COMPOSITIONS AND METHODS FOR INHIBITING CORROSION UNDER OXIDATED ENVIRONMENTS

Description

TECHNICAL FIELD

The present disclosure generally relates to corrosion inhibitor compositions and methods for inhibiting corrosion. More particularly, the disclosure relates to compositions and methods for inhibiting corrosion under oxidated environments.

BACKGROUND

Large computer systems, such as supercomputers, high-performance computing (HPC) systems, data centers, enterprise systems, and other large computer systems generate significant amounts of waste heat that must be managed. Traditionally, computer systems were air-cooled; however, many modern supercomputers and other large computer systems use liquid cooling systems. Liquid cooling may increase cooling efficiency and effectiveness as compared to air cooling, especially for extremely power-dense computing systems. Typical liquid cooling systems for large computing systems include a closed loop that is pressurized with coolant, such as water or a water/propylene glycol mixture.

In use, the coolant included in such a closed loop cooling system for computer systems may become degraded, contaminated, fouled, or otherwise change over time.

Corrosion inhibitors are typically added to industrial cooling water systems or aqueous coolant systems to prevent or inhibit corrosion of metal surfaces in contact with the aqueous medium. Further, oxidizing agents are often added to industrial cooling water systems or aqueous coolant systems for microbiological control. The oxidizing agents typically increase the rate of corrosion of metal surfaces in contact with the aqueous medium. Also, the oxidizing agents tend to react with and decrease the effectiveness of the corrosion inhibitors, such as azole-containing compounds, in the medium.

BRIEF SUMMARY

The present disclosure provides corrosion inhibitor compositions and methods for inhibiting corrosion of a metal surface in contact with an aqueous medium.

In some embodiments, a method of inhibiting corrosion of a metal surface in contact with an aqueous medium comprises adding a composition comprising a corrosion inhibitor to the aqueous medium, wherein the corrosion inhibitor comprises a benzotriazole compound and/or a derivative thereof, a halo-benzotriazole, a imidazole compound, a benzimidazole compound, a substituted imidazole compound, a substituted benzimidazole compound, a tetrazole compound, a pyrazole compound and/or a derivative thereof, a pyrimidine compound and/or a derivative thereof, and any combination thereof.

In certain embodiments, the present disclosure provides a method of monitoring and controlling a concentration of a corrosion inhibitor in an aqueous medium, comprising:

• • (a) providing a monitoring and controlling unit comprising a controller and a sensor in communication with the controller, wherein the sensor is operable to measure the concentration of the corrosion inhibitor in the aqueous medium;
  • (b) providing a chemical injection pump, which is in communication with the controller;
  • (c) inputting an acceptable range for the concentration of the corrosion inhibitor into the controller;
  • (d) providing a delivery conduit having a first end in fluid communication with the aqueous medium and a second end in fluid communication with an inlet of the monitoring and controlling unit;
  • (e) delivering a sample of the aqueous medium through the delivery conduit and into the monitoring and controlling unit;
  • (f) measuring the concentration of the corrosion inhibitor in the sample with the sensor;
  • (g) determining if the measured concentration is within the acceptable range inputted into the controller in step (c);
  • (h) causing a change in an influx of the corrosion inhibitor into the aqueous medium from the chemical injection pump if the measured concentration is outside of the acceptable range inputted into the controller in step (c); and
  • (i) optionally repeating steps (a) to (h) to determine if the concentration of the corrosion inhibitor has been brought within the acceptable range inputted in step (c).

The foregoing has outlined rather broadly the features and technical advantages of the present disclosure in order that the detailed description that follows may be better understood. Additional features and advantages of the disclosure will be described hereinafter that form the subject of the claims of this application. It should be appreciated by those skilled in the art that the conception and the specific embodiments disclosed may be readily utilized as a basis for modifying or designing other embodiments for carrying out the same purposes of the present disclosure. It should also be realized by those skilled in the art that such equivalent embodiments do not depart from the spirit and scope of the disclosure as set forth in the appended claims.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

A detailed description of the invention is hereafter described with specific reference being made to the drawings in which:

FIG. 1 shows a simplified block diagram of a system for high-performance computing with liquid cooling;

FIG. 2 shows a simplified block diagram of at least one embodiment of a liquid monitoring system for a high-performance computing system with liquid cooling;

FIG. 3 shows a simplified block diagram of at least one embodiment of another liquid monitoring system for a high-performance computing system with liquid cooling;

FIG. 4 shows a diagram of at least one embodiment of a coolant blade of the liquid monitoring system of FIG. 3;

FIG. 5 shows a simplified flow diagram of at least one embodiment of a method for liquid cooling system monitoring that may be executed by a controller of FIGS. 2-4; and

FIG. 6 shows a simplified block diagram of at least one additional embodiment of a liquid monitoring system for a high-performance computing system with liquid cooling.

DETAILED DESCRIPTION

Various embodiments are described below. The relationship and functioning of the various elements of the embodiments will be better understood in light of the following detailed description. However, elements and embodiments are not strictly limited to those explicitly described below.

Examples of methods and materials are described below, although methods and materials similar or equivalent to those described herein can be used in practice or testing of the present disclosure. All publications, patent applications, patents and other reference materials mentioned herein are incorporated by reference in their entirety. The materials, methods, and examples disclosed herein are illustrative only and not intended to be limiting.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. In case of conflict, the present document, including definitions, will control.

Unless otherwise indicated, an alkyl group as described herein alone or as part of another group is an optionally substituted linear or branched saturated monovalent hydrocarbon substituent containing from, for example, one to about sixty carbon atoms, such as one to about thirty carbon atoms, in the main chain. Examples of unsubstituted alkyl groups include methyl, ethyl, n-propyl, i-propyl, n-butyl, i-butyl, s-butyl, t-butyl, n-pentyl, i-pentyl, s-pentyl, t-pentyl, and the like.

The terms “aryl” or “ar” as used herein alone or as part of another group (e.g., arylene) denote optionally substituted homocyclic aromatic groups, such as monocyclic or bicyclic groups containing from about 6 to about 12 carbons in the ring portion, such as phenyl, biphenyl, naphthyl, substituted phenyl, substituted biphenyl or substituted naphthyl. The term “aryl” also includes heteroaryl functional groups. It is understood that the term “aryl” applies to cyclic substituents that are planar and comprise 4n+2 electrons, according to Huckel's Rule.

“Cycloalkyl” refers to a cyclic alkyl substituent containing from, for example, about 3 to about 8 carbon atoms, such as from about 4 to about 7 carbon atoms or about 4 to 6 carbon atoms. Examples of such substituents include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, and the like. The cyclic alkyl groups may be unsubstituted or further substituted with alkyl groups, such as methyl groups, ethyl groups, and the like.

“Heteroaryl” refers to a monocyclic or bicyclic 5- or 6-membered ring system, wherein the heteroaryl group is unsaturated and satisfies Huckel's rule. Non-limiting examples of heteroaryl groups include furanyl, thiophenyl, pyrrolyl, pyrazolyl, imidazolyl, 1,2,3-triazolyl, 1,2,4-triazolyl, isoxazolyl, oxazolyl, isothiazolyl, thiazolyl, 1,3,4-oxadiazol-2-yl, 1,2,4-oxadiazol-2-yl, 5-methyl-1,3,4-oxadiazole, 3-methyl-1,2,4-oxadiazole, pyridinyl, pyrimidinyl, pyrazinyl, triazinyl, benzofuranyl, benzothiophenyl, indolyl, quinolinyl, isoquinolinyl, benzimidazolyl, benzoxazolinyl, benzothiazolinyl, quinazolinyl, and the like.

Compounds of the present disclosure may be substituted with suitable substituents. The term “suitable substituent,” as used herein, is intended to mean a chemically acceptable functional group, preferably a moiety that does not negate the activity of the compounds. Such suitable substituents include, but are not limited to, halo groups, perfluoroalkyl groups, perfluoro-alkoxy groups, alkyl groups, alkenyl groups, alkynyl groups, hydroxy groups, oxo groups, mercapto groups, alkylthio groups, alkoxy groups, aryl or heteroaryl groups, aryloxy or heteroaryloxy groups, aralkyl or heteroaralkyl groups, aralkoxy or heteroaralkoxy groups, HO—(C═O)— groups, heterocylic groups, cycloalkyl groups, amino groups, alkyl- and dialkylamino groups, carbamoyl groups, alkylcarbonyl groups, alkoxycarbonyl groups, alkylaminocarbonyl groups, dialkylamino carbonyl groups, arylcarbonyl groups, aryloxy-carbonyl groups, alkylsulfonyl groups, and arylsulfonyl groups. In some embodiments, suitable substituents may include halogen, an unsubstituted C₁-C₁₂ alkyl group, an unsubstituted C₄-C₆ aryl group, or an unsubstituted C₁-C₁₀ alkoxy group. Those skilled in the art will appreciate that many substituents can be substituted by additional substituents.

The term “substituted” as in “substituted alkyl,” means that in the group in question (e.g., the alkyl group), at least one hydrogen atom bound to a carbon atom is replaced with one or more substituent groups, such as hydroxy (—OH), alkylthio, phosphino, amido (—CON(R_A)(R_B), wherein R_A and R_B are independently hydrogen, alkyl, or aryl), amino (—N(R_A)(R_B), wherein R_A and R_B are independently hydrogen, alkyl, or aryl), halo (fluoro, chloro, bromo, or iodo), silyl, nitro (—NO₂), an ether (—OR_A wherein R_A is alkyl or aryl), an ester (—OC(O)R_A wherein R_A is alkyl or aryl), keto (—C(O)R_A wherein R_A is alkyl or aryl), heterocyclo, and the like.

When the term “substituted” introduces a list of possible substituted groups, it is intended that the term apply to every member of that group. That is, the phrase “optionally substituted alkyl or aryl” is to be interpreted as “optionally substituted alkyl or optionally substituted aryl.”

The terms “polymer,” “copolymer,” “polymerize,” “copolymerize,” and the like include not only polymers comprising two monomer residues and polymerization of two different monomers together, but also include (co)polymers comprising more than two monomer residues and polymerizing together more than two or more other monomers. For example, a polymer as disclosed herein includes a terpolymer, a tetrapolymer, polymers comprising more than four different monomers, as well as polymers comprising, consisting of, or consisting essentially of two different monomer residues. Additionally, a “polymer” as disclosed herein may also include a homopolymer, which is a polymer comprising a single type of monomer unit.

Unless specified differently, the polymers of the present disclosure may be linear, branched, crosslinked, structured, synthetic, semi-synthetic, natural, organic, inorganic, and/or functionally modified. A polymer of the present disclosure can be in the form of a solution, a dry powder, a liquid, or a dispersion, for example.

“Aqueous system” refers to any system containing one or more metal surfaces/components, which are in contact with an aqueous medium (e.g., water) on a periodic or continuous basis. Aqueous systems of the present disclosure include any system that circulates an aqueous medium or a medium including water as a component. Non-limiting examples of “aqueous systems” include cooling systems, boiler systems, heating systems, membrane systems, oil and gas systems, a petroleum well, a downhole formation, a geothermal well, a mineral washing system, a flotation and benefaction system, a papermaking system, a gas scrubber, an air washer, a continuous casting system, an air conditioning and/or refrigeration system, a water reclamation system, a water purification system, a clarification system, a municipal sewage treatment system, a municipal water treatment system, and a potable water system, and any other system that circulates or includes water.

