COOLING ARRANGEMENT FOR A THERMOELECTRIC COOLING MODULE

Description

The present application claims the benefit of India Provisional Application No. 202421096844, filed December 7, 2024, which is herein incorporated by reference in the entirety.

TECHNICAL FIELD

The present disclosure relates to the field of heat transfer, and more particularly to, a cooling arrangement for thermoelectric cooling modules.

BACKGROUND

A thermoelectric cooling (TEC) module is a type of solid-state device that utilizes the Peltier effect to create a temperature difference between a hot surface and a cold surface when an electric current is passed through it. TEC modules are widely used in various applications, including cooling electronic components, temperature control in scientific equipment, and even in energy harvesting systems. The TEC modules include n-type and p-type semiconductor materials, which are typically arranged alternatingly in a series and thermally connected in parallel. These semiconductor elements are encapsulated between ceramic plates, which provide structural support and facilitate heat transfer.

In conventional TEC systems, effective heat removal from the hot side of the TEC module is necessary to maintain efficient temperature at the cold side. Conventionally, heat sink with fan(s) are used to dissipate heat from the hot surface of the TEC module. However, conventional cooling arrangements introduce several drawbacks. For example, the ceramic plates that form the hot and cold surfaces of the TEC module are fragile and prone to failure due to the structural load of the attached heat sink. Further, the structural load of the attached heat sink tends to increase the mechanical stress on the ceramic plates which may cause premature failure of the module. Additionally, the fan attached to the heat sink induces vibration that may be transferred to the operative surface of the TEC module and can damage or disturb the integrity of the TEC module.

Further, in the conventional cooling arrangements there exists a temperature difference between the heat sink and the ambient environment. Such temperature differential affects the internal surface temperature of the thermoelectric cooling module, which reduces the efficiency of the heat removal process. Despite the use of fans and heat sinks, the efficiency of heat dissipation is often suboptimal, which leads to decreased performance of the thermoelectric cooling module in high-demand environments.

Therefore, it would be desirable to provide a cooling arrangement for the thermoelectric cooling module that cures the shortfalls of the previous approaches identified above.

SUMMARY

In embodiments, a cooling system for a thermoelectric cooling (TEC) module, the cooling system including: a cold plate configured to be mounted on a surface of a hot side of the TEC module, the cold plate including: a base and a top body mounted thereon at a predetermined distance from the base, wherein the base and the top body are configured to create an enclosure therebetween to facilitate fluid flow; an inlet and an outlet defined on the cold plate, wherein the inlet and outlet are configured to allow fluid to flow through the enclosure; a plurality of internal ribs configured on the base, the plurality of internal ribs including a plurality of holes configured to facilitate fluid dispersion and turbulence; and a plurality of ridges configured on the base between a pair of the plurality of internal ribs, the plurality of ridges configured to disrupt laminar fluid flow and create turbulence to enhance heat transfer efficiency.

In embodiments, a cooling system for a thermoelectric cooling (TEC) module, the cooling system including: a cold plate configured to be mounted on a surface of a hot side of the TEC module, the cold plate including: a base and a top body mounted thereon at a predetermined distance from the base, wherein the base and the top body are configured to create an enclosure therebetween to facilitate fluid flow; an inlet and an outlet defined on the cold plate, wherein the inlet and outlet are configured to allow fluid to flow through the enclosure; a plurality of internal ribs configured on the base, the plurality of internal ribs including a plurality of holes configured to facilitate fluid dispersion and turbulence; and a plurality of ridges configured on the base between a pair of the plurality of internal ribs, the plurality of ridges configured to disrupt laminar fluid flow and create turbulence to enhance heat transfer efficiency; a heat pipe including an evaporator section and a condenser section; and a holding plate configured to couple the heat pipe to the TEC module.

In embodiments, a cooling system for a thermoelectric cooling (TEC) module, the cooling system including: a cold plate configured to be mounted on a surface of a hot side of the TEC module, the cold plate including: a base and a top body mounted thereon at a predetermined distance from the base, wherein the base and the top body are configured to create an enclosure therebetween to facilitate fluid flow; an inlet and an outlet defined on the cold plate, wherein the inlet and outlet are configured to allow fluid to flow through the enclosure; a plurality of internal ribs configured on the base, the plurality of internal ribs including a plurality of holes configured to facilitate fluid dispersion and turbulence; and a plurality of ridges configured on the base between a pair of the plurality of internal ribs, the plurality of ridges configured to disrupt laminar fluid flow and create turbulence to enhance heat transfer efficiency; a heat sink configured to be in operative configuration with a surface of a cold side of the TEC module; and a fan, wherein the fan and the heat sink are enclosed within a thermal load confinement, wherein the fan is configured to conduct forced convection with the heat sink to extract heat from the thermal load, wherein the TEC module is configured to extract heat from the heat sink and redirect the heat onto the cold plate.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not necessarily restrictive of the invention as claimed. The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and together with the general description, serve to explain the principles of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The numerous advantages of the disclosure may be better understood by those skilled in the art by reference to the accompanying figures in which:

FIG. 1 illustrates a sectional view of a conventional cooling arrangement.

FIG. 2 illustrates a simplified block diagram of a cooling system including a TEC module, in accordance with one or more embodiments of the present disclosure.

FIG. 3A illustrates a cross-sectional view of a cold plate assembly of the cooling system, in accordance with one or more embodiments of the present disclosure.

FIG. 3B illustrates a cross-sectional view of a cold plate assembly of the cooling system, in accordance with one or more embodiments of the present disclosure.

FIG. 4 illustrates an isometric view of the cooling system including a cold plate assembly, in accordance with one or more embodiments of the present disclosure.

FIG. 5A illustrates a closed loop circuit for cooling the fluid of the cold plate assembly of the cooling system, in accordance with one or more embodiments of the present disclosure.

FIG. 5B illustrates a closed loop circuit for cooling the fluid of the cold plate assembly of the cooling system, in accordance with one or more embodiments of the present disclosure.

FIG. 5C illustrates a closed loop circuit for cooling the fluid of the cold plate assembly of the cooling system, in accordance with one or more embodiments of the present disclosure.

FIGS. 6A-6B illustrates the different configurations of the cooling coils or pipes/tubes, in accordance with one or more embodiments of the present disclosure.

FIG. 7A illustrates a top view of the cooling plate with an inlet port and an outlet port for the flow of cooling fluid to exchange heat, in accordance with one or more embodiments of the present disclosure.

FIG. 7B illustrates a cross-sectional side view of the cooling system of FIG. 7A, in accordance with one or more embodiments of the present disclosure..

FIG. 8 illustrates a cross-sectional view of a cooling plate including an inlet port, an outlet port, a plurality of baffles plates and ridges to enable exchange of heat of the cooling system of FIG. 7B, in accordance with one or more embodiments of the present disclosure.

FIG. 9 illustrates an isometric view of the cooling system including a cold plate in a horizontal configuration, in accordance with one or more embodiments of the present disclosure.

FIG. 10 illustrates an isometric view of the cooling system including a cold plate in a vertical configuration, in accordance with one or more embodiments of the present disclosure.

FIG. 11A illustrates the cooling system including a heat pipe with fan assembly, in accordance with one or more embodiments of the present disclosure.

FIG. 11B illustrates the cooling system including a heat pipe with fan assembly, in accordance with one or more embodiments of the present disclosure.

FIG. 11C illustrates the cooling system including a pair of heat sinks, in accordance with one or more embodiments of the present disclosure.

FIG. 12 illustrates the cooling system including a heat pipe, in accordance with one or more embodiments of the present disclosure.

FIG. 13 illustrates the cooling system including a pair of heat sinks and a pair of heat pipes for cooling the fluid, in accordance with one or more embodiments of the present disclosure.

DETAILED DESCRIPTION

Reference will now be made in detail to the subject matter disclosed, which is illustrated in the accompanying drawings. The present disclosure has been particularly shown and described with respect to certain embodiments and specific features thereof. The embodiments set forth herein are taken to be illustrative rather than limiting. It should be readily apparent to those of ordinary skill in the art that various changes and modifications in form and detail may be made without departing from the spirit and scope of the disclosure.

The terminology used, in the present disclosure, is only for the purpose of explaining a particular embodiment and such terminology shall not be considered to limit the scope of the present disclosure. As used in the present disclosure, the forms "a,” "an," and "the" may be intended to include the plural forms as well, unless the context clearly suggests otherwise. The terms "comprises," "comprising," “including,” and “having,” are open ended transitional phrases and therefore specify the presence of stated features, elements, modules, units and/or components, but do not forbid the presence or addition of one or more other features, elements, components, and/or groups thereof.

Definitions

The term ‘thermoelectric cooling module’ herein refers to a solid-state device that generates a temperature difference between its two surfaces when an electric current passes through it, enabling one side to cool while the other side heats. It is commonly used for precise temperature control in applications such as refrigeration, electronics cooling, and energy harvesting.

The term "thermal load" herein refers to the amount of heat energy generated by a component, system, or environment that must be managed or dissipated to maintain desired operational temperatures. In the context of thermoelectric cooling (TEC) modules, the thermal load may include a body, an enclosure such as a cabinet, or any other entity that requires cooling. It directly influences the cooling capacity and performance requirements of the TEC module.

FIG. 1 illustrates a sectional view of a conventional cooling system 50. In particular, FIG. 1 depicts a heat sink 61 affixed to a thermoelectric cooling (TEC) module 57, where the TEC module 57 has a cold side 53 and a hot side 55.

In conventional TEC systems 50, as shown in FIG. 1, effective heat dissipation from a hot side 55 of the TEC module 57 is a critical factor in maintaining optimal performance. Typically, the heat sinks 61 are combined with fans 63 and mounted directly on the surface of the hot side 55 of the TEC module 57 to remove excess heat. While this approach is widely used, it has inherent limitations. For example, the ceramic plates 59 on the surfaces of the TEC module 57, which provide structural support, are prone to failure under the mechanical stress imposed by the weight of the heat sink 61 and fan assembly 63. Furthermore, the vibrations generated by fan operation can exacerbate structural weaknesses, leading to reduced reliability and increased maintenance requirements. Additionally, the efficiency of conventional heat sinks 61 is affected by the limited heat transfer capacity of air, which has a relatively low heat capacity and specific heat compared to other mediums. The temperature differential between the heat sink 61 and the ambient air further reduces the effectiveness of heat dissipation, causing the TEC module 57 to operate at suboptimal thermal conditions. These challenges limit the application and efficiency of TEC modules 57, particularly in environments requiring high heat dissipation or precise temperature control.

Embodiments of the present disclosure are directed to a cooling system for a thermoelectric cooling module. In particular, embodiments of the present disclosure are directed to a cooling system that incorporates a cold plate, heat pipe, or combinations thereof, configured to enhance heat removal from the hot side of the TEC module. For example, the system may utilize a cold plate assembly with circulating fluid and structural features that promote turbulence, thereby improving heat transfer efficiency and maintaining the hot surface temperature close to ambient conditions. In this regard, the cooling system of the present disclosure addresses mechanical stress, vibration, and mounting challenges associated with conventional systems, resulting in improved reliability and performance of thermoelectric cooling modules.

The present disclosure described hereinabove has several technical advantages including, but not limited to, a cooling system for a thermoelectric cooling module that can: (i) allow effective removal of heat while maintaining the temperature of the hot surface close to ambient environment temperature; (ii) minimize mechanical stress on an operative surface of the thermoelectric cooling module; (iii) eliminate vibrations caused due to the operation of the cooling system; and (iv) facilitate ease of mounting to the surface of the thermoelectric cooling module.

The present disclosure addresses these limitations by introducing a cooling system 100 for a TEC module 56, which will be described with reference to FIGS. 2-13.

The system 100 may include a TEC module 56 including a cold side 52 and a hot side 54. Referring generally to FIG. 2, the system 100 may further include at least one of a cold plate 102, a heat pipe 130, and/or a heat sink 60 configured to be mounted in communication to a surface of the hot side 54 of the TEC module 56. For example, the system 100 may include a cold plate assembly 100A including the cold plate 102, as will be discussed further herein with reference to FIGS. 3A-10. In some instances, as shown in FIG. 3B, the cold plate assembly 100A may further include the heat sink 60. By way of another example, the system 100 may include a heat pipe assembly 100B including the heat pipe 130, as will be discussed further herein with reference to FIGS. 11A-11C. In some instances, as shown in FIGS. 11B-11C, the heat pipe assembly 100B may further include the heat sink 60. By way of another example, the system 100 may include the cold plate assembly 100A and the heat pipe assembly 100B, as will be discussed further herein with reference to FIGS. 12-13. In some instances, as shown in FIG. 13, the cold plate assembly 100A and/or the heat pipe assembly 100B may further include the heat sink 60.

Referring generally to FIGS. 3A-10, the cold plate 102 may be configured to circulate fresh ambient fluid and fluid particles, where the fluid particles may possess relatively higher heat capacity and specific heat than ambient air. For example, as the fluid and particles flow through the cold plate 102, they absorb heat from the surface of the hot side 54 of the TEC module 56, maintaining its temperature close to ambient levels before exiting the system. This efficient heat removal mechanism eliminates the need for bulky heat sinks 60 or avoids the need to be mounted directly on the surface of the TEC module 56 and reduces mechanical stress and vibrations, thereby potentially enhancing the durability and reliability of the TEC module 56.

It is contemplated herein that fluid particles, due to their higher heat capacity and specific heat compared to ambient air, are significantly more effective in heat removal applications. As such, in some cases, it may be advantageous to replace a conventional heat sink assembly 61, as shown in FIG. 1, on the hot side of the TEC module with a cold plate 102.

In an embodiment, the cold plate 102 may be operatively connected to the TEC module 56. For example, the cold plate 102 may be positioned on the surface of the hot side 54 of the TEC module 56 configured to receive heat from the TEC module 56. The cold plate 102 may include an inlet 116 and an outlet 118 for cooling fluid that enters the cold plate 102, as shown in FIGS. 3A-3B and FIGS. 7A-10. The cooling fluid flow path within the system may be referred to as fluid flow 132 herewith the ongoing description. The cold side 52 of the TEC module 56 may be in operative configuration with a component or an enclosed environment to extract heat from an enclosure or a component which is to be cooled, hereinafter referred to as a thermal load 64.

The cold plate 102 may be in operative configuration with fluid circulating conduits herein referred to as a cold plate tube 114, as shown in FIG. 4. For example, the cold plate tube 114 may be operatively connected to the inlet 116 and outlet 118 of the cold plate 102 configured to circulate fluid within the system 100. For instance, ambient fluid may be actively circulated through the cold plate tube 114 and the cold plate 102, ensuring a continuous flow of heat-absorbing fluid. In this regard, as the fluid and particles absorb heat from the hot side 54 of the TEC module 56, the fluid and particles may help maintain its temperature close to the ambient level before exiting the cold plate 102.

Referring to FIG. 8, the cold plate 102 may be defined by a base 104 and a top body 106. For example, the top body 106 may be configured to be mounted on top of the base 104 such that an enclosure is created between the cold plate 102 for the fluid to flow. The cold plate 102 may be constructed in such a configuration that allows the cooling fluid flowing through the cold plate 102 to experience turbulence. The introduction of turbulence within the fluid flowing through the cold plate 102 may potentially enhance the heat transfer capacity of the fluid. The cold plate 102 employed in the present disclosure may be configured with an internal structure that may induce turbulence in the fluid flowing within the cold plate 102 from the cold plate tubes 114.

Turbulence may be achieved through strategically placing at least one of one or more baffles, channels, and/or textured surfaces within the cold plate 102. For example, as the fluid and fluid particles flow through the cold plate 102, these baffles/channels/textured surfaces can disrupt the smooth, laminar flow of the fluid, creating turbulent flow patterns. Turbulence significantly enhances heat transfer by increasing the interaction between the fluid and the surfaces of the cold plate 102. In laminar flow, only the fluid layers closest to the surface participate effectively in heat transfer, as the outer layers move relatively slowly and exhibit minimal mixing. However, turbulence disrupts these fluid layers, causing continuous mixing of the fluid. This mixing of fluid, so that more fluid particles are in contact with the hot surface and are actively exchanging heat.

The base 104 of the cold plate 102 may include a series of internal ribs 120 arranged in an alternating pattern to facilitate controlled fluid flow and turbulence, potentially enhancing thermal performance. The internal ribs 120 may further include a plurality of holes 122 configured thereon to allow fluid to disperse while flowing therethrough, as shown in FIGS. 9-10. This configuration may also include a plurality of ridges 124, as shown in FIGS. 9 and 7B, either rectangular or triangular in shape, interspersed within the base 104 of the cold plate 102 assembly. As the fluid enters the cold plate 102, it crosses these ridges 124 and flows into an empty chamber. The fluid then moves through the small holes 122 in the internal ribs 120 that follow. The alternating system of internal ribs 120 and ridges 124 function as the required baffles/channels/textured surfaces that facilitate mixing of the fluid, disrupting laminar flow, and creating turbulence. The resulting turbulence may increase the heat transfer rate by continuously exposing cooler portions of the fluid to the heated surfaces of the cold plate 102. Additionally, as shown in FIGS. 8 and 7B, a plurality of projections 126 at the top body 106 of the cold plate 102 may be configured to redirect any bypassed fluid, pushing it back down into the flow cycle.

It is contemplated herein that the cold plate 102 may accommodate a variety of installation orientations, such as horizontal (as shown in FIG. 9), vertical (as shown in FIG. 10), or angled configurations. This versatility allows the cooling system 100 to be adapted for optimal thermal performance in different environments and applications. For instance, when mounted vertically, the cold plate may leverage gravity to enhance fluid mixing and heat transfer, while a horizontal or angled placement can be beneficial for specific spatial constraints or airflow patterns. The ability to modify the orientation of the cold plate 102 ensures that the cooling system 100 can deliver efficient heat removal regardless of the mounting scenario, maintaining consistent temperature control and reliability.

In embodiments, where the cold plate 102 is mounted vertically (as shown in FIG. 10), an additional series of secondary ribs 121 may be included in the assembly. Unlike the internal ribs 120, the secondary ribs 121 may not be continuous throughout the width of the cold plate 102. For example, the secondary ribs 121 may be configured to introduce a flow path to the fluid flowing within the cold plate 102. These secondary ribs 121 may ensure that the fluid flows through a sequential path, interacting with multiple surfaces, and maintains effective heat transfer throughout the system 100. The vertical arrangement may further enhance the mixing effect of the fluid, aided by gravity and the structured flow configuration.

In embodiments, as shown in FIG. 3B, the cold plate assembly 100A may be configured with the heat sink 60 and the fan 62 which may be enclosed within the thermal load 64 confinement or cabinet. For example, the fan 62 may be configured to conduct forced convection with the heat sink 60, functionally extracting heat from the thermal load 64. The heat sink 60 may be configured to be in operative configuration with the surface of the cold side 52 of the TEC module 56. The TEC module 56 may be further configured to extract heat from the heat sink 60 and redirect the heat onto the cold plate 102. Further, the cold plate 102 may be configured to functionally exchange heat from the TEC module 56 by means of circulating cooling fluid within the cold plate 102. The forced convection air path may be referred to as airflow 134 herewith in reference to drawing and description.

In embodiments, as shown in FIGS. 5A-5C, the cold plate assembly 100A may be configured with a radiator 108. For example, the radiator 108 may be in operative configuration with the cold plate tubes 114 such that the radiator 108 functionally radiates the heat from the fluid flowing through the cold plate assembly 100A into the ambient environment. The cold plate assembly 100A may further include a fluid pump 110 configured to circulate fluid within the cold plate assembly 100A. For example, the fluid pump 110 may be in operative configuration with the cold plate tubes 114 acting as conduits for the fluid flow.

In embodiments, as shown in FIG. 5B, the cold plate assembly 100A may further include a mini water tank 112A. For example, the mini water tank 112A may be configured to fluidly communicate with the fluid pump 110. For instance, the mini water tank 112A may be used as a cooling fluid reservoir for the cold plate assembly 100A.

In embodiments, as shown in FIG. 5C, the cold plate assembly 100A may further include a big water tank 112B. For example, the big water tank 112B may be configured to fluidly communicate with the fluid pump 110. Depending on the thermal load 64, the big water tank 112B may be used as a cooling fluid reservoir for the cold plate assembly 100A for comparatively greater amount of heat extraction.

For purposes of the present disclosure, the term “mini water tank” refers to a compact reservoir that serves as a storage unit for cooling fluid within the cold plate assembly. It is designed to hold a relatively small volume of fluid, making it suitable for applications where space is limited or where the required heat extraction is moderate. The mini water tank ensures that the fluid pump can continuously circulate cooling fluid through the system, supporting efficient thermal management. Conversely, for purposes of the present disclosure, the term “big water tank” denotes a larger reservoir intended to store a greater quantity of cooling fluid. This tank is utilized in scenarios where the thermal load is higher, or extended heat extraction capacity is needed. By accommodating a larger volume of fluid, the big water tank enables the cooling system to maintain effective temperature control over prolonged periods and manage more substantial heat loads.

In embodiments, as shown in FIGS. 6A-6B, the routing of the cold plate tubes 114 may be modified to based on at least one of the specific location, orientation, and/or performance requirements of the cold plate 102. It is contemplated herein that such flexibility may allow the cooling system 100 to adapt seamlessly to various installation scenarios, whether the cold plate 102 is positioned horizontally, vertically, or at an angle. In this regard, by customizing the path of the cold plate tubes 114, efficient fluid circulation may be achieved.

Referring generally to FIGS. 11A-11C, the cooling system 100 includes the heat pipe assembly 100B.

In embodiments, as shown in FIG. 11A, a heat pipe assembly 100B may be integrated onto the TEC module 56 to potentially improve its thermal management capabilities on both the hot side 54 and cold side 52. It is contempatled herein that the heat pipes 130 may be exceptionally efficient at transferring heat compared to conventional materials like metals. The heat pipe 130 on the hot side 54 of the TEC module 56, can remove the heat rapidly, keeping the hot side 54 temperature close to ambient temperatures. As shown in FIG. 11A, the heat pipe assembly 100B may enable connection of the evaporator section 130A of the heat pipe 130 with the surface of the hot side 54 of the TEC module 56. Consequently, a holding plate 131 may be configured to ensure proper contact between the heat pipe 130 and the TEC module 56, securing the heat pipe assembly 100B in place. The condenser section 130B of the heat pipe 130 may be connected to the heat sink 60, which dissipates the heat into the surrounding air/ambient air. Further, the fan 62 may be configured longitudinally to the heat sink 60 to expel the heat more effectively. The fan 62 may be configured to facilitate forced convection of the heat from the heat sink 60 surface to the ambient air or environment. The condenser section 130B of the heat pipe 130 may be configured to transfer the heat to the heat sink 60. Further, the evaporator section 130A of the heat pipe 130 may be configured to extract heat from the TEC module 56.

In embodiments, as shown in FIG. 11B, the heat pipe assembly 100B may be configured to be positioned on the cold side 52 of the TEC module 56. This configuration may particularly be useful for achieving a uniform temperature within an enclosure or compartment, such as a cabinet. For example, the heat pipe 130 may distribute the cooling effect evenly, allowing consistent thermal conditions across the space and in applications involving temperature-sensitive components or environments where precise temperature control is essential.

In embodiments, as shown in FIG. 11C, the heat pipe assembly 100B may be used in installations with space constraints. For example, the heat pipe assembly 100B may include a pair of heat sinks 60, where a first heat sink is positioned perpendicular to a second heat sink about the holding plate 131. The orientation and placement of the heat pipe 130 whether horizontal, vertical, or angled can be adjusted to suit the specific needs of the application making the heat pipe assembly 100B feasible for irregularly shaped systems where traditional cooling methods may not be practical.

Referring generally to FIGS. 12-13, in embodiments, the cooling system 100 includes both the cold plate assembly 100A and the heat pipe assembly 100B.

