HEAT PUMP

Description

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation application, claiming priority under 35 U.S.C. § 365(c), of an International application No. PCT/KR2025/020261, filed on Dec. 1, 2025, which is based on and claims the benefit of a Korean patent application number 10-2024-0183109, filed on Dec. 10, 2024, in the Korean Intellectual Property Office, the disclosure of which is incorporated by reference herein in its entirety.

BACKGROUND

1. Field

• • The disclosure relates to a heat pump.

2. Description of Related Art

A heat pump is a device for supplying heat to an indoor space.

Refrigerant used in the heat pump may be composed of particles heavier than air.

When the height at which the refrigerant in the heat pump may leak is increased, even when the refrigerant leaks outside the heat pump, it may not be an excessive risk.

The above information is presented as background information only to assist with an understanding of the disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with regard to the disclosure.

SUMMARY

Aspects of the disclosure are to address at least the above-mentioned problems and/or disadvantages and to provide at least the advantages described below. Accordingly, an aspect of the disclosure is to provide a heat pump.

Additional aspects will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments.

In accordance with an aspect of the disclosure, a heat pump is provided. The heat pump includes a refrigerant flow portion providing a flow path for refrigerant between an indoor unit and an outdoor unit, a heat medium circuit configured to exchange heat with the refrigerant, a heat exchanger mediating heat exchange between the refrigerant and the heat medium circuit and including an inner connection portion to which the refrigerant flow portion is connected, a housing accommodating the heat exchanger and including an outer connection portion to which the refrigerant flow portion is connected, and a sealing unit surrounding at least a portion of the refrigerant flow portion and having one end placed at the inner connection portion to prevent the refrigerant from leaking in the housing, wherein the other end of the sealing unit is placed above the outer connection portion, thereby controlling a height at which the refrigerant is leakable to be greater than a height of the outer connection portion.

Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of certain embodiments of the disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a schematic diagram conceptually illustrating a heat exchange circuit of a heat pump according to an embodiment of the disclosure;

FIG. 2 is a conceptual diagram schematically illustrating a first elevation structure of a heat pump according to an embodiment of the disclosure;

FIG. 3 is a conceptual diagram schematically illustrating a second elevation structure of a heat pump according to an embodiment of the disclosure;

FIG. 4 is a perspective view of a heat pump according to an embodiment of the disclosure;

FIG. 5 is an enlarged view of a heat pump according to an embodiment of the disclosure;

FIG. 6 is a front view of a heat pump according to an embodiment of the disclosure;

FIG. 7 is a view for explaining a sealing unit according to an embodiment of the disclosure;

FIG. 8 is a view for explaining a sealing unit according to an embodiment of the disclosure;

FIG. 9 is a conceptual diagram schematically illustrating a sealing unit according to an embodiment of the disclosure;

FIG. 10 is a conceptual diagram schematically illustrating a sealing unit of a heat pump according to an embodiment of the disclosure;

FIG. 11 is a view for explaining a fixing portion of a heat pump according to an embodiment of the disclosure;

FIG. 12 is a front view of a heat pump according to an embodiment of the disclosure;

FIG. 13 is a conceptual diagram schematically illustrating a fixing portion of a heat pump according to an embodiment of the disclosure; and

FIG. 14 is a conceptual diagram schematically illustrating an insulating member of a heat pump according to an embodiment of the disclosure.

The same reference numerals are used to represent the same elements throughout the drawings.

DETAILED DESCRIPTION

The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of various embodiments of the disclosure as defined by the claims and their equivalents. It includes various specific details to assist in that understanding but these are to be regarded as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the various embodiments described herein can be made without departing from the scope and spirit of the disclosure. In addition, descriptions of well-known functions and constructions may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are not limited to the bibliographical meanings, but, are merely used by the inventor to enable a clear and consistent understanding of the disclosure. Accordingly, it should be apparent to those skilled in the art that the following description of various embodiments of the disclosure is provided for illustration purpose only and not for the purpose of limiting the disclosure as defined by the appended claims and their equivalents.

It is to be understood that the singular forms “a,” “an,” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to “a component surface” includes reference to one or more of such surfaces.

In the specification, each of the phrases “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one of the items listed together in that phrase, or all possible combinations of them.

The term “and/or” includes any combination of multiple related described elements or any one of multiple related described elements.

Terms such as “first,” “second” may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order).

When a component (e.g., a first component) is referred to as being “coupled” or “connected” to another component (e.g., a second component), with or without the terms “functionally” or “communicatively,” it means that the component may be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

The terms “include” or “have” and the like are intended to specify the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but do not exclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

When a component is described as “connected,” “coupled,” “supported,” or “is in contact” with another component, this includes not only cases where the components are directly connected, coupled, supported, or in contact, but also cases where the components are indirectly connected, coupled, supported, or in contact through a third component.

When a component is described as being “on” another component, this includes not only cases where the component is in contact with the other component, but also cases where there is another component between the two components.

Hereinafter, a heat pump according to an example embodiment of the disclosure will be described in detail with reference to the attached drawings. The same reference numerals or symbols used in each drawing represent components or elements that perform substantially the same functions.

It should be appreciated that the blocks in each flowchart and combinations of the flowcharts may be performed by one or more computer programs which include instructions. The entirety of the one or more computer programs may be stored in a single memory device or the one or more computer programs may be divided with different portions stored in different multiple memory devices.

Any of the functions or operations described herein can be processed by one processor or a combination of processors. The one processor or the combination of processors is circuitry performing processing and includes circuitry like an application processor (AP, e.g. a central processing unit (CPU)), a communication processor (CP, e.g., a modem), a graphics processing unit (GPU), a neural processing unit (NPU) (e.g., an artificial intelligence (AI) chip), a wireless fidelity (Wi-Fi) chip, a Bluetooth® chip, a global positioning system (GPS) chip, a near field communication (NFC) chip, connectivity chips, a sensor controller, a touch controller, a finger-print sensor controller, a display driver integrated circuit (IC), an audio CODEC chip, a universal serial bus (USB) controller, a camera controller, an image processing IC, a microprocessor unit (MPU), a system on chip (SoC), an IC, or the like.

FIG. 1 is a schematic diagram conceptually illustrating a heat exchange circuit of a heat pump according to an embodiment of the disclosure.

Referring to FIG. 1, a heat pump 1 may supply thermal energy to a heat medium. Here, the heat medium may refer to a fluid capable of containing thermal energy to transfer thermal energy to a target location. The heat medium may include a substance having a high specific heat, such as water, but is not limited thereto.

The heat pump 1 may include an indoor unit 11 and an outdoor unit 12. The indoor unit 11 may transfer thermal energy received by the heat pump 1 through the outdoor unit 12 to the heat medium. The heat pump 1 may include a heat medium circuit 31. The heat medium circuit 31 may obtain thermal energy by being connected to the indoor unit 11. The heat medium circuit 31 may be formed by a low-temperature heat medium flowing into the indoor unit 11 to obtain heat energy and then becoming a high-temperature heat medium and being discharged to the outside of the indoor unit 11. The high-temperature heat medium discharged to the outside of the indoor unit 11 may transfer heat energy to a target location and then be re-introduced to the indoor unit 11 as a low-temperature heat medium. However, the heat medium circuit 31 may not constitute a closed circuit. In other words, the heat medium connected to the indoor unit 11 may not be circulated, and new heat medium may be continuously supplied to the indoor unit 11.

The heat pump 1 may include a refrigerant flow portion 5. The refrigerant flow portion 5 may provide a flow path for refrigerant between the indoor unit 11 and the outdoor unit 12. The refrigerant flow portion 5 may allow the refrigerant to flow between the indoor unit 11 and the outdoor unit 12, thereby transferring heat energy from the outdoor unit 12 to the indoor unit 11. The heat pump 1 may include a refrigerant circuit 32. The refrigerant flow portion 5 may form the refrigerant circuit 32 between the indoor unit 11 and the outdoor unit 12. The refrigerant flow portion 5 may have various shapes, such as a pipeline or a duct, as long as it provides a flow path for the refrigerant.

The refrigerant circuit 32 may control the flow of refrigerant between the indoor unit 11 and the outdoor unit 12, thereby transferring thermal energy. The refrigerant circuit 32 may transfer thermal energy between the indoor unit 11 and the outdoor unit 12. More specifically, the refrigerant circuit 32 may transfer thermal energy from the outdoor unit 12 to the indoor unit 11. Here, the transfer of thermal energy by the refrigerant circuit 32 may refer to the energy difference between a high-energy refrigerant and a low-energy refrigerant being transferred to the indoor unit 11. In this case, the energy difference of the refrigerant may include not only sensible heat energy due to a temperature difference but also latent heat energy due to a phase change of the refrigerant. The high-energy refrigerant may transfer heat energy to the indoor unit 11 by being connected thereto. The low-energy refrigerant may be discharged to the outside of the indoor unit 11. The low-energy refrigerant discharged to the outside of the indoor unit 11 may be connected to the outdoor unit 12 to receive heat energy from the outside. The low-energy refrigerant may be converted to the high-energy refrigerant by receiving heat energy from the outdoor unit 12. The refrigerant circuit 32 may be configured to circulate between the outdoor unit 12 and the indoor unit 11, but is not limited thereto, and the refrigerant circuit 32 may not constitute a closed circuit.

The heat pump 1 may include a heat exchanger. The heat exchanger may mediate heat exchange between the refrigerant and the heat medium circuit 31. The refrigerant circuit 32 and the heat medium circuit 31 may each be connected to the heat exchanger. The high-energy refrigerant may transfer heat energy to the heat medium circuit 31 inside the heat exchanger and may be discharged to the outside of the heat exchanger as a low-energy refrigerant. The heat exchanger may include, but is not limited to, a plate heat exchanger, for example.

The refrigerant flow portion 5 may be connected to the heat exchanger. The area where the refrigerant flow portion 5 is connected to the heat exchanger may be referred to as an inner connection portion 4. The inner connection portion 4 may be distinguished from an outer connection portion 2, which will be described later. The inner connection portion 4 may include a first inner connection portion 41 and a second inner connection portion 42, which will be described in more detail later.

During the installation of the heat pump 1, the indoor unit 11 and the outdoor unit 12 may be placed in separate spaces. For example, when installing the heat pump 1 on site, the indoor unit 11 is placed indoors and the outdoor unit 12 is placed outdoors, and the refrigerant flow portion 5 may need to be connected between the indoor unit 11 and the outdoor unit 12. In this case, the refrigerant flow portion 5 may be composed of a plurality of parts. In other words, a refrigerant flow portion 5 connected to the indoor unit 11 and a refrigerant flow portion 5 connected to the outdoor unit 12 may exist as separate components. When the refrigerant flow portion 5 is composed of a plurality of parts, the installation of the heat pump 1 may be facilitated. However, this is an example description and is not limited thereto.

The refrigerant flow portion 5 may include an indoor flow portion 51, an outdoor flow portion 52, and a connection portion 53. The indoor flow portion 51 may refer to the refrigerant flow portion 5 directly connected to the indoor unit 11. The outdoor flow portion 52 may refer to the refrigerant flow portion 5 connected to the outdoor unit 12. The area where the indoor flow portion 51 and the outdoor flow portion 52 are connected to each other may be referred to as the connection portion 53. The connection portion 53 may connect the indoor flow portion 51 to the outdoor flow portion 52, and may form the refrigerant circuit 32 between the indoor unit 11 and the outdoor unit 12. Here, the indoor flow portion 51 may be a separate component from the indoor unit 11, but the indoor flow portion 51 may also be provided as an integral part with the indoor unit 11. In other words, the indoor flow portion 51 may be a component included in the indoor unit 11. More specifically, it may be understood that the indoor unit 11 includes the indoor flow portion 51, at least a portion of the indoor flow portion 51 is placed inside a housing 110, and the remaining portion of the indoor flow portion 51 is placed outside the housing 110.