As an illustrative example, the compositions and methods disclosed herein can be used in connection with an aqueous medium (e.g., cooling water) used for cooling various components in a data center direct to chip cooling process. Large computer systems, such as supercomputers, high-performance computing (HPC) systems, data centers, enterprise systems, and other large computer systems generate significant amounts of waste heat that may be managed with a cooling fluid. Typical liquid cooling systems for large computing systems include a closed loop that is pressurized with a cooling fluid, such as a fluid comprising water, propylene glycol, ethylene glycol, or any combination thereof. The compounds and/or compositions disclosed herein may be added to the cooling fluid to inhibit and/or reduce its propensity to cause corrosion of metal surfaces in contact with the cooling fluid.

The present disclosure provides corrosion inhibitor compounds, compositions, and methods of inhibiting corrosion. Inhibiting corrosion includes, for example, reducing corrosion, completely eliminating corrosion or prohibiting corrosion from occurring for some period of time, lowering a rate of corrosion, etc.

A composition of the present disclosure includes a corrosion inhibitor compound. The corrosion inhibitor compound may comprise, for example, a benzotriazole compound and/or a derivative thereof, a halo-benzotriazole, a imidazole compound, a benzimidazole compound, a substituted imidazole compound, a substituted benzimidazole compound, a tetrazole compound, a pyrazole compound and/or a derivative thereof, a pyrimidine compound and/or a derivative thereof, and any combination thereof

The compound containing the benzotriazole group is not particularly limited. In an illustrative, non-limiting embodiment, the compound comprises a halo-benzotriazole.

The halo-benzotriazoles disclosed herein may comprise any halogen element or combination of halogen elements, such as chloro-, fluoro-, bromo- and iodo-, in addition to halo-alkyl (trifluoromethyl) benzotriazoles. Illustrative, non-limiting examples include chloro-tolyltriazole and bromo-tolyltriazole. The azole may comprise, for example, tolyltriazole, benzotriazole, butylbenzotriazole, mercaptobenzothiazole, etc.

As an additional, non-limiting example, the benzotriazole compound comprises:

or a salt thereof.

The “X” and “Y” variables may be the same or they may be different. The X and Y variables may be independently selected from hydrogen, C₁-C₁₆ alkyl (e.g., C₁-C₁₂, C₁-C₁₀, C₁-C₇, C₁-C₄, C₄-C₁₆, C₈-C₁₆, C₁₂-C₁₆ alkyl), aryl, C₂-C₁₆ alkenyl (e.g., C₂-C₁₂, C₂-C₁₀, C₂-C₇, C₂-C₄, C₄-C₁₆, C₈-C₁₆, C₁₂-C₁₆ alkenyl), C₂-C₁₆ alkynyl (e.g., C₂-C₁₂, C₂-C₁₀, C₂-C₇, C₂-C₄, C₄-C₁₆, C₈-C₁₆, C₁₂-C₁₆ alkynyl), heteroaryl, C₃-C₈ cycloalkyl (e.g., C₃-C₆, C₃-C₅, C₃-C₄, C₄-C₈, C₅-C₈, C₆-C₈, C₄-C₆ cycloalkyl), benzyl, alkylheteroaryl, halogen, halosubstituted alkyl, amino, aminoalkyl, cyano, alkoxy, hydroxyl, thiol, alkylthio, carbonyl, nitro, phosphoryl, phosphonyl, and sulfonyl.

Each of R¹ and R² may be the same or different and may be independently selected from hydrogen, deuterium, C₁-C₁₆ alkyl (e.g., C₁-C₁₂, C₁-C₁₀, C₁-C₇, C₁-C₄, C₄-C₁₆, C₈-C₁₆, C₁₂-C₁₆ alkyl), aryl, C₂-C₁₆ alkenyl (e.g., C₂-C₁₂, C₂-C₁₀, C₂-C₇, C₂-C₄, C₄-C₁₆, C₈-C₁₆, C₁₂-C₁₆ alkenyl), C₂-C₁₆ alkynyl (e.g., C₂-C₁₂, C₂-C₁₀, C₂-C₇, C₂-C₄, C₄-C₁₆, C₈-C₁₆, C₁₂-C₁₆ alkynyl), heteroaryl, C₃-C₈ cycloalkyl (e.g., C₃-C₇, C₃-C₆, C₃-C₅, C₃-C₄, C₄-C₈, C₅-C₈, C₆-C₈ cycloalkyl), benzyl, alkylheteroaryl, halogen, hydroxyl, and carbonyl.

The “m” variable may be, for example, 1, 2, 3, or 4, and the “n” variable may be, for example, 1, 2, or 3.

In some embodiments, the benzotriazole compound comprises:

or any combination thereof.

The “R” variable may be, for example, a linear or branched C₁-C₁₀ alkyl group, such as a C₁-C₈, C₁-C₆, C₁-C₄, C₁-C₂, C₃-C₁₀, C₅-C₁₀, C₇-C₁₀ alkyl group.

A corrosion inhibitor of the present disclosure may comprise, for example, a pyrimidine derivative, such as a compound comprising a pyrimidine group and/or a modified pyrimidine group. In an illustrative embodiment, the pyrimidine derivative comprises:

or a salt thereof.

In the foregoing formula, X is selected from the group consisting of —NH₂, —OH, —SH, and halogen;

• • Y is selected from the group consisting of H, aryl, heteroaryl, C₁-C₁₆ alkyl, C₂-C₁₆ alkenyl, C₂-C₁₆ alkynyl, C₃-C₈ cycloalkyl, benzyl, alkylheteroaryl, halogen, halosubstituted alkyl, amino, aminoalkyl, cyano, alkoxy, hydroxyl, thiol, alkythio, carbonyl, nitro, phosphoryl, and sulfonyl;
  • R₁ is selected from the group consisting of hydrogen, deuterium, C₁-C₁₆ alkyl, aryl, C₂-C₁₆ alkenyl, C₂-C₁₆ alkynyl, heteroaryl, C₃-C₈ cycloalkyl, benzyl, alkylheteroaryl, halogen, hydroxyl, and carbonyl; and
  • R₂ is selected from the group consisting of hydrogen, aryl, heteroaryl, benzyl, alkylheteroaryl, C₂-C₁₆ alkenyl, C₂-C₁₆ alkynyl, C₃-C₈ cycloalkyl, and C₁-C₁₆ alkyl; or a salt thereof;
  • with the proviso that when X is NH₂ and R¹ and R² are hydrogen, Y is not hydrogen.

Additional, illustrative examples include:

In certain embodiments, the corrosion inhibitor comprising the tetrazole comprises the following formula:

or a salt thereof.

The R¹ and R² variables may each be independently selected from the group consisting of hydrogen, alkyl, alkenyl, alkynyl, aryl, arylalkyl, arylalkenyl, arylalkynyl, heteroaryl, heteroarylalkyl, heteroarylalkenyl, heteroarylalkynyl, heterocyclyl, heterocyclylalkyl, heterocyclylalkenyl, heterocyclylalkynyl, cycloalkyl, cycloalkylalkyl, cycloalkylalkenyl, and cycloalkylalkynyl.

The number of carbon atoms present in any of the foregoing groups is not particularly limited. For example, if the R¹ and/or R² variable comprises an alkyl, alkenyl, and/or alkynyl group, it may comprise a C₁-C₃₀, C₁-C₂₅, C₁-C₂₀, C₁-C₁₅, C₁-C₁₀, C₁-C₅, C₁-C₃, C₅-C₃₀, C₁₀-C₃₀, C₁₅-C₃₀, C₂₀-C₃₀, or a C₂₅-C₃₀ alkyl, alkenyl, and/or alkynyl group.

Corrosion inhibitors of the present disclosure may also comprise imidazoles and/or benzimidazoles.

For example, a corrosion inhibitor of the present disclosure may comprise one or more compounds of the following structure:

• • wherein each X is the same or different, and is selected from the group consisting of hydrogen, C₁-C₁₆ alkyl, aryl, C₂-C₁₆ alkenyl, C₂-C₁₆ alkynyl, heteroaryl, C₃-C₈ cycloalkyl, benzyl, alkylheteroaryl, halogen, halosubstituted alkyl, amino, aminoalkyl, cyano, alkoxy, hydroxyl, thiol, alkylthio, carbonyl, nitro, phosphoryl, phosphonyl, and sulfonyl;
  • Y is selected from the group consisting of hydroxyl, halogen, oxo, alkoxy, thiol, alkylthio, amino, hydrogen, and aminoalkyl;
  • Z is selected from the group consisting of C and nitrogen;
  • R¹ is selected from the group consisting of hydrogen, deuterium, C₁-C₁₆ alkyl, aryl, C₂-C₁₆ alkenyl, C₂-C₁₆ alkynyl, heteroaryl, C₃-C₈ cycloalkyl, benzyl, alkylheteroaryl, halogen, hydroxyl, and carbonyl;
  • R² and R³ are selected from the group consisting of hydrogen, halogen, hydroxyl, aryl, phenyl, heteroaryl, benzyl, alkylheteroaryl, carbonyl, C₂-C₁₆ alkenyl, C₂-C₁₆ alkynyl, C₃-C₈ cycloalkyl, and C₁-C₁₆ alkyl; and
  • m is 1, 2, 3, or 4; or a salt thereof.

The X substituent or substituents as shown can occupy any available position on the imidazole or benzimidazole ring. Thus, in certain embodiments, the X substituent or substituents can be located at the 4-position, 5-position, 6-position, and/or 7-position of the benzimidazole. In certain preferred embodiments, the X substituent is at the 5-position. The X substituent or substituents as shown can occupy any available position on the imidazole ring. Thus, in certain embodiments, the X substituent or substituents can be located at the 4-position and/or 5-position of the imidazole.

As disclosed above, m can be 1, 2, 3, or 4. If m is 2, 3, or 4, the X substituents can occupy any open position and can be positioned ortho-, meta-, or para- to each other.

In certain embodiments, X is electron-rich or a C₁-C₁₆ alkyl group.

In certain embodiments, X is hydrogen, a C₁-C₁₆ alkyl group, and/or methyl.

In certain embodiments, Y is hydroxyl.

In certain embodiments, R¹ is hydrogen.

In certain embodiments, R² is aryl or heteroaryl.

In certain embodiments, R² is phenyl.

In certain embodiments, Y is not present when Z is nitrogen.

In certain embodiments, the compound comprises:

wherein X_m is the same as disclosed above.

In certain embodiments, the compound comprises:

In certain embodiments, the compound comprises:

wherein X is the same as defined above and m and n are independently selected from 1, 2, 3, or 4.

In certain embodiments, the compound comprises:

wherein X is the same as defined above.

For example, the compound may comprise the following structure:

In certain embodiments, the compound comprises:

wherein Ar is aryl, Me is methyl, and X_m is as defined above.

In certain embodiments, the compound is a chloride salt, bromide salt, iodide salt, sulfate salt, fluoride salt, perchlorate salt, acetate salt, trifluoroacetate salt, phosphate salt, nitrate salt, carbonate salt, bicarbonate salt, formate salt, chlorate salt, bromated salt, chlorite salt, thiosulfate salt, oxalate salt, cyanide salt, cyanate salt, tetrafluoroborate salt, and the like. In certain embodiments, the compound is a hydrochloride or a sulfate salt.

In certain embodiments, R¹ in the compounds above may be hydrogen. While not wishing to be bound by any particular theory, it is postulated that when R¹ is hydrogen, hydrogen-bonding can occur between molecules when added to an aqueous system in contact with a metal surface, thereby resulting in enhanced strength of the corrosion inhibitor protective film on the metal surface. Moreover, compounds having R¹ as hydrogen generally have increased water solubility.

In certain embodiments, X is an electron-rich group or an alkyl group. While not wishing to be bound by any particular theory, it is postulated that when X is more electron-rich, the nitrogen atoms in the imidazole ring may have increased electron density. It is believed that nitrogen atoms having a greater electron density will have stronger coordination with the metal surface of the aqueous system, resulting in a stronger protective film. However, in certain embodiments, X is electron-deficient.

The compounds can be a single enantiomer (i.e., (R)-isomer or (S)-isomer), a racemate, or a mixture of enantiomers at any ratio.

An imidazole of the present disclosure may also comprise:

wherein each of X and Y is the same or different, and is selected from the group consisting of hydrogen, C₁-C₁l alkyl, aryl, C₂-C₁₆ alkenyl, C₂-C₁₆ alkynyl, heteroaryl, C₃-C₅ cycloalkyl, benzyl, alkylheteroaryl, halogen, halosubstituted alkyl, amino, aminoalkyl, cyano, alkoxy, hydroxyl, thiol, alkylthio, carbonyl, nitro, phosphoryl, phosphonyl, and sulfonyl; R is selected from the group consisting of hydrogen, deuterium, C₁-C₁₆ alkyl, aryl, C₂-C₁₆ alkenyl, C₂-C₁₆ alkynyl, heteroaryl, C₃-C₈ cycloalkyl, benzyl, alkylheteroaryl, halogen, hydroxyl, and carbonyl; m is 1, 2, 3, or 4; and n is 1, 2, 3, or 4; or a salt thereof. The X substituent or substituents as shown can occupy any available position on the benzimidazole ring. Thus, in certain embodiments, the X substituent or substituents can be located at the 4-position, 5-position, 6-position, and/or 7-position of the benzimidazole. In certain preferred embodiments, the X substituent is at the 5-position. The X substituent or substituents as shown can occupy any available position on the imidazole ring. Thus, in certain embodiments, the X substituent or substituents can be located at the 4-position and/or 5-position of the imidazole.

The Y substituent or substituents as shown can occupy any available position on the pyridyl ring. Thus, in certain embodiments, the Y substituent or substituents can be located at the 2′-position, 3′-position, 4′-position, 5′-position, and/or 6′-position of the pyridyl ring.

As disclosed above, m can be 1, 2, 3, or 4. If m is 2, 3, or 4, the X substituents can occupy any open position and can be positioned ortho-, meta-, or para- to each other.

As disclosed above, n can be 1, 2, 3, or 4. If n is 2, 3, or 4, the Y substituents can occupy any open position and can be positioned ortho-, meta-, or para- to each other.

In certain embodiments, X and Y are individually chosen electron-rich or a C₁-C₁₆alkyl group.

In certain embodiments, R is hydrogen.

In certain embodiments, X is C₁-C₁₆alkyl and Y is hydrogen.

In certain embodiments, X and Y are hydrogen.

In certain embodiments, X is methyl, Y is hydrogen, m is 1, and n is 1.

In certain embodiments, the imidazole or benzimidazole is located at the 2′-position of the pyridyl ring.

In certain embodiments, the compound comprises:

wherein X_m is the same as disclosed above,

In certain embodiments, a compound of formula (II) is a chloride salt, bromide salt, iodide salt, sulfate salt, fluoride salt, perchlorate salt, acetate salt, trifluoroacetate salt, phosphate salt, nitrate salt, carbonate salt, bicarbonate salt, formate salt, chlorate salt, bromated salt, chlorite salt, thiosulfate salt, oxalate salt, cyanide salt, cyanate salt, tetrafluoroborate salt, and the like. In certain preferred embodiments, a compound of formula (II) is a hydrochloride or sulfate salt.

In certain preferred embodiments, R is hydrogen. While not wishing to be bound by any particular theory, it is postulated that when R is hydrogen, hydrogen-bonding can occur between molecules when added to an aqueous system in contact with a metal surface, thereby resulting in enhanced strength of the corrosion inhibitor protective film on the metal surface. Moreover, compounds of formula (II) where R is hydrogen generally have increased water solubility.

In certain preferred embodiments, X and/or Y is an electron-rich group or an alkyl group. While not wishing to be bound by any particular theory, it is postulated that when X or Y is more electron-rich, the nitrogen atoms in the imidazole ring may have increased electron density. It is believed that nitrogen atoms having a greater electron density will have stronger coordination with the metal surface of the aqueous system, resulting in a stronger protective film. However, in certain embodiments, X and/or Y is electron-deficient.

In an illustrative embodiment, the corrosion inhibitor composition comprises 2-(alpha-hydroxybenzyl)benzimidazole. In certain embodiments, the corrosion inhibitor composition excludes an azole.

A pyrazole compound of the present disclosure may include, for example:

In the structure above, X is selected from the group consisting of —OH, —NH₂, —SH, and halogen; Y is selected from the group consisting of —CR⁴ and nitrogen; R¹ and R² form a six-membered aromatic ring, or each of R¹ and R² is the same or different and independently selected from the group consisting of hydrogen, aryl, heteroaryl, C₁-C₁₆ alkyl, C₂-C₁₆ alkenyl, C₂-C₁₆ alkynyl, C₃-C₈ cycloalkyl, benzyl, alkylheteroaryl, halogen, halosubstituted alkyl, amino, aminoalkyl, cyano, hydroxyl, alkoxy, thiol, alkylthio, carbonyl, nitro, phosphoryl, phosphonyl, and sulfonyl; R³ is selected from the group consisting of hydrogen, aryl, heteroaryl, C₁-C₁₆ alkyl, C₂-C₁₆ alkenyl, C₂-C₁₆ alkynyl, C₃-C₈ cycloalkyl, benzyl, alkylheteroaryl, halogen, halosubstituted alkyl, amino, aminoalkyl, cyano, hydroxyl, alkoxy, thiol, alkylthio, carbonyl, nitro, phosphoryl, phosphonyl, and sulfonyl;

• • R⁴ is selected from the group consisting of hydrogen, aryl, heteroaryl, C₁-C₁₆ alkyl, C₂-C₁₆ alkenyl, C₂-C₁₆ alkynyl, C₃-C₈ cycloalkyl, benzyl, alkylheteroaryl, halogen, halosubstituted alkyl, amino, aminoalkyl, cyano, hydroxyl, alkoxy, thiol, alkylthio, carbonyl, nitro, phosphoryl, phosphonyl, and sulfonyl; and m is an integer from 1 to 9, such as 2, 3, 4, 5, 6, 7, or 8; or
  • a salt thereof.

In certain embodiments, R¹ and R² are hydrogen.

In certain embodiments, R³ is hydrogen.

In certain embodiments, R³ is methyl.

In certain embodiments, R³ is phenyl.

In certain embodiments, R¹ is methyl and Y is —CR⁴, where R⁴ is methyl.

In certain embodiments, R¹ is methyl and R² is hydrogen.

In certain embodiments, m is 1.

In certain embodiments, the compound comprises

In certain embodiments, the compound comprises:

wherein Me is methyl.

Additionally, a pyrazole compound of the present disclosure may include, for example:

Each of R¹, R², and R³ is the same or different and may be independently selected from the group consisting of hydrogen, aryl, heteroaryl, C₁-C₁₆ alkyl, C₂-C₁₆ alkenyl, C₂-C₁₆ alkynyl, C₃-C₈ cycloalkyl, benzyl, alkylheteroaryl, halogen, halosubstituted alkyl, amino, aminoalkyl, cyano, hydroxyl, alkoxy, thiol, alkylthio, carbonyl, nitro, phosphoryl, phosphonyl, and sulfonyl; and R⁴ is selected from the group consisting of hydrogen, deuterium, C₁-C₁₆ alkyl, aryl, C₂-C₁₆ alkenyl, C₂-C₁₆ alkynyl, heteroaryl, C₃-C₈ cycloalkyl, benzyl, alkylheteroaryl, halogen, hydroxyl, and carbonyl; or a salt thereof.

The amount of corrosion inhibitor compound in a composition of the present disclosure is not particularly limited. For example, a composition of the present disclosure may comprise from about 1 wt. % to about 100 wt. % of the corrosion inhibitor, such as about 5 wt. % to about 100 wt. %, about 10 wt. % to about 100 wt. %, about 15 wt. % to about 100 wt. %, about 20 wt. % to about 100 wt. %, about 25 wt. % to about 100 wt. %, about 30 wt. % to about 100 wt. %, about 35 wt. % to about 100 wt. %, about 40 wt. % to about 100 wt. %, about 45 wt. % to about 100 wt. %, about 50 wt. % to about 100 wt. %, about 55 wt. % to about 100 wt. %, about 60 wt. % to about 100 wt. %, about 65 wt. % to about 100 wt. %, about 70 wt. % to about 100 wt. %, about 75 wt. % to about 100 wt. %, about 80 wt. % to about 100 wt. %, about 85 wt. % to about 100 wt. %, about 90 wt. % to about 100 wt. %, about 1 wt. % to about 95 wt. %, about 1 wt. % to about 90 wt. %, about 1 wt. % to about 85 wt. %, about 1 wt. % to about 80 wt. %, about 1 wt. % to about 75 wt. %, about 1 wt. % to about 70 wt. %, about 1 wt. % to about 65 wt. %, about 1 wt. % to about 60 wt. %, about 1 wt. % to about 55 wt. %, about 1 wt. % to about 50 wt. %, about 1 wt. % to about 45 wt. %, about 1 wt. % to about 40 wt. %, about 1 wt. % to about 35 wt. %, about 1 wt. % to about 30 wt. %, about 1 wt. % to about 25 wt. %, about 1 wt. % to about 20 wt. %, about 1 wt. % to about 15 wt. %, or about 1 wt. % to about 10 wt. %.

The compositions of the present disclosure may include (or exclude) one or more additional components (other than the corrosion inhibitor compound) and/or one or more additional components may be added to the medium and/or metal surface before, after, and/or with a composition of the present disclosure.

Illustrative, non-limiting examples of additional components include a fouling control agent, an additional corrosion inhibitor, a corrosion inhibitor intensifier, a biocide, a preservative, an acid, an anti-emulsifier, an iron chelating agent, a surfactant, a scale inhibitor, a pH modifier (e.g., trisodium phosphate, sodium borate, sodium carbonate, etc.), an emulsion breaker, a reverse emulsion breaker, a coagulant, a flocculant, a water clarifier, a dispersant, an antioxidant, a polymer degradation prevention agent, a permeability modifier, an antifoaming agent, a CO₂ scavenger, an O₂ scavenger, a friction reducing agent, a salt, a bactericide, a salt substitute, a relative permeability modifier, a breaker, a fluid loss control additive, an iron control agent, a flow improver, a viscosity reducer, or any combination thereof.

A biocide may include, for example, glutaraldehyde, tetrakis(hydroxymethyl)phosphonium sulphate, a quaternary ammonium compound, chlorine, hypochlorite, ClO₂, bromine, ozone, hydrogen peroxide, peracetic acid, peroxycarboxylic acid, peroxysulphate, dibromonitrilopropionamide, isothiazolone, terbutylazine, polymeric biguanide, methylene bisthiocyanate, and any combination thereof.

A scale inhibitor may include, for example, a phosphonate, a sulfonate, a phosphate, a phosphate ester, a polymer comprising a phosphonate or phosphonate ester group, a polymeric organic acid, a peroxycarboxylic acid, and any combination thereof. In some embodiments, the scale inhibitor may be selected from a compound comprising an amine and/or a quaternary amine, nitrilotriacetic acid (NTA), ethylenediaminetetraacetic acid (EDTA), DETA phosphonate, and any combination thereof.

In some embodiments, the scale inhibitor is an acid-based scale inhibitor, such as phosphonic acid. In some embodiments, the scale inhibitor comprises an anionic group. The anionic group may comprise, for example, a carboxylate group or a sulfate group. In some embodiments, the scale inhibitor may include a phosphorous atom, a phosphorous-oxygen double bond, and/or a phosphono group.

In some embodiments, the scale inhibitor is selected from the group consisting of hexamethylene diamine tetrakis (methylene phosphonic acid), diethylene triamine tetra (methylene phosphonic acid), diethylene triamine penta (methylene phosphonic acid), polyacrylic acid (PAA), phosphino carboxylic acid (PPCA), diglycol amine phosphonate (DGA phosphonate), 1-hydroxyethylidene 1,1-diphosphonate (HEDP phosphonate), bisaminoethylether phosphonate (BAEE phosphonate), 2-acrylamido-2-methyl-1-propanesulphonic acid (AMPS), and any combination thereof.

In certain embodiments, the scale inhibitor is a polymer comprising an anionic monomer. The anionic monomer may be selected from, for example, acrylic acid, methacrylic acid, vinyl sulfonic acid, vinyl phosphonic acid, maleic anhydride, itaconic acid, crotonic acid, maleic acid, fumaric acid, styrene sulfonic acid, and any combination thereof.

The fouling control agent may comprise, for example, a quaternary compound.

The acid may comprise, for example, hydrochloric acid, hydrofluoric acid, citric acid, formic acid, acetic acid, or any combination thereof.

The additional corrosion inhibitor may comprise, for example, an imidazoline compound, a pyridinium compound, a quaternary ammonium compound, a phosphate ester, an amine, an amide, a carboxylic acid, a thiol, and any combination thereof.

The surfactant may be non-ionic, cationic, anionic, amphoteric, or zwitterionic.

If a composition of the present disclosure comprises the additional component, the composition may comprise from, for example, about 0.1 wt. % to about 25 wt. % of the component, such as from about 0.1 wt. % to about 20 wt. %, about 0.1 wt. % to about 15 wt. %, about 0.1 wt. % to about 10 wt. %, about 0.1 wt. % to about 5 wt. %, about 1 wt. % to about 5 wt. %, about 1 wt. % to about 10 wt. %, about 1 wt. % to about 15 wt. %, about 5 wt. % to about 15 wt. %, or about 5 wt. % to about 20 wt. %.

The additional component may be added to the medium before, after, and/or with the corrosion inhibitor compound. The amount of additional component (and/or corrosion inhibitor compound) added to the medium is not particularly limited. For example, from about 1 ppm to about 5,000 ppm of the additional component may be added to the medium, such as about 1 ppm to about 2,500 ppm, about 1 ppm to about 2,000 ppm, about 1 ppm to about 1,500 ppm, about 1 ppm to about 1,000 ppm, about 1 ppm to about 750 ppm, about 1 ppm to about 500 ppm, about 1 ppm to about 250 ppm, about 1 ppm to about 100 ppm, about 1 ppm to about 50 ppm, about 1 ppm to about 25 ppm, about 1 ppm to about 15 ppm, about 1 ppm to about 10 ppm, about 1 ppm to about 5 ppm, about 10 ppm to about 2,500 ppm, about 25 ppm to about 1,500 ppm, about 25 ppm to about 1,000 ppm, or about 25 ppm to about 500 ppm.

A composition of the present disclosure may comprise a solvent. The solvent is not particularly limited and may comprise, for example, water, an alcohol, a hydrocarbon, a ketone, an ether, an aromatic, an amide, a nitrile, a sulfoxide, an ester, a glycol ether, and any combination thereof.

The amount of solvent in the composition is not particularly limited. For example, a composition of the present disclosure may comprise from about 1 wt. % to about 99 wt. % of the solvent, such as about 5 wt. % to about 99 wt. %, about 10 wt. % to about 99 wt. %, about 15 wt. % to about 99 wt. %, about 20 wt. % to about 99 wt. %, about 25 wt. % to about 99 wt. %, about 30 wt. % to about 99 wt. %, about 35 wt. % to about 99 wt. %, about 40 wt. % to about 99 wt. %, about 45 wt. % to about 99 wt. %, about 50 wt. % to about 99 wt. %, about 55 wt. % to about 99 wt. %, about 60 wt. % to about 99 wt. %, about 65 wt. % to about 99 wt. %, about 70 wt. % to about 99 wt. %, about 75 wt. % to about 99 wt. %, about 80 wt. % to about 99 wt. %, about 85 wt. % to about 99 wt. %, about 90 wt. % to about 99 wt. %, about 1 wt. % to about 95 wt. %, about 1 wt. % to about 90 wt. %, about 1 wt. % to about 85 wt. %, about 1 wt. % to about 80 wt. %, about 1 wt. % to about 75 wt. %, about 1 wt. % to about 70 wt. %, about 1 wt. % to about 65 wt. %, about 1 wt. % to about 60 wt. %, about 1 wt. % to about 55 wt. %, about 1 wt. % to about 50 wt. %, about 1 wt. % to about 45 wt. %, about 1 wt. % to about 40 wt. %, about 1 wt. % to about 35 wt. %, about 1 wt. % to about 30 wt. %, about 1 wt. % to about 25 wt. %, about 1 wt. % to about 20 wt. %, about 1 wt. % to about 15 wt. %, or about 1 wt. % to about 10 wt. %.

Any medium and/or composition of the present disclosure may also comprise an oxidizing agent. In some embodiments, an oxidizing agent may be added to the medium.

The oxidizing agent may be selected from, for example, hypochlorite bleach, chlorine, bromine, a hypochlorite (such as lithium hypochlorite, sodium hypochlorite, calcium hypochlorite, etc.), a hypobromite (lithium hypobromite, sodium hypobromite, calcium hypocbromite, etc.) chlorine dioxide, iodine/hypoiodous acid, hypobromous acid, a halogenated hydantoin, trichloroisocyanuric acid, dichloroisocyanuric acid, ozone, a peroxide, a persulfate, a permanganate, a percarboxylic acid (e.g., a peroxyformic acid, a peracetic acid, a peroxypropionic acid, a peroxybutyric acid, a peroxyoctanoic acid), a percarbonate, and any combination thereof.

In some embodiments, the oxidizing agent is a non-halogen-containing oxidizing agent, such as ozone, a peroxide, a persulfate, a permanganate, a percarboxylic acid (e.g., a peroxyformic acid, a peracetic acid, a peroxypropionic acid, a peroxybutyric acid, a peroxyoctanoic acid), a percarbonate, and any combination thereof.

The corrosion inhibitors of the present disclosure have been carefully selected to ensure that they overcome the negative effects of oxidizing agents. For example, any oxidizing agent/biocide in the medium with the corrosion inhibitor does not react with and/or negatively impact the ability of the corrosion inhibitor to inhibit corrosion of metal surfaces in contact with the medium. The corrosion inhibitors are capable of achieving enhanced corrosion control performance without compromising the intended function of the oxidizing agents (e.g., microbiological control) that may be present in the same medium.

The methods, compounds, and compositions disclosed herein may be used in any aqueous systems where corrosion inhibition is desired. In illustrative, non-limiting embodiments, the compositions, compounds, and methods of the present disclosure may be used to inhibit corrosion of a metal surface in contact with an aqueous medium (e.g., cooling water) used for cooling various components in a data center direct to chip cooling process.

Illustrative, non-limiting examples of components that may be cooled with an aqueous medium of the present disclosure include a compute blade, a computing device, a processor, a microchip, a graphical processing unit, an application specific integrated circuit, a server, a node, . . . and any combination thereof.

In operation, a supply conduit transports the aqueous medium to the component and a return conduit transports the aqueous medium from the component. As the aqueous medium passes by the component, it absorbs heat generated from the component. Then, the aqueous medium is cooled in a heat exchanger and recirculated to the component for additional cooling. As is more fully described below, the supply conduit and/or the return conduit may comprise a liquid monitoring system. The liquid monitoring system may comprise a controller and one or more sensors in communication with the controller. The sensor measures a property of the aqueous medium. Illustrative, non-limiting examples of sensors include turbidity, oxidation-reduction potential (ORP), microbiological concentration, pH, propylene glycol concentration, ethylene glycol concentration, conductivity, fluorescence, color, dissolved oxygen content, flow rate, pressure, oxidizing agent concentration, corrosion inhibitor concentration, and any combination thereof.

Certain methods disclosed herein comprise adding a composition and/or compound to an aqueous medium in contact with a metal surface. Alternatively and/or additionally, the methods disclosed herein may comprise applying the composition and/or compound directly to the metal surface as opposed to, for example, adding to a liquid medium in contact with the metal surface. In some embodiments, the composition and/or compound may be applied to the interior wall of a conduit when the interior wall is dry or substantially dry.

Various methods disclosed herein may be implemented, in some cases, in hardware, firmware, software, or any combination thereof. The disclosed embodiments may also be implemented as instructions carried by or stored on one or more transitory or non-transitory machine-readable (e.g., computer-readable) storage media, which may be read and executed by one or more processors. A machine-readable storage medium may be embodied as any storage device, mechanism, or other physical structure for storing or transmitting information in a form readable by a machine (e.g., a volatile or non-volatile memory, a media disc, or other media device).

A computing system with liquid cooling may include a computing blade enclosure that includes multiple compute blades. The system may include any appropriate chassis, rack, frame, or other enclosure configured to support multiple compute blades or other high-density computing devices. The system may include one or multiple blade enclosures that may be arranged in rows or otherwise combined to form a high-performance computing (HPC) system, supercomputer, computing cluster, data center, server farm, or other computing system that includes liquid-cooled computing units.

Each of the compute blades may be embodied as individual computing devices, servers, nodes, or other heat-generating computing devices. The blade enclosure includes a number of bays or slots of standardized dimensions, and each compute blade may have a standard size and/or other standardized physical characteristics such that each compute blade may be received in a corresponding bay or slot of the blade enclosure. In some embodiments, the bays or slots may have a height or other dimension that is smaller than a typical “1 U” rack height, allowing the blade enclosure to support high compute density.

