Explore the 8,690 U.S. Patent Applications published on the 37th week of 2014, including 6,108 applications that subsequently received a Patent Grant.
Method of fabricating interconnect structure for package-on-package devices
An interconnect structure and a method of forming an interconnect structure are provided. The interconnect structure is formed over a carrier substrate, upon which a die may also be attached. Upon removal of the carrier substrate and singulation, a first package is formed. A second package may be attached to the first package, wherein the second package may be electrically coupled to through vias formed in the first package.
Published: 2014-09-11 Assignee: ETHICON ENDO-SURGERY, INC..
Detachable motor powered surgical instrument
A detachable motor-powered surgical instrument is disclosed. The instrument may include a housing that includes at least one engagement member for removably attaching the housing to an actuator arrangement. A motor is supported within the housing for supplying actuation motions to various portions of a surgical end effector coupled to the housing. The housing may include a contact arrangement that is configured to permit power to be supplied to the motor only when the housing is operably attached to the actuator arrangement.
Published: 2014-09-11 Assignee: ETHICON ENDO-SURGERY, INC..
Detachable motor powered surgical instrument
A detachable motor-powered surgical instrument. The instrument may include a housing that includes at least one engagement member for removably attaching the housing to an actuator arrangement. A motor is supported within the housing for supplying actuation motions to various portions of a surgical end effector coupled to the housing. The housing may include a contact arrangement that is configured to permit power to be supplied to the motor only when the housing is operably attached to the actuator arrangement.
Published: 2014-09-11 Assignee: ETHICON ENDO-SURGERY, INC..
Detachable motor powered surgical instrument
A detachable motor-powered surgical instrument is disclosed. The instrument may include a housing that includes at least one engagement member for removably attaching the housing to an actuator arrangement. A motor is supported within the housing for supplying actuation motions to various portions of a surgical end effector coupled to the housing. The housing may include a contact arrangement that is configured to permit power to be supplied to the motor only when the housing is operably attached to the actuator arrangement.
Published: 2014-09-11 Assignee: Covidien LP.
Staple cartridge with shipping wedge
An end effector usable with a surgical instrument includes a first jaw pivotably coupled to a second jaw. The first jaw includes staple forming depressions. A staple cartridge is releasably attachable to a channel of the second jaw. A plurality of staples is disposed in the staple cartridge. A shipping wedge is releasably attached to the staple cartridge. The shipping wedge maintains the staples in their respective retention slots and is usable to separate the staple cartridge from the channel of the second jaw.
Published: 2014-09-11 Assignee: ETHICON ENDO-SURGERY, INC., Ethicon Endo-Surgery, LLC.
Staple cartridge comprising multiple regions
A staple cartridge includes a plurality of staples, wherein each said staple comprises a base and a deformable leg extending from said base. The staple cartridge further includes a first region comprising a first density, a second region, and a third region comprising a density greater than said first density, wherein said third region is separable into a plurality of pieces.
Published: 2014-09-11 Assignee: ETHICON ENDO-SURGERY, INC., Ethicon LLC.
Tissue thickness compensator for surgical staplers
A fastener cartridge is disclosed which comprises a cartridge body, a deck, a plurality of fastener cavities, and a plurality of fasteners removably stored within the fastener cavities. The fastener cartridge further comprises a tissue thickness compensator positioned over the fastener cavities configured to be captured within the fasteners, wherein the tissue thickness compensator is configured to adapt to the thickness of the tissue captured within the fasteners. The tissue thickness compensator comprises a first compression zone having a first set of material properties and a second compression zone having a second set of material properties, wherein a property in the first set of material properties is different than a corresponding property in the second set of material properties.
Published: 2014-09-11 Assignee: Covidien LP.
End effector identification by mechanical features
According to one aspect of the present disclosure, a surgical instrument is disclosed. The instrument includes a handle portion, a body portion extending distally from the handle portion and defining a first longitudinal axis and a loading unit. The loading unit includes a tool assembly, the loading adapted to be coupled to the body portion. The instrument also includes a sensor tube movably positioned within the body portion, the sensor tube adapted to engage the loading unit and a load switch coupled to a microcontroller. The load switch is adapted to be actuated by the sensor tube when the sensor tube is engaged by the loading unit being inserted into the body portion.
Published: 2014-09-11 Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD..
Structure and method for 3D IC package
Provided is a chip package structure and a method for forming the chip package. The method includes bonding a plurality of first dies on a carrier, encapsulating in a first molding compound the first dies on the carrier, coupling a plurality of second dies on the first dies using conductive elements, adding an underfill between the second dies and the first dies surrounding the conductive elements, and encapsulating in a second molding compound the second dies and the underfill. The chip package comprises a chip encapsulated in a molding compound, and a larger chip coupled to the first chip via conductive elements, wherein the conductive elements are encapsulated in an underfill between the chip and the larger chip without an interposer, and wherein the larger chip and the underfill are encapsulated in a second molding compound in contact with the molding compound.
Published: 2014-09-11
UNMANNED DRONE, ROBOT SYSTEM FOR DELIVERING MAIL, GOODS, HUMANOID SECURITY, CRISIS NEGOTIATION, MOBILE PAYMENTS, SMART HUMANOID MAILBOX AND WEARABLE PERSONAL EXOSKELETON HEAVY LOAD FLYING MACHINE
Provided is a system and method for delivering mail and goods using a mobile robot drone system. The method may comprise self-moving the mobile robot drone system to a mail or goods receiving location. Data on the mail or goods receiving location and mail or goods to deliver id received from a user. Itinerary to the mail or goods receiving location is determined based on itinerary data received from a GPS unit. In the location, the mobile robot drone system receives the mail or goods via a mail and goods compartment and then delivers the mail or goods to a predefined location. Based on user instructions, the mobile robot drone system electronically signs receipt verification documents or performs payment by displaying a payment barcode encoding user payment information. After delivering the mail or goods, the mobile robot drone system provides access to the mail and goods compartment.