VIBRATORY POLISHERS HAVING ATTACHED COVERS

Description

RELATED APPLICATIONS

The present application claims the benefit of U.S. Provisional Patent Application Ser. No. 63/739,961, filed Dec. 30, 2024, entitled “VIBRATORY POLISHERS HAVING ATTACHED COVERS.” The entirety of U.S. Provisional Patent Application Ser. No. 63/739,961 is expressly incorporated herein by reference.

FIELD OF THE DISCLOSURE

This disclosure relates generally to vibratory polishers and, more particularly, to vibratory polishers having attached covers.

BACKGROUND

Grinding and polishing operations are performed on specimens for numerous purposes and across a vast array of sectors and industries. In some applications, surface preparation of a specimen by grinding/polishing operations are performed by grinding/polishing devices. For instance, a specimen can be contained in a sample holder, and be polished by traveling through a polishing fluid.

SUMMARY

Vibratory polishers having attached covers are disclosed, substantially as illustrated by and described in connection with at least one of the figures, as set forth more completely in the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an example system for polishing a specimen in a sample holder, in accordance with aspects of this disclosure.

FIG. 2 illustrates a top view of the example system of FIG. 1.

FIG. 3 illustrates an example vibratory polishing system including a polishing bowl cover that is configured to be coupled to a polishing bowl, in accordance with aspects of this disclosure.

FIG. 4 illustrates another example vibratory polishing system including a polishing bowl cover that is configured to be coupled to a polishing bowl using stretch fasteners, in accordance with aspects of this disclosure.

FIG. 5 illustrates an example vibratory polishing system including a polishing bowl cover that is configured to be coupled to a polishing bowl via a friction fit, in accordance with aspects of this disclosure.

FIG. 6 illustrates an example vibratory polishing system including a polishing bowl cover that is configured to be coupled to a polishing bowl using electromagnets, in accordance with aspects of this disclosure.

FIG. 7 illustrates an example vibratory polishing system including a polishing bowl cover that is configured to be coupled to a polishing bowl using magnets, in accordance with aspects of this disclosure.

FIG. 8 illustrates an example vibratory polishing system including a polishing bowl cover that is configured to be coupled to a polishing bowl using a bayonet-style connection, in accordance with aspects of this disclosure.

FIG. 9 illustrates an example vibratory polishing system including a polishing bowl cover that is configured to be coupled to a polishing bowl using a threaded connection, in accordance with aspects of this disclosure.

FIG. 10 illustrates an example vibratory polishing system including a polishing bowl cover that is configured to be coupled to a polishing bowl using fasteners coupled to the platen, in accordance with aspects of this disclosure.

The figures are not necessarily to scale. Wherever appropriate, similar or identical reference numerals are used to refer to similar or identical components.

DETAILED DESCRIPTION

The disclosed polishing systems and methods employ a polishing system to perform a polishing operation on one or more samples. The polishing system may be a vibratory polishing system that includes a platen on which a sample, a set of samples, and/or a sample holder (e.g., a puck) are placed. During a polishing operation, the platen holds a polishing fluid and serves as a polishing surface upon which the samples move. For example, a vibratory device, such as a vibrating bowl, supports or is otherwise connected to the platen, causing the samples to traverse the polishing fluid (e.g., an abrasive fluid) on the vibrating polishing surface. The samples tend to rotate about an inner circumference of the platen (enclosed by one or more bumpers), thereby polishing the samples.

Conventional vibratory polishing systems include a cover which can be removed or raised to permit access to the polishing surface for insertion and/or removal of the samples. However, conventional vibratory polishing systems are subject to significant vibration noise from the cover, as well as significant evaporation of the polishing fluid which can diminish the effectiveness of the polishing process and/or require excess polishing fluid to be consumed.

Disclosed example vibratory polishing systems include a cover which is coupled to the polishing bowl in which the samples are contained for polishing. In some examples, the cover is secured, attached, or otherwise coupled to the vibratory bowl itself. Disclosed example vibratory polishing systems having coupled covers reduce an interior volume within the cover, which reduces the evaporation of the polishing fluid. Disclosed example vibratory polishing systems having coupled covers further reduce the vibration noise generated by the cover during operation of the vibratory polishing system.

According to aspects of this disclosure, example vibratory polisher systems include: a polishing bowl; a polishing bowl cover coupled to the polishing bowl and configured to enclose an interior of the polishing bowl; and a vibration actuator configured to vibrate the polishing bowl and the polishing bowl cover.

In some example vibratory polisher systems, the polishing bowl cover further includes a lid. In some example vibratory polisher systems, the lid is coupled to the polishing bowl cover via a hinge. In some example vibratory polisher systems, the lid includes a latch configured to secure the lid in a closed position during operation of the vibratory polisher system. In some example vibratory polisher systems, the lid includes a gasket configured to seal the polishing bowl during operation of the vibratory polisher system.

In some example vibratory polisher systems, the polishing bowl is configured to receive a polishing cloth, and the vibratory polisher system further includes a compression ring coupled to the polishing bowl to secure the polishing cloth within the polishing bowl. Some example vibratory polisher systems further include a platen coupled to the vibration actuator, in which the platen is configured to mount the polishing bowl. Some example vibratory polisher systems further include a plurality of bolts extending from a top surface of the platen and configured to secure the polishing bowl and the polishing bowl cover to the platen. In some example vibratory polisher systems, the polishing bowl and the polishing bowl cover each include a plurality of holes configured to receive the plurality of bolts extending from the top surface of the platen, and a plurality of hand-nuts configured for hand-tightening and hand-loosening the polishing bowl cover to the polishing bowl when the bolts are extended through the plurality of holes.

In some example vibratory polisher systems, the polishing bowl cover is coupled to the polishing bowl via a friction fit. Some example vibratory polisher systems further include a gasket configured to be compressed between the polishing bowl cover and the polishing bowl, the gasket being positioned around an outer circumferential surface of the polishing bowl cover or the polishing bowl.

Some example vibratory polisher systems further include a plurality of stretch fasteners configured to secure the polishing bowl cover to the polishing bowl. Some example vibratory polisher systems further include a compression ring coupled to the polishing bowl. In some example vibratory polisher systems, the compression ring is integral to the polishing bowl cover. Some example vibratory polisher systems further include a first plurality of magnets attached to the at least one of the polishing bowl or the polishing bowl cover, and configured to secure the polishing bowl cover to the polishing bowl.

In some example vibratory polisher systems, the polishing bowl includes at least one of a ferrous locking strip or a second plurality of magnets, in which the first plurality of magnets are configured to secure the polishing bowl cover to the polishing bowl in cooperation with the least one of the ferrous locking strip or the second plurality of magnets. In some example vibratory polisher systems, the polishing bowl and the polishing bowl cover include a bayonet-style attachment configured to secure the polishing bowl cover to the polishing bowl.

Some example vibratory polisher systems further include an electromagnet configured to selectively secure the polishing bowl cover to the polishing bowl. Some example vibratory polisher systems further include control circuitry configured to: control operation of the vibration actuator; control the electromagnet to secure the polishing bowl cover to the polishing bowl while the vibration actuator is operating; and control the electromagnet to release the polishing bowl cover while the vibration actuator is not operating. In some example vibratory polisher systems, the polishing bowl cover and the polishing bowl have a threaded connection.

As used herein, the word “exemplary” means “serving as an example, instance, or illustration.” The embodiments described herein are not limiting, but rather are exemplary only. It should be understood that the described embodiments are not necessarily to be construed as preferred or advantageous over other embodiments. Moreover, the term “embodiments” does not require that all disclosed embodiments include the discussed feature, advantage, or mode of operation.

As utilized herein, “and/or” means any one or more of the items in the list joined by “and/or”. As an example, “x and/or y” means any element of the three-element set {(x), (y), (x, y)}. In other words, “x and/or y” means “one or both of x and y”. As another example, “x, y, and/or z” means any element of the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)}. In other words, “x, y and/or z” means “one or more of x, y and z”. As utilized herein, the term “exemplary” means serving as a non-limiting example, instance, or illustration. As utilized herein, the terms “e.g.” and “for example” set off lists of one or more non-limiting examples, instances, or illustrations.

