THERMAL EXCHANGE MODULE THAT INCORPORATES A PHASE CHANGE MATERIAL

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to and the benefit under 35 U.S.C. § 119(e) of U.S. Provisional Patent Application No. 63/670,487 filed on Jul. 12, 2024, entitled “THERMAL EXCHANGE MODULE THAT INCORPORATES A PHASE CHANGE MATERIAL.” The present application is related to copending, commonly owned U.S. application Ser. No. 18/151,732 filed Jan. 9, 2023, which claims the benefit of U.S. Application No. 63/312,127 filed Feb. 21, 2022, both of which are entitled “LAUNDRY APPLIANCE HAVING A THERMAL STORAGE MECHANISM FOR CAPTURING EXCESS HEAT FROM ONE OR MORE HEAT SOURCES.” The present application is also related to copending, commonly owned U.S. application Ser. No. 18/098,261 filed Jan. 18, 2023, which claims the benefit of priority of U.S. Pat. No. 63,312,133 filed Feb. 21, 2022, both of which are entitled “THERMAL STORAGE MECHANISM FOR A LAUNDRY APPLIANCE THAT UTILIZES RECOVERY HEAT AND RENEWABLE ENERGY SOURCES.” The disclosures of the foregoing are hereby incorporated herein by reference in their entirety.

BACKGROUND OF THE DISCLOSURE

The present disclosure generally relates to thermal exchange mechanisms and, more specifically, a thermal exchange module that can be incorporated within an appliance, and where the thermal exchange module utilizes a phase change material for receiving heat energy from one location and providing for the transfer of heat energy to a separate location.

SUMMARY OF THE DISCLOSURE

According to a first aspect of the disclosure, a thermal exchange module includes a thermal exchange path, an inner fin structure extending from the thermal exchange path, a phase change structure surrounding the inner fin structure and containing a phase change material therein, and an outer fin structure that extends outward from the phase change structure. The inner fin structure is in thermal communication with the thermal exchange path and the phase change structure, the phase change structure is in thermal communication with the inner fin structure and the outer fin structure, and the outer fin structure is in thermal communication with a fluid path that is configured to deliver a media therethrough.

According to another aspect of the disclosure, a thermal exchange structure includes a plurality of thermal exchange modules that are coupled together by a thermal media conduit. Each thermal exchange module of the plurality of thermal exchange modules includes an extruded thermal exchange path having a central conduit that is coupled with the thermal media conduit and a plurality of fins that radially extend outward from the central conduit, a phase change structure surrounding the extruded thermal exchange path, a phase change material positioned between the extruded thermal exchange path and the phase change structure therein, and an outer fin structure that extends outward from the phase change structure. The phase change material places the extruded thermal exchange path in thermal communication with the outer fin structure.

According to yet another aspect of the disclosure, a heat exchange system for an appliance includes a refrigerant loop that includes a thermal media conduit that delivers a thermal exchange media through a heat exchange area, a fluid path that directs a fluid media through the heat exchange area, and a thermal exchange structure that is disposed within the heat exchange area and places the thermal exchange media within the thermal media conduit in thermal communication with, and physically separated from, the fluid media moving through the fluid path. The thermal exchange structure includes a plurality of thermal exchange modules, each of which includes an extruded thermal exchange path having a central conduit that is in fluid communication with the thermal media conduit, and a plurality of fins that radially extend outward from the central conduit, a phase change structure surrounding the extruded thermal exchange path, a phase change material positioned between, and in thermal communication with, the extruded thermal exchange path and the phase change structure, and an outer fin structure that extends outward from the phase change structure. The phase change material places the extruded thermal exchange path and the thermal exchange media in thermal communication with the outer fin structure and the fluid media moving through the fluid path.

These and other features, advantages, and objects of the present disclosure will be further understood and appreciated by those skilled in the art by reference to the following specification, claims, and appended drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings:

FIG. 1 is a schematic perspective view of an aspect of the thermal exchange module that incorporates the phase change material (PCM);

FIG. 2 is a perspective view of a phase change structure that incorporates a plurality of phase change modules into a single assembly;

FIG. 3 is an aspect of the phase change structure that incorporates a plurality of phase change modules;

FIG. 4 is a cross-sectional view of the phase change structure of FIG. 3 taken along line IV-IV;

FIG. 5 is an exemplary perspective view of an aspect of the phase change module that incorporates the PCM;

FIG. 6 is an exemplary partially exploded perspective view of an aspect of the phase change module that incorporates the PCM, with the cover structure partially removed from the phase change structure;

FIG. 7 is an exemplary partially exploded perspective view of an aspect of the phase change module that incorporates the PCM, showing the cover structure removed and the inner fin structure partially removed from the phase change structure; and

FIG. 8 is an exemplary partially exploded perspective view of an aspect of the phase change module that incorporates the PCM, showing the inner fin structure and the cover structure partially removed from the phase change structure.

