Published: 2009-10-01 Assignee: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., Fu Zhun Precision Industry (ShenZhen) Co., Ltd., Foxconn Technology Co., Ltd..
US20090242168A1
Mechanical engineering
Heat sink assembly and method for manufacturing the same
A heat sink assembly is designed to cool electronic devices like CPUs that generate a lot of heat. It consists of a base, a group of fins, and a heat pipe that connects these parts together. Each fin has a T-shaped recess at the bottom, allowing the base to fit snugly into them. The heat pipe has two sections: one that absorbs heat from the base and another that releases it through the fins. This design helps to lower production costs while maintaining effective heat dissipation.