The blade enclosure further includes a supply manifold and a return manifold, which are configured to distribute coolant (e.g., cooling liquid, such as water or a water/propylene glycol mixture) to the compute blades (and/or other components) and to collect the coolant from the compute blades (and/or other components). The blade enclosure may further include power, networking, and/or other connections or components configured to support operations of the compute blades.

The blade enclosure is coupled to a one or more cooling distribution unit (CDU) via a technology cooling system (TCS), also called a secondary coolant loop. TCS may be embodied as one or more pipes or other liquid conduits capable of transferring coolant from the CDU to the blade enclosure and back. The CDU includes a heat exchanger configured to extract heat from the TCS. The CDU may also include one or more additional components configured to support circulating coolant to the blade enclosure, such as pumps, thermostats, filters, and/or other components.

The CDU is coupled to a facility water system (FWS) via a primary loop. The primary loop may be embodied as one or more pipes or other liquid conduits capable of transferring facility water or other coolant between the FWS and the CDU. The FWS is illustratively coupled to a cooling tower, which rejects heat from the FWS to the environment. Additionally, the FWS may include and/or be coupled to one or more additional components to support rejecting heat, such as one or more chillers, additional liquid loops, thermostats, condensers, and/or other components.

In use, the CDU supplies cool coolant to the blade enclosure via the TCS. The coolant may be maintained at an appropriate temperature, such as a temperature above a dew point at the location of the blade enclosure in order to avoid condensation or other issues. The coolant is distributed through the supply manifold to the compute blades. In each of the compute blades, the coolant flows through one or more cold plates, water blocks, or other cooling components coupled to processors, graphical processing units (GPUs), application specific integrated circuits (ASICs), or other heat-generating components of the compute blades. Warm coolant from the compute blades is collected by the return manifold and returned to the CDU. Heat from the warm coolant is transferred to the FWS using the heat exchanger, and then this heat is rejected to the environment using the cooling tower.

The system may include one or more blade enclosures and one or more CDUs. Additionally, in some embodiments, the CDU may use a different technique to cool the coolant in the TCS. For example, in some embodiments, the CDU may be air-cooled and may not require a connection to the facility primary loop.

With reference to FIG. 1, a computing system 100 with liquid cooling includes a computing blade enclosure 102 that includes multiple compute blades 120. Although illustrated as including a blade enclosure 102, it should be understood that the system 100 may include any appropriate chassis, rack, frame, or other enclosure configured to support multiple compute blades 120 or other high-density computing devices. Additionally, although illustrated as including a single blade enclosure 102, it should be understood that the system 100 may include multiple blade enclosures 102 which may be arranged in rows or otherwise combined to form a high-performance computing (HPC) system, supercomputer, computing cluster, data center, server farm, or other computing system that includes liquid-cooled computing units.

Each of the compute blades 120 may be embodied as individual computing devices, servers, nodes, or other heat-generating computing devices. The blade enclosure 102 includes a number of bays or slots of standardized dimensions, and each compute blade 120 may have a standard size and/or other standardized physical characteristics such that each compute blade 120 may be received in a corresponding bay or slot of the blade enclosure 102. In some embodiments, the bays or slots may have a height or other dimension that is smaller than a typical “1 U” rack height, allowing the blade enclosure 102 to support high compute density.

The blade enclosure 102 further includes a supply manifold 122 and a return manifold 124, which are configured to distribute coolant (e.g., cooling liquid, such as water or a water/propylene glycol mixture) to the compute blades 120 and to collect the coolant from the compute blades 120. The blade enclosure 102 may further include power, networking, and/or other connections or components configured to support operations of the compute blades 120.

As shown, the blade enclosure 102 is coupled to one or more cooling distribution units (CDU) 104 via a technology cooling system (TCS) 108, also called a secondary coolant loop 108. TCS 108 may be embodied as one or more pipes or other liquid conduits capable of transferring coolant from the CDU 104 to the blade enclosure 102 and back. The CDU 104 includes a heat exchanger 140 configured to extract heat from the TCS 108. The CDU 104 may also include one or more additional components configured to support circulating coolant to the blade enclosure 102, such as pumps, thermostats, filters, and/or other components.

The CDU 104 is coupled to a facility water system (FWS) 106 via a primary loop 110. The primary loop 110 may be embodied as one or more pipes or other liquid conduits capable of transferring facility water or other coolant between the FWS 106 and the CDU 104. The FWS 106 is illustratively coupled to a cooling tower 160, which rejects heat from the FWS 106 to the environment. Additionally, the FWS 106 may include and/or be coupled to one or more additional components to support rejecting heat, such as one or more chillers, additional liquid loops, thermostats, condensers, and/or other components.

In use, the CDU 104 supplies cool coolant to the blade enclosure 102 via the TCS 108. The coolant may be maintained at an appropriate temperature, such as a temperature above a dew point at the location of the blade enclosure 102 in order to avoid condensation or other issues. The coolant is distributed through the supply manifold 122 to the compute blades 120. In each of the compute blades 120, the coolant flows through one or more cold plates, water blocks, or other cooling components coupled to processors, graphical processing units (GPUs), application specific integrated circuits (ASICs), or other heat-generating components of the compute blades 120. Warm coolant from the compute blades 120 is collected by the return manifold 124 and returned to the CDU 104. Heat from the warm coolant is transferred to the FWS 106 using the heat exchanger 140, and then this heat is rejected to the environment using the cooling tower 160.

Although illustrated as including a single blade enclosure 102 and CDU 104, it should be understood that in some embodiments, the system 100 may include multiple blade enclosures 102 and CDUs 104. Additionally, in some embodiments, the CDU 104 may use a different technique to cool the coolant in the TCS 108. For example, in some embodiments, the CDU 104 may be air-cooled and may not require a connection to the facility primary loop 110.

Referring now to FIG. 2, a system 200 for liquid coolant (e.g., aqueous medium) monitoring for a liquid cooled computing system includes a blade enclosure 102, CDU 104, and FWS 106. It is to be understood that in this embodiment or in any embodiment disclosed in the present application, the CDU may be replaced with a heat exchanger. Additionally, the system 200 includes a liquid monitoring and controlling system 202 that is coupled to the secondary loop 108 between the CDU 104 and the blade enclosure 102. The liquid monitoring and controlling system 202 includes an internal liquid conduit 204 that extends between an inlet 206 and an outlet 208. As shown, the inlet 206 is coupled to the CDU 104 via the TCS 108, and the outlet 208 is coupled to the inlet manifold 122 of the blade enclosure 102 via the TCS 108. Thus, coolant provided by the CDU 104 passes through the conduit 204 of the liquid monitoring system 202 before being provided to the blade enclosure 102. It should be understood that in other embodiments, the liquid monitoring and controlling system 202 may be coupled to the system 200 in one or more other configurations. For example, in an embodiment, the liquid monitoring and controlling system 202 may be coupled to the return leg of the TCS 108 (i.e., coupled between the return manifold 124 of the blade enclosure 102 and the CDU 104). As another example, in an embodiment with multiple blade enclosures 102, the liquid monitoring and controlling system 202 may be coupled between blade enclosures 102.

The liquid monitoring and controlling system 202 further includes one or more sensors 210 that are each coupled to the conduit 204. Illustratively, the liquid monitoring and controlling system 202 includes three sensors 210a, 210b, 210c, however, in other embodiments, the system 202 may include a different number of sensors 210, such as one, two, four, five, six, seven, eight, nine, ten, or more. Each of the sensors 210 may be embodied as any electronic sensor capable of monitoring or otherwise measuring one or more parameters of the coolant, such as turbidity, pH, percentage propylene glycol, percentage ethylene glycol, conductivity, fluroesence, color, dissolved oxygen content, flow rate, pressure, or other parameters. Those measured parameters may be indicative of coolant health. For example, the sensors 210 may include sensor for online-refractometry to measure percentage propylene glycol. As another example, the sensors 210 may include a filter fitted with pressure sensors for measuring differential pressure across the filter as an additional data point for fluid health and particulate. As another example, the sensors 210 may measure absorbance or fluorescence to monitor pH via an indicator. As another example, the sensors 210 may measure color to determine coolant health, for example by monitoring the inherent color of the propylene glycol, color of a dye added as an inert additive, or measuring UV absorbance as a surrogate for total organic carbon (TOC). As another example, the sensors 210 may measure dissolved oxygen in the coolant, which may be indicative of glycol degradation. As another example, the sensors 210 may measure pressure and vibration, for example at a recirculation pump outlet. In some embodiments, the liquid monitoring and controlling system 202 may include additional sensors that may not be directly fluidly coupled to the conduit 204, such as leak sensors, fluid reservoir volume sensors, or other sensors.

In some embodiments, the liquid monitoring and controlling system 202 may be used to monitor treated water systems in addition to or alternatively to liquid cooling systems. In those embodiments, the liquid monitoring and controlling system 202 may include the sensors 210 described above (without the refractometer in some embodiments) along with additional sensors for microbiology sensing, oxidation-reduction potential (ORP), or other sensors for monitoring for inhibitor residuals. In some embodiments, the liquid monitoring and controlling system 202 may include sensors 210 for measuring organic and inorganic deposits or other fouling.

Each of the sensors 210 is communicatively coupled to a controller 212. The illustrative controller 212 may be embodied as any programmable logic controller, microcontroller, microprocessor, or other device capable of performing the functions described herein. To do so, the controller 212 may include a number of electronic components commonly associated with units utilized in the control of electronic and electromechanical systems. For example, the controller 212 may include, amongst other components customarily included in such devices, a processor 214 and a memory device 216. The processor 214 may be any type of device capable of executing software or firmware, such as a microcontroller, microprocessor, digital signal processor, or the like. The memory 216 may be embodied as one or more volatile and/or non-volatile memory device. The memory device 216 is provided to store, amongst other things, instructions in the form of, for example, a software routine (or routines) which, when executed by the processor 214, allows the controller 212 to monitor sensor data from the sensors 210 as described herein. The controller 212 also includes an interface circuit 218, which may be embodied as any analog and/or digital electrical circuit(s), component, or collection of components capable of performing the functions described herein. The interface circuit 218 converts output signals (e.g., from the sensors 210) into signals which are suitable for presentation to an input of the processor 212. In particular, in some embodiments, the interface circuit 218, by an analog-to-digital (A/D) converter, or the like, converts analog signals into digital signals for use by the processor 214. Similarly, the interface circuit 218 may convert signals from the processor 214 into output signals which are suitable for presentation to the electrically-controlled components associated with system 202 (e.g., one or more pumps or other components). In particular, the interface circuit 218, by use of a variable-frequency signal generator, digital-to-analog (D/A) converter, or the like, may convert digital signals generated by the processor 214 into analog signals for use by the electronically-controlled components associated with the system 202. It is contemplated that, in some embodiments, the interface circuit 218 (or portions thereof) may be integrated into the processor 214.

The controller 212 may be in wireless communication with a remote computing device 220. The remote computing device 220 may be embodied as any controller, computer, server device, or other device capable of performing the functions described herein. In some embodiments, the remote device 220 may be embodied as a gateway device or other device configured to receive data from the controller 212 and forward that data to another remote device 220 such as a digital platform server. For example, in some embodiments the remote device 220 may be embodied as a Nalco Global Gateway. Accordingly, in some embodiments, the remote computing device 220 may include components typically found in a server computer, such as a process, a memory, and various interface circuits. The above description of similar components of the controller 212 is applicable to similar components of the remote device 220 and for clarity is not repeated herein.

The illustrative liquid monitoring and controlling system 202 may be physically installed on a stand, a sled, a skid, a plate, or other physical structure to support components of the liquid monitoring and controlling system 202 and to allow for physical installation of the system 202 at the computing system 100. For example, in some embodiments, the liquid monitoring and controlling system 202 may be mounted to a freestanding stand that may be positioned near the CDU 104 and the blade enclosure 102. The secondary loop 108 may be thus routed from the CDU 104 to the blade enclosure 102 through the liquid monitoring and controlling system 202. As another example, in some embodiments the liquid monitoring and controlling system 202 may be mounted to a sled, a skid, a plate, or other structure that may be physically attached to the blade enclosure 102, the CDU 104, or another structure. For example, in some embodiments, the liquid monitoring and controlling system 202 may be attached to a wall or other structure near the blade enclosure 102 and the CDU 104. As another example, in some embodiments, the liquid monitoring and controlling system 202 may be attached to a side panel of the blade enclosure 102. This arrangement may allow for access to the compute blades 120 while also providing access to the liquid monitoring and controlling system 202, for maintenance or other tasks. As yet another example, the liquid monitoring and controlling system 202 may be attached to a front panel of the CDU 104, which allows for access to the liquid monitoring and controlling system 202 for maintenance or other tasks.

Thus, system 200, including the liquid monitoring and controlling system 202, allows for automated, real time or near real time monitoring of coolant (e.g., aqueous medium) parameters for liquid cooled computing system. Compared to previous liquid cooled computing systems, the system 200 may allow for monitoring additional coolant parameters continually, with improved accuracy or otherwise improved monitoring quality. Such monitoring may allow for improved coolant quality (e.g., ensuring parameters remain within accepted ranges or thresholds), which in turn may improve cooling performance and/or computing performance of the system 200.

Referring now to FIG. 3, a system 300 for liquid cooling monitoring for a liquid cooled computing system includes a blade enclosure 102, CDU 104, and FWS 106 similar to those described above in connection with FIG. 2. Additionally, and as shown in FIG. 3, the system 300 includes a coolant blade 302 mounted to the blade enclosure 102. As described further below, the coolant blade 302 includes sensors 310 (illustratively shown in FIG. 4) and a cooling liquid conduit similar to the liquid monitoring system 202 shown in FIG. 2. Additionally, the coolant blade 302 is adapted to be received in the same bays or slots of the blade enclosure 102 as the compute blades 120. In particular, the coolant blade is coupled to the supply manifold 122 and the return manifold 124. As coolant circulates through the secondary loop 108, a portion of the coolant passes through the coolant blade 302, which uses sensors to monitor one or more parameters of the coolant, similar to the liquid monitoring system 202 of FIG. 2. The secondary loop 108 has a relatively small volume of coolant, and thus over time, all or substantially all of the coolant within the secondary loop 108 passes through the coolant blade 302 for monitoring.

As shown in FIG. 3, the coolant blade 302 is communicatively coupled to a controller 312, which includes a processor 314, a memory 316, and an interface 318. The illustrative controller 312 may be the same as or similar to the controller 212 of FIG. 2. As shown, the controller 312 may also be in communication with a remote computing device 320, which may be the same as or similar to the remote computing device 220 of FIG. 2. Accordingly, the description of the controller 212 and its components is also applicable to the controller 312 and its components, and the description of the remote computing device 220 is also applicable to the remote computing device 320. To improve clarity of this disclosure, those descriptions are not repeated herein.

Thus, the system 300, including the coolant blade 302, allows for automated, real time or near real time monitoring of coolant parameters for liquid cooled computing system. Compared to previous liquid cooled computing systems, and similar to the system 200, the system 300 may allow for monitoring additional coolant parameters continually, with improved accuracy or otherwise improved monitoring quality. Such monitoring may allow for improved troubleshooting and other maintenance of the coolant system, thus improving coolant quality (e.g., by performing early maintenance to ensure parameters remain within accepted ranges or thresholds). Improved maintenance, troubleshooting, and/or coolant quality may thus improve cooling performance and/or computing performance of the system 300. Additionally, by using a coolant blade 302 that is interchangeable with a compute blade 120, the system 300 may provide improved coolant monitoring without requiring modifications to existing liquid cooling systems (e.g., without requiring connection to the secondary loop 108 outside of the blade enclosure 302). Thus, the system 300 may reduce costs or otherwise improve efficiency associated with liquid coolant monitoring. Further, the coolant blade 302 may be incorporated into the system 300 without requiring additional space for liquid coolant monitoring, which is desirable for many high performance computing systems in which space is at a premium.

Referring now to FIG. 4, diagram 400 illustrates one potential embodiment of a coolant blade 302 of the system 300. The illustrative coolant blade 302 includes a chassis 402 that supports and encloses components of the coolant blade 302. The chassis 402 illustratively includes a pair of opposing side panels 404, 406, a front panel 408, and a rear panel 410. The chassis 402 may also include a top panel and a bottom panel, which are not specifically shown in FIG. 4.

The illustrative coolant blade 302 includes a liquid conduit 412 or other passage that extends throughout the interior of the chassis 402. The liquid conduit 412 may include one or more pipes, valves, and other components capable of containing pressurized coolant. The coolant blade 302 further includes an inlet connector 414 and an outlet connector 416 that are fluidly coupled to the liquid conduit 412. The connectors 414, 416 are configured to connect to the secondary loop 108 of the system 300, for example by connecting to the supply manifold 122 and the return manifold 124 or other liquid coolant handling components of the blade enclosure 102. The connectors 414, 416 are illustratively quick connect connectors; however, the connectors 414, 416 may be embodied as any liquid connector compatible with the blade enclosure 102.

The chassis 404 further includes a handle 418 extending outward from the front panel 408. The handle 418 may be used to facilitate inserting the chassis 402 into a bay or slot of the blade enclosure 102. Illustratively, the connectors 414, 416 also extend outwardly from the front panel 408 of the chassis 402, so that the connectors 414, 416 are accessible when the chassis 402 is inserted in the blade enclosure 102. In other embodiments, the connectors 414, 416 may extend from the rear panel 410 or be otherwise arranged relative to the chassis 402 to connect to the blade enclosure 102 when the chassis 402 is inserted in the blade enclosure 102. Similarly, the chassis 402 may include one or more locking levers, attachment devices, or other mechanical features to support installation in the blade enclosure 102.

As shown, the illustrative coolant blade 302 includes multiple sensors 310 that are fluidly coupled to the liquid conduit 412 and positioned in an interior of the chassis 402. Illustratively, the diagram 400 includes four sensors 420, 422, 424, 426 fluidly coupled to the liquid conduit 412. Similar to the sensors 210 of the liquid monitoring system 202 of FIG. 2, each of the sensors 310 may be embodied as any electronic sensor capable of monitoring or otherwise measuring one or more parameters of the coolant, such as turbidity, pH, percentage propylene glycol, percentage ethylene glycol, conductivity, temperature, flow rate, or other parameters. Those measured parameters may be indicative of coolant health. For example, the sensors 310 may include sensor for online-refractometry to measure percentage propylene glycol. As another example, the sensors may include a filter fitted with pressure sensors for measuring differential pressure across the filter as an additional data point for fluid health and particulate. As another example, the sensors may measure absorbance or fluorescence to monitor pH via an indicator. As described above, in some embodiments, the sensors may include additional sensors for microbiology sensing, oxidation-reduction potential (ORP), or other sensors for monitoring for inhibitor residuals.

The sensors 420, 422, 424, 426 are illustratively communicatively coupled to the controller 312. As described further below, and similar to the controller 212, the controller 312 is configured to receive sensor data from the sensors, process the sensor data, and in some embodiments to transmit the sensor data to one or more remote devices 320. As shown, in the illustrative embodiment, the controller 312 is a component separate from the chassis 402 and connected to the sensors 420, 422, 424, 426. In this illustrative embodiment, the controller 312 may be attached or otherwise positioned in an accessible location. For example, the controller 312 may be attached to an outside surface of the blade enclosure 102 or another location that is accessible by a maintenance technician or other user. Additionally, although illustrated as using wired connections to the sensors 310, it should be understood that in some embodiments the controller 312 may be connected to the sensors 310 wirelessly.

Additionally or alternatively, in some embodiments some or all components of the controller 312 may be included inside or otherwise incorporated with the chassis 402 of the coolant blade 302. For example, in an embodiment the controller 312 may be positioned inside the chassis 402 and connected to the sensors 420, 422, 424, 426 by wires. In some embodiments, one or more screens, buttons, or other user interface devices of the controller 312 may be user-accessible, for example by being positioned on (or otherwise accessible through) the front panel 408 of the chassis 402.

As shown, the chassis 402 includes a width 428 and a depth 430. The chassis 402 may also include a height (not shown). Those dimensions may be similar to standardized dimensions of one or more compute blades 120 that are compatible with the blade enclosure 102. For example, in some embodiments, the chassis 402 may have width 428, depth 430, and height equal to a full-height blade or a double-height blade used with a blade enclosure 102. As another example, in some embodiments the chassis 402 may have a width 428 equal to a standard rack width (e.g., 19 inches or another dimension).

In some embodiments, the chassis 402 may include additional features providing access to the secondary loop 108 for maintenance or other purposes. For example, in an embodiment, the chassis 402 may include an additional port positioned on the front panel 408 or other accessible location of the chassis 402 that is fluidly coupled to the liquid conduit 412, and thus to the secondary loop 108. Continuing that example, pressurized cartridges, bottles, or other containers of chemicals, such as propylene glycol, may be attached to the liquid conduit 412 using this port in order to add those chemicals to the secondary loop 108. Such additions may be based on measurements of the coolant generated by the coolant blade 302. Accordingly, the coolant blade 302 may allow for addition of chemicals to the secondary loop 108 without interrupting coolant flow from the CDU 104 and with reduced risk of contamination compared to typical systems.

In some embodiments, the chassis 402 may include additional sensors or other data sources for the controller 312. For example, in an embodiment the chassis may include one or more leak detection sensors. Those sensors may not be fluidly coupled to the liquid conduit 412.

Referring now to FIG. 5, in use, a controller 212 or a controller 312 may execute a method 500 for monitoring and/or controlling the liquid monitoring system 202 or a coolant blade 302, respectively. The method 500 begins in block 502, in which the controller 212, 312 receives sensor data from one or more sensors 210, 310 of the liquid monitoring and controlling system 202 or coolant blade 302, respectively. In block 504, the controller 212, 312 transmits the sensor data to a remote computing device 220, 320. The remote computing device may be, for example, a Nalco Global Gateway, a digital platform server device, or other device.

In block 506, the controller 212, 312 may perform one or more control operations or other automation operations based on the sensor data. In some embodiments, in block 508, the controller 212, 312 may log the sensor data for later review and/or analysis. In some embodiments, the sensor data may be logged by the remote device 220, 320 in addition to or alternatively to the controller 212, 312. In some embodiments, in block 510 the controller 212, 312 may log one or more control inputs made by a user to the controller 212, 312. For example, in certain embodiments, a technician may press a button, select a graphical user interface element, or otherwise activate a control input of the controller 212, 312 whenever a compute blade 120 or other component of the system 200, 300 is added, removed, swapped, or otherwise changed. The controller 212, 312 may store a timestamp associated with the control input. Those logged control inputs associated with compute blade 120 change events may be compared to logged sensor data, for example to identify any changes to coolant parameters caused by the compute blade 120 change event. Logging sensor data and/or user input events may provide for insight into physical changes to the computing system that is not actionable with typical systems.

In some embodiments, in block 512 the controller 212, 312 may compare sensor data to one or more predetermined thresholds and/or predetermined ranges. For example, the controller 212, 312 may compare a measured percentage propylene glycol in the coolant to a predetermined acceptable range of propylene glycol percentages. In some embodiments, in block 514 the controller 212, 312 may activate an alarm based on sensor data, for example in response to comparing the sensor data to the predetermined threshold or range. The alarm may be visual, audible, or any other modality, and may be presented by the controller 212, 312 and/or transmitted to a remote device 220, 320. In some embodiments, in block 516 the controller 212, 312 may activate an automatic water or chemical (e.g., corrosion inhibitor) addition based on the sensor data. For example, in response to determining that the percentage propylene glycol in the coolant is below the predetermined acceptable range, the controller 212, 312 may cause additional propylene glycol to be added to the coolant by one or more chemical injection pumps or other components.

Any of the chemical injection pumps disclosed herein may be in fluid communication with a storage device. Each storage device may comprise one or more chemicals and the chemical injection pumps may transport those chemicals into the aqueous medium. In some embodiments, the chemical injection pump comprises the storage device. The chemical injection pumps may be in communication with the controller in any number of ways, such as through any combination of wired connection, a wireless connection, electronically, cellularly, through infrared, satellite, or according to any other types of communication networks, topologies, protocols, standards and more. Accordingly, the controller can send signals to the pumps to control their chemical (e.g., corrosion inhibitor, oxidizing agent, etc.) feed rates.

FIG. 6 illustrates another potential embodiment of a liquid monitoring system 602 that may be used with the system 200 of FIG. 2. As shown, the illustrative system 602 includes many of the same components of the liquid monitoring system 202 shown in FIG. 2, the description of which is applicable to the corresponding components of the liquid monitoring system 602 and is not repeated herein so as not to obscure the present disclosure. Thus, the liquid monitoring system 602 may be used with the system 200 in place of and/or together with the liquid monitoring system 202, for example by coupling the inlet 206 to the CDU 104 via the TCS 108 and coupling the outlet 208 to the inlet manifold 122 of the blade enclosure 102 via the TCS 108.

As shown, the liquid monitoring system 602 includes an internal liquid conduit 204 that extends between the inlet 206 and the outlet 208. The liquid monitoring system 602 further includes a side channel 604 coupled to the liquid conduit 204. The sensors 210 are coupled to the side channel 604. Accordingly, at least a part of the coolant received at the inlet 206 passes through the conduit 204 and then the side channel 604, wherein the coolant may be measured by one or more of the sensors 210. The TCS 108 has a relatively small volume of coolant, and thus over time, all or substantially all of the coolant within the TCS 108 passes through the side channel 604 for monitoring.

The chemical may be added at one or more addition points in the coolant blade 302, the CDU 104, or another addition point. With respect to FIG. 2, for example, chemical may be added at before and/or after the FWS, before and/or after the CDU, before and/or after the liquid monitoring system, and/or before and/or after the blade enclosure. In some embodiments, the chemical is injected into a conduit carrying/transporting the aqueous medium, such as the internal liquid conduit and/or a conduit of the secondary loop.

The controller 212, 312 is operable to cause the addition of other chemicals (e.g., a corrosion inhibitor). For example, in response to detecting microbiology activity in the coolant, the controller 212, 312 may cause addition of biocide and/or oxidizing agent. As another example, in response to determining that the percentage propylene glycol in the coolant is above the predetermined acceptable range, the controller 212, 312 may cause additional water to be added to the coolant.

As another example, the controller 212, 312 may cause the secondary loop to be refilled (e.g., with water or water/propylene glycol mixture) in response to detecting a compute blade 120 change. Continuing that example, in some embodiments, the compute blade 120 may be stored with its internal cooling passages empty or otherwise with less coolant than used in operation. In such embodiments, replacing an operating compute blade 120 with another compute blade 120 may reduce the total amount of coolant in the secondary loop 108. As described herein, the controller 212, 312 may cause replenishment of the coolant based on measured sensor data and/or received user input (e.g., a buttonpress or other input indicating that a compute blade 120 has been changed). As another example, the controller 212, 312 may detect a compute blade 120 change based on sensor data, such as changes in pressure and flow rate at the pump outlet (e.g., in the CDU 104).

In some embodiments, control operations performed by the controller 212, 312 may include optimization of one or more parameters of the coolant. Optimization can include, for example, measuring one or more properties associated with the coolant to be sure that the one or more properties are within an acceptable, predetermined range and, if the one or more properties are not within the acceptable, predetermined range for each respective property being measured, causing a change in the coolant to bring the property back within the acceptable, predetermined range. As another example, in some embodiments the controller 212, 312 may cause discharge of at least a portion of the coolant in the secondary loop 108 and then replenish the secondary loop 108 with fresh fluid, for example when sensor data indicates potential contamination of the coolant.

Certain embodiments of the present disclosure provide a method of monitoring and controlling corrosion inhibitor concentration and/or a level of a metal ion in a system as disclosed in FIGS. 1-6.

The method includes the use of a monitoring and controlling unit as described herein comprising a controller and one or more sensors in communication with the controller. Each of the sensors is operable to measure a property of the medium. For example, in some embodiments, the unit comprises three sensors, wherein each sensor is operable to measure a different property, such as pH, metal ion level, and corrosion inhibitor concentration.

One or more pumps, which are in communication with the controller, are utilized to inject various chemicals into the water, such as corrosion inhibitors, propylene glycol, ethylene glycol, acids (e.g., HCl), bases (e.g., NaOH), and/or water. Each chemical may have its own chemical injection pump.

An acceptable range for various aqueous medium parameters, such as pH of the aqueous medium, metal ion level, and/or corrosion inhibitor concentration in the medium, is entered into the controller.

A conduit (as shown in, for example, FIG. 2) may be provided between the cooling fluid and the monitoring and controlling unit. A sample of the medium passes through the conduit and into an inlet of the monitoring and controlling unit. Next, a property of the medium, such as the corrosion inhibitor concentration, metal ion level, and/or pH, is are measured using one or more sensors and the controller determines if the measured property is within the acceptable range previously entered into the controller. This determining step can be automatically performed by the controller and in this step, the measured value for each measured property is compared to the acceptable range entered for that specific property.

If the measured pH, metal ion level, and/or corrosion inhibitor concentration are outside of the acceptable range associated with that property, the controller and/or operator of the controller may cause a change, for example, in an influx of a chemical into the aqueous medium from the one or more chemical injection pumps, the chemical(s) being capable of adjusting the measured property and bringing it back within the acceptable range. The controller is operable to determine when the measured property is back within the acceptable range, such as by taking continuous or periodic measurements, and subsequently turn off the chemical injection pump(s).

The monitoring and controlling system may further comprise a fluorometer. The fluorometer is configured to measure a fluorescent signal of a fluorescent tracer in the medium. If the medium comprises two or more tracers that are different, the fluorometer is capable of measuring a fluorescent signal of each different tracer.

In an illustrative, non-limiting embodiment, a tracer may be added to the medium in a known amount with a corrosion inhibitor. A portion (such as a side stream) of the medium may be continuously routed through the monitoring and controlling unit and passed by any of the sensors disclosed herein and/or passed through a fluorometer. The fluorometer detects a fluorescent signal from the portion of the medium and transmits the signal to the controller, which analyzes the signal and determines an amount of tracer in the medium, which may be proportional to the amount of corrosion inhibitor in the medium. If the signal is below a predetermined value, the controller may carry out a corrective action, such as sending a signal to a chemical injection pump causing the pump to add additional corrosion inhibitor to the medium until the fluorescent signal is brought back within the predetermined acceptable range.

In certain embodiments, the monitoring and controlling system is implemented to have the plurality of sensors, fluorometer, etc., provide continuous or intermittent feedback, feed-forward, and/or predictive information to the controller, which can relay this information to a relay device, such as the Nalco Global Gateway, which can transmit the information via cellular communications to a remote device, such as a cellular telephone, computer, and/or any other device that can receive cellular communications. This remote device can interpret the information and automatically send a signal (e.g., electronic instructions) back, through the relay device, to the controller to cause the controller to make certain adjustments to the output of the pumps. The information can also be processed internally by the controller and the controller can automatically send signals to the pumps to adjust the amount of chemical injection, for example. Based upon the information received by the controller from the plurality of sensors, fluorometer, or from the remote device, the controller may transmit signals to the various pumps to make automatic, real-time adjustments, to the amount of chemical that the pumps are injecting into the medium.

Alternatively, an operator of the remote device that receives cellular communications from the controller can manually manipulate the pumps through the remote device. The operator may communicate instructions, through the remote device, cellularly or otherwise, to the controller and the controller can make adjustments to the rate of chemical addition of the chemical injection pumps. For example, the operator can receive a signal or alarm from the remote device through a cellular communication from the controller and send instructions or a signal back to the controller using the remote device to turn on one or more of the chemical injection pumps, turn off one or more of the chemical injection pumps, increase or decrease the amount of chemical being added to the medium by one or more of the injection pumps, or any combination of the foregoing. The controller and/or the remote device is also capable of making any of the foregoing adjustments or modifications automatically without the operator actually sending or inputting any instructions. Preset parameters or programs are entered into the controller or remote device so that the controller or remote device can determine if a measured property is outside of an acceptable range. Based on the information received by the plurality of sensors and/or fluorometer, the controller or remote device can make appropriate adjustments to the pumps or send out an appropriate alert.

In certain embodiments, the remote device or controller can include appropriate software to receive data from the plurality of sensors and/or fluorometer and determine if the data indicates that one or more measured properties of the medium are within, or outside, an acceptable range. The software can also allow the controller or remote device to determine appropriate actions that should be taken to remedy the property that is outside of the acceptable range. For example, if the measured pH is above the acceptable range, the software allows the controller or remote device to make this determination and take remedial action, such as alerting a pump to increase the flow of an acid into the medium.

The monitoring and controlling system and/or controller disclosed herein can incorporate programming logic to convert analyzer signals from the plurality of sensors and/or fluorometer to pump adjustment logic and, in certain embodiments, control one or more of a plurality of chemical injection pumps with a unique basis. Non-limiting, illustrative examples of the types of chemical injection pumps that can be manipulated include chemical injection pumps responsible for injecting water, corrosion inhibitors, oxidizing agents, propylene glycol, ethylene glycol, and/or any other type of chemical that could prove to be useful in the particular medium.

The fluorometer and sensors disclosed herein are operable to sense and/or predict a property associated with the medium or system parameter and convert the property into an input signal, e.g., an electric signal, capable of being transmitted to the controller. A transmitter associated with the fluorometer and each sensor transmits the input signal to the controller. The controller is operable to receive the transmitted input signal, convert the received input signal into an input numerical value, analyze the input numerical value to determine if the input numerical value is within an acceptable range, generate an output numerical value, convert the output numerical value into an output signal, e.g., an electrical signal, and transmit the output signal to a receiver, such as a pump incorporating such receiver capabilities or a remote device, such as a computer or cellular telephone, incorporating receiver capabilities. The receiver receives the output signal and either alerts an operator to make adjustments to flow rates of the pumps, or the receiver can be operable to cause a change in a flow rate of the pumps automatically, if the output numerical value is not within the acceptable range for that property.

The method is optionally repeated for a plurality of different system parameters, where each different system parameter has a unique associated property, or, alternatively, all system parameters can be analyzed concurrently by fluorometer and the plurality of sensors.

Data transmission of measured parameters or signals to chemical pumps, alarms, remote monitoring devices, such as computers or cellular telephones, or other system components is accomplished using any suitable device, and across any number of wired and/or wireless networks, including as examples, WiFi, WiMAX, Ethernet, cable, digital subscriber line, Bluetooth, cellular technologies (e.g., 2G, 3G, Universal Mobile Telecommunications System (UMTS), GSM, Long Term Evolution (LTE), or more) etc. The Nalco Global Gateway is an example of a suitable device. Any suitable interface standard(s), such as an Ethernet interface, wireless interface (e.g., IEEE 802.11 a/b/g/x, 802.16, Bluetooth, optical, infrared, radiofrequency, etc.), universal serial bus, telephone network, the like, and combinations of such interfaces/connections may be used.

As used herein, the term “network” encompasses all of these data transmission methods. Any of the described devices (e.g., archiving systems, data analysis stations, data capturing devices, process devices, remote monitoring devices, fluorometers, sensors, chemical injection pumps, etc.) may be connected to one another using the above-described or other suitable interface or connection.

In some embodiments, system parameter information is received from the system and archived. In certain embodiments, system parameter information is processed according to a timetable or schedule. In some embodiments, system parameter information is immediately processed in real-time or substantially real-time. Such real-time reception may include, for example, “streaming data” over a computer network.

The chemicals to be added to the medium, such as the corrosion inhibitor, oxidizing agent, etc., may be introduced to the medium using any suitable type of chemical injection pump. Most commonly, positive displacement injection pumps are used and are powered either electrically or pneumatically. Continuous flow injection pumps can also be used to ensure specialty chemicals are adequately and accurately injected into the medium. Though any suitable pump or delivery system may be used, exemplary pumps and pumping methods include those disclosed in U.S. Pat. No. 5,066,199, titled “Method for Injecting Treatment Chemicals Using a Constant Flow Positive Displacement Pumping Apparatus” and U.S. Pat. No. 5,195,879, titled “Improved Method for Injecting Treatment Chemicals Using a Constant Flow Positive Displacement Pumping Apparatus,” each incorporated herein by reference in its entirety.

In some embodiments, changes in the chemical injection pumps are limited in frequency. In some aspects, adjustment limits are set at a maximum of 1 per 15 min and sequential adjustments in the same direction may not exceed 8, for example. In some embodiments, after 8 total adjustments or a change of 50% or 100%, the pump could be suspended for an amount of time (e.g., 2 or 4 hours) and alarm could be triggered. If such a situation is encountered, it is advantageous to trigger an alarm to alert an operator. Other limits, such as maximum pump output, may also be implemented. It should be appreciated that it is within the scope of the invention to cause any number of adjustments in any direction without limitation. Such limits are applied as determined by the operator or as preset into the controller.

A aqueous medium of the present disclosure may comprise, for example, fresh water, municipal water, recycled water, salt water, surface water, condensed water, cooling water, injection water, ground water, or any mixture thereof.

A medium treated with a composition and/or compound of the present disclosure can be at any selected temperature, such as ambient temperature or an elevated temperature. For example, the medium may be at a temperature of from about 10° C. to about 250° C. In some embodiments, the medium may be at a temperature of from about 10° C. to about 100° C., about 10° C. to about 50° C., about 10° C. to about 40° C., or about 20° C. to about 50° C.

The presently disclosed compositions, compounds, and methods are useful for inhibiting corrosion of surfaces comprising any metal or combination of metals. In some aspects, the metal surface comprises steel, such as stainless steel or carbon steel. In some aspects, the metal surface comprises iron, aluminum, zinc, chromium, manganese, nickel, tungsten, molybdenum, titanium, vanadium, cobalt, niobium, or copper. The metal surface may also comprise any combination of the foregoing metals and/or any one or more of boron, phosphorus, sulfur, silicon, oxygen, and nitrogen.

In some aspects of the present disclosure, a metal surface may comprise metallic-chrome steel, ferritic-alloy steel, austenitic-steel, precipitation-hardened steel, high-nickel steel, carbon steel, or a combination thereof.

The presently disclosed corrosion inhibitor compounds, compositions, and methods are useful for inhibiting corrosion of metal surfaces in contact with any type of corrodent in the medium, such as a metal cation, a metal complex, a metal chelate, an organometallic complex, an aluminum ion, an ammonium ion, a barium ion, a chromium ion, a cobalt ion, a cuprous ion, a cupric ion, a calcium ion, a ferrous ion, a ferric ion, a hydrogen ion, a magnesium ion, a manganese ion, a molybdenum ion, a nickel ion, a potassium ion, a sodium ion, a strontium ion, a titanium ion, a uranium ion, a vanadium ion, a zinc ion, a bromide ion, a carbonate ion, a chlorate ion, a chloride ion, a chlorite ion, a dithionate ion, a fluoride ion, a hypochlorite ion, an iodide ion, a nitrate ion, a nitrite ion, an oxide ion, a perchlorate ion, a peroxide ion, a phosphate ion, a phosphite ion, a sulfate ion, a sulfide ion, a sulfite ion, a hydrogen carbonate ion, a hydrogen phosphate ion, a hydrogen phosphite ion, a hydrogen sulfate ion, a hydrogen sulfite ion, an acid, such as carbonic acid, hydrochloric acid, nitric acid, sulfuric acid, nitrous acid, sulfurous acid, a peroxy acid, or phosphoric acid, ammonia, bromine, carbon dioxide, chlorine, chlorine dioxide, fluorine, hydrogen chloride, hydrogen sulfide, iodine, nitrogen dioxide, nitrogen monoxide, oxygen, ozone, sulfur dioxide, hydrogen peroxide, a polysaccharide, a metal oxide, sand, a clay, silicon dioxide, titanium dioxide, mud, a brine, an organic acid, an insoluble inorganic and/or organic particulate, an oxidizing agent, a chelating agent, an alcohol, and any combination of the foregoing.

In a further aspect, the present disclosure provides a method of monitoring and controlling a concentration of a corrosion inhibitor in an aqueous medium. In some embodiments, the corrosion inhibitor may comprise a fluorescent compound (e.g., 1,3,6,8-pyrenetetrasulfonic acid, sodium salt) and/or a fluorescent compound (e.g., 1,3,6,8-pyrenetetrasulfonic acid, sodium salt) may be added to the aqueous medium in a known proportion/concentration to the corrosion inhibitor. The method can be carried out with a monitoring and controlling unit comprising a controller and a sensor in communication with the controller, wherein the sensor is operable to measure the concentration of the corrosion inhibitor in the aqueous medium (e.g., measure a fluorescent signal from the fluorescent compound). The method may involve the use of a chemical injection pump, which is in communication with the controller. An acceptable range for the concentration of the corrosion inhibitor, such as about 0.05 ppm to about 2,000 ppm, about 0.5 ppm to about 1,000 ppm, about 1 ppm to about 500 ppm, or about 1 ppm to about 100 ppm, may be entered into the controller.

A delivery conduit having a first end in fluid communication with the aqueous medium and a second end in fluid communication with an inlet of the monitoring and controlling unit is provided and a sample of the aqueous medium is delivered through the delivery conduit and into the monitoring and controlling unit. The method further comprises measuring the concentration of the corrosion inhibitor in the sample with the sensor, determining if the measured concentration is within the acceptable range inputted into the controller in step, and causing a change in an influx of the corrosion inhibitor into the aqueous medium from the chemical injection pump if the measured concentration is outside of the acceptable range inputted into the controller in step.

The foregoing steps may be repeated continuously or intermittently to determine if/when the concentration of the corrosion inhibitor has been brought within the acceptable range.

In addition to corrosion inhibitor concentration, any other property/parameter disclosed herein may be monitored and controlled with the presently disclosed methods. Illustrative examples include cooling medium volume, flowrate, heat exchanger inlet and outlet temperature difference, corrosion coupon (small piece of metal which is same metallurgy with the system heat exchanger) corrosion rate, the cooling loop pH, conductivity, and/or ORP.

Colormetric tests may also be used to measure azole concentration.

All of the compositions and methods disclosed and claimed herein can be made and executed without undue experimentation in light of the present disclosure. While this invention may be embodied in many different forms, there are described in detail herein specific preferred embodiments of the invention. The present disclosure is an exemplification of the principles of the invention and is not intended to limit the invention to the particular embodiments illustrated. In addition, unless expressly stated to the contrary, use of the term “a” is intended to include “at least one” or “one or more.” For example, “a corrosion inhibitor” is intended to include “at least one corrosion inhibitor” or “one or more corrosion inhibitors.”

Any ranges given either in absolute terms or in approximate terms are intended to encompass both, and any definitions used herein are intended to be clarifying and not limiting. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the invention are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements. Moreover, all ranges disclosed herein are to be understood to encompass any and all subranges (including all fractional and whole values) subsumed therein.

Any composition disclosed herein may comprise, consist of, or consist essentially of any element, component and/or ingredient disclosed herein or any combination of two or more of the elements, components or ingredients disclosed herein.

Any method disclosed herein may comprise, consist of, or consist essentially of any method step disclosed herein or any combination of two or more of the method steps disclosed herein.

The transitional phrase “comprising,” which is synonymous with “including,” “containing,” or “characterized by,” is inclusive or open-ended and does not exclude additional, un-recited elements, components, ingredients and/or method steps.

The transitional phrase “consisting of” excludes any element, component, ingredient, and/or method step not specified in the claim.

The transitional phrase “consisting essentially of” limits the scope of a claim to the specified elements, components, ingredients and/or steps, as well as those that do not materially affect the basic and novel characteristic(s) of the claimed invention.

Unless specified otherwise, all molecular weights referred to herein are weight average molecular weights and all viscosities were measured at 25° C. with neat (not diluted) polymers.

As used herein, the term “about” refers to the cited value being within the errors arising from the standard deviation found in their respective testing measurements, and if those errors cannot be determined, then “about” may refer to, for example, within 5%, 4%, 3%, 2%, or 1% of the cited value.

Furthermore, the invention encompasses any and all possible combinations of some or all of the various embodiments described herein. It should also be understood that various changes and modifications to the presently preferred embodiments described herein will be apparent to those skilled in the art. Such changes and modifications can be made without departing from the spirit and scope of the invention and without diminishing its intended advantages. It is therefore intended that such changes and modifications be covered by the appended claims.