The indoor flow portion 51 may include a first indoor flow portion 511 and a second indoor flow portion 512. The first indoor flow portion 511 may provide a path through which a high-temperature refrigerant flows. The first indoor flow portion 511 may be configured to allow a high-temperature refrigerant to flow. The first indoor flow portion 511 may provide a high-temperature refrigerant to the heat exchanger. The second indoor flow portion 512 may provide a path through which a low-temperature refrigerant flows. The second indoor flow portion 512 may be configured to allow a low-temperature refrigerant to flow. The second indoor flow portion 512 may receive a low-temperature refrigerant from the heat exchanger. Because the first indoor flow portion 511 and the second indoor flow portion 512 are distinguished from each other, the flow path of the high-temperature refrigerant entering the inside of the heat exchanger or discharged to the outside of the heat exchanger and the flow path of the low-temperature refrigerant entering the inside of the heat exchanger or discharged to the outside of the heat exchanger may be set to be different. The area where the first indoor flow portion 511 is connected to the outdoor flow portion 52 may be referred to as a first connection portion 531. The first indoor flow portion 511 may be connected to the outdoor flow portion 52 through the first connection portion 531. The first indoor flow portion 511 may transfer a high-temperature refrigerant discharged from the outdoor unit 12 to the indoor unit 11. The area where the second indoor flow portion 512 is connected to the outdoor flow portion 52 may be referred to as a second connection portion 532. The second indoor flow portion 512 may be connected to the outdoor flow portion 52 through the second connection portion 532. The second indoor flow portion 512 may transfer a low-temperature refrigerant discharged from the indoor unit 11 to the outdoor unit 12. However, this is an example description and is not limited thereto.

The refrigerant circuit 32 connected to the heat exchanger may have at least two paths. Connecting the refrigerant circuit 32 to the heat exchanger may mean that the indoor flow portion 51 of the refrigerant flow portion 5 is connected to the heat exchanger. The indoor flow portion 51 connected to the heat exchanger may have at least two paths. For example, the indoor flow portion 51 may include a first indoor flow portion 511 and a second indoor flow portion 512. The first indoor flow portion 511 may be connected to the heat exchanger through the first inner connection portion 41. The first inner connection portion 41 may refer to an area where a high-temperature refrigerant is transferred to the interior of the heat exchanger. The high-temperature refrigerant may be introduced into the interior of the heat exchanger through the first inner connection portion 41. The second indoor flow portion 512 may be connected to the heat exchanger through the second inner connection portion 42. The second inner connection portion 42 may refer to an area where a low-temperature refrigerant is discharged to the outside of the heat exchanger. The low-temperature refrigerant may flow out from the inside of the heat exchanger through the second inner connection portion 42. The first inner connection portion 41 and the second inner connection portion 42 may be spaced apart from each other on the heat exchanger. When the first inner connection portion 41 and the second inner connection portion 42 are spaced apart from each other, heat loss may be prevented between the first indoor flow portion 511 providing a flow path for high-temperature refrigerant and the second indoor flow portion 512 providing a flow path for low-temperature refrigerant. The first inner connection portion 41 may be placed to be higher than the second inner connection portion 42 on the heat exchanger. However, this is an example description and is not limited thereto.

The heat medium circuit 31 connected to the heat exchanger may have at least two connection portions. For example, the heat medium circuit 31 may be connected to the heat exchanger through a heat medium inlet 311 and a heat medium outlet 312. The heat medium inlet 311 may refer to an area in the heat medium circuit 31 where a low-temperature heat medium is transferred to the interior of the heat exchanger. The heat medium outlet 312 may refer to an area in the heat medium circuit 31 where a high-temperature heat medium is discharged to the exterior of the heat exchanger. In the heat exchanger, the heat medium outlet 312 may be positioned higher than the heat medium inlet 311. However, the above description of the functions and roles of the heat medium inlet 311 and the heat medium outlet 312 is an example description and is not limited thereto.

The heat pump 1 may include the housing 110. The housing 110 may constitute the exterior of the indoor unit 11. The heat exchanger may be placed inside the indoor unit 11. In other words, the housing 110 of the indoor unit 11 may accommodate the heat exchanger. The housing 110 may accommodate at least a portion of the refrigerant flow portion 5. The refrigerant flow portion 5 may be connected to the interior of the housing 110. In other words, a portion of the refrigerant flow portion 5 may be placed inside the housing 110 and another portion may be placed outside the housing 110. The refrigerant flow portion 5, at least a portion of which is placed inside the housing 110, may include the indoor flow portion 51. In other words, the indoor flow portion 51 may be connected to the housing 110 and at least a portion of the indoor flow portion 51 may be placed inside the housing 110. The housing 110 may protect components of the heat pump 1 placed inside the indoor unit 11. For example, the components of the heat pump 1 that may be accommodated by the housing 110 may include a temperature detection portion 101, a pump 102, a control element 103, etc. The temperature detection portion 101 may be placed on the heat medium circuit 31 and may detect the temperature of the heat medium. The pump 102 may be placed on the heat medium circuit 31 and may induce flow in the heat medium circuit 31. The control element 103 may be placed on the heat medium circuit 31 and may control the flow direction of the heat medium circuit 31. However, the above description is an example description and is not limited thereto.

The area where the refrigerant flow portion 5 is connected to the housing 110 may be referred to as an outer connection portion 2. In this case, the refrigerant flow portion 5 connected to the housing 110 may include the indoor flow portion 51. In other words, the indoor flow portion 51 may be connected to the housing 110 through the outer connection portion 2. Here, connecting to the housing 110 may mean connecting to the indoor unit 11 of the heat pump 1. When the refrigerant flow portion 5 includes the first indoor flow portion 511 and the second indoor flow portion 512, the first indoor flow portion 511 may be connected to the housing 110 through a first outer connection portion 21, and the second indoor flow portion 512 may be connected to the housing 110 through a second outer connection portion 22. However, this is an example description and is not limited thereto.

One end of the indoor flow portion 51 may be placed inside the housing 110 and the other end may be placed outside the housing 110. One end of the indoor flow portion 51 placed inside the housing 110 may be placed toward the inside of the housing 110 with respect to the outer connection portion 2. The other end of the indoor flow portion 51 placed outside the housing 110 may be placed toward the outside of the housing 110 with respect to the outer connection portion 2. One end of the indoor flow portion 51 may be placed at the inner connection portion 4 and be connected to the heat exchanger, and the other end may be connected to the outdoor flow portion 52 through the connection portion 53 on the outside of the housing 110. In other words, the connection portion 53 connecting the indoor flow portion 51 and the outdoor flow portion 52 to each other may be placed outside the housing 110. However, this is an example description and is not limited thereto.

The refrigerant provided to the refrigerant flow portion 5 may include a flammable refrigerant. The refrigerant provided to the refrigerant flow portion 5 may include, for example, an A2L grade refrigerant such as R32. When a flammable refrigerant is provided to the refrigerant flow portion 5, there may be certain restrictions on the installation area and installation height of the heat pump 1. For example, when an R32 refrigerant is provided to the refrigerant flow portion 5, restrictions according to the following Equation 1 may exist on the installation area and installation height of the heat pump 1 in order to comply with the ISO-817 regulations.

A min = m 2 / ( 2.5 * L ⁢ F ⁢ L 5 / 4 * h 0 ) 2 Equation ⁢ 1

In the Equation 1, A_min represents the minimum indoor area required for the installation of the heat pump 1, m represents the charge of the refrigerant, Lower Flammable Limit (LFL) represents the limit mass of the refrigerant that may be flammable per unit volume (i.e., Lower Flammable Limit), and h₀ represents the installation height factor of the indoor unit 11.

Referring to Equation 1, it may be confirmed that A_min is inversely proportional to the square of h₀ when the refrigerant charging conditions are the same. In other words, it may be understood that as h₀ increases, A_min decreases inversely proportional to the square of h₀. Because h₀ is determined by the minimum height at which refrigerant may leak, it may be understood that when the minimum height at which refrigerant may leak is set high, the minimum indoor area requirement for installing the heat pump 1 decreases. However, the relationship between the minimum indoor area requirement and the installation height index according to Equation 1 is merely an example and is not limited thereto.

FIG. 2 is a conceptual diagram schematically illustrating a first elevation structure of a heat pump according to an embodiment of the disclosure.

Referring to FIGS. 1 and 2, a first elevation structure 7 may be provided in the heat pump 1. A second elevation structure covers the heat exchanger on the inside of the housing 110 and has a structure passing through an upper portion of the housing 110. The first elevation structure 7 covers the heat exchanger on the inside of the housing 110 and provides an opening passing through the upper portion of the housing 110, thereby providing a structure in which refrigerant leaking from the heat exchanger is discharged through the opening passing through the upper portion of the housing 110. However, because the first elevation structure 7 does not cover the refrigerant flow portion 5, the first elevation structure 7 is a structure in which the leakage height may not be increased for refrigerant leaking from the refrigerant flow portion 5. In particular, when the refrigerant flow portion 5 has a curved pipe shape, there is a high possibility that the refrigerant will leak from the refrigerant flow portion 5, but because the first elevation structure 7 does not cover the refrigerant flow portion 5, the first elevation structure 7 is a structure in which the leakage of the refrigerant may not be prevented.

FIG. 3 is a conceptual diagram schematically illustrating a second elevation structure of a heat pump according to an embodiment of the disclosure.

Referring to FIGS. 1 to 3, a second elevation structure 70 may be provided in the heat pump 1. The second elevation structure 70 covers the heat exchanger and the refrigerant flow portion 5 inside the housing 110 and has a structure passing through an upper portion of the housing 110. The second elevation structure 70 covers the heat exchanger and the refrigerant flow portion 5 and provides an opening passing through the upper portion of the housing 110, thereby providing a structure in which refrigerant leaking from the heat exchanger and the refrigerant flow portion 5 is discharged through the opening passing through the upper portion of the housing 110. However, the second elevation structure 70 may occupy an excessive volume inside the housing 110 in order to simultaneously cover the heat exchanger and the refrigerant flow portion 5. When the second elevation structure 70 occupies an excessive volume inside the housing 110, the weight and/or volume of the heat pump 1 may be excessively increased. Furthermore, when the refrigerant flow portion 5 includes the first indoor flow portion 511 and the second indoor flow portion 512, the second elevation structure 70 may cover both the first indoor flow portion 511 and the second indoor flow portion 512, and thus, the width of the opening passing through the upper portion of the housing 110 may be excessively increased. When the opening passing through the upper portion of the housing 110 is excessively wide, excessive refrigerant may leak out of the heat pump 1.

FIG. 4 is a perspective view of a heat pump according to an embodiment of the disclosure. FIG. 5 is an enlarged view of a heat pump according to an embodiment of the disclosure. FIG. 6 is a front view of a heat pump according to an embodiment of the disclosure. FIGS. 4 to 6 are views illustrating a configuration of a heat pump 1, focusing on an indoor unit 11, a refrigerant flow portion 5 (more specifically, an indoor flow portion 51), and a sealing unit 6. However, the indoor unit 11 may also be understood as including the indoor flow portion 51, consistent with the above description.

Referring to FIGS. 1 and 4 to 6, a housing upper portion 111 of the heat pump 1 according to an example embodiment of the disclosure may be defined as an outer area of the housing 110 positioned upward. The height of the housing upper portion 111 may generally be understood as the height of the heat pump 1 (or the height of the indoor unit 11).

The housing upper portion 111 according to an example embodiment of the disclosure may include a pipe withdrawal portion 112. The pipe withdrawal portion 112 may be defined as an area through which the refrigerant flow portion 5 is withdrawn. The fact that a pipe is withdrawn based on the housing 110 may be interpreted as the pipe being connected to the housing 110 when understood with the refrigerant flow portion 5 as the center. The outer connection portion 2 may be placed on the pipe withdrawal portion 112. The refrigerant flow portion 5 may be connected to the housing 110 through the outer connection portion 2 placed on the pipe withdrawal portion 112. The indoor flow portion 51 may be connected to the housing 110 through the outer connection portion 2 placed on the pipe withdrawal portion 112. The first indoor flow portion 511 may be connected to the housing 110 through the first outer connection portion 21 placed on the pipe withdrawal portion 112. The second indoor flow portion 512 may be connected to the housing 110 through the second outer connection portion 22 placed on the pipe withdrawal portion 112. However, the function of the pipe withdrawal portion 112 is not limited thereto, and for example, the pipe withdrawal portion 112 may also provide an area from which a heat medium pipe 310 is withdrawn.

