Fully encapsulated electronics and printed circuit boards

A method of encapsulating and hermetically sealing a printed circuit board of a flex cable includes: positioning a printed circuit board portion of a flex cable into a channel defined in a first mold half of a mold, the printed circuit board portion including a substrate and electronic components mounted on the substrate; mounting a second mold half onto the first mold half to enclose the channel of the first mold half and form a cavity within the mold; and filling the cavity of the mold with an encapsulation material through an inlet opening defined through the mold.

Technologies to authorize user equipment use of local area data network features and control the size of local area data network information in access and mobility management function

Systems, apparatuses, methods, and computer-readable media are provided for indicating local area data network (LADN) data network names (DNNs). In embodiments, a user equipment (UE) provides a list of configured LADN DNNs in a registration request message during a registration procedure. An Access and Mobility Management Function (AMF) determines LADN information for the UE by looking into configured LADN DNNs in the AMF and/or retrieved LADN authorization/subscription information. The LADN information includes a list of LADN DNNs and corresponding LADN service area(s) that the UE can use, including LADN DNNs that the UE can use in a current registration area. The AMF sends the LADN information to the UE in a registration accept message. Other embodiments may be described and/or claimed.

Method for forming vertical spacers for spacer-defined patterning

A method of forming vertical spacers for spacer-defined multiple patterning, includes: depositing a first conformal pattern-transfer film having a first film stress, and continuously depositing a second conformal pattern-transfer film having a second film stress on a template; dry-etching the template except for a core material and a vertical portion of the first and second pattern-transfer films to form vertical spacers; and dry-etching the core material, forming a vacant space between the vertical spacers, wherein by adjusting the difference in film stress between the first and second pattern-transfer films, the leaning angle of the spacers is adjusted.

Guided wave communication system with interference mitigation and methods for use therewith

Aspects of the subject disclosure may include, for example, generating electromagnetic waves that convey data, receiving a wireless signal generated by a communication device, determining that the wireless signal is transmitted during a first resource block used for transport of the electromagnetic waves that convey the data, detecting an interference condition caused by the wireless signal, and adjusting the electromagnetic waves to generate adjusted electromagnetic waves that convey the data in a second resource block that does not overlap with the first resource block. Other embodiments are disclosed.

Control signaling for uplink multiple input multiple output, channel state information reference signal configuration and sounding reference signal configuration

Systems, apparatuses, methods, and computer-readable media are provided for time domain resource allocations in wireless communications systems. Disclosed embodiments include time-domain symbol determination and/or indication using a combination of higher layer and downlink control information signaling for physical downlink shared channel and physical uplink shared channel; time domain resource allocations for mini-slot operations; rules for postponing and dropping for multiple mini-slot transmission; and collision handling of sounding reference signals with semi-statically or semi-persistently configured uplink transmissions. Other embodiments may be described and/or claimed.

Systems and methods to correct for uncommanded instrument roll

Certain aspects relate to systems, methods, and techniques for correcting for uncommanded instrument roll. A method for adjusting a controller-feedback system in a medical instrument may comprise receiving data from a sensor at or near a distal end of the instrument, determining a tip frame of reference based on the data from the sensor, the tip frame of reference representing a current orientation of the distal end of the instrument, obtaining a desired frame of reference, determining an adjustment to a visual frame of reference or a control frame of reference based on the tip frame of reference and the desired frame of reference, and transforming the visual frame of reference or the control frame of reference.

Highly etch selective amorphous carbon film

Implementations described herein generally relate to the fabrication of integrated circuits. More particularly, the implementations described herein provide techniques for deposition of amorphous carbon films on a substrate. In one implementation, a method of forming an amorphous carbon film is provided. The method comprises depositing an amorphous carbon film on an underlayer positioned on a susceptor in a first processing region. The method further comprises implanting a dopant or inert species into the amorphous carbon film in a second processing region. The dopant or inert species is selected from carbon, boron, nitrogen, silicon, phosphorous, argon, helium, neon, krypton, xenon or combinations thereof. The method further comprises patterning the doped amorphous carbon film. The method further comprises etching the underlayer.

Digital assistant services based on device capabilities

Systems and processes for operating an intelligent automated assistant to provide extension of digital assistant services are provided. An example method includes, at an electronic device having one or more processors, receiving, from a first user, a first speech input representing a user request. The method further includes obtaining an identity of the first user; and in accordance with the user identity, providing a representation of the user request to at least one of a second electronic device or a third electronic device. The method further includes receiving, based on a determination of whether the second electronic device or the third electronic device, or both, is to provide the response to the first electronic device, the response to the user request from the second electronic device or the third electronic device. The method further includes providing a representation of the response to the first user.

Active adaptation of networked compute devices using vetted reusable software components

A method includes receiving a text description of a system capability request, and converting the text description into a normalized description of the system capability request. A repository is then queried, based on the normalized description and using a search algorithm, to identify multiple candidate application software units (ASUs). The candidate ASUs are displayed to a user for selection. The user-selected ASU is then deployed, either locally or to at least one remote compute device, in response to receiving the user selection. Deployment can include the user-selected candidate ASU being integrated into a local or remote software package, thus defining a modified software package that is configured to provide the system capability.

Uniform deposition of SiOC on dielectric and metal surfaces

Plasma enhanced atomic layer deposition (PEALD) processes for simultaneously depositing SiOC on two or more different surfaces of a substrate are provided. For example, SiOC may be deposited simultaneously on a first dielectric surface and a second metal or metallic surface. The PEALD processes can comprise two or more deposition cycles for forming SiOC on the two surfaces. The deposition cycles may comprise alternately and sequentially contacting the substrate with a first precursor comprising silicon and a second plasma reactant, such as an Ar/H2 plasma. In some embodiments, a PEALD process further comprises contacting the substrate with a plasma reactant prior to beginning the deposition cycle. In some embodiments, the deposition cycle is repeated more than 500 times and a uniform SiOC film may be formed on the two different surfaces.