CHIP GRINDING DEVICE AND GRINDING METHOD

Description

TECHNICAL FIELD

The application relates to the field of chip technology, in particular to a chip grinding device and grinding method.

BACKGROUND

In the process of chip production, the chip board generally needs to be cut, and the staff needs to grind the corners of the chip after the cutting is completed to ensure that its surroundings are complete and easy to install.

The traditional grinding device is usually completed by splicing the bracket and the grinding spindle, and the grinding work needs to be completed by manually moving the grinding spindle. However, this grinding device has problems such as long grinding time, low efficiency, and low yield of finished products.

SUMMARY

Based on this, it is necessary to provide a chip grinding device and a grinding method for the above-mentioned technical problems, which can automatically grind the chip and improve the grinding efficiency and grinding accuracy.

First, the application provides a chip grinding device, and the chip grinding device comprises:

• • A fixture for clamping the chip;
  • The grinding assembly is arranged above the clamp and is used for grinding the chip;
  • The moving assembly is connected with the grinding assembly for moving the grinding assembly to adjust the position of the grinding assembly;
  • The vacuum assembly is arranged on one side of the clamp for collecting the debris and dust generated when the chip is grinding, wherein the vacuum assembly is provided with a speed regulating button for adjusting the collected power;
  • The controller, at least electrically connected with the grinding assembly and the moving assembly, is used for controlling the work of the grinding assembly and the moving assembly.

In one embodiment, the fixture comprises:

• • The base is provided with a base slide rail;
  • The first clamping block and the second clamping block are arranged on the base, the chip is arranged between the first clamping block and the second clamping block, and at least one of the first clamping block and the second clamping block can move along the base slide rail to clamp the chip.

In one of the embodiments, the first clamping block and the second clamping block are provided with spaced bumps on the side facing the chip, and the bumps of the first clamping block and the projections of the second clamping block are dislocated.

In one of the embodiments, the moving assembly comprises a first moving unit, a second moving unit and a third moving unit, wherein:

• • The first moving unit is connected with the grinding assembly and is used for controlling the grinding assembly to move in the first direction;
  • The second moving unit is connected with the first moving unit and the third moving unit respectively, and the second moving unit is used for controlling the first moving unit to move in the second direction;
  • The third moving unit is used for controlling the second moving unit to move upwards in a third party;
  • Wherein, the first direction, the second direction, and the third party are perpendicular to each other, and the first direction is perpendicular to the direction of the chip.

In one embodiment, the chip grinding device further comprises an automatic leveling sensor and a pressure sensor, the grinding assembly comprises a grinding motor and a grinding head, the grinding motor is used for driving the grinding head to rotate, the self-leveling sensor is arranged on the first moving unit and is used for following the first moving unit to move to touch the feature position points of the chip, and the pressure sensor is arranged on the base for when the self-leveling sensor touches a plurality of feature position points of the chipto obtain the heights of the grinding heads respectively to calculate the relative heights of the plurality of feature position points, thereby controlling the grinding heads to rise or fall according to the plurality of relative heights.

In one of the embodiments, the chip grinding device further comprises a camera arranged above the chip for detecting the model of the chip and feeding back the controller so that the controller controls the grinding assembly and the moving assembly according to the model.

In one embodiment, the vacuum assembly comprises a vacuum cleaner and a dust pipe, wherein:

• • One end of the dust collection pipe is connected with the vacuum cleaner, and the other end is arranged on one side of the clamp, and the opening of the other end is oriented toward the chip;
  • The vacuum cleaner is provided with a dust collection fan, and the speed regulating button is arranged on the vacuum cleaner for adjusting the power of the dust collection fan.

In one of the embodiments, the dust collection pipe comprises a dust collection portion, a transition portion, a main body portion and a connecting portion, wherein: the dust collection portion is arranged on described clamp side, and forms described opening;

• • The transition portion is connected with the dust collection portion and the main body portion, the direction of the dust collection portion and the main body portion are not the same, and the transition portion is a curved structure;
  • One end of the main body that is far away from the transition part is connected to the vacuum cleaner through the connecting portion.

In one embodiment, the dust collection portion is a cuboid structure, the main body is a cylindrical structure, one end of the transition portion is a cuboid structure adapted to the dust collection portion, the other end is a cylindrical structure adapted to the main body portion, and the transition portion is bent and arranged in the transition of the cuboid structure to the cylindrical structure.

Second, the embodiment of the application provides a chip grinding method, the chip grinding method is applied in the chip grinding device described above, and the chip grinding method comprises:

• • Provide the chip on the fixture;
  • Control the movement of the moving assembly to adjust the position of the grinding assembly;
  • Control the grinding assembly to grind the chip, and simultaneously opening the vacuum assembly to collect the debris and dust generated when the chip is grinding, wherein the power collected by the vacuum assembly can be adjusted according to the grinding speed of the grinding assembly.

The chip grinding device comprises: a clamp for clamping the chip; the grinding assembly is arranged above the clamp and is used for grinding the chip; the moving assembly is connected with the grinding assembly for moving the grinding assembly to adjust the position of the grinding assembly; the vacuum assembly is arranged on one side of the clamp for collecting the debris and dust generated when the chip is grinding, wherein the vacuum assembly is provided with a speed regulating button for adjusting the collected power; the controller, at least electrically connected with the grinding assembly and the moving assembly, is used for controlling the work of the grinding assembly and the moving assembly. Therefore, the application controls the movement of the moving assembly through a controller, so as to adjust the position of the grinding assembly, further control the grinding operation of the grinding assembly, realize automatic grinding, and avoid the problems of low efficiency and low precision caused by manual grinding; In addition, the application collects the chips and dust generated by grinding through a vacuum assembly, maintains the cleanliness of the surrounding environment, and avoids problems such as chip short circuit caused by debris and dust; Finally, the application adjusts the power of collecting debris and dust by setting the speed adjustment button, which can be adjusted according to the grinding situation of the chip, and the unnecessary power consumption can be saved under the condition of ensuring a clean environment.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic diagram of the structure of a chip grinding device provided in the embodiment of the present application;

FIG. 2 is a schematic diagram of the enlarged structure of the chip grinding device shown in FIG. 1 at A;

FIG. 3 is a schematic diagram of the combined state structure of another chip grinding device provided in the embodiment of the present application;

FIG. 4 is a schematic diagram of the dismantling state structure of another chip grinding device provided in the embodiment of the present application;

FIG. 5 is a schematic diagram of the flow of a chip grinding method provided in the embodiment of the present application.

DETAILED DESCRIPTION OF THE EMBODIMENTS

In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to interpret the present application and are not intended to qualify the present application.

Please participate in FIG. 1, which is a schematic diagram of the structure of a chip grinding device provided in the embodiment of the present application, as shown in FIG. 1, the chip grinding device 10 comprises a clamp 101, a grinding assembly 102, a moving assembly 103, a vacuum assembly 104 and a controller 105.

Wherein, the clamp 101 is used for clamping the chip 100. The grinding assembly 102 is arranged above the fixture 101 and is used for grinding the chip 100. The moving assembly 103 is connected with the grinding assembly 102 and is used for moving the grinding assembly 102 to adjust the position of the grinding assembly 102. The vacuum assembly 104 is arranged on one side of the clamp 101 and is used for collecting debris and dust generated when the chip 100 is grinding, wherein the vacuum assembly 104 is provided with a speed regulating button 141 for adjusting the collected power. The controller 105 is electrically connected with at least the grinding assembly 102 and the moving assembly 103 and is used for controlling the work of the grinding assembly 102 and the moving assembly 103.

Therefore, the embodiment controls the movement of the moving assembly 103 through a controller, thereby adjusting the position of the grinding assembly 102, further controlling the grinding operation of the grinding assembly 102, realizing automatic grinding, and avoiding the problems of low efficiency and low precision caused by manual grinding; In addition, the embodiment collects the debris and dust produced by grinding through the vacuum assembly 104, maintains the cleanliness of the surrounding environment, and avoids problems such as chip short circuit caused by debris and dust, and finally, the embodiment adjusts the power of collecting debris and dust by setting a speed regulating button 141, can be adjusted according to the grinding situation of the chip 100, and can also save unnecessary power consumption under the condition of ensuring that the environment is clean.

In an optional embodiment, the clamp 101 may comprise a base 110, a first clamping block 111 and a second clamping block 112. Wherein, the base 110 is provided with a base slide rail 1101. The specific base slide rail 1101 is arranged on both sides of the base 110. the first clamping block 111 and the second clamping block 112 are arranged on the base 110, the chip 100 is arranged between the first clamping block 111 and the second clamping block 112, and at least one of the first clamping block 111 and the second clamping block 112 can move along the base slide rail 1101 to clamp the chip 100.

In an optional embodiment, the second clamping block 112 is fixed at one end of the base 110, and the first clamping block 111 can move along the base slide rail 1101 to clamp the chip 100.

Please further participate in FIG. 2, FIG. 2 is a schematic diagram of the enlarged structure of the chip grinding device shown in FIG. 1 at A, as shown in FIG. 2, the first clamping block 111 and the second clamping block 112 are provided with spaced projections 113 on the side of the chip 100, and the projection 113 of the first clamping block 111 and the projection 113 of the second clamping block 112 are dislocated settings. As a result, the chip 100 can be resisted at different positions and the stability of the chip 100 can be improved.

In an optional embodiment, the grinding assembly 102 comprises a grinding motor 121 and a grinding head 122, and the grinding motor 121 can drive the grinding head 122 to rotate to grind the chip 100 through the grinding head 122.

In an optional embodiment, the moving assembly 103 comprises a first moving unit 131, a second moving unit 132 and a third moving unit 133. Wherein, the first moving unit 131 is connected with the grinding assembly 102 and is used for controlling the grinding assembly 102 to move in the first direction, the second moving unit 132 is connected with the first moving unit 131 and the third moving unit 133 respectively, the second moving unit 132 is used for controlling the first moving unit 131 to move in the second direction, and the third moving unit 133 is used for controlling the second moving unit 132 to move upwards in a third party.

Wherein, the first direction, the second direction, and the third party are perpendicular to each other, and the first direction is perpendicular to the direction of the chip. For example, the first direction is the Z-axis direction in the spatial coordinate system, the second direction is the Y-axis direction, and the third-party direction is the X-axis direction.

In an optional embodiment, the moving assembly 103 comprises three moving units, each moving unit comprises a moving motor 134, a moving main body 135 and a moving track 136, the moving main body 135 is arranged on the moving track 136, and the moving motor 134 is arranged on the moving main body 135 for controlling the moving main body 135 to move along the moving track 136. It should be understood that the direction of the moving track 136 of each moving unit is different, and the setting direction of the three moving tracks 136 is perpendicular in pairs, so that the three moving directions are perpendicular in pairs.

In an optional embodiment, the vacuum assembly 104 comprises a vacuum cleaner 142 and a dust collection pipe 143, wherein one end of the dust collection pipe 143 is connected with the dust collection device 142, the other end is arranged on one side of the clamp 101, and the opening 144 at the other end is oriented toward the chip 100. a dust collection fan 1421 is arranged in the vacuum cleaner 142, and the speed regulating button 141 is arranged on the vacuum cleaner 142 for adjusting the power of the dust collection fan 1421. When the dust collection fan 1421 is started, it sucks inside the vacuum cleaner 142, so that a negative pressure is formed inside the vacuum cleaner 142, whereby dust and debris are sucked into the vacuum cleaner 142 through the dust collection pipe 143 under the action of negative pressure. Further, the vacuum cleaner 142 comprises a housing 1422, and a ventilation hole 1423 is arranged on the housing 1422 to provide a suction air duct to the dust collection fan 1421.

In an optional embodiment, the height of the other end of the dust collection pipe 143 is higher than the height of the chip 100, so that the height of the opening 144 is higher than the height of the chip 100. Because the chip 100 is grinding, dust and debris will fly in the surrounding environment because of high-speed vibration, and the dust collection pipe 143 that is higher than the chip 100 is conducive to the absorption of dust and debris.

In an optional embodiment, the dust collection pipe 143 comprises a dust collection portion 1431, a transition portion 1432, a main body portion 1433 and a connecting portion 1434. Wherein, the dust collection portion 1431 is arranged on one side of the fixture 101 and forms the opening 144. the transition portion 1432 is connected with the dust collection portion 1431 and the main body portion 1433, the dust collection portion 1431 and the main body portion 1433 are arranged in different directions, and the transition portion 1432 is a curved structure. One end of the main body 1433, which is far away from the transition portion 1432, is connected to the vacuum cleaner 142 through the connecting portion 1434.

In an optional embodiment, the dust collection portion 1431 is a cuboid structure, and its shape is similar to that of the chip 100. the main body 1433 is a cylindrical structure, one end of the transition portion 1432 is a cuboid structure adapted to the dust collection portion 1431, the other end is a cylindrical structure matched with the main body 1433, and the transition portion 1432 is bent and arranged in the cuboid structure transitioning to a cylindrical structure. That is to say, the transition section 1432 transitions from a cuboid structure to a cylindrical structure, and forms an arc bend in the part where the cuboid structure is transformed into a cylindrical structure, so as to reduce the structural instability of the dust collection pipe 143 caused by the sudden bending.

In an optional embodiment, the controller 105 may be a flat plate, and it may provide the user with input instructions for instructing and controlling the work of the grinding assembly 102 and the moving assembly 103. For example, the grinding motor 121 of the grinding assembly 102 is instructed to open and close, or the grinding motor 121 is instructed to change speed. Another example is the movement of the three moving units indicating the moving assembly 103. At the same time, it can also store a grinding program, and grind the chip 100 according to the grinding program when it is necessary to grind.

Therefore, the embodiment controls the movement of the moving assembly through a controller, so that the position of the grinding assembly can be automatically adjusted, the grinding operation of the grinding assembly is further controlled, the manual grinding is replaced by the grinding motor, the grinding motor rotates fast, and the grinding time is short, so that the grinding efficiency is improved, the automatic grinding is realized, and the problem of low precision caused by manual grinding is avoided. In addition, the embodiment collects the debris and dust produced by grinding through a vacuum assembly, maintains the cleanliness of the surrounding environment, and avoids problems such as chip short circuit caused by debris and dust; Finally, the embodiment adjusts the power of collecting debris and dust by setting the speed control button, which can be adjusted according to the grinding situation of the chip, and can also save unnecessary power consumption under the condition of ensuring that the environment is clean.

Please refer to FIG. 3 and FIG. 4 again, FIG. 3 is a schematic diagram of the combined state structure of another chip grinding device provided in the embodiment of the present application, and FIG. 4 is a schematic diagram of the dismantling state structure of another chip grinding device provided in the embodiment of the present application. As shown in FIG. 3, the difference between the chip grinding device 20 of the present embodiment and the chip grinding device 10 described in the preceding embodiment is that: the chip grinding device 20 of the present embodiment further comprises an automatic leveling sensor 201, a camera 202 and a pressure sensor 204.

Wherein, the self-leveling sensor 201 is arranged on the first moving unit 203 and is used for following the movement of the first moving unit 203 to touch the characteristic position points of the chip 200, such as four corner points of the chip 200. The pressure sensor 204 is arranged on the base 220 and is used for obtaining the height of the grinding head 205 when the automatic leveling sensor 201 touches the plurality of feature position points of the chip 200, respectively, to calculate the relative height of the plurality of feature position points, so that the grinding head 205 rises or falls according to the relative height of the plurality of feature position points during grinding, so that the grinding plane and the chip 200 plane are solved in parallel, so that the grinding accuracy is improved.

The camera 202 is arranged above the chip 200 for detecting the model of the chip 200 and giving feedback to the controller, so that the controller controls the grinding assembly and the moving assembly according to the model. Further, when the chip 200 is grinded, the camera 202 automatically locks and generates positioning data to the controller, so that the positioning function of the chip 200 is realized.

The embodiment of the present application also provides a chip grinding method, and the chip grinding method is applied in the chip grinding device described above. Refer to FIG. 3, FIG. 3 is a schematic diagram of the flow of a chip grinding method provided in the embodiment of the present application, as shown in FIG. 3, the chip grinding method comprises the following steps:

• • Step S1: provide the chip on the fixture.

Specifically, the chip is placed on the base of the fixture and at least one of the first clamping blocks and the second clamping block is further moved to clamp the chips.

• • Step S2: controlling the movement of the moving assembly to adjust the position of the grinding assembly.

Specifically, the three moving units that control the moving assembly move in different directions to adjust the position of the grinding assembly in different directions.

• • Step S3: controlling the grinding assembly to grind the chip, and simultaneously opening the vacuum assembly to collect the debris and dust generated when the chip is grinding, wherein the power collected by the vacuum assembly can be adjusted according to the grinding speed of the grinding assembly.

Specifically, the grinding speed of the grinding assembly can be adjusted according to different chips or requirements, and the power collected by the vacuum collection unit can be adjusted according to the grinding speed.

Therefore, the embodiment of the present application describes a chip grinding device and a chip grinding method, and the chip grinding device comprises: a fixture for clamping the chip; the grinding assembly is arranged above the clamp and is used for grinding the chip; the moving assembly is connected with the grinding assembly for moving the grinding assembly to adjust the position of the grinding assembly; the vacuum assembly is arranged on one side of the clamp for collecting the debris and dust generated when the chip is grinding, wherein the vacuum assembly is provided with a speed regulating button for adjusting the collected power; the controller, at least electrically connected with the grinding assembly and the moving assembly, is used for controlling the work of the grinding assembly and the moving assembly. Therefore, the application controls the movement of the moving assembly through a controller, so as to adjust the position of the grinding assembly, further control the grinding operation of the grinding assembly, realize automatic grinding, and avoid the problems of low efficiency and low precision caused by manual grinding; In addition, the application collects the chips and dust generated by grinding through a vacuum assembly, maintains the cleanliness of the surrounding environment, and avoids problems such as chip short circuit caused by debris and dust; Finally, the application adjusts the power of collecting debris and dust by setting the speed adjustment button, which can be adjusted according to the grinding situation of the chip, and the unnecessary power consumption can be saved under the condition of ensuring a clean environment.

The technical features of the above embodiments may be arbitrarily combined, and for the sake of conciseness, all possible combinations of the technical features in the above embodiments are not described, however, as long as there is no contradiction between the combinations of these technical features, they shall be considered to be within the scope of this specification.

The above embodiments only express several embodiments of the present application, and their descriptions are more specific and detailed, but this cannot be understood as a limitation on the scope of the patent of the present application. It should be noted that, for a person of ordinary skill in the art, a number of variations and improvements can be made without departing from the conception of the present application, which fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be subject to the attached claims.