The housing upper portion 111 according to an example embodiment of the disclosure may have a stepped structure. More specifically, the pipe withdrawal portion 112 of the housing upper portion 111 may be positioned below by a certain distance from the uppermost surface of the housing upper portion 111, which is positioned furthest from the ground in a vertical direction. The fact that the pipe withdrawal portion 112 is positioned below by a certain distance from the uppermost surface of the housing upper portion 111 may be understood as meaning that the outer connection portion 2 is positioned below by a certain distance from the uppermost surface of the housing upper portion 111. When the pipe withdrawal portion 112 is positioned below the uppermost surface of the housing upper portion 111 by a certain distance, a work area 1120 may be provided in the housing upper portion 111. The work area 1120 may provide a space where a worker may easily handle the refrigerant flow portion 5, drawn out through the pipe withdrawal portion 112, during the process of installing the heat pump 1 on site. Here, the worker's handling of the refrigerant flow portion 5 may include, but is not limited to, connecting the indoor flow portion 51 to the outdoor flow portion 52 through the connection portion 53. In addition, the housing upper portion 111 does not necessarily have a stepped structure, and the pipe withdrawal portion 112 may be positioned on the uppermost surface of the housing upper portion 111.

The connection portion 53 according to an example embodiment of the disclosure may be positioned above the outer connection portion 2. Here, the arrangement of the connection portion 53 may refer to the end of the indoor flow portion 51 configured to be connected to the outdoor flow portion 52. The connection portion 53 may be placed within the work area 1120. The connection portion 53 may be placed at the same height as the uppermost surface of the housing upper portion 111. The connection portion 53 may be placed below the height of the uppermost surface of the housing upper portion 111 within the work area 1120. When the connection portion 53 is placed below the height of the uppermost surface of the housing upper portion 111, it may be easy to connect the indoor flow portion 51 to the outdoor flow portion 52 during the process of installing the heat pump 1. However, the disclosure is not limited thereto, and the connection portion 53 may be placed higher than the uppermost surface of the housing upper portion 111.

There may be certain constraints according to the above-described Equation 1, etc., regarding the installation area and installation height of the heat pump 1. The minimum indoor area required for the installation of the heat pump 1 may decrease as an installation height factor h₀ of the indoor unit 11 increases. In this case, the installation height factor h₀ of the indoor unit 11 may be understood in relation to the minimum height at which the refrigerant may leak to the outside of the indoor unit 11. When the connection portion 53 is placed above the outer connection portion 2, the installation height factor h₀ of the indoor unit 11 may generally be understood in relation to the height of the outer connection portion 2. However, the installation height factor h₀ of the indoor unit 11 may be controlled to be greater than the height of the outer connection portion 2 through the sealing unit 6 described below.

Hereinafter, the sealing unit 6 that surrounds at least a portion of the refrigerant flow portion 5 of the heat pump 1 and controls the installation height factor h₀ to be greater than the height of the outer connection portion 2 will be described in more detail.

FIG. 7 is a view for explaining a sealing unit 6 according to an embodiment of the disclosure. FIG. 8 is a view for explaining a sealing unit 6 according to an embodiment of the disclosure. FIGS. 7 and 8 are views centered on the heat exchanger, the indoor flow portion 51, and the sealing unit 6 among the components of the heat pump 1 illustrated in FIGS. 4 to 6. FIG. 9 is a conceptual diagram schematically illustrating a sealing unit 6 according to an embodiment of the disclosure.

Referring to FIGS. 4 to 9, the heat pump 1 according to an example embodiment of the disclosure may include the sealing unit 6. The sealing unit 6 may surround at least a portion of the refrigerant flow portion 5. The sealing unit 6 may surround at least a portion of the indoor flow portion 51. At least a portion of the sealing unit 6 may be placed inside the housing 110, and the remaining portion may be placed outside the housing 110. At least a portion of the sealing unit 6 placed inside the housing 110 may be configured to entirely surround the indoor flow portion 51. At least a portion of the sealing unit 6 may be placed inside the housing 110 and one end may be placed at the inner connection portion 4. At least a portion of the sealing unit 6 may cover the indoor flow portion 51 connected to the heat exchanger through the inner connection portion 4 inside the housing 10. At least a portion of the sealing unit 6 may entirely cover the indoor flow portion 51 inside the housing 110. The fact that the sealing unit 6 entirely covers the indoor flow portion 51 inside the housing 110 may mean that the sealing unit 6 entirely covers the indoor flow portion 51 placed inside the housing 110. However, the above description of the arrangement relationship between the sealing unit 6 and the indoor flow portion 51 is merely an embodiment and is not limited thereto.

The sealing unit 6 according to an example embodiment of the disclosure may include one end placed inside the housing 110 and the other end placed outside the housing 110. The one end of the sealing unit 6 placed inside the housing 110 and the other end of the sealing unit 6 placed outside the housing 110 may be configured in a continuous shape. In other words, the sealing unit 6 may provide airtightness to the inner space formed between the one end and the other end. The sealing unit 6 may cover the indoor flow portion 51 configured in a curved pipe shape by including a flexible material, but is not limited thereto. The sealing unit 6 may have, for example, a bellows shape, but is not limited thereto. The shape of the sealing unit 6 may vary beyond the description above, as long as it may provide airtightness to the inner space between one end placed inside the housing 110 and the other end placed outside the housing 110.

The sealing unit 6 according to an example embodiment of the disclosure may prevent refrigerant from leaking from the indoor flow portion 51 placed inside the housing 110. The fact that the sealing unit 6 prevents refrigerant from leaking from the indoor flow portion 51 placed inside the housing 110 may mean preventing the refrigerant from leaking from the indoor flow portion 51 to the outside of the sealing unit 6. Through this, refrigerant leaking from the indoor flow portion 51 may be prevented from leaking from the inside of the housing 110 due to the airtightness of the inner space provided by the sealing unit 6. In addition, refrigerant may be prevented from leaking from the inside of the housing 110 to the outside of the housing 110 through the outer connection portion 2. However, the above description of the function of the sealing unit 6 is merely an embodiment and is not limited thereto. For example, the sealing unit 6 may provide thermal insulation to the refrigerant flow portion 5 (more specifically, the indoor flow portion 51).