The components in the figures are not necessary to scale, emphasis instead being placed upon illustrating the principles described therein.

DETAILED DESCRIPTION

The present illustrated embodiments reside primarily in combinations of method steps and apparatus components related to a thermal exchange module that can be incorporated within an appliance or other fixture, and where the thermal exchange module utilizes a phase change material for receiving heat energy from one location and providing for the transfer of heat energy to a separate location. Accordingly, the apparatus components and method steps have been represented, where appropriate, by conventional symbols in the drawings, showing only those specific details that are pertinent to understanding the embodiments of the present disclosure so as not to obscure the disclosure with details that will be readily apparent to those of ordinary skill in the art having the benefit of the description herein. Further, like numerals in the description and drawings represent like elements.

For purposes of description herein, the terms “upper,” “lower,” “right,” “left,” “rear,” “front,” “vertical,” “horizontal,” and derivatives thereof shall relate to the disclosure as oriented in FIG. 1. Unless stated otherwise, the term “front” shall refer to the surface of the element closer to an intended viewer, and the term “rear” shall refer to the surface of the element further from the intended viewer. However, it is to be understood that the disclosure may assume various alternative orientations, except where expressly specified to the contrary. It is also to be understood that the specific devices and processes illustrated in the attached drawings, and described in the following specification are simply exemplary embodiments of the inventive concepts defined in the appended claims. Hence, specific dimensions and other physical characteristics relating to the embodiments disclosed herein are not to be considered as limiting, unless the claims expressly state otherwise.

The terms “including,” “comprises,” “comprising,” or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element preceded by “comprises a . . . ” does not, without more constraints, preclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

Referring to FIGS. 1-8, reference numeral 10 generally refers to a thermal exchange module that is incorporated within an appliance 12 for receiving heat energy 14 from a fluid media 36, such as ambient air 16, within a first location 18, and delivering the absorbed heat energy 14 to a separate second location 20 for heating a certain area within an appliance 12, fixture, or other mechanism having a heat exchange functionality. In the case of an appliance 12, the area within the appliance 12 is typically a processing space 22 of the appliance 12. According to the various aspects of the device, the thermal exchange module 10 includes a thermal exchange path 24, which can take the form of a refrigerant path. An inner fin structure 26 extends outward from the thermal exchange path 24. A phase change structure 28 includes an outer shell 130 that surrounds the inner fin structure 26. The outer shell 130 of the phase change structure 28 cooperates with the inner fin structure 26 to define an inner volume 30 that contains a phase change material (PCM) 32. The PCM 32 is contained, and typically sealed, within the inner volume 30 of the phase change structure 28. An outer fin structure 34 extends outward from the phase change structure 28. The inner fin structure 26 is in thermal communication with the thermal exchange path 24 and the phase change structure 28. The outer shell 130 of the phase change structure 28 is in thermal communication with the inner fin structure 26 and the outer fin structure 34. The outer fin structure 34, in turn, is in thermal communication with a fluid path 40 that is configured to deliver a fluid media 36 therethrough. This fluid media 36 can be in the form of air, water, or other fluid media that can be used to absorb heat energy 14 from the outer fin structure 34, via the PCM 32, for delivering this heat energy 14 to a processing space 22 or other area designed for receiving the heat energy 14.

Referring again to FIGS. 1-8, the thermal exchange module 10 is configured to act as a storage unit for receiving and retaining heat energy 14 for a period of time. This heat energy 14 is delivered to the thermal exchange module 10 by a thermal exchange media 92, such as a refrigerant. To store the heat energy 14, the thermal exchange module 10 surrounds the thermal exchange path 24 and allows for the absorption or transfer of heat energy 14 into the PCM 32 via the inner fin structure 26. The PCM 32 retains and stores the heat energy 14 by changing phases, or states of matter, as described herein. In this manner, the PCM 32 can change states of matter, and remain in this changed state of matter for an extended period of time. By remaining in this changed state of matter, the PCM 32 is able to absorb and retain heat energy 14 in a substantially stable manner. When the heat energy 14 is needed at a separate second location 20, the fluid media 36 flowing through the fluid path 40 is able to absorb the heat energy 14 from the PCM 32 via the outer fin structure 34. At this time, the PCM 32, in releasing the heat energy 14, tends to revert back to its previous state of matter as the heat energy 14 is transferred into the fluid media 36 moving through the outer fin structure 34. In this manner, the PCM 32 places the inner fin structure 26 in communication with the outer fin structure 34. This communication provides for the transfer of heat energy 14 between the thermal exchange media 92 and the fluid media 36 via the inner fin structure 26, the PCM 32, and the outer fin structure 34.

As described herein, the thermal exchange module 10 includes the PCM 32 and the inner fin structure 26 that are contained within the outer shell 130 of the phase change structure 28. Typically, the PCM 32 is sealed within the inner volume 30 defined between the outer shell 130 of the phase change structure 28 and the inner fin structure 26. In this matter, the PCM 32 can be in direct contact with each of the phase change structure 28 and the inner fin structure 26 to ensure an efficient transfer of heat energy 14 from the inner fin structure 26 and into the PCM 32 for storage of heat energy 14. Then, subsequently, the heat energy 14 can be transferred from the PCM 32, through the phase change structure 28 and into the outer fin structure 34. At this point, the heat energy 14 is transferred to the fluid media 36 moving through the outer fin structure 34 and having a lower temperature than a temperature of the outer fin structure 34. This temperature difference provides for the transfer of heat energy 14 from a warmer portion of the thermal exchange module 10 to the cooler fluid media 36. Through this configuration, the PCM 32 can repeatedly absorb, store, and release heat energy 14 over an extended period of time as the PCM 32 repeatedly changes states of matter according to the movement of heat energy 14 therethrough.

According to the various aspects of the device, as exemplified in FIGS. 1-8, the thermal exchange path 24 and the inner fin structure 26 can be defined as separate components. In this aspect of the device, the thermal exchange path 24 can be a central conduit 56 that extends through a separate structure having fins 54 that make up the inner fin structure 26. It is also contemplated that the inner fin structure 26 can be in the form of an extruded component 52. In such an aspect of the device, the extruded component 52 can include the fins 54. In certain aspects of the device, the extruded component 52 can also include the thermal exchange path 24 within the central conduit 56 that is integral with the extruded component 52. The fins 54 of the inner fin structure 26 extend outward from this central conduit 56 to form the extruded form of the inner fin structure 26.

As exemplified in FIG. 8, in certain aspects of the device, a cover structure 70 can be attached to the fins 54 of the inner fin structure 26. The cover structure 70 is positioned to at least partially separate the fins 54 of the inner fin structure 26 from the surface of the phase change structure 28. Additionally, the cover structure 70 operates to evenly position the inner fin structure 26 within the inner volume 30 of the phase change structure 28. It is also contemplated that this cover structure 70 can include portions of the phase change structure 28 or can directly engage the phase change structure 28. In such an aspect of the device, the cover structure 70 extends at least partially around the fins 54 of the inner fin structure 26.

Typically, the cover structure 70 is disposed on opposing ends 72 of the inner fin structure 26 and serves to evenly space the inner fin structure 26 within the phase change structure 28. The cover structure 70 can also be used to close off the edges of each thermal exchange module 10 so that the PCM 32 can be contained within the inner volume 30 of the phase change structure 28. As described herein, the inner volume 30 is contained between the phase change structure 28, the inner fin structure 26 and the cover structure 70. Through this configuration, the PCM 32 that is contained or substantially sealed within the phase change structure 28 can be more closely engaged with the surface of the inner fin structure 26. As described herein, this close engagement can be used to achieve a more efficient and more complete transfer of heat energy 14 from the thermal exchange path 24, through the inner fin structure 26, and into the PCM 32.

Referring again to FIGS. 1-8, the thermal exchange path 24 of the thermal exchange module 10 can include a dedicated central conduit 56 that extends through the separate inner fin structure 26. In such an aspect of the device, the inner fin structure 26 includes an interior aperture 90 that allows the central conduit 56 of the thermal exchange path 24 to pass therethrough.

As described herein, the thermal exchange path 24 and the inner fin structure 26 can also be defined within a common extruded component 52. In such an aspect of the device, this common extruded component 52 can be a rigid extruded component made of a metallic material or other formable rigid material having a high thermal conductivity.

The metallic materials of the inner fin structure 26 and the extruded component 52 can include, but are limited to, aluminum, aluminum alloys, and other metals having a high thermal conductivity. Other materials having a high thermal conductivity can be utilized within the inner fin structure 26, as well as other components of the thermal exchange module 10. The materials utilized for the thermal exchange module 10 typically provide for the efficient movement of heat energy 14 between thermal exchange media 92 contained within the thermal exchange path 24 and the outer fin structure 34, as well as the inner fin structure 26 and the phase change structure 28 contained therebetween.

Referring it again to FIGS. 1-8, according to the various aspects of the device, a thermal exchange structure 170 can include a plurality of thermal exchange modules 10 that are coupled together by a thermal media conduit 50. Each thermal exchange module 10 includes an extruded thermal exchange path 24 having a central conduit 56 that is coupled with the thermal media conduit 50. A plurality of fins 54 of the inner fin structure 26 can extend radially outward from the central conduit 56. The fins 54 of the inner fin structure 26 typically extend outward from a longitudinal axis 74 of the central conduit 56 for the thermal exchange path 24. The phase change structure 28 surrounds the extruded thermal exchange path 24, including the inner fin structure 26, and a phase change material 32 is positioned between the extruded thermal exchange path 24 and the phase change structure 28. The outer fin structure 34 extends outward from the phase change structure 28. The PCM 32 places the extruded thermal exchange path 24 in thermal communication with the outer fin structure 34.

Referring again to FIGS. 1-8, the thermal exchange conduit 50 of the thermal exchange structure 170 cooperates with the central conduit 56 for each thermal exchange module 10 to define a continuous path that extends through each thermal exchange module 10 of the thermal exchange structure 170. Accordingly, as the thermal exchange media 92 moves through the thermal exchange structure 170, it moves continuously through a single path that moves through each thermal exchange module 10 of the thermal exchange structure 170. In this manner, the continuous path places the thermal exchange media 92 in thermal communication with the plurality of thermal exchange modules 10. Similarly, each of the thermal exchange modules 10 is placed in thermal communication with the fluid path 40 to provide for the efficient exchange of heat energy 14 from the thermal exchange media 92 to the fluid media 36, as described herein. In certain aspects of the device, the thermal exchange media 92 can move through the thermal exchange structure 170 in one or more parallel paths. In such a configuration, the parallel paths for directing the thermal exchange media 92 can divert into the one or more parallel paths. In this manner, the parallel paths of the thermal exchange media 92 can efficiently exchange heat energy 14 between the thermal exchange media 92 and the fluid media 36, as described herein. The plurality of parallel paths of the thermal exchange media 92 can then recombine into a single path that is directed downstream within the heat exchange system 190.

It is contemplated that the inner fin structure 26 includes a set of metallic fins 54 that extend outward from the thermal exchange path 24. These metallic fins 54, as described herein, provide for a thermal exchange of heat energy 14 between the thermal exchange media 92 within the thermal exchange path 24, typically in the form of the refrigerant, into the inner fin structure 26 and the metallic fins 54 thereof. These fins 54 typically radiate outward from the thermal exchange path 24. These fins 54 can also be oriented in different configurations. Such configurations can include, but are not limited to, parallel, perpendicular, oblique, irregular, tessellated, combinations thereof and other similar configurations that extend between the thermal exchange path 24, or the central conduit 56, and the phase change structure 28. Additionally, the various surfaces of the thermal exchange module 10 can include one or more surface textures that increase the surface area of these surfaces. By way of example, and not limitation, the fins 54 of the inner fin structure 26 and the outer fin structure 34, the surfaces of the phase change structure 28 and other surfaces that are used for the transfer of heat energy 14 can include a surface texture. In this manner, as the thermal exchange media 92 moves through the thermal exchange path 24 and the fluid media 36 moves through the outer fin structure 34, the textured surfaces increase the surface area of these structures. This increased surface area results in greater transfer of heat energy 14 between the thermal exchange media 92 and the fluid media 36. These surface textures can include etching, roughened surfaces, undulations, surface applications, combinations thereof, and other similar surface textures.

As exemplified in FIGS. 5 and 6, in certain aspects, the cover structure 70 can include a void 110 that is defined by an inner surface 112 of the cover structure 70. In such an aspect, the inner fin structure 26 can engage the inner surface 112 of this void 110 such that the inner fin structure 26 matingly engages the void 110 of the cover structure 70. Through this configuration, the cover structure 70 centrally aligns that inner fin structure 26 within the phase change structure 28. This central spacing creates an even and consistent spacing between the fins 54 of the inner fin structure 26 and the interior surface 132 of the phase change structure 28. The cover structure 70, in certain aspects of the device, includes a generally undulating shape that follows the contour of the fin-shaped configuration of the inner fin structure 26.

Referring again to FIGS. 1-8, the phase change structure 28 can include an outer shell 130, such as a tube having a circular or polygonal profile that generally matches the shape of the inner fin structure 26. The outer shell 130 includes an interior surface 132 that defines the inner volume 30 that contains the PCM 32. The outer shell 130 of the phase change structure 28 is typically sealed to prevent the PCM 32 from escaping the phase change structure 28. This is useful when the PCM 32 absorbs heat energy 14 and converts from a solid state to a liquid state, or a gaseous state.

In certain aspects of the device the inner volume 30 of the phase change structure 28 can be defined between the outer shell 130 and the inner fin structure 26, with the phase change material 32 disposed within the inner volume 30. It is also contemplated that the phase change structure can be defined between the outer shell 130 and an inner shell. In such an aspect of the device, the inner fin structure 26 is disposed within the inner shell and the inner volume 30 is defined between the outer shell 130 and the inner shell, with the phase change material 32 disposed within the inner volume 30.

The material of the outer shell 130 of the phase change structure 28 can include sealable materials, such as steel, aluminum, alloys thereof, and other similar metals. The outer shell 130 of the phase change structure 28 can also include other rigid materials, such as metals, polymers, carbon-based materials, silica-based materials, combinations thereof and other similar materials, that can be sealed to contain the PCM 32 within the inner volume 30 defined therein. Typically, the inner volume 30 of the phase change structure 28 is defined between the outer shell 130 and the inner fin structure 26. The inner fin structure 26 and the outer shell 130 of the phase change structure 28 can define a plurality of extruded triangular volumes that each contain at least a portion of the PCM 32.

According to the various aspects of the device, it is contemplated that the PCM 32 can include any number of materials. Such materials can include, but are not limited to, glycol, paraffin wax, one or more refrigerants, water, air, combinations thereof, and other similar PCMs 32. It is also contemplated that the PCM 32 can include certain additives to enhance storage potential and/or storage capacity. Such additives can also be included to enhance the efficiency and effectiveness of the phase change transitions between states of matter, as described herein. These PCMs 32 typically change phases between states of matter as heat energy 14 is delivered and absorbed into the PCM 32 and as heat energy 14 is extracted from the PCM 32. In the case of paraffin wax, the PCM 32 may take a solid form when unheated. As heat energy 14 is added to the PCM 32, the paraffin wax may change to a liquid form indicative of absorbing heat energy 14. Conversely, as heat energy 14 is extracted or otherwise removed from the paraffin wax, the PCM 32 typically changes phases from a liquid back to a solid, which is indicative of the wax releasing heat energy 14. Other PCMs 32 may undergo other phase change transitions as heat energy 14 is absorbed into and extracted from the PCM 32.

Referring again to FIGS. 1-8, the outer fin structure 34 can include a set of plates 150 that extend outward from the phase change structure 28. These plates 150 include gaps 152 therebetween that allow for the movement of process air 154 to move between the plates 150 of the outer fin structure 34. These plates 150 are typically oriented in a parallel configuration. It is contemplated that the plates 150 can be oriented in different configurations as well. These alternative configurations can vary in shape, angle, orientation, and other variations. In each of these configurations, the plates 150 include the gap 152 that is defined between each of the plates 150. As process air 154, or other fluid media 36, moves through these gaps 152 between the plates 150 of the outer fin structure 34, heat energy 14 can be absorbed from the PCM 32 and into the process air 154. The gaps 152 between the plates 150 can vary in size or can be regulated in width. These plates 150 of the outer fin structure 34 can take the form of panels, fins, tabs, protrusions, combinations thereof, and other similar structures that allow for the movement of fluid media 36 therethrough and the transfer of heat energy 14 from the PCM 32 to the fluid media 36 moving through the outer fin structure 34. The plates 150 can be in the form of individual structures. The plates 150 can also be in the form of one or more helical structures that extend around the phase change structure 28.