Referring to FIG. 12, the evaporator section 130A of the heat pipe 130 may be operatively connected to the surface of TEC module 56 functionally receiving the heat from the module 56. The heat pipe 130 may be secured on the operative surface of the TEC module 56 by means of the holding plate 131. The condenser section 130B of the heat pipe 130 may be operatively connected to the cold plate 102 configured to extract heat from the condenser section 130B of the heat pipe 130. The cold plate 102 may be configured to extract the heat from the condenser section 130B of the heat pipe 130. This configuration may potentially eliminate the vibration, and mechanical issues generally associated with fan operated modules.

Referring to FIG. 13, the combination of the cold plate assembly 100A and the heat pipe assembly 100B may be configured in such a way that, the cold plate 102 is in direct contact with the operative surface of the TEC module 56. Further, the fluid exiting the cold plate 102 after the heat exchange may be in operative configuration with the heat pipe 130. The heat pipe 130 may be configured to extract the heat from the fluid exiting from the cold plate 102. Moreover, the heat pipe 130 may be configured with the heat sink 60 and the fan 62 module to disperse heat from the heat pipe 130 to the ambient air.

Example Embodiment

In an exemplary embodiment, different cooling systems were tested for determining their efficiency in cooling the TEC module. The parameters considered are as follows: (i) the cabinet volume defined by dimensions: 250 mm (Height) x 325 mm (width) x 160 mm (Depth); (ii) the material used for the test is cardboard box; (iii) ambient temperature during the test of 30.8 degree Celsius; (iv) Power supplied - 5 V, 2 Amp; (v) TEC module “TEC1-12706”; and (vi) Duration of test - 60 minutes. The cooling systems included a TEC module provided with a conventional fan assembly and a TEC module provided with a cold plate.

For the TEC module with the fan assembly, it was observed that hot side temperature was 37.3 degree Celsius whereas temperature inside the box was 27.6 degree Celsius. The temperature inside the box dropped by 3.2 degree Celsius below the ambient temperature.

For the TEC module with the cold plate arrangement of the present disclosure, it was observed that the hot side temperature was 29.9-30.3 degree Celsius, whereas temperature inside the box was 18.3-23.2 degree Celsius. The temperature inside the box was dropped by approximately 10 degree Celsius below the ambient temperature.

The foregoing description of the embodiments has been provided for purposes of illustration and not intended to limit the scope of the present disclosure. Individual components of a particular embodiment are generally not limited to that particular embodiment, but, are interchangeable. Such variations are not to be regarded as a departure from the present disclosure, and all such modifications are considered to be within the scope of the present disclosure.

The embodiments herein and the various features and advantageous details thereof are explained with reference to the non-limiting embodiments in the following description.

Descriptions of well-known components and processing techniques are omitted so as to not unnecessarily obscure the embodiments herein. The examples used herein are intended merely to facilitate an understanding of ways in which the embodiments herein may be practiced and to further enable those of skill in the art to practice the embodiments herein. Accordingly, the examples should not be construed as limiting the scope of the embodiments herein.

The foregoing description of the specific embodiments so fully reveal the general nature of the embodiments herein that others can, by applying current knowledge, readily modify and/or adapt for various applications such specific embodiments without departing from the generic concept, and, therefore, such adaptations and modifications should and are intended to be comprehended within the meaning and range of equivalents of the disclosed embodiments. It is to be understood that the phraseology or terminology employed herein is for the purpose of description and not of limitation. Therefore, while the embodiments herein have been described in terms of preferred embodiments, those skilled in the art will recognize that the embodiments herein can be practiced with modification within the spirit and scope of the embodiments as described herein.

Any discussion of devices, articles or the like that has been included in this specification is solely for the purpose of providing a context for the disclosure. It is not to be taken as an admission that any or all of these matters form a part of the prior art base or were common general knowledge in the field relevant to the disclosure as it existed anywhere before the priority date of this application.

While considerable emphasis has been placed herein on the components and component parts of the preferred embodiments, it will be appreciated that many embodiments can be made and that many changes can be made in the preferred embodiments without departing from the principles of the disclosure. These and other changes in the preferred embodiment as well as other embodiments of the disclosure will be apparent to those skilled in the art from the disclosure herein, whereby it is to be distinctly understood that the foregoing descriptive matter is to be interpreted merely as illustrative of the disclosure and not as a limitation.