According to an example embodiment of the disclosure, one end of the sealing unit 6 may be placed at the inner connection portion 4, and the other end may be placed above the outer connection portion 2. Here, the other end of the sealing unit 6 may refer to an end of the sealing unit 6 placed on the outside of the housing 110.

According to an example embodiment of the disclosure, the other end of the sealing unit 6 may be placed above the outer connection portion 2, and thus, the height at which the refrigerant may leak from the heat pump 1 may be controlled to be greater than the height of the outer connection portion 2. In other words, the sealing unit 6 may provide airtightness to the inner space formed between the one end and the other end, and thus, the refrigerant leaked from the indoor flow portion 51 may be guided to be discharged from the other end of the sealing unit 6. In other words, the sealing unit 6 may guide the refrigerant leaked from the indoor flow portion 51 to be discharged from above the outer connection portion 2 of the housing 110. Because the sealing unit 6 may guide the refrigerant leaking from the heat pump 1 to be discharged from above the outer connection portion 2 of the housing 110, the installation height factor h₀ of the indoor unit 11 may be increased. The sealing unit 6 may increase the installation height factor h₀ of the indoor unit 11, thereby reducing the minimum indoor area required for the installation of the heat pump 1.

One end of the sealing unit 6 according to an example embodiment of the disclosure may be placed at the inner connection portion 4, and the other end may be placed at a height less than or equal to the height at which the connection portion 53 is placed. For example, the end of the sealing unit 6 placed outside the housing 110 may be placed in the work area 1120 of the housing upper portion 111. For example, the end of the sealing unit 6 placed outside the housing 110 may be placed at a height less than or equal to the height at which the connection portion 53 is placed in the work area 1120 of the housing upper portion 111. However, this is merely a description of an embodiment, and the arrangement relationship between the sealing unit 6 and the connection portion 53 is not limited thereto.

The sealing unit 6 according to an example embodiment of the disclosure may not surround the connection portion 53. The sealing unit 6 may be positioned at a height less than or equal to the height at which the connection portion 53 is positioned, thereby exposing the connection portion 53. When the sealing unit 6 exposes the connection portion 53, the indoor flow portion 51 and the outdoor flow portion 52 may be easily connected to each other. As the sealing unit 6 exposes the connection portion 53, the heat pump 1, in which the indoor flow portion 51 and the outdoor flow portion 52 may be easily connected to each other at the installation site of the heat pump 1, may be provided. However, this is merely a description of an embodiment and is not limited thereto.

The indoor flow portion 51 according to an example embodiment of the disclosure may include a first indoor flow portion 511 and a second indoor flow portion 512. The first indoor flow portion 511 may be configured to allow high-temperature refrigerant to flow, and the second indoor flow portion 512 may be configured to allow low-temperature refrigerant to flow, but is not limited thereto. The first indoor flow portion 511 may be connected to the housing 110 through the first outer connection portion 21. The second indoor flow portion 512 may be connected to the housing 110 through the second outer connection portion 22. The first indoor flow portion 511 may be connected to the outdoor flow portion 52 through the first connection portion 531. The first connection portion 531 may be placed on the outside of the housing 110. The first connection portion 531 may be placed above the first outer connection portion 21. The second indoor flow portion 512 may be connected to the outdoor flow portion 52 through the second connection portion 532. The second connection portion 532 may be placed on the outside of the housing 110. The second connection portion 532 may be placed above the first outer connection portion 21.

Hereinafter, a first sealing unit 61 and a second sealing unit 62, which surround the first indoor flow portion 511 and the second indoor flow portion 512, respectively, will be described. In this case, overlapping details will be omitted and the differences will be primarily described.

The sealing unit 6 according to an example embodiment of the disclosure may include the first sealing unit 61 and the second sealing unit 62. The first sealing unit 61 and the second sealing unit 62 may be configured as separate components. The first sealing unit 61 may be configured to surround the first indoor flow portion 511. The second sealing unit 62 may be configured to surround the second indoor flow portion 512. The first sealing unit 61 and the second sealing unit 62 may surround the first indoor flow portion 511 and the second indoor flow portion 512, respectively. One end of the first sealing unit 61 may be placed at the first inner connection portion 41 and the other end may be placed above the first outer connection portion 21. One end of the second sealing unit 62 may be placed at the second inner connection portion 42 and the other end may be placed above the second outer connection portion 22. However, the above description of the arrangement relationship between the first sealing unit 61 and the second sealing unit 62 is a description of an embodiment and is not limited thereto.

One end of the first sealing unit 61 according to an example embodiment of the disclosure may be placed at the first inner connection portion 41, and the other end may be placed at a height less than or equal to the height at which the first connection portion 531 is placed. The first sealing unit 61 may be controlled to increase the height at which refrigerant leaked from the first indoor flow portion 511 may be discharged. One end of the second sealing unit 62 may be placed at the second inner connection portion 42, and the other end may be placed at a height less than or equal to the height at which the second connection portion 532 is placed. The second sealing unit 62 may be controlled to increase the height at which refrigerant leaked from the second indoor flow portion 512 may be discharged.

The first sealing unit 61 and the second sealing unit 62 according to an example embodiment of the disclosure may each have an inner space. The inner space of the first sealing unit 61 and the inner space of the second sealing unit 62 may be distinguished from each other. The inner space of the first sealing unit 61 and the inner space of the second sealing unit 62 may not be connected to each other. Because the first sealing unit 61 and the second sealing unit 62 have inner spaces that are distinguished from each other, the first sealing unit 61 and the second sealing unit 62 may not occupy excessive space inside the housing 110. The first sealing unit 61 and the second sealing unit 62 may independently surround the first indoor flow portion 511 and the second indoor flow portion 512, respectively, thereby providing the heat pump 1 having reduced weight and/or volume. The first sealing unit 61 and the second sealing unit 62 may independently surround the first indoor flow portion 511 and the second indoor flow portion 512, respectively, and thus, the width of the opening passing through an upper portion of the housing 110 (more specifically, passing through the pipe withdrawal portion 112) may not be large. However, the above description of the first sealing unit 61 and the second sealing unit 62 is merely an embodiment and is not limited thereto.

FIG. 10 is a conceptual diagram schematically illustrating a sealing unit of a heat pump according to an embodiment of the disclosure.

