of the working surface. That is to say that the total height of the exchanger measured in a straight line orthogonal to the fluid connection surface 63 is greater than the total height of the exchanger measured in a straight line orthogonal to an adjacent working surface 61.

This enables a better distribution of the cycle fluid and a better homogenization of the flow rate thereof.

According to one embodiment, a section of the exchanger 6 in a plane parallel with the fastening surface 63 may have a rectangular, diamond, round, elliptical or polygonal shape.

The invention also relates to a method for cooling a device 7 to be thermalized. The method uses an installation according to one or more of the embodiments described above and comprises a step of fixing at least a portion of the device 7 to be thermalized to the working surface 61 of a heat exchanger 6.

According to one embodiment, the device 7 to be thermalized is fixed “straddling” between the exchanger 6 and the plate 3, 4. That is to say that the device 7 to be thermalized is installed so that one portion is in direct contact with the exchanger 6 whilst another portion is in direct contact with the plate 3, 4

The device 7 to be thermalized may in particular be a device that produces heat which is intended to be dissipated and the method enables the power produced by the device 7 to be dissipated via the exchanger 6. For example, the device 7 may be an electronic device such as an amplifier, an attenuator, a sensor, or any other electronic or microelectronic circuit, or a portion of an electric cable.

While the invention has been described in conjunction with specific embodiments thereof, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications, and variations as fall within the spirit and broad scope of the appended claims. The present invention may suitably comprise, consist or consist essentially of the elements disclosed and may be practiced in the absence of an element not disclosed.

Furthermore, if there is language referring to order, such as first and second, it should be understood in an exemplary sense and not in a limiting sense. For example, it can be recognized by those skilled in the art that certain steps can be combined into a single step.

The singular forms “a”, “an” and “the” include plural referents, unless the context clearly dictates otherwise.

“Comprising” in a claim is an open transitional term which means the subsequently identified claim elements are a nonexclusive listing (i.e., anything else may be additionally included and remain within the scope of “comprising”). “Comprising” as used herein may be replaced by the more limited transitional terms “consisting essentially of” and “consisting of” unless otherwise indicated herein.

“Providing” in a claim is defined to mean furnishing, supplying, making available, or preparing something. The step may be performed by any actor in the absence of express language in the claim to the contrary.

Optional or optionally means that the subsequently described event or circumstances may or may not occur. The description includes instances where the event or circumstance occurs and instances where it does not occur.

Ranges may be expressed herein as from about one particular value, and/or to about another particular value. When such a range is expressed, it is to be understood that another embodiment is from the one particular value and/or to the other particular value, along with all combinations within said range.

All references identified herein are each hereby incorporated by reference into this application in their entireties, as well as for the specific information for which each is cited.