As described herein, the thermal exchange module 10 is described as absorbing heat energy 14 from thermal exchange path 24, and delivering this heat energy 14 to a separate location. It is also contemplated that a reverse transfer of heat energy 14 can also be performed using the thermal exchange module 10. In this manner, the thermal exchange module 10 can be cooled by extracting heat energy 14 from the PCM 32. In such an aspect of the device, a cooled refrigerant 92 can extract heat energy 14 from the PCM 32 via the inner fin structure 26. The now-cooled PCM 32 can be used to extract heat energy 14 from a fluid media 36 moving through a fluid path 40, thereby cooling the fluid media 36 for delivery to a separate second location 20. Accordingly, use of the thermal exchange module 10 can be used for heating and cooling functions within a particular application.

Referring again to FIGS. 1-8, a heat exchange system 190 for the appliance 12 or fixture can include a refrigerant loop 192 having a thermal media conduit 50 that delivers a thermal exchange media 92 through a heat exchange area 194. A fluid path 40 directs a fluid media 36, which is separate from the thermal exchange media 92, through the heat exchange area 194. A thermal exchange structure 170 is disposed within the heat exchange area 194 and places the thermal exchange media 92 within the thermal media conduit 50. This configuration places the thermal exchange media 92 in thermal communication with, and also physically separated from, the fluid media 36 moving through the fluid path 40. The thermal exchange structure 170 includes a plurality of the thermal exchange modules 10. Each of these thermal exchange modules 10 includes the extruded thermal exchange path 24 having the central conduit 56 that is in fluid communication with the thermal media conduit 50. A plurality of fins 54 extends radially outward from the central conduit 56 to define the inner fin structure 26. A phase change structure 28 surrounds the extruded thermal exchange path 24. The PCM 32 is positioned between, and in thermal communication with, the extruded thermal exchange path 24 and the phase change structure 28. The outer fin structure 34 extends outward from the phase change structure 28, wherein the outer fin structure 34 is fixedly attached to an outer surface 196 of the phase change structure 28. The PCM 32 places the extruded thermal exchange path 24 and the thermal exchange media 92 in thermal communication with the outer fin structure 34 and the fluid media 36 moving through the fluid path 40.

Referring again to FIGS. 1-4, thermal exchange module 10 can be attached to other adjacent thermal exchange modules to form a thermal exchange structure 170. Such a thermal exchange structure 170 can include a bracket 172 that holds the various thermal exchange modules 10 in a static pattern. Thermal exchange conduits 50 can extend between the thermal exchange modules 10 for forming a single continuous thermal exchange path 24 that moves through the plurality of thermal exchange modules 10.

According to the various aspects of the device, as exemplified in FIGS. 2-4, the various thermal exchange modules 10 are positioned in an array configuration to form the thermal exchange structure 170. The fluid path 40 extends through the outer fin structure 34 for each of the thermal exchange modules 10 of the plurality of thermal exchange modules 10. The array of thermal exchange modules 10 can be coupled together and placed in a variety of configurations. These configurations can include, but are not limited to, staggered configurations, orthogonal configurations, aligned configurations, irregular configurations, radial configurations, combinations thereof, and other similar configurations. The configuration of the thermal exchange modules 10 that form the thermal exchange structure 170 is utilized for maximizing the extraction of heat energy 14 from the thermal exchange media 92, into the PCM 32, and then to the fluid media 36 flowing through the fluid path 40 of the thermal exchange structure 170.

When the thermal exchange modules 10 are positioned within the bracket 172 to form the thermal exchange structure 170, greater amounts of heat energy 14 can be absorbed from the thermal exchange path 24 into the PCM 32 contained in the various phase change structures 28. As process air 154 moves through the thermal exchange structure 170, greater amounts of heat energy 14 can also be extracted from the PCM 32, through the outer fin structures 34, and into the process air 154 or other fluid media 36 being delivered through the thermal exchange structure 170.