Referring to FIGS. 4 to 10, a sealing unit 6 according to an example embodiment of the disclosure may have one end placed at an inner connection portion 4 and the other end placed at a height at which a connection portion 53 is placed. The sealing unit 6 may surround an indoor flow portion 51 from the inner connection portion 4 to the connection portion 53, thereby sealing the indoor flow portion 51. The other end of the sealing unit 6 may be placed at a height at which the connection portion 53 is placed, thereby providing a heat pump 1 in which the indoor flow portion 51 and an outdoor flow portion 52 may be easily connected to each other and the installation height factor h₀ of an indoor unit 11 may be maximized. The other end of the sealing unit 6 may be placed at a height at which the connection portion 53 is placed, thereby providing a heat pump 1 in which the indoor flow portion 51 and the outdoor flow portion 52 may be easily connected to each other and the minimum indoor area required for installation is small.

According to an example embodiment of the disclosure, a first sealing unit 61 may surround a first indoor flow portion 511 from a first inner connection portion 41 to a first connection portion 531, thereby sealing the first indoor flow portion 511. A second sealing unit 62 may surround a second indoor flow portion 512 from a second inner connection portion 42 to a second connection portion 532, thereby sealing the second indoor flow portion 512. However, the disclosure is not limited thereto, and for example, the other end of one of the first sealing unit 61 or the second sealing unit 62 may be placed at a height less than the height at which the connection portion 53 is placed.

Among the ends of the first sealing unit 61 and the second sealing unit 62, an end placed on the outside of the housing 110 may be an end at which the first connection portion 531 and the second connection portion 532 are placed. The first connection portion 531 and the second connection portion 532 may each be configured to be connected to the outdoor flow portion 52. In order for the first connection portion 531 and the second connection portion 532 to be stably connected to the outdoor flow portion 52, the first connection portion 531 and the second connection portion 532 may need to be positionally fixed on the outside of the housing 110.

FIG. 11 is a view for explaining a fixing portion of a heat pump according to an embodiment of the disclosure. FIG. 12 is a front view of a heat pump according to an embodiment of the disclosure. FIG. 13 is a conceptual diagram schematically illustrating a fixing portion of a heat pump according to an embodiment of the disclosure.

Referring to FIGS. 11 to 13, a heat pump 1 according to an example embodiment of the disclosure may include a fixing portion 60. The fixing portion 60 may be configured to fix a first connection portion 531 and a second connection portion 532 to a housing 110. The fixing portion 60 may be configured to fix the first connection portion 531 and the second connection portion 532 to a housing upper portion 111. For example, the fixing portion 60 may be configured to fix the first connection portion 531 and the second connection portion 532 to a pipe withdrawal portion 112 of the housing upper portion 111. For example, the fixing portion 60 may be configured to fix the first connection portion 531 and the second connection portion 532 to a work area 1120 of the housing upper portion 111. Here, fixing the first connection portion 531 and the second connection portion 532 to the housing 110 may include positioning and fixing an end, placed on the outside of the housing 110, of each of the first indoor flow portion 511 and the second indoor flow portion 512 to the housing 110. The first sealing unit 61 and the second sealing unit 62 may independently cover the first indoor flow portion 511 and the second indoor flow portion 512, respectively. Fixing the first connection portion 531 and the second connection portion 532 to the housing 110 may include positioning and fixing an end, placed on the outside of the housing 110, of each of the first sealing unit 61 and the second sealing unit 62 to the housing 110.

According to an example embodiment of the disclosure, the fixing portion 60 may surround the first sealing unit 61 and the second sealing unit 62 exposed to the outside of the housing 110, thereby positionally fixing the first sealing unit 61 and the second sealing unit 62 to the housing 110. The fixing portion 60 may surround the first sealing unit 61 and the second sealing unit 62 exposed to the outside of the housing 110, thereby sealing the first sealing unit 61 and the second sealing unit 62. The fixing portion 60 may be configured, for example, in a basket shape having a bottom surface facing upwards so that the first indoor flow portion 511 and the second indoor flow portion 512 pass through the bottom surface, but is not limited thereto. A first fixing element 601 (e.g., a bolt structure) may positionally fix the first indoor flow portion 511 and the second indoor flow portion 512 to the fixing portion 60, but is not limited thereto. A second fixing element 602 (e.g., a hook structure) may positionally fix the fixing portion 60 to the housing 110, but is not limited thereto.

FIG. 14 is a conceptual diagram schematically illustrating an insulating member of a heat pump according to an embodiment of the disclosure.

Referring to FIGS. 4 to 14, a heat pump 1 according to an example embodiment of the disclosure may include an insulating member 600. The insulating member 600 may be configured to surround a refrigerant flow portion 5 exposed to the outside of a sealing unit 6. The insulating member 600 may provide insulation to the refrigerant flow portion 5. The insulating member 600 may provide insulation to an indoor flow portion 51. The insulating member 600 may be configured to surround a connection portion 53. The insulating member 600 may provide insulation to the connection portion 53. The insulating member 600 may be configured to surround each of a first connection portion 531 and a second connection portion 532. The insulating member 600 may provide insulation to each of the first connection portion 531 and the second connection portion 532.

The insulating member may be placed to surround a connection portion 53 after an indoor flow portion 51 and an outdoor flow portion 52 are connected to each other during the installation process of the heat pump 1. Because the insulating member is placed after the indoor flow portion 51 and the outdoor flow portion 52 are connected to each other, the insulating member may not expose the connection portion 53 to the outside.

According to an example embodiment of the disclosure, the insulating member 600 may be placed on the outside of the housing 110. The insulating member 600 may completely surround the connection portion 53 and may seal the connection portion 53. The end of the insulating member 600 may be positioned higher than the height at which the connection portion 53 is placed. The end of the insulating member 600 may be positioned higher than the height at which the connection portion 53 is placed, and thus, the height at which refrigerant may leak may be controlled to be greater than the height of the connection portion 53. The insulating member 600 may have an approximately cylindrical shape, but is not limited thereto. The insulating member may have various shapes that surround the connection portion 53 to provide insulation and airtightness and to allow refrigerant leaking from the connection portion 53 to be discharged at a higher position than the connection portion 53.

