Substrate processing apparatus, and method of manufacturing semiconductor device

There is provided a technique that includes: a first processing module including a first processing chamber for processing vertically arranged substrates; a second processing module including a second processing chamber for processing the substrates, the second processing chamber disposed adjacent to the first processing chamber; a first exhaust box storing a first exhaust system exhausting the first processing chamber; a second exhaust box storing a second exhaust system exhausting the second processing chamber; a common supply box controlling at least one of a flow path and a flow rate of process gases supplied into the first and second processing chambers; a first valve group connecting gas pipes from the common supply box to the first processing chamber such that a communication state is controllable; and a second valve group connecting the gas pipes from the common supply box to the second processing chamber such that a communication state is controllable.

Authenticated access and aggregation database platform

A data processing system is disclosed for data processing, including database and file management, as well accessing one or more databases or other data structures, authenticating users, and categorizing data items for addition to the database system. In some embodiments, the system may be configured to coordinate access to user account information via user-provided authentication credentials; apply account identification rules to the accessed account information to identify a plurality of accounts of the user; and initiate updates to a database record associated with the user indicative of any accounts identified.

Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics

Layer structures for making direct metal-to-metal bonds at low temperatures and shorter annealing durations in microelectronics are provided. Example bonding interface structures enable direct metal-to-metal bonding of interconnects at low annealing temperatures of 150° C. or below, and at a lower energy budget. The example structures provide a precise metal recess distance for conductive pads and vias being bonded that can be achieved in high volume manufacturing. The example structures provide a vertical stack of conductive layers under the bonding interface, with geometries and thermal expansion features designed to vertically expand the stack at lower temperatures over the precise recess distance to make the direct metal-to-metal bonds. Further enhancements, such as surface nanotexture and copper crystal plane selection, can further actuate the direct metal-to-metal bonding at lowered annealing temperatures and shorter annealing durations.

Method for detecting merchant data breaches with a computer network server

A method for minimizing merchant data breach damage depends on computers and financial networks to carry out its steps. Every payment card transaction witnessed each day by a network server is assessed by a “jury” of fraud classification algorithms and assigned a fraud-risk-verdict. Those payment transactions receiving a high-risk-fraud verdict are retained and sorted into a table according to transaction date, cardholder, and merchant. The raw verdicts are normalized and standardized according to merchant size groups, e.g., to even the comparisons that will be made. A daily tally is made for each merchant of the number of suspected-card-visits, the number of highly-probable-card-visits, and the number of total-card-visits. A merchant data-breach alert is issued if a final score and sum of the normalized verdicts exceeds a threshold.

Multiple networks for virtual execution elements

In some examples, a method includes receiving, by an orchestrator for a virtualized computing infrastructure, namespace specification data the specifