COOLING DEVICE AND COOLING UNIT INCLUDING THE SAME

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

The present invention claims priority under 35 U.S.C. $119 to Japanese Patent Application No. 2024-116046, filed on Jul. 19, 2024, and Japanese Patent Application No. 2024-208154, filed on Nov. 29, 2024, the entire contents of which are hereby incorporated herein by reference.

1. FIELD OF THE INVENTION

The present disclosure relates to cooling devices and cooling assemblies including the same.

2. BACKGROUND

A conventional cooling device includes a cold plate, a pair of manifolds, an inflow pipe, and an outflow pipe. The cold plate has a lower surface that comes into contact with a heat generating component, and includes a refrigerant flow path in which a refrigerant flows. The pair of manifolds is disposed to oppose each other across the cold plate. The inflow pipe extends from one of the manifolds to the inflow port of the cold plate to allow the refrigerant to flow toward the cold plate. The outflow pipe allows the refrigerant flowing out of the outflow port of the cold plate to flow out toward the other manifold. A refrigerant pipe extends in an intersecting direction intersecting the opposing direction of the pair of manifolds.

However, in the conventional cooling device, there is a possibility that assembling workability is deteriorated when the inflow pipe and the manifold are connected or when the outflow pipe and the manifold are connected. When the cooling air flows along the inflow pipe and the outflow pipe, heat of the heat generating component and the components disposed around the heat generating component can be exhausted. However, there is a possibility that the cooling air collides with the manifold and the cooling effect by the cooling air is reduced.

SUMMARY

An example embodiment of a cooling device of the present disclosure includes a first cold plate, a pair of manifolds, an inflow pipe, and an outflow pipe. The first cold plate includes a lower surface that comes into contact with a heat generating component, and includes a refrigerant flow path in which a refrigerant flows. The pair of manifolds oppose each other across the first cold plate, and each includes a first refrigerant pipe through which the refrigerant flows. The inflow pipe extends from one manifold to the inflow port of the first cold plate, and allows the refrigerant to flow toward the first cold plate. The outflow pipe extends from the outflow port of the first cold plate to the other manifold, and allows the refrigerant to flow out toward the other manifold. The first refrigerant pipe extends in an intersecting direction intersecting the opposing direction of the pair of manifolds. At least one of the inflow pipe and the outflow pipe are connected to the first refrigerant pipe via an elbow located on an upper surface or a lower surface of each of the manifolds.

The above and other elements, features, steps, characteristics and advantages of the present disclosure will become more apparent from the following detailed description of the example embodiments with reference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a cooling device according to a first example embodiment of the present disclosure.

FIG. 2 is a perspective view of the cooling device according to the first example embodiment of the present disclosure.

FIG. 3 is a perspective view of the cooling device according to the first example embodiment of the present disclosure.

FIG. 4 is a side view of the cooling device according to the first example embodiment of the present disclosure.

FIG. 5 is a perspective view of a cooling assembly according to a second example embodiment of the present disclosure.

FIG. 6 is a top view of a cooling device according to a third example embodiment of the present disclosure.

FIG. 7 is a top view of the cooling device according to the third example embodiment of the present disclosure.

FIG. 8 is an enlarged longitudinal sectional view schematically illustrating an elbow of the cooling device according to the third embodiment of the present disclosure.

FIG. 9 is an enlarged longitudinal sectional view schematically illustrating an elbow of the cooling device according to the third example embodiment of the present disclosure.

FIG. 10 is a side view of the cooling device according to the third example embodiment of the present disclosure.

FIG. 11 is an enlarged longitudinal sectional view schematically illustrating a manifold of the cooling device according to the third example embodiment of the present disclosure.

FIG. 12 is an enlarged perspective view illustrating a portion of the cooling device according to the third example embodiment of the present disclosure.

DETAILED DESCRIPTION

Example embodiments of the present disclosure will be described below with reference to the drawings. In the present application, a direction in which a bracket 50 is disposed with respect to a cold plate 11 is referred to as an “upper side”, and a direction opposite to the direction in which the bracket 50 is disposed is referred to as a “lower side”. Moreover, in the present application, a direction in which the bracket 50 is disposed with respect to the cold plate 11 is referred to as a “vertical direction”, a direction orthogonal to the “vertical direction” is referred to as a “horizontal direction”, and the shape and positional relationship of each part will be described accordingly.

A direction in which a pair of manifolds 21 and 22 of a cooling device 1 oppose each other is defined as an opposing direction (X1-X2), and a direction intersecting the opposing direction (X1-X2) is defined as an intersecting direction (Y1-Y2). In the present example embodiment, a vertical direction (Z1-Z2) is orthogonal to the opposing direction (X1-X2) and the intersecting direction (Y1-Y2). However, the vertical direction and the horizontal direction are defined merely for convenience of description, and the orientations of the cooling device 1 according to the present disclosure at the time of manufacture and at the time of use are not limited.

In addition, a “parallel direction” in the present application includes a substantially parallel direction. Moreover, an “orthogonal direction” in the present application includes a substantially orthogonal direction.

A cooling device according to an example embodiment of the present disclosure will be described. FIGS. 1, 2, and 3 are perspective views of the cooling device 1 according to an example embodiment of the present disclosure. FIG. 2 illustrates the cooling device from below, and FIG. 3 illustrates a state in which a top wall 51 of the bracket 50 is omitted.

The cooling device 1 includes a plurality of cold plates (first cold plates) 11, a pair of manifolds 21 and 22, an inflow pipe 31, an outflow pipe 32, a supply pipe 41, a discharge pipe 42, and a bracket 50.

The plurality of cold plates 11 are connected in parallel to the pair of manifolds 21 and 22 via the inflow pipe 31 and the outflow pipe 32. The manifold 21 is connected to the supply pipe 41, and the manifold 22 is connected to the discharge pipe 42. The supply pipe 41 and the discharge pipe 42 are connected to a pump (not illustrated).

When the pump is driven, a refrigerant is supplied from the supply pipe 41 to the manifold 21. The refrigerant supplied to the manifold 21 branches into the respective inflow pipes 31.

The branched refrigerant flows into each cold plate 11. The refrigerant flowing into each cold plate 11 flows out to the manifold 22 via the outflow pipe 32. The refrigerant flowing out to the manifold 22 returns to the pump via the discharge pipe 42. As a result, the refrigerant circulates in the cooling device 1, and the lower surface of the cold plate 11 is cooled by the refrigerant.

The cold plate 11 has a lower surface that comes into thermal contact with a heat generating component (not illustrated), and includes a refrigerant flow path (first refrigerant flow path) 11a in which the refrigerant flows (see FIG. 2).

In the present example embodiment, a plurality of the cold plates 11 are arranged in the intersecting direction (Y1-Y2) and connected in parallel via the pair of manifolds 21 and 22. Accordingly, it is possible to efficiently cool the plurality of heat generating components by disposing the cold plates 11 corresponding to the heat generating components respectively. In the present example embodiment, two cold plates 11 are arranged in the intersecting direction (Y1-Y2). However, one or three or more cold plates may be arranged.

The cold plate 11 is made of a metal having high thermal conductivity such as copper or aluminum. The cold plate 11 includes a bottom wall 111 and a lid 110. The bottom wall 111 includes a recessed portion 111a formed to be recessed downward (Z2) and a flange portion 111b expanding in the horizontal direction from the upper peripheral edge of the recessed portion 111a (see FIG. 2). The lid 110 covers the opening of the recessed portion 111a and is joined to the flange portion 111b. A heat generating component comes into contact with the lower surface of the recessed portion 111a.

The refrigerant flow path (first refrigerant flow path) 11a is formed in a space surrounded by the recessed portion 111a of the bottom wall 111 and the lid 110, and a plurality of blades (not illustrated) are arranged in the refrigerant flow path (first refrigerant flow path) 11a. The blades are formed by, for example, cutting the upper surface of the bottom wall 111. As a result, thermal conductivity from the bottom wall 111 to the blades is improved.

An inflow port 110a and an outflow port 110b penetrating in the vertical direction (Z1-Z2) are formed in the lid 110. The inflow port 110a and the outflow port 110b face the recessed portion 111a in the vertical direction (Z1-Z2). The refrigerant flow path (first refrigerant flow path) 11a is formed inside the recessed portion 111a.

In the present example embodiment, the cold plate 11 has a rectangular shape in the top view, but is not limited thereto. For example, the shape may be a polygon having a plurality of corners or a circle in the top view.

The pair of manifolds 21 and 22 is disposed to oppose each other with the cold plate 11 interposed therebetween, and includes refrigerant pipes 21a and 22a respectively through which the refrigerant flows. In the present example embodiment, the manifolds 21 and 22 are each formed in a rectangular parallelepiped shape, and the refrigerant pipes 21a and 22a extend in the intersecting direction (Y1-Y2). The refrigerant pipes 21a and 22a extend in parallel to each other, and the opposing direction (X1-X2) and the intersecting direction (Y1-Y2) are orthogonal to each other. As a result, it is possible to suppress the size increase of the cooling device 1.

The inflow pipe 31 extends from one manifold 21 to the inflow port 110a of the cold plate 11 to allow the refrigerant to flow toward the cold plate 11. The outflow pipe 32 extends from the outflow port 110b of the cold plate 11 to the other manifold 22 to allow the refrigerant to flow out toward the other manifold 22.

In the present example embodiment, the inflow pipe 31 and the outflow pipe 32 extend in parallel along the opposing direction (X1-X2) and are orthogonal to the extending direction of the refrigerant pipes 21a and 22a. The inflow pipe 31 and the outflow pipe 32 may not extend linearly over the entire length in the opposing direction (X1-X2). For example, the inflow pipe 31 and the outflow pipe 32 may extend in parallel along the opposing direction (X1-X2) while being partially bent.

The inflow pipe 31 is connected to the refrigerant pipe 21a via an elbow 81 disposed on an upper surface of the manifold 21 at an end on one side (X1) in the opposing direction. The inflow pipe 31 is connected to the refrigerant flow path 11a via an elbow 83 disposed on an upper surface of the lid 110 of the cold plate 11 at an end on the other side (X2) in the opposing direction.

The outflow pipe 32 is connected to the refrigerant pipe 22a via an elbow 82 disposed on an upper surface of the manifold 22 at an end on the other side (X2) in the opposing direction. The outflow pipe 32 is connected to the refrigerant flow path 11a via an elbow 84 disposed on the upper surface of the lid 110 of the cold plate 11 at an end on one side (X1) in the opposing direction.

The elbow 81 connects the inflow pipe 31 and the refrigerant pipe 21a by changing the circulation direction of the refrigerant. The elbow 82 connects the outflow pipe 32 and the refrigerant pipe 22a by changing the circulation direction of the refrigerant. The elbow 81 changes the flowing direction of the refrigerant flowing in the intersecting direction (Y1-Y2) to the opposing direction (X1-X2). The elbow 82 changes the flowing direction of the refrigerant flowing in the opposing direction (X1-X2) to the intersecting direction (Y1-Y2).

Since the elbows 81 and 82 are disposed on the upper surfaces of the manifolds 21 and 22, the work space is expanded, and the inflow pipe 31 and the refrigerant pipe 21a can be easily connected. In addition, the outflow pipe 32 and the refrigerant pipe 22a can be easily connected. This improves the assembling workability of the cooling device 1.

When the cooling air flows in the opposing direction (X1-X2) along the inflow pipe 31 and the outflow pipe 32, the heat of the heat generating component and the components disposed around the heat generating component can be exhausted. At this time, the cooling air flowing in the opposing direction (X1-X2) easily passes through the upper surfaces of the manifolds 21 and 22 without colliding with the manifolds 21 and 22. As a result, the cooling effect by the cooling air can be improved. The cooling air passing through the upper surfaces of the manifolds 21 and 22 can also improve the cooling effect on the components disposed around the cooling device 1.

The elbow 83 connects the inflow pipe 31 and the refrigerant flow path 11a. The elbow 84 connects the outflow pipe 32 and the refrigerant flow path 11a.

Since the elbows 83 and 84 are disposed on the upper surface of the lid 110 of the cold plate 11, the work space is expanded, and the refrigerant flow path 11a and the inflow pipe 31 can be easily connected. In addition, the refrigerant flow path 11a and the outflow pipe 32 can be easily connected. As a result, the assembling workability of the cooling device 1 is further improved.

The supply pipe 41 supplies the refrigerant to one manifold 21. The discharge pipe 42 discharges the refrigerant from the other manifold 22. In the present example embodiment, the supply pipe 41 is connected to the refrigerant pipe 21a via the elbow 85 disposed on the upper surface of the manifold 21. On the other hand, the discharge pipe 42 is connected to a side surface of the manifold 22 on the other side (X2) in the opposing direction. The discharge pipe 42 may be connected to the upper surface of the manifold 22 via an elbow. That is, at least one of the supply pipe 41 and the discharge pipe 42 is preferably connected to the refrigerant pipes 21a and 22a via the elbows 85 disposed on the upper surfaces of the manifolds 21 and 22.

Since the elbow 85 is disposed on the upper surface of the manifold 21, the work space is expanded, and the supply pipe 41 and the refrigerant pipe 21a can be easily connected. As a result, the assembling workability of the cooling device 1 is further improved.

In the present example embodiment, the supply pipe 41 and the discharge pipe 42 are drawn out to the other side in the opposing direction (the same direction side X2 in the opposing direction), and the supply pipe 41 is connected to the refrigerant pipe 21a at the end on one side (Y1) in the intersecting direction of the manifold 21. Here, the manifold 21 is disposed on the side opposite to the drawing direction (X2) of the supply pipe 41 and the discharge pipe 42.

When the supply pipe 41 and the discharge pipe 42 are drawn out to one side (X1) in the opposing direction, the discharge pipe 42 is connected to the refrigerant pipe 22a at the end on the other side (Y2) in the intersecting direction of the manifold 22. That is, the supply pipe 41 and the discharge pipe 42 are drawn out to the same direction side in the opposing direction (X1-X2), and one of the supply pipe 41 and the discharge pipe 42 is connected to the refrigerant pipes 21a and 22a at the ends in the intersecting direction (Y1-Y2) of the manifolds 21 and 22 arranged on the opposite side to the drawing direction of the supply pipe 41 and the discharge pipe 42.

As a result, even when the inflow pipe 31 and the outflow pipe 32 has been connected to the manifolds 21 and 22 respectively, the supply pipe 41 or the discharge pipe 42 to be connected later can be easily connected to the refrigerant pipe 21a or the refrigerant pipe 22a. On the other hand, even when the supply pipe 41 or the discharge pipe 42 has been connected to the manifolds 21 and 22 respectively, the inflow pipe 31 and the outflow pipe 32 to be connected later can be easily connected to the refrigerant pipe 21a or the refrigerant pipe 22a. Therefore, the assembling workability of the cooling device 1 is further improved.

In the present example embodiment, the end in the intersecting direction (Y1) of the manifold 21 disposed on the opposite side (X1) to the drawing direction protrudes in the intersecting direction (Y1) with respect to the end in the intersecting direction (Y1) of the manifold 22 disposed on the drawing direction side (X2). As a result, the supply pipe 41 is drawn out in the opposing direction (X1-X2) without coming into contact with the end in the intersecting direction (Y1) of the manifold 22 arranged on the drawing direction side (X2). Therefore, it is possible to further suppress an increase in size of the cooling device 1.

When the supply pipe 41 and the discharge pipe 42 are drawn out to one side (X1) in the opposing direction, the end in the intersecting direction (Y2) of the manifold 22 arranged on the opposite side (X2) to the drawing direction preferably protrudes in the intersecting direction (Y2) with respect to the end in the intersecting direction (Y2) of the manifold 21 arranged on the drawing direction side (X1). As a result, the discharge pipe 42 is drawn out in the opposing direction (X1-X2) without coming into contact with the end in the intersecting direction (Y1) of the manifold 21 arranged on the drawing direction side (X1).

FIG. 4 is a side view of the cooling device 1. The bracket 50 protects the cold plate 11. The bracket 50 includes a top wall 51 and legs 52. The top wall 51 is a plate-shaped metal member covering the cold plate 11 from above (Z1). The legs 52 extend downward (Z2) from the outer periphery of the top wall 51 and are disposed outside the manifolds 1 and 22 in the intersecting direction (Y1-Y2). The manifolds 21 and 22 are fixed to the legs 52.

In the present example embodiment, the top wall 51 is formed in a rectangular shape in a plan view, and the legs 52 are provided at four places at corner portions of the top wall 51. The legs 52 are fixed to outer surfaces of the manifolds 21 and 22 in the intersecting direction (Y1-Y2).

In the top view, the top wall 51 at least partially overlaps the elbows 81 and 82 disposed on the upper surfaces of the manifolds 21 and 22. Thus, the elbows 81 and 82 are covered and protected by the top wall 51.

By fixing the bracket 50 and the manifolds 21 and 22, the cooling device 1 can be easily integrated. At this time, the manifolds 21 and 22 are easily positioned, and the assembly efficiency of the cooling device 1 is further improved. Further, by providing the legs 52, a gap is formed between the top wall 51 and the manifolds 21 and 22. Accordingly, the cooling air flowing through the gap between the top wall 51 and the cold plates 11 in the opposing direction (X1-X2) easily passes through the gap between the top wall 51 and the manifolds 21 and 22. As a result, the cooling effect by the cooling air is further improved.

The gap between the top wall 51 and the manifolds 21 and 22 in the vertical direction (Z1-Z2) is preferably larger than the gap between the manifolds 21 and 22 and the lid 110 of the cold plate 11 in the vertical direction (Z1-Z2). As a result, the flow amount of the cooling air passing through the gap between the top wall 51 and the manifolds 21 and 22 can be increased. Therefore, the cooling effect by the cooling air is further improved. In addition, by providing a large gap between the top wall 51 and the manifolds 21 and 22, it is possible to sufficiently secure the installation space for the elbows arranged on the upper surfaces of the manifolds. As a result, the assembling workability of the cooling device 1 is further improved.

In the present example embodiment, the lower ends of the manifolds 21 and 22 are positioned below (Z2) the upper end of the cold plate 11 and above (Z1) the lower end of the cold plate 11. The lower ends of the manifolds 21 and 22 may be disposed above (Z1) the upper end of the cold plate 11.

Accordingly, the cooling air flowing through the gap between the top wall 51 and the cold plates 11 in the opposing direction (X1-X2) easily passes through the lower surfaces of the manifolds 21 and 22. As a result, the cooling effect by the cooling air is further improved.

Next, a second example embodiment of the present disclosure will be described. FIG. 5 is a perspective view of a cooling assembly 200 according to the second example embodiment, illustrating a state in which the top wall 51 of the bracket 50 is omitted. For convenience of description, similar parts to those of the cooling device 1 in the first example embodiment illustrated in FIGS. 1 to 4 are denoted by the same reference signs. The cooling assembly 200 of the second example embodiment is configured such that the cooling device 1 and a cooling device 201 are arranged side by side in the intersecting direction (Y1-Y2). Other parts are similar to those in the first example embodiment.

The cooling device 201 includes a plurality of cold plates 211, a pair of manifolds 221 and 222, an inflow pipe 231, an outflow pipe 232, a supply pipe 241, a discharge pipe 242, and a bracket 50.

The plurality of cold plates 211 are connected in parallel to the pair of manifolds 221 and 222 via the inflow pipe 231 and the outflow pipe 232. The manifold 221 is connected to the supply pipe 241, and the manifold 222 is connected to the discharge pipe 242.

When the pump is driven, a refrigerant is supplied from the supply pipe 241 to the manifold 221. The refrigerant supplied to the manifold 221 branches into the respective inflow pipes 231.

The branched refrigerant flows into each cold plate 211. The refrigerant flowing into each cold plate 211 flows out to the manifold 222 via the outflow pipe 232. The refrigerant flowing out to the manifold 222 returns to the pump via the discharge pipe 242.

The manifold 21 connected to the inflow pipe 31 and the manifold 222 connected to the outflow pipe 232 are adjacent to each other in the intersecting direction (Y1-Y2). The manifold 221 connected to the inflow pipe 231 and the manifold 22 connected to the outflow pipe 32 are adjacent to each other in the intersecting direction (Y1-Y2).

Heat exchange is performed between the manifolds 21 and 222 adjacent to each other in the intersecting direction (Y1-Y2). In addition, heat exchange is performed between the manifolds 22 and 221 adjacent to each other in the intersecting direction (Y1-Y2). As a result, the cooling effect of the entire cooling assembly 200 can be reduced from being biased to one side in the opposing direction (X1-X2).

Although the bracket 50 is omitted in the present example embodiment, it is preferable that the top wall 51 covers the cold plates 11 and the cold plates 211 from above (Z1) to integrate the cooling device 1 and the cooling device 201.

Next, a third embodiment of the present invention will be described. FIGS. 6 and 7 are top views of a cooling device 301 of the third embodiment, and FIG. 7 illustrates a state in which the top wall 51 of the bracket 50 is omitted. For convenience of description, parts similar to those of the cooling device 1 of the first embodiment illustrated in FIGS. 1 to 5 are denoted by the same reference numerals. In the cooling device 301 according to the third embodiment, a plurality of cold plates (first cold plates) 311 are arranged between the pair of manifolds 21 and 22. An inflow pipe 331 extends from one manifold 21 and branches to be connected to the inflow ports 110a of the plurality of cold plates 311. An outflow pipe 332 extends from the other manifold 22 and branches to be connected to the outflow ports 110b of the plurality of cold plates 311.

In the present embodiment, two cold plates (first cold plates) 311 are arranged in the opposing direction (X1-X2) to constitute a cold plate group 311A. In the cold plate group 311A, the cold plates (first cold plates) 311 are connected in parallel. Two cold plate groups 311A are arranged in the intersecting direction (Y1-Y2) and connected in parallel via the pair of manifolds 21 and 22.