The embodiments described above are merely examples, and it will be obvious to one of ordinary skill in the art that various modifications and equivalent other embodiments may be made from the above-described embodiments of the disclosure. Therefore, the true technical protection scope according to example embodiments should be determined by the technical idea of the disclosure described in the following claims.

A heat pump 1 according to an example embodiment of the disclosure may include a refrigerant flow portion 5 providing a flow path for refrigerant between an indoor unit 11 and an outdoor unit 12, a heat medium circuit 31 configured to exchange heat with the refrigerant, a heat exchanger mediating heat exchange between the refrigerant and the heat medium circuit 31 and including an inner connection portion 4 to which the refrigerant flow portion 5 is connected, a housing 110 accommodating the heat exchanger and including an outer connection portion 2 to which the refrigerant flow portion 5 is connected, and a sealing unit 6 surrounding at least a portion of the refrigerant flow portion 5 and having one end placed at the inner connection portion 4 to prevent the refrigerant from leaking from an interior of the housing 110, wherein the other end of the sealing unit 6 may be placed above the outer connection portion 2, thereby controlling a height at which the refrigerant may leak to be greater than the height of the outer connection portion 2.

According to an example embodiment of the disclosure, the heat pump 1 may be safely used by increasing the height at which the refrigerant may leak. By increasing the height at which the refrigerant may leak, the heat pump 1 may relax installation space requirements for the heat pump 1.

According to an example embodiment of the disclosure, the refrigerant flow portion 5 of the heat pump 1 may include an indoor flow portion 51 connected to the inner connection portion 4 and an outdoor flow portion 52 connecting the indoor flow portion 51 to the outdoor unit 12, and the sealing unit 6 may surround the indoor flow portion 51.

According to an example embodiment of the disclosure, the heat pump 1 may provide a sealing unit 6 surrounding the indoor flow portion 51 so that the height at which the refrigerant may leak may be increased to a height at which a connection portion 53 is placed.

According to an example embodiment of the disclosure, the connection portion 53 connecting the indoor flow portion 51 to the outdoor flow portion 52 may be placed above the outer connection portion 2.

According to an example embodiment of the disclosure, the heat pump 1 may increase the height at which the refrigerant may leak to the height of the connection portion 53 placed above the outer connection portion 2.

According to an example embodiment of the disclosure, the sealing unit 6 of the heat pump 1 may have one end placed at the inner connection portion 4 and the other end placed at a height less than or equal to a height at which the connection portion 53 is placed.

According to an example embodiment of the disclosure, the heat pump 1 may provide the sealing unit 6 capable of completely surrounding the indoor flow portion 51 without excessive waste of material.

According to an example embodiment of the disclosure, the sealing unit 6 of the heat pump 1 may have one end placed at the inner connection portion 4 and the other end placed at a height at which the connection portion 53 is placed.

According to an example embodiment of the disclosure, the sealing unit 6 of the heat pump 1 may surround the indoor flow portion 51 from the inner connection portion 4 to the connection portion 53, thereby sealing the indoor flow portion 51.

According to an example embodiment of the disclosure, the heat pump 1 may further includes an insulating member 600 that surrounds the connection portion 53 exposed to the outside of the sealing unit 6 and provides insulation to the connection portion 53, and an end of the insulating member 600 may be placed at a height greater than the height at which the connection portion 53 is placed, thereby controlling the height at which the refrigerant may leak to be greater than the height of the connection portion 53.

According to an example embodiment of the disclosure, the insulating member 600 of the heat pump 1 may have a cylindrical shape.

The indoor flow portion 51 may include a first indoor flow portion 511 configured to allow high-temperature refrigerant to flow and a second indoor flow portion 512 configured to allow low-temperature refrigerant to flow, wherein a first connection portion 531 through which the first indoor flow portion 511 is connected to the outdoor flow portion 52 may be placed above a first outer connection portion 21 through which the first indoor flow portion 511 is connected to the housing 110, and a second connection portion 532 through which the second indoor flow portion 512 is connected to the outdoor flow portion 52 may be placed above a second outer connection portion 22 through which the second indoor flow portion 512 is connected to the housing 110.

According to an example embodiment of the disclosure, the sealing unit 6 of the heat pump 1 may include a first sealing unit 61 and a second sealing unit 62, wherein the first sealing unit 61 may surround the first indoor flow portion 511, and the second sealing unit 62 may surround the second indoor flow portion 512.

According to an example embodiment of the disclosure, the inner connection portion 4 of the heat pump 1 may include a first inner connection portion 41 configured to allow high-temperature refrigerant to flow into an interior of the heat exchanger and a second inner connection portion 42 configured to allow low-temperature refrigerant to flow out from the interior of the heat exchanger, wherein one end of the first sealing unit 61 may be placed at the first inner connection portion 41 and the other end of the first sealing unit 61 may be placed above the first outer connection portion 21, and one end of the second sealing unit 62 may be placed at the second inner connection portion 42 and the other end of the second sealing unit 62 may be placed above the second outer connection portion 22.

According to an example embodiment of the disclosure, the one end of the first sealing unit 61 of the heat pump 1 may be placed at the first inner connection portion 41 and the other end of the first sealing unit 61 may be placed at a height less than or equal to a height at which the first connection portion 531 is placed, and the one end of the second sealing unit 62 may be placed at the second inner connection portion 42 and the other end of the second sealing unit 62 may be placed at a height less than or equal to a height at which the second connection portion 532 is placed.

According to an example embodiment of the disclosure, the first sealing unit 61 of the heat pump 1 may surround the first indoor flow portion 511 from the first inner connection portion 41 to the first connection portion 531, thereby sealing the first indoor flow portion 511, and the second sealing unit 62 may surround the second indoor flow portion 512 from the second inner connection portion 42 to the second connection portion 532, thereby sealing the second indoor flow portion 512.

According to an example embodiment of the disclosure, the sealing unit 6 of the heat pump 1 may include a fixing portion 60 fixing the first connection portion 531 and the second connection portion 532 to the housing 110, wherein the fixing portion 60 may surround the first sealing unit 61 and the second sealing unit 62 exposed to an outside of the housing 110, thereby sealing the first sealing unit 61 and the second sealing unit 62.

According to an example embodiment of the disclosure, the refrigerant provided to the heat pump 1 may be flammable.

While the disclosure has been shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents.