TWO-STAGE COOLING SYSTEM

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a system which can cool a circulating refrigerant.

2. General Background and State of the Art

There are many devices which generate heat while they are being used. For example, the temperature of electronic devices is increased due to electrical resistance in the components. Other mechanical devices generate heat through friction. All of these devices must be continuously cooled to insure the operate properly.

Electrical components can produce a significant amount of heat which can require removal during normal operation. A common method of cooling is to use a refrigerant which transfers heat away from the device. The refrigerant is in a fluid state and it can be applied directly to the device in some instances. After the refrigerant passes over the heated components, it is collected though a suitable structure, such as a sump and then transported away. In other instances, the present invention includes a fluid cooling apparatus which cools a circulating fluid using optimum power and water consumptions. The cooled fluid can then be used, in turn be a mission critical facility including but not limited to a data center. The disclosed fluid cooling apparatus offers low power and water consumption by combining a mechanical cooling system with an evaporative fluid cooling system in one single apparatus.

There is therefore a need in the marketplace to provide a system which can cooling mechanism for recirculating.

There are multiple industries that this will be able to influence and/or disrupt; for example: automobiles, server farms, air conditioning, and swamp coolers. The cooling unit can be replaced or be added to target equipment to make it more efficient. Autos will be able to cool brakes, oil, engine, and cabin more efficiently. Server farms will run cooler and the rooms they are in will be cooler reducing operating temperatures and A/C electrical costs. A/C units for houses and server rooms will be less taxed, especially in very high temp settings like the desert where “box” works more efficiently due to very low humidity. Swamp coolers efficiency significantly increases when water colder than ambient temperature is run in/on its radiators from “box”. This unit (“box”) is unique by using 2 types of cooling. The 2 cooling loops work more efficiently and greater combined than if they were separate systems. The unit (“box”) allows for cooling 15-20 degrees lower than ambient temp causes less strain on equipment being used (higher temps will see greater deltas as high as 80 degrees difference). Heat that is removed from target equipment is cooler than if it was run on a dry radiator. Dry radiators will expel heat temps that are the same as the coolant. Service life of target equipment will be notably lengthened. In conclusion the “box” does not emit heat to cool. The heat that is drawn and expelled from the target is significantly cooler and ambient temps rise far slower. The amount of electrical energy used to dissipate heat is a fraction of the cost of anything being used on the market. Water is the most abundant substance on the planet and almost free so supply chain stability is safe.

SUMMARY OF THE INVENTION

The present invention pertains to a cooling system which provides a system for reducing the temperature of a circulating fluid includes a cooling tower and an enclosure which has located in in one or more trays located below one or more radiators wrapped in a layered cooling blanket, a plurality of fans disposed to pass air over the radiators, further including a drip cooling assembly for passing a second quantity of coolant over the radiators and cooling blankets, and wherein the cooling loop is structured such that it exits the cooling tower, enters the enclosure, and passes through the radiators, thereby returning chilled coolant which can be used to cool an outside apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features of this invention will be best understood by reference to the following detailed description of a preferred embodiment of the invention, taken in conjunction with the accompanying drawings, in which:

FIG. 1 illustrates the major components of the cooling system of the present invention.

FIG. 2 shows the cooling tower used in the present invention for first stage cooling.

FIG. 3 is a detail view of the vapor loop in the cooling tower.

FIG. 4 is the cooling enclosure used in the present invention for second stage cooling.

FIG. 5 shows the input and output ports to the enclosure.

FIG. 6 illustrates the cooling tower with the top and side walls removed showing the upper cooling reservoir.

FIG. 7a is a side view of the interior of the enclosure illustrating the elements of the invention inside.

FIG. 7b is a close-up view of the upper and lower cooling trays in the enclosure, showing the upper tray being substantially wrapped in a cooling blanket material.

FIG. 8 shows the sump pump used for recirculating the cooling fluid used in the enclosure.

FIG. 9 shows a cross-sectional view of the cooling blanket used in the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

In the following description of the preferred embodiment, reference is made to the accompanying drawings that form a part hereof, and in which is shown—by way of illustration—a specific embodiment in which the invention may be practiced. It is to be understood that other embodiments may be utilized, and changes may be made without departing from the scope of the present invention. In the following description, disclosure of the invention is made with primary reference to the use of an evaporative cooling system for a recirculating fluid. It will be apparent to those of skill in the art, however, that the system of the present invention can also be used with other configurations. The reference to a particular construction and arrangement for the cooling system is for explanatory purposes of a specific example or embodiment of the preset invention and is not intended to be limiting in any manner.

Referring first to FIG. 1, a block diagram of the major components of cooling system 10 of the present invention are illustrated. An apparatus which is to be cooled is shown in dashed lines. It is to be understood the apparatus does not constitute a part of the system of the present invention. Rather the cooling system can be used with a wide variety of different devices or machines which need to be cooled during their operation.

The primary components of the cooling system shown in FIG. 1 are the cooling enclosure 12, the coolant loop 14 and the and the cooling tower 16. The coolant loop is made of at least three different segments. These segments are labelled 14a, 14b and 14c in FIG. 1. Segment 14a is connected is connected to the input of the apparatus, segment 14b is connected between the cooling tower and the cooling enclosure and segment 14c is connected to the output of the cooling enclosure.

The coolant loop is a pipe or tubing of suitable diameter to transport a coolant from the apparatus to be cooled and through the various components of the cooling system of the invention. The tubing for the coolant loop may be insulated through the use of a removable insulation jacket. A removable insulation jacket is a cover made from layers of thermal insulation materials that is fastened onto a mechanical component to maximize its efficiency and regulate its temperature. Using such jackets ensures that the covered component is easily accessible and serviceable, unlike traditional stay-in-place insulation. Removable insulation jackets are also known as removable insulation pads and removable insulation covers. Since pipework can operate at temperatures far removed from the ambient temperature, and the rate of heat flow from a pipe is related to the temperature differential between the pipe and the surrounding ambient air, heat flow from pipework can be considerable. In many situations, this heat flow is undesirable. The application of thermal pipe insulation introduces thermal resistance and reduces the heat flow. Thicknesses of thermal pipe insulation used for saving energy vary, but as a general rule, pipes operating at more-extreme temperatures exhibit a greater heat flow and larger thicknesses are applied due to the greater potential savings.

One section of the coolant loop 14a connects the apparatus to the cooling tower 16. The cooling tower performs first-stage temperature reduction of the coolant. When the coolant exits the apparatus, it has picked up excess heat and is at a high temperature. The coolant then passes through section 14a and enters the cooling tower 16. The cooling tower has a pump 17 connected to it. In FIG. 1, the pump is shown as being integrated with the tower 16 at the bottom portion thereof. It will be apparent to those of skill in the art that the pump can be separated from the cooling tower and work with equal effectiveness. The pump creates a negative pressure and pulls the coolant downward through the tower. The coolant exits the tower and passes through segment 14b of the coolant loop, where it enters the cooling enclosure.

The interior of the cooling tower is under negative pressure. With negative pressure, the small amount of interior liquid instantly evaporates and condenses in the unit. Heated coolant pumped into the tower transfers heat to vapor chamber loops 22 which are illustrated in FIG. 3. This heat creates vapor in the vapor chamber loop 22w and heated gases rise to the top of the loop. The vapor then passes through the cooling section of the loop and is condensed. That liquid flows downward on the outside of the tower chamber and is returned back to the heated section of the loop which is on the interior of the cooling tower. The sections of vapor chamber loop that are on the exterior of the cooling tower are covered in wet cooling blankets.

After the coolant exits the cooling tower it passes through segment 14b of the coolant loop and enters the evaporative cooling enclosure, which is used for second stage cooling of the coolant. The coolant then exits the evaporative cooling enclosure and returns to the apparatus through coolant loop 14c. The major components of the two-stage cooling system will now separately be described in more details.

FIG. 2 shows a more detailed view of the cooling tower. As noted above, the cooling tower is connected to the portion of the cooling loop 14a which exits from the apparatus to be cooled. The coolant enters the cooling tower 16 through the entry port 51. The entry port is chosen from tubing which will permit the coolant to enter to cooling tower with a minimum of restriction.

Located beneath the entry port is the upper chamber 53. The upper chamber contains within it a copper mesh. Copper is chosen because it thermal properties allow for rapid and efficient cooling. Other materials which can be used include cellulose, poly, graphene, carbon, and graphite. Beneath the upper chamber is the vacuum chamber 54. The vacuum chamber 54 is generally larger than the upper chamber. Additionally, cooling blanket material may be disposed within the vacuum chamber. The cooling blanket material is described in more detail below in connection with FIG. 9.

A pump 51 is integrated into the base of the cooling tower. In the preferred embodiment, the pump is of the centrifugal type. It will be understood by those of skill in the art that the pump can be of a different style or construction. In other instances, the pump will not be integrated into the base of the cooling tower but can be a separate element. At the base of the cooling tower is the exit port 55. The exit port is connected to the cooing loop 14b.

In operation, the vacuum chamber is at least partially filled with coolant. The pump 52 is activated and used to reduce pressure in the vacuum chamber. As a result, and in combination with the force of gravity the coolant is sucked into upper chamber of the cooling tower. The heated coolant passes though is sprayed and passes through the mesh. The mesh agitates the coolant and is a medium for evaporation. This negative pressure allows coolant to boil and evaporate in the vacuum chamber due to lower boiling and evaporate point. The vapor loop is semi-submerged once system is running. The vacuum makes heated coolant expand and air space will be created in the vacuum 54 chamber The cooling tower is comparable to a dehumidifier and acts in a similar fashion.

The cooling tower includes a vapor chamber. A vapor chamber is a type of heat-spreader technology that uses evaporation and condensation of liquid. Unlike traditional heat sinks, which rely on solid metal, vapor chambers use a sealed chamber filled with a small amount of liquid (usually deionized water) that evaporates when heated. The vapor chamber is bonded to the base of the heat sink, allowing for efficient heat transfer. Vapor-chamber-based heat sinks are most efficient when the heat source is small and the heat sink is fairly large. A vapor chamber heatsink (VCH) is a heat spreader that uses a sealed chamber and a small amount of fluid to quickly move heat away from a source. VCHs are often used in high-powered devices and are considered one of the best heat spreading options for the base of a heatsink. VCHs can be made from substantially sealed copper plates and have an internal support structure to prevent the walls from buckling. When heat is generated, the liquid in the chamber evaporates and turns into vapor. The vapor then moves to the cooler end of the chamber, where it condenses back into liquid and releases heat. VCHs are commonly used in laptops, mobile devices, graphics cards, LEDs, servers, and hard drives. They are also used in automotive applications to cool the engine and transmission. VCHs can reduce conduction loss by 50% or more, resulting in lower thermal resistance. They can also expel heat faster with less fan noise.

As shown in FIG. 1, the coolant leaves the cooling tower 22 and passes through coolant loop 14c to the enclosure 20. The outside view of the enclosure is shown in FIG. 4 The coolant enters the enclosure through an entry port. Referring next to FIG. 5, input port 61 and exit port 62 for the coolant are shown. The input port 61 receives the coolant from section 14b of the coolant loop. The fluid is hot when it enters the enclosure. After the refrigerant is cooled by the use of the present invention, it leave the enclosure through the exit port 22. Although the input and exit ports are shown in the specific location as illustrated in FIG. 2, it will be appreciated by those of skill in the art that they can be positioned in alternative locations as may be desired.

The enclosure 20 is shown in FIG. 5, which is a perspective view. As shown the enclosure is substantially rectangular in shape and is of sufficient size to include all of the elements of the present invention. The sides of the enclosure are constructed in a manner which permits one or more of them to be easily removed to allow access to the various components of the invention which are located within. The specific manner of how the sides can be removed is not a limiting factor of the invention. In the preferred embodiment, the sides are connected by screws. Alternatively, they can be connected by hinges, or can be secured together by latches which permit their removal completely. The sides of the enclosure include opening or access ports to permit a power connection to the elements inside. The enclosure can include handles, so it can be easily lifted and carried.

Referring next to FIG. 6, a perspective view showing the top surface and one of the side surfaces of the enclosure 10 removed. A cooling reservoir 32 is shown. It is in the upper portion of the enclosure and is above the other elements of the cooling system.

Referring next to FIG. 7a top view of the enclosure is shown. Here the reservoir 32 has been removed. Located underneath the reservoir two radiator assemblies 40 are shown. It will be understood that a different number of radiators can be employed in the present invention. For example, only a single radiator may be employed where the cooling load is not large. In other instances three or more radiators can be placed in the enclosure when a larger cooling capacity is needed. The radiators have the shape of a rectangular prism. Other shapes can also be used. For example, the radiator may be constructed as a cylinder or cone.

One or more trays are located underneath the radiators. The bottommost tray acts as a sump. A second pump 48 is located inside the enclosure. It circulates any fluid in the recovery tray back to the top of the enclosure and into the reservoir. This is illustrated in FIG. 8.

The radiators 40 have a rigid skeleton, and the skeleton supports a layer of cooling blanket material. Tubing 44 is provided inside of the enclosure and is disposed to pass along a central axis of each of the radiators 40.

Referring next to FIG. 9, a cross-section the cooling blanket which is used in the present invention is show. The cooling layer is made from a number of layers which work together to facilitate the transfer of heat and provide an efficient cooling mechanism. The order of material determines which direction the liquid flows and thus controls temperature and which side is cooler. The layers are shown in FIG. 9 and include SSAM, poly foam (polyacrylate), cellulose, plastic pillars, mesh, carbon, graphite, graphene, and neoprene. Layers are stacked in various combinations to make CB Panel (CBP).

The combination of materials has multiple purposes. Some material combinations hold water in place more efficiently, others are more effective at transporting heated water via drip siphon effect and some have a more efficient evaporation rate. Each material has its own unique speed in the transportation of water. When poly is used, the flow is significantly slowed and held in suspension. The volume held in suspension is larger due to material super absorbency. With larger volume of water thermal equalization occurs faster due to increased volume. The heat has more immediate space to move into. It has super absorption and slower release, allowing water to absorb heat into larger volume held by that specific medium. This layer is in direct contact of a faster flowing material, acting as a siphon pulling the heated water, like a dry sponge, away from that layer allowing fresh cooler water to be pulled into poly on opposing side of layer.

Other listed material significantly impacts the rate of evaporation and speed of water exchange, and thus its ability to achieve lower temps faster. The surface area for each material varies and makes maximum cooling efficiency dependent on which material is used. Material also determines the speed at which water is exchanged in the thermal blanket.

All material works cooperatively with drip siphon effect eliminating laminar flow. Materials are layered in a specific order to choose the water's direction of pull into circulatory system of drip siphon effect. Heated water is removed from source (radiator) via the blanket while being cooled and enters the tray or next step of continued cooling (reservoir at top is covered in the blanket). This description is meant to cover any parts that have the thermal blanket attached.

A series of fans 48 are included in the enclosure. FIG. 7 illustrates the placement of the fans and their relationship to the radiators and the sides of the enclosure in the preferred embodiment. A series of three fans 48 are placed above the radiators and beneath the upper reservoir 32. Additional fans 48 are on the side of the enclosure. The fans force air from the outside of the enclosure to pass over the radiators and absorb heat from the cooling layers. It will be apparent to those of skill in the art that a different arrangement of fans could be used with equal effectiveness. In addition, the size and shape of the fans can be different from what is shown in FIG. 7.

FIG. 7 is a side view of the enclosure with one if its side walls removed. Coolant fluid is located in the upper reservoir 42. The coolant passes over cooling blankets attached to radiators; the heated coolant drips onto an upper tray 43; which is also covered in cooling blankets. The upper tray is initially cools the fluid once it leaves heat source. As coolant is being pulled via siphon drip effect it is being cooled by cooling blanket on sides on the upper tray. Holes are located in the bottom of the upper tray 41. Coolant drips through the holes into a lower tray 45. The lower tray acts as a sump as described above. A sump pump recirculates the coolant to the reservoir 42. Once recirculated to top “reservoir tray” from “tray 2”, (reservoir tray is also covered in cooling blanket on all 6 sides) and performs final additional cooling before being dripped over radiators with cooling blanket coverings. By the time the coolant is circulated completely, the coolant (water) is cooled to wet bulb temp meaning it cannot be cooled any further without changing humidity or air pressure.

A close-up view of the upper tray 43 and lower tray 44 are shown in FIG. 7b. In this version of the invention, two trays are used to cool the coolant. It will be apparent to those of skill in the art that additional trays can also be used, according to the thermal needs of the coolant and apparatus being cooled.

Referring again to the Figures, the operation of the enclosure will now be described. The coolant enters the enclosure through the entry port, as described above. A second quantity of coolant is place in the reservoir tray. The holes in the bottom of the reservoir allow the coolant to drip onto the radiators and the thermal blanket. The air from the fans causes heat to be transferred away. The coolant from the reservoir collects in the sump and is recirculated as discussed above.

The coolant then exits the enclosure and passes back to the apparatus as shown in FIG. 1.

While the specification describes particular embodiments of an evaporative cooling system, those of ordinary skill can devise variations of the present invention without departing from the overall inventive concept. The foregoing description is therefore to be understood as illustrative in nature and an example of embodiments of the invention. The full scope of the present invention is limited only by the following claims.