According to various aspects of the device, within each thermal exchange module 10, the thermal exchange path 24 can be a simple linear path through the thermal exchange module 10. It is also contemplated that the thermal exchange path 24 can take the form of a more complex geometry such as a winding, coiled counterflow, or sinusoidal path through the inner fin structure 26 of each thermal exchange module 10. It is contemplated that where the thermal exchange path 24 remains within the inner fin structure 26 for a greater length of time, greater amounts of heat energy 14 can be extracted from the thermal exchange path 24 and into the inner fin structure 26 to be transferred to the PCM 32 of the phase change structure 28.

Referring again to FIGS. 2-4, when the thermal exchange modules 10 are positioned within the bracket 172 of the thermal exchange structure 170, the thermal exchange modules 10 can be positioned in a staggered configuration. The staggered configuration ensures a greater interaction between the process air 154 and the outer fin structure 34 of each of the thermal exchange modules 10. Aligned configuration, irregular configurations, and other configurations of the thermal exchange modules 10 are also contemplated.

Referring now to FIG. 1, the thermal exchange path 24 extends through the central portion of the thermal exchange module 10. As described herein, the inner fin structure 26 extends outward from the thermal exchange path 24. The fins 54 of the inner fin structure 26 provide for the transfer of heat energy 14 from the refrigerant 92 moving to the thermal exchange path 24, and into the inner fin structure 26. Heat energy 14 moving through the inner fin structure 26 is delivered to the phase change structure 28 and the PCM 32 contained therein. As cooler process air 154 moves through the outer fin structure 34, a temperature difference between the heat-laden PCM 32 and the cooler process air 154 moving through the outer fin structure 34 causes heat energy 14 to transfer into the process air 154 from the PCM 32. Accordingly, heat energy 14 captured within one area can be delivered into the thermal exchange module 10 and delivered to a separate area via the process air 154. Accordingly, a refrigerant or other thermal exchange media 92 can interact with the process air 154, via the thermal exchange module 10, while maintaining no physical contact with one another. Through the use of the thermal exchange module 10, separate and dedicated vapor compression loops can be utilized for absorbing heat energy 14 from a first location 18 and delivering this heat energy 14 to a separate second location 20 via the thermal exchange module 10.

It will be understood by one having ordinary skill in the art that construction of the described disclosure and other components is not limited to any specific material. Other exemplary embodiments of the disclosure disclosed herein may be formed from a wide variety of materials, unless described otherwise herein.

For purposes of this disclosure, the term “coupled” (in all of its forms, couple, coupling, coupled, etc.) generally means the joining of two components (electrical or mechanical) directly or indirectly to one another. Such joining may be stationary in nature or movable in nature. Such joining may be achieved with the two components (electrical or mechanical) and any additional intermediate members being integrally formed as a single unitary body with one another or with the two components. Such joining may be permanent in nature or may be removable or releasable in nature unless otherwise stated.

It is also important to note that the construction and arrangement of the elements of the disclosure as shown in the exemplary embodiments is illustrative only. Although only a few embodiments of the present innovations have been described in detail in this disclosure, those skilled in the art who review this disclosure will readily appreciate that many modifications are possible (e.g., variations in sizes, dimensions, structures, shapes and proportions of the various elements, values of parameters, mounting arrangements, use of materials, colors, orientations, etc.) without materially departing from the novel teachings and advantages of the subject matter recited. For example, elements shown as integrally formed may be constructed of multiple parts or elements shown as multiple parts may be integrally formed, the operation of the interfaces may be reversed or otherwise varied, the length or width of the structures and/or members or connectors or other elements of the system may be varied, the nature or number of adjustment positions provided between the elements may be varied. It should be noted that the elements and/or assemblies of the system may be constructed from any of a wide variety of materials that provide sufficient strength or durability, in any of a wide variety of colors, textures, and combinations. Accordingly, all such modifications are intended to be included within the scope of the present innovations. Other substitutions, modifications, changes, and omissions may be made in the design, operating conditions, and arrangement of the desired and other exemplary embodiments without departing from the spirit of the present innovations.

It will be understood that any described processes or steps within described processes may be combined with other disclosed processes or steps to form structures within the scope of the present disclosure. The exemplary structures and processes disclosed herein are for illustrative purposes and are not to be construed as limiting.