As a result, the cold plates 311 can be disposed corresponding to a plurality of heat generating components arranged in the opposing direction (X1-X2) to more efficiently cool the plurality of heat generating components.

In the present embodiment, two cold plates (first cold plates) 311 are connected in parallel in the cold plate group 311A, but three or more cold plates may be connected in parallel. In the present embodiment, two cold plate groups 311A are connected in parallel, but three or more cold plate groups may be connected in parallel. Only one cold plate group 311A may be disposed between the pair of manifolds 21 and 22.

In the present embodiment, the inflow pipe 331 branches on an elbow 384B disposed on the upper surface of the lid 110 of the cold plate (first cold plate) 311 disposed on the upstream side X1. The outflow pipe 332 branches on an elbow 383A disposed on the upper surface of the lid 110 of the cold plate (first cold plate) 311 disposed on the downstream side X2. That is, the inflow pipe 331 or the outflow pipe 332 branches on the elbows 383A or 384B disposed on the upper surface of one cold plate (first cold plate) 311.

Since the elbows 383A and 384B are disposed on the upper surface of the lid 110 of the cold plate 311, the working space is expanded, and the refrigerant flow path (first refrigerant flow path) 11a and the inflow pipe 331 can be easily connected. In addition, the refrigerant flow path (first refrigerant flow path) 11a and the outflow pipe 332 can be easily connected to each other. Accordingly, the assembling workability of the cooling device 301 is further improved.

FIG. 8 is an enlarged longitudinal sectional view schematically illustrating the elbow 384B. In FIG. 8, the flow of the refrigerant is indicated by arrows. The elbow 384B connects the inflow pipe 331 and the refrigerant flow path 11a. More specifically, the elbow 384B is a T-shaped pipe, and both ends of the elbow 384B in the opposing direction (X1-X2) are connected to the inflow pipe 331. The lower end of the elbow 384B is connected to the inflow port 110a of the cold plate 311 disposed on the upstream side X1.

The elbow 384A is an L-shaped pipe, and an end on the upstream side X1 is connected to the inflow pipe 331 (see FIG. 7). The lower end of the elbow 384A is connected to the inflow port 110a of the cold plate 311 disposed on the downstream side X2. As a result, a part of the refrigerant flowing from the refrigerant pipe 21a of the manifold 21 toward the cold plate 311 disposed on the downstream side X2 branches at the elbow 384B and flows into the refrigerant flow path 11a from the inflow port 110a.

FIG. 9 is an enlarged longitudinal sectional view schematically illustrating the elbow 383A. In FIG. 9, the flow of the refrigerant is indicated by arrows. The elbow 383A connects outflow pipe 332 and refrigerant flow path 11a. More specifically, the elbow 383A is a T-shaped pipe, and both ends of the elbow 383A in the opposing direction (X1-X2) are connected to the outflow pipe 332. The lower end of the elbow 383A is connected to the outflow port 110b of the cold plate 311 disposed on the downstream side X2.

The elbow 383B is an L-shaped pipe, and an end on the downstream side X2 is connected to the outflow pipe 332 (see FIG. 7). The lower end of the elbow 383B is connected to the outflow port 110b of the cold plate 311 disposed on the upstream side X1. As a result, the refrigerant flowing out of the outflow port 110b of the cold plate 311 disposed on the upstream side X1 merges with the refrigerant flowing out of the outflow port 110b of the cold plate 311 disposed on the downstream side X2, and flows toward the refrigerant pipe 22a of the manifold 22.

In the present embodiment, the inflow pipe 331 and the outflow pipe 332 are made of the same piping material, and each include an inner diameter portion 33a and an outer diameter portion 33b. The inner diameter portion 33a constitutes a refrigerant flow path and has a tubular shape. The outer diameter portion 33b covers and protects the inner diameter portion 33a and has a tubular shape. The inner diameter portion 33a is made of a resin having a lower water absorption rate than the outer diameter portion 33b. The outer diameter portion 33b is made of a resin having a bending stress larger than that of the inner diameter portion 33a.

As the inner diameter portion 33a, for example, a polypropylene resin having low water absorbency is suitably used. Leakage of the refrigerant can be prevented by using a resin having low water absorbency for the inner diameter portion 33a. As the outer diameter portion 33b, for example, a nylon (nylon 66) having a large bending stress is suitably used. By using a resin having a large bending stress for the outer diameter portion 33b, it is possible to reduce breakage of the inflow pipe 331 and the outflow pipe 332 even when the inflow pipe 331 and the outflow pipe 332 are bent and disposed in the cooling device 301. Therefore, the inflow pipe 331 and the outflow pipe 332 are easily routed, and the assembling workability of the cooling device 301 is further improved.

The linear expansion coefficient of the resin constituting the inner diameter portion 33a and the linear expansion coefficient of the resin constituting the outer diameter portion 33b are preferably substantially the same. This configuration prevents the inflow pipe 331 and the outflow pipe 332 from being deformed by heat of the circulating refrigerant when the cooling device 301 is driven. Therefore, the refrigerant can be smoothly circulated to reduce the drive power of the cooling device 301.

In addition, a cross-sectional area Sla of the flow path of the inflow pipe 331 disposed upstream of the elbow (branch point) 384B is preferably larger than a cross-sectional area S1b of the flow path of the inflow pipe 331 disposed downstream of the elbow (branch point) 384B (see FIG. 8). As a result, the circulation amount of the refrigerant can be increased in the inflow pipe 331 before branching, and the refrigerant can be smoothly circulated. In addition, a cross-sectional area S2b of the flow path of the outflow pipe 332 disposed downstream of the elbow (branch point) 383A is preferably larger than a cross-sectional area S2a of the flow path of the outflow pipe 332 disposed upstream of the elbow (branch point) 383A. As a result, it is possible to increase the circulation amount of the refrigerant in the outflow pipe 332 after merging and to smoothly circulate the refrigerant.

In the inflow pipe 331 and the outflow pipe 332, a band portion 34 that tightens and fixes outer peripheral surfaces of the elbows 81, 383A, 383B, 384A, 384B, and 386 and the connector 382 is disposed. By disposing the band portion 34, it is possible to prevent the inflow pipe 331 and the outflow pipe 332 from coming off from the elbows 81, 383A, 383B, 384A, 384B, and 386 and the connector 382 and to suppress leakage of the refrigerant. The band portion 34 may be disposed in only one of the inflow pipe 331 and the outflow pipe 332.

In addition, the top wall 51 has an opening portion 51a that opens to face the band portion 34 in the vertical direction (Z1-Z2). As a result, the band portion 34 and the top wall 51 can be prevented from coming into contact with each other, and a connection failure between the inflow pipe 331 and the elbows 384A and 384B or a connection failure between the outflow pipe 332 and the elbows 383A and 383B can be prevented.

In the present embodiment, the inflow pipe 331 is connected to the refrigerant pipe (first refrigerant pipe) 21a via the elbows 81 and 386 disposed on the upper surface of the manifold 21, and the outflow pipe 332 is connected to the refrigerant pipe (first refrigerant pipe) 22a via the connector 382 disposed on the side surface of the manifold 22.

The connector 382 changes the flowing direction of the refrigerant flowing in the opposing direction (X1-X2) to the intersecting direction (Y1-Y2). By connecting the outflow pipe 332 via the connector 382 disposed on the side surface of the manifold 22, the cooling air flowing in the opposing direction (X1-X2) smoothly passes through the upper surface of the manifold 22. As a result, the cooling effect on the components arranged around the cooling device 301 can be further improved.

The outflow pipe 332 may be connected to the refrigerant pipe (first refrigerant pipe) 22a via an elbow disposed on the upper surface of the manifold 22, and the inflow pipe 331 may be connected to the refrigerant pipe (first refrigerant pipe) 21a via a connector disposed on a side surface of the manifold 21. The elbows 81 and 386 may be disposed on the lower surface of the manifold 21 to connect the inflow pipe 331 and the refrigerant pipe 21a.

In the present embodiment, the elbow 386 disposed on the upper surface of the manifold 21 has a protruding portion 386b and an extending portion 386a (see FIG. 7). The protruding portion 386b protrudes in a direction X2 approaching the cold plate (first cold plate) 311 in the opposing direction from the peripheral edge of the manifold 21. As a result, a space adjacent to the protruding portion 386b in the intersecting direction (Y1-Y2) can be secured as a screw fastening space. As a result, a screw 385a can be easily screwed without being disturbed by the inflow pipe 331, and the assembly workability of the cooling device 301 is further improved.

The extending portion 386a extends in the direction X1 away from the cold plate (first cold plate) 311 from the center of the manifold 21 in the opposing direction (X1-X2). As a result, the cantilever support strength of the elbow 386 is improved.

When an elbow is disposed on the upper surface or the lower surface of the manifold 22, the protruding portion 386b and the extending portion 386a may be provided in the elbow disposed on the manifold 22.

FIG. 10 is a side view of the cooling device 301, and FIG. 11 is an enlarged longitudinal sectional view schematically illustrating the manifold 21. In the present embodiment, a cold plate (second cold plate) 312 disposed below the manifold 21 is further provided. The lower surface of the cold plate (second cold plate) 312 comes into thermal contact with a heat generating component. The cold plate (second cold plate) 312 includes a second refrigerant flow path 312a that communicates with the refrigerant pipe (first refrigerant pipe) 21a and through which the refrigerant flows.

A cold plate (second cold plate) 313 is disposed below the manifold 22. The cold plate 313 includes a second refrigerant flow path 313a that communicates with the refrigerant pipe (first refrigerant pipe) 22a and through which the refrigerant flows.

Since the cold plates (second cold plates) 312 and 313 are disposed, heat generating components disposed below the manifolds 21 and 22 can be efficiently cooled.

More specifically, the cold plate 312 is made of a metal having high thermal conductivity such as copper or aluminum. The cold plate 312 includes a bottom wall 3111 and a lid 3110. The bottom wall 3111 includes a recessed portion 3111a formed to be recessed downward (Z2) and a flange portion 3111b expanding in the horizontal direction from the upper end peripheral edge of the recessed portion 3111a. The lid 3110 covers the opening of the recessed portion 3111a and is joined to the flange portion 3111b. A heat generating component comes into contact with the lower surface of the recessed portion 3111a.

A second refrigerant flow path 312a is formed in a space surrounded by the recessed portion 3111a of the bottom wall 3111 and the lid 3110, and a plurality of blades (not illustrated) are arranged in the second refrigerant flow path 312a. The blades are formed by, for example, cutting the upper surface of the bottom wall 3111. As a result, thermal conductivity from the bottom wall 3111 to the blades is improved.

A through hole 3110a penetrating in the vertical direction (Z1-Z2) is formed in the lid 3110. In the present embodiment, the refrigerant pipe (first refrigerant pipe) 21a and the second refrigerant flow path 312a communicate with each other via the through hole 3110a. As a result, the refrigerant flows through the second refrigerant flow path 312a in the intersecting direction (Y1-Y2).

In the present embodiment, the cold plate 312 has a rectangular shape in the top view, but is not limited thereto. For example, the shape may be a polygon having a plurality of corners or a circle in the top view. The cold plate 313 also has the same structure as the cold plate 312, and the refrigerant flows through the second refrigerant flow paths 313a in the intersecting direction (Y1-Y2).

FIG. 12 is an enlarged perspective view illustrating a part of the cold plate 311. The cold plate (first cold plate) 311 includes an inclined surface 311a. In the inclined surface 311a, an upper end portion of a surface facing the manifold 21 in the opposing direction (X1-X2) is inclined in the direction X2 away from the manifold 21 in the opposing direction (X1-X2) as it goes upward Z1.

In the cold plate (first cold plate) 311 facing the manifold 22, the inclined surface 311a is inclined in the direction X1 away from the manifold 22 in the opposing direction (X1-X2) as it goes upward Z1.

Accordingly, when the inflow pipe 331 or the outflow pipe 332 is connected to the manifold 21 or 22, it is possible to prevent the inflow pipe 331 or the outflow pipe 332 from coming into contact with the cold plate (first cold plate) 311 and being damaged.

The cooling device 301 preferably further includes a buffer (not illustrated) sandwiched between the cold plate (first cold plate) 311 and the manifolds 21 and 22 in the opposing direction (X1-X2). As a result, damage to the manifolds 21 and 22 due to contact between the cold plate (first cold plate) 311 and the manifolds 21 and 22 caused by vibration during transportation or the like can be prevented.

In addition, the cooling device 301 preferably further includes a buffer (not illustrated) sandwiched between the top wall 51 and the manifolds 21 and 22 in the vertical direction (Z1-Z2). As a result, damage to the manifolds 21 and 22 due to contact between the top wall 51 and the manifolds 21 and 22 caused by vibration during transportation or the like can be prevented.

The above example embodiments are merely examples of the present disclosure. The configurations of the example embodiments may be appropriately changed without departing from the technical idea of the present disclosure. In addition, the example embodiments may be implemented in combination within a feasible range. For example, in the example embodiments described above, the elbows 81 and 82 are disposed on the upper surfaces of the manifolds 21 and 22, but the elbows 81 and 82 may be disposed on the lower surfaces of the manifolds 21 and 22.

That is, the inflow pipe 31 is connected to the refrigerant pipe 21a via the elbow 81 disposed on the lower surface of the manifold 21 at an end on one side (X1) in the opposing direction. The outflow pipe 32 is connected to the refrigerant pipe 22a via the elbow 82 disposed on the lower surface of the manifold 22 at an end on the other side (X2) in the opposing direction. At this time, the lower ends of the manifolds 21 and 22 are preferably disposed above (Z1) the upper end of the cold plate 11. As a result, the work space expands, and the inflow pipe 31 and the refrigerant pipe 21a can be easily connected. In addition, the outflow pipe 32 and the refrigerant pipe 22a can be easily connected.

As described above, a cooling device (1) according to one example embodiment of the present disclosure includes: a first cold plate (11) including a lower surface that comes into thermal contact with a heat generating component, and including a first refrigerant flow path (11a) in which a refrigerant flows; a pair of manifolds (21, 22) opposing each other across the first cold plate and each including a first refrigerant pipe through which the refrigerant flows; an inflow pipe (31) extending from one of the pair of manifolds to an inflow port (110a) of the first cold plate and allowing the refrigerant to flow toward the first cold plate; and an outflow pipe (32) extending from an outflow port (110b) of the first cold plate to another of the pair of manifolds and allowing the refrigerant to flow out toward the other of the pair of manifolds, wherein the first refrigerant pipe extends in an intersecting direction (Y1-Y2) intersecting an opposing direction (X1-X2) of the pair of manifolds, and at least one of the inflow pipe and the outflow pipe are connected to the first refrigerant pipe via an elbow (81, 82) located on an upper surface or a lower surface of each of the pair of manifolds (first configuration).

In the first configuration, the cooling device may be configured such that the inflow pipe and the outflow pipe are connected to the first refrigerant flow path via an elbow (83, 84) located on an upper surface of the first cold plate (second configuration).

In the first or second configuration, the cooling device may be configured to further include a supply pipe (41) to supply the refrigerant to one of the pair of manifolds, and a discharge pipe (42) to discharge the refrigerant from the other of the pair of manifolds, and configured such that at least one of the supply pipe and the discharge pipe is connected to the first refrigerant pipe via an elbow (85) located on an upper surface or a lower surface of each of the pair of manifolds (third configuration).

In any one of the first to third configurations, the cooling device may be configured such that the supply pipe and the discharge pipe are drawn out in the same direction (X2) in the opposing direction, and one of the supply pipe and the discharge pipe is connected to the first refrigerant pipe at an end in the intersecting direction of one of the pair of manifolds located on an opposite side (X2) to a drawing direction of the supply pipe and the discharge pipe (fourth configuration).

In any one of the first to fourth configurations, the cooling device may be configured such that the end in the intersecting direction of the one of the pair of manifolds located on the opposite side to the drawing direction protrudes in the intersecting direction with respect to an end in the intersecting direction of the other of the pair of manifolds located on the drawing direction side (fifth configuration).

In any one of the first to fifth configurations, the cooling device may be configured to further include a bracket (50) including: a top wall (51) in a plate shape covering the first cold plate from above; and legs (52) extending downward from an outer periphery of the top wall and located outside the pair of manifolds in the opposing direction or the intersecting direction, and configured such that the pair of manifolds is fixed to the legs (sixth configuration).

In any one of the first to sixth configurations, the cooling device may be configured such that a lower end of one of the pair of manifolds may be positioned above an upper end of the first cold plate (seventh configuration).

In any one of the first to seventh configurations, the cooling device may be configured such that a gap in a vertical direction between the top wall and one of the pair of manifolds is larger than a gap in the vertical direction between the one of the pair of manifolds and the first cold plate (eighth configuration).

In any one of the first to eighth configurations, the cooling device may be configured such that the top wall at least partially overlaps the elbow located on the upper surface of one of the pair of manifolds in the top view (ninth configuration).

In any one of the first to ninth configurations, the cooling device may be configured such that the opposing direction and the intersecting direction are orthogonal to each other (tenth configuration).

In any one of the first to tenth configurations, the cooling device may be configured such that a plurality of the first cold plates are provided in the intersecting direction and are connected in parallel via the pair of the manifolds (eleventh configuration).

In any one of the first to eleventh configurations, the cooling device may be configured such that a plurality of the first cold plates are arranged between the pair of manifolds, the inflow pipe extends from the one of the pair of manifolds and branches to be connected to the inflow ports of the plurality of first cold plates respectively, and the outflow pipe extends from the other of the pair of manifolds and branches to be connected to the outflow ports of the plurality of first cold plates respectively (twelfth configuration).

In the twelfth configuration, the cooling device may be configured such that two of the first cold plates are arranged in the opposing direction (thirteenth configuration).

In the twelfth configuration, the cooling device may be configured such that the inflow pipe or the outflow pipe is branched on an elbow located on an upper surface of one of the first cold plates (fourteenth configuration).

In the twelfth configuration, the cooling device may be configured such that a cross-sectional area of a flow path of the inflow pipe located upstream of a branch point is larger than a cross-sectional area of a flow path of the inflow pipe disposed downstream of the branch point, and

• • a cross-sectional area of a flow path of the outflow pipe located downstream of the branch point is larger than a cross-sectional area of a flow path of the outflow pipe located upstream of the branch point (fifteenth configuration).

In any one of the first to fifteenth configurations, the cooling device may be configured such that each of the inflow pipe and the outflow pipe includes:

• • an inner diameter portion having a tubular shape and defining a flow path for the refrigerant and an outer diameter portion having a tubular shape and covering and protecting the inner diameter portion, the inner diameter portion is made of a resin having a water absorption rate lower than a water absorption rate of the outer diameter portion, and the outer diameter portion is made of a resin having a bending stress larger than a bending stress of the inner diameter portion (sixteenth configuration).

In any one of the first to sixteenth configurations, the cooling device may be configured such that one of the inflow pipe and the outflow pipe is connected to the first refrigerant pipe via an elbow located on an upper surface or a lower surface of one of the pair of manifolds, and another of the inflow pipe and the outflow pipe is connected to the first refrigerant pipe via a connector (382) located on a side surface of another of the pair of manifolds (seventeenth configuration).

In any one of the first to seventeenth configurations, the cooling device may be configured to further include a second cold plate (312) including a lower surface that comes into thermal contact with a heat generating component and is located below one of the pair of manifolds, and configured such that the second cold plate includes a second refrigerant flow path (312a) that communicates with the first refrigerant pipe and in which the refrigerant flows (eighteenth configuration).

In any one of the first to eighteenth configurations, the cooling device may be configured such that at least one of the inflow pipe and the outflow pipe is provided with a band portion (34) that tightens and fixes an outer peripheral surface to the elbow, and

• • the top wall includes an opening portion (51a) that opens to oppose the band portion in the vertical direction (nineteenth configuration).

In any one of the first to nineteenth configurations, the cooling device may be configured such that the first cold plate includes an inclined surface (311a) in which an upper end portion of a surface opposing one of the pair of manifolds in the opposing direction is inclined in a direction away from the one of the pair of manifolds in the opposing direction as the upper end portion goes upward (twentieth configuration).

In any one of the first to twentieth configurations, the cooling device may be configured such that the elbow located on the upper surface or the lower surface of the one of the pair of manifolds includes a protruding portion protruding in a direction approaching the first cold plate in the opposing direction from a peripheral edge of the one of the pair of manifolds (twenty-first configuration).

In the twenty-first configuration, the cooling device may be configured such that the elbow located on the upper surface or the lower surface of the one of the pair of manifolds includes an extending portion extending in a direction away from the first cold plate from a center in the opposing direction of the one of the pair of manifolds (twenty-second configuration).

In any one of the first to twenty-second configurations, the cooling device may be configured to further include a buffer located between the first cold plate and the pair of manifolds in the opposing direction (twenty-third configuration).

In any one of the first to twenty-third configurations, the cooling device may be configured to further include a buffer sandwiched between the top wall and the pair of manifolds in the vertical direction (twenty-fourth configuration).

In a cooling assembly (200) including a plurality of the cooling devices according to any one of the first to twenty-fourth configurations arranged in the intersecting direction, one of the pair of manifolds connected to the inflow pipe and the other of the pair of manifolds connected to the outflow pipe are adjacent to each other in the intersecting direction (twenty-fifth configuration).

Features of the above-described example embodiments and the modifications thereof may be combined appropriately as long as no conflict arises.

While example embodiments of the present disclosure have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present disclosure. The scope of the present disclosure, therefore, is to be determined solely by the following claims.