For the purpose of promoting an understanding of the principles of the claimed technology and presenting its currently understood, best mode of operation, reference will be now made to the embodiments illustrated in the drawings and specific language will be used to describe the same. It will nevertheless be understood that no limitation of the scope of the claimed technology is thereby intended, with such alterations and further modifications in the illustrated device and such further applications of the principles of the claimed technology as illustrated therein being contemplated as would typically occur to one skilled in the art to which the claimed technology relates.

FIG. 1 shows an example polishing system 100 includes a sample holder 104 to support a sample 101 to be subject to a treatment operation, such as polishing and/or grinding. FIG. 2 illustrates a top view of the example system 100 of FIG. 1.

A housing 106 includes a platen 102, which is configured to actuate a polishing bowl 112. In some examples, the polishing bowl 112 is detachably attached to the platen 102. In other examples, the polishing bowl 112 is integral to the platen 102.

The polishing bowl 112 can receive the sample holder 104 containing the sample 101, and/or the sample 101 itself. The polishing bowl 112 contains the sample holder 104 and, in some examples, a polishing surface and/or a polishing fluid to enhance the polishing operation. During a polishing operation, the sample 101 undergoes polishing by relative movement between the sample 101 and a polishing surface (e.g., a polishing cloth). In some examples, a motor or other vibration actuator 108 (e.g., an electromechanical magnetic actuator, a solenoid, etc.) is arranged in the housing 106 and operable to vibrate the platen 102 and the polishing bowl 112. The vibration of the polishing bowl 112 further causes vibration, rotation, and/or other movement of the sample 101 and/or sample holder 104. In some examples, the platen 102, border 109, and/or polishing bowl 112 are configured to be removed from the housing 106.

As shown rotational movement of the sample holders 104 (according to arrow 105) causes the sample holders 104 to traverse the platen 102 (e.g., in direction 107) by contact with a support, wall, or border 109 about the platen 102 (e.g., a wall of the polishing bowl 112). In some examples, control circuitry 114 controls one or more parameters of the polishing operation in response to the movement data. For example, the control circuitry 114 can increase and/or decrease a speed of the sample holders 104 about the platen 102 (e.g., by controlling the actuator 108). This can include stopping movement altogether.

The control circuitry 114 may further control the user interface 116 to display information regarding a duration, number of rotations, and/or an estimate of polishing progress during the polishing operation. In some examples, the control circuitry 114 is connected to a remote device (e.g., a tablet, a smartphone, a network, remote computer, etc.), and information can be transmitted (via wires or wirelessly) to such a device.

The control circuitry 114 includes a processor, which may be a general-purpose central processing unit (CPU). In some examples, the control circuitry 114 may be implemented using, or include, one or more specialized processing units, such as FPGA, RISC processors with an ARM core, graphic processing units, digital signal processors, and/or system-on-chips (SoC). The control circuitry 114 executes machine-readable instructions that may be stored locally at the control circuitry 114 (e.g., in an included cache or SoC), in a random access memory (or other volatile memory), in a read-only memory (or other non-volatile memory such as FLASH memory), and/or in a mass storage device. Example mass storage devices include a hard drive, a solid-state storage drive, a hybrid drive, a RAID array, and/or any other mass data storage device.

FIG. 3 illustrates an example vibratory polishing system 300 including a polishing bowl cover that is configured to be coupled to a polishing bowl. The example vibratory polishing system 300 may include some or all of the elements of the system 100 of FIGS. 1 and 2. For example, the system 300 includes the housing 106, the platen 102, and the polishing bowl 112 of FIG. 1.

The example system 300 of FIG. 3 further includes a compression ring 302, which has a mounting flange 304. The compression ring 302 is inserted into the polishing bowl 112 after a polishing cloth has been placed into the polishing bowl 112. The compression ring 302 has a diameter that exceeds the diameter of a polishing surface onto which the polishing cloth is placed, and holds the polishing cloth in the polishing bowl 112. In some examples, the insertion of the compression ring 302 into the polishing bowl 112 places tension on the polishing cloth (e.g., to obtain a substantially uniform surface of the polishing cloth over the polishing surface). The mounting flange 304 of the compression ring 302 may be detachably attached to the polishing bowl 112 to hold the compression ring 302 and the polishing cloth in place in spite of vibrations of the polishing bowl 112.

The example system 300 further includes a polishing bowl cover 306 configured to be coupled to the polishing bowl 112. When coupled to the polishing bowl 112, the polishing bowl cover 306 encloses an interior of the polishing bowl 112. When the actuator 108 vibrates the polishing bowl 112 via the platen 102, the polishing bowl cover 306 is also vibrated.

In the example of FIG. 3, the platen 102 includes multiple fasteners 308 (e.g., bolts) extending from the surface of the platen 102. The polishing bowl 112, the compression ring 302, and the polishing bowl cover 306 each include through-holes 310 at positions aligned with the fasteners 308, such that the polishing bowl 112, the compression ring 302, and the polishing bowl cover 306 are installed onto the fasteners 308. When the polishing bowl 112, the compression ring 302, and the polishing bowl cover 306 have been placed onto the fasteners 308, the polishing bowl 112, the compression ring 302, and the polishing bowl cover 306 may be tightened by installing hand-nuts 312 (or other type of nut) and securing (e.g., tightening) the hand-nuts 312.

The polishing bowl cover 306 may be removed to permit access to the interior of the polishing bowl 112 by removing the hand-nuts 312. Additionally or alternatively, the example polishing bowl cover 306 may include a removable lid 314. The example removable lid 314 is removably attached to a top of the polishing bowl cover 306. In some examples, the removable lid 314 is attached via a friction fit, a threaded fit, and/or via any other type of coupling. The removable lid 314 and/or the polishing bowl cover 306 may include a vibration damper at the interface between the lid 314 and the polishing bowl cover 306.

FIG. 4 illustrates another example vibratory polishing system 400 including a polishing bowl cover 404 that is configured to be coupled to a polishing bowl 112 using stretch fasteners. The example vibratory polishing system 400 may include some or all of the elements of the system 100 of FIGS. 1 and 2. For example, the system 400 includes the housing 106, the platen 102, and the polishing bowl 112 of FIG. 1. The example system 400 further includes the compression ring 302 of FIG. 3.

Instead of bolts or other hardware, the example system 400 of FIG. 4 includes stretch fasteners 402 which can be stretched and relaxed to secure components. For example, each of the polishing bowl 112, the compression ring 302, and a polishing bowl cover 404 may include slots 408 instead of the holes 310 of FIG. 3. To couple the polishing bowl 112, the compression ring 302, and the polishing bowl cover 404 to the platen 102, the stretch fasteners 402 are stretched and a narrow portion 406 of the stretch fastener 402 is fit into corresponding slots 408 in each of the polishing bowl 112, the compression ring 302, and the polishing bowl cover 404. Corresponding slots 408 of the polishing bowl 112, the compression ring 302, and the polishing bowl cover 404 are aligned for insertion of the stretch fastener 402 into each set of slots 408.

When the stretch fastener 402 has been inserted into the corresponding slots 408, the stretch fastener 402 may be released to allow a retention portion 410 of the stretch fastener 402 to engage an upper surface 412 of the polishing bowl cover 404. The tension in the narrow portion 406 of the stretch fastener 402 pulls the polishing bowl 112, the compression ring 302, and the polishing bowl cover 404 toward the platen 102.

While the example of FIG. 4 includes T-shaped stretch fasteners, in other examples the stretch fasteners may be implemented using stretchable cords or other elastic fastening techniques.

The polishing bowl cover 404 further includes a lid 414. In the example of FIG. 4, the lid 414 is coupled to the polishing bowl cover 404 via a hinge 416 to allow the lid 414 to be easily moved and replaced for access to the interior of the polishing bowl 112. The polishing bowl cover 404 further includes a latch 418 or other device to releasably secure the lid 414 in a closed position (e.g., to reduce evaporation of the polishing fluid within the polishing bowl 112). The latch 418 may be implemented using any appropriate type of latching device, and the hinge 416 may be implemented using any appropriate type of hinge to couple the lid 414 to the polishing bowl cover 404.

FIG. 5 illustrates another example vibratory polishing system 500, including a polishing bowl cover that is configured to be coupled to a polishing bowl via a friction fit. The example vibratory polishing system 500 may include some or all of the elements of the system 100 of FIGS. 1 and 2. For example, the system 500 includes the housing 106, the platen 102, and the polishing bowl 112 of FIG. 1. The example system 500 further includes the compression ring 302, the fasteners 308, and the hand-nuts 312 of FIG. 3.

In the example of FIG. 5, the fasteners 308 and the hand-nuts 312 (or other types of fasteners) couple the compression ring 302 and the polishing bowl 112 to the platen 102. The system 500 further includes a polishing bowl cover 502 configured to have a friction fit with the compression ring 302 and/or the polishing bowl 112. For example, the inner diameter of the polishing bowl cover 502 is formed to be substantially the same as the outer diameter of the compression ring 302 and/or the polishing bowl 112, or slightly bigger than the outer diameter of the compression ring 302 and/or the polishing bowl 112 so as to increase the ease of placement and removal of the polishing bowl cover 502.

In the example of FIG. 5, the polishing bowl 112 is further provided with a gasket 504, such as an O-ring or other compressible gasket 504, around an outer circumference of the polishing bowl 112. The gasket 504 may be compressed between the polishing bowl 112 and the polishing bowl cover 502 to hold the polishing bowl cover 502 in place during vibration of the polishing bowl 112.

In some examples, the polishing bowl 112, the compression ring 302, and the polishing bowl cover 502 are a non-circular shape (e.g., square, elliptical, polygonal, etc.) to prevent rotation of the polishing bowl cover 502 with respect to the polishing bowl 112. Additionally or alternatively, the polishing bowl 112, the compression ring 302, and/or the polishing bowl cover 502 may include keying features, such as tabs and corresponding slots, to prevent rotation of the polishing bowl cover 502 with respect to the polishing bowl 112.

FIG. 6 illustrates an example vibratory polishing system 600 including a polishing bowl cover that is configured to be coupled to a polishing bowl using electromagnets. The example vibratory polishing system 600 may include some or all of the elements of the system 100 of FIGS. 1 and 2. For example, the system 600 includes the housing 106, the platen 102, and the polishing bowl 112 of FIG. 1. The example system 500 further includes the compression ring 302 of FIG. 3.

In the example of FIG. 6, the polishing bowl 112 includes one or more electromagnetic coils 602 configured to selectively secure a polishing bowl cover 604 to the polishing bowl 112. In the example of FIG. 6, the polishing bowl cover 604 includes one or more magnetic targets 606 to be attracted to the electromagnetic coils 602. For example, the magnetic targets 606 may be permanent magnets, separate pieces of ferrous material, contiguous strips of ferrous material extending around the circumference of the polishing bowl cover 604, or any other material that can be attracted to generate a force to couple the polishing bowl cover 604 to the polishing bowl 112.

The example control circuitry 114 is coupled to the electromagnetic coils 602 to control the force generated by the electromagnetic coils 602. For example, while the vibration actuator 108 is operating to vibrate the platen 102, the control circuitry 114 controls the electromagnetic coils 602 to secure the polishing bowl cover 604 to the polishing bowl 112 by controlling coil driver circuitry 608 to conduct current through the coils 602. When the polishing bowl cover 604 and the magnetic targets 606 are placed on the polishing bowl 112, the magnetic field generated by the coils 602 generate an attractive force that pulls the targets 606 toward the electromagnetic coils 602, thereby retaining the polishing bowl cover 604 in contact with the polishing bowl 112.

Conversely, while the vibration actuator 108 is not operating, the control circuitry 114 may control the electromagnetic coils 602 to turn off, removing the force between the polishing bowl cover 604 and the polishing bowl 112 and allowing removal of the polishing bowl cover 604 with significantly less force.

The driver circuitry 608 may include any type of power conversion circuitry or power supply circuitry to convert input power to output a coil current, and output the coil current to the coils 602. For example, the driver circuitry 608 may include AC-DC conversion circuitry and/or DC-DC conversion circuitry, such as switched-mode power supplies, step-up converters, step-down converters, forward converters, flyback converters, and/or any other type of conversion circuitry. In some examples, all or a portion of the driver circuitry 608 may be integrated into the control circuitry 114, such as by including the driver circuitry 608 in a same semiconductor package as the control circuitry 114, and/or may be implemented on a same printed circuit board as the control circuitry 114.

FIG. 7 illustrates an example vibratory polishing system 700 including a polishing bowl cover that is configured to be coupled to a polishing bowl using magnets. The example vibratory polishing system 700 may include some or all of the elements of the system 100 of FIGS. 1 and 2. For example, the system 700 includes the housing 106, the platen 102, and the polishing bowl 112 of FIG. 1. The example system 700 further includes the compression ring 302 of FIG. 3.

The example vibratory polishing system 700 of FIG. 7 is similar to the example system 600 of FIG. 6. However, instead of electromagnetic coils 602 to generate the attractive force between the polishing bowl cover and the polishing bowl, the example system 700 includes a first set of permanent magnets 702 on one of the polishing bowl 112 or a polishing bowl cover 704, and a second set of permanent magnets and/or a ferrous target material on the other of the polishing bowl 112 or a polishing bowl cover 704. In the illustrated example, the polishing bowl cover 704 includes the first set of permanent magnets 702 arranged around a circumference of the polishing bowl cover 704. The polishing bowl 112 includes a strip of ferrous material 706 arranged on the upper surface of the polishing bowl 112. However, as mentioned above, the strip of ferrous material 706 may be replaced with individual pieces of ferrous material and/or a second set of magnets, arranged to align with the arrangement of the magnets 702.

When the polishing bowl cover 704 is placed onto the polishing bowl 112, the magnets 702 are attracted to the ferrous material 706 and create an attractive force that holds the polishing bowl cover 704 in place. In examples in which both the polishing bowl cover 704 and the polishing bowl 112 include a corresponding set of magnets, the attractive force between the magnets may further reduce the likelihood of rotation of the polishing bowl cover 704 with respect to the polishing bowl 112. The polishing bowl cover 704 may be removed from the polishing bowl 112 by lifting the polishing bowl cover 704.

In the example of FIGS. 6 and 7, the polishing bowl 112 may be secured to the platen 102 using a different attachment system than the permanent magnets or electromagnets used to secure the polishing bowl cover 604, 704. For example, the polishing bowl 112 may be secured to the platen 102 using the bolts and hand-nuts (or other fasteners) as described above, and the electromagnetic coils 602 or permanent magnets 702 to secure the polishing bowl cover 604, 704 to the polishing bowl 112 are positioned between ones of the fasteners securing the polishing bowl 112 to the platen 102. In some other examples, the polishing bowl 112 may be attached to the platen 102 using other types of connections, such as threaded connections, bayonet-style or other twist connections, and/or any other type of connection that does not interfere with the electromagnetic force between the polishing bowl cover 604, 704 and the electromagnetic coils 602 or permanent magnets 702.

FIG. 8 illustrates an example vibratory polishing system 800 including a polishing bowl cover that is configured to be coupled to a polishing bowl using a bayonet-style connection. The example vibratory polishing system 800 may include some or all of the elements of the system 100 of FIGS. 1 and 2. For example, the system 800 includes the housing 106, the platen 102, and the polishing bowl 112 of FIG. 1. The example system 800 further includes the compression ring 302 of FIG. 3.

The example system 800 of FIG. 8 includes a polishing bowl cover 802 that fits over the compression ring 302 and the polishing bowl 112, in a similar manner as described above with reference to FIG. 5. The polishing bowl cover 802 may have a friction fit with the compression ring 302 and/or the polishing bowl 112. The polishing bowl cover 802 further includes a bayonet-style attachment, including one or more slots 804 in the polishing bowl cover 802 that engage one or more corresponding posts 806 on the polishing bowl 112. In the example of FIG. 8, the polishing bowl cover 802 is placed down onto the polishing bowl 112 such that the openings of the slots 804 engage with the posts 806. The polishing bowl cover 802 is moved further down, and then twisted with respect to the polishing bowl 112 to move the posts 806 along lateral portions of the slots 804, and then moved down to a locking portion of the slots 804 that reduce the likelihood that the polishing bowl cover 802 can be vibrated out of place.

FIG. 9 illustrates an example vibratory polishing system including a polishing bowl cover that is configured to be coupled to a polishing bowl using a threaded connection. The example vibratory polishing system 900 may include some or all of the elements of the system 100 of FIGS. 1 and 2. For example, the system 900 includes the housing 106, the platen 102, and the polishing bowl 112 of FIG. 1. The example system 900 further includes the compression ring 302 of FIG. 3.

The example system 900 of FIG. 9 includes a polishing bowl cover 902 that fits over the compression ring 302 and the polishing bowl 112, in a similar manner as described above with reference to FIG. 5. In contrast with the friction fit described above, the example polishing bowl cover 902 includes internal threads 904, which are configured to engage with external threads 906 on the polishing bowl 112. For example, the polishing bowl cover 902 may be placed over the compression ring 302 and the polishing bowl 112, and then turned to thread the polishing bowl cover 902 onto the polishing bowl 112. In some examples, a portion of the internal threads 904 and the external threads 906 are interfering, to cause the polishing bowl cover 902 to be secured to the polishing bowl 112 and reduce the likelihood of loosening of the polishing bowl cover 902.

FIG. 10 illustrates an example vibratory polishing system including a polishing bowl cover that is configured to be coupled to a polishing bowl using fasteners coupled to the platen. The example vibratory polishing system 1000 may include some or all of the elements of the system 100 of FIGS. 1 and 2. For example, the system 1000 includes the housing 106, the platen 102, and the polishing bowl 112 of FIG. 1. The example system 1000 further includes the compression ring 302 of FIG. 3.

The example system 1000 of FIG. 9 includes a polishing bowl cover 1002 that is secured to the platen 102 with the compression ring 302 and the polishing bowl 112, in a similar manner as described above with reference to FIG. 3. In the example of FIG. 10, the platen 102 includes fastener holes 1004, and corresponding bolts 1006 are inserted through holes in the cover 1002, the compression ring 302, and the polishing bowl 112 and secured to the fastener holes 1004. The example bolts 1006 include hand nuts to enable hand tightening and loosening of the bolts 1006.

While the examples of FIGS. 5-9 illustrate covers having non-removable lids, these example implementations may be modified to include removable and/or movable lids as described with reference to FIGS. 3 and 4.

While the examples of FIGS. 5, 8, and 9 illustrate covers fitting over the compression rings and the polishing bowls, these examples may be modified to fit the covers on an interior of the compression rings and the polishing bowls by reversing the interior/exterior placement or configuration of the securing features on the polishing bowls and the polishing bowl covers. For example, the polishing bowl cover 902 may be configured with exterior threading and the compression ring and/or the polishing bowl is configured with interior threading. In another example, the posts 806 may be position on an interior circumference of the polishing bowl 112 to engage the slots 804, while the polishing bowl cover 802 has a smaller diameter to fit within the interior circumference of the compression ring 302 and/or the polishing bowl 112.

Furthermore, while the examples disclosed above with reference to FIGS. 3-9 include a separate compression ring, any of these examples may be modified to omit the compression ring and/or to integrate the compression ring into the polishing bowl cover. In examples in which the compression ring is omitted, other techniques to secure the polishing cloth may be used, and the polishing bowl cover may be coupled directly to the polishing bowl.

The polishing bowl covers of the disclosed examples may be constructed using any desired material. In some examples, the polishing bowl covers are constructed using acrylic, polycarbonate, glass, and/or any other rigid, transparent materials having sufficient structural integrity to enable viewing of the samples during operation. However, other materials, including opaque materials, may also be used.

The present methods and systems may be realized in hardware, software, and/or a combination of hardware and software. Example implementations include an application specific integrated circuit and/or a programmable control circuit.

The foregoing description and accompanying figures illustrate the principles, preferred embodiments, and modes of operation. However, the disclosure should not be construed as being limited to the particular embodiments discussed above. Additional variations of the embodiments discussed above will be appreciated by those skilled in the art.

While the present method and/or system has been described with reference to certain implementations, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the present method and/or system. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the present disclosure without departing from its scope. For example, block and/or components of disclosed examples may be combined, divided, re-arranged, and/or otherwise modified. Therefore, the present method and/or system are not limited to the particular implementations disclosed. Instead, the present method and/or system will include all implementations falling within the scope of the appended claims, both literally and under the doctrine of equivalents. While the controllers and methods are described as being employed in connection with a grinding/polishing and/or hardness/density testing systems, the teachings may be similarly applied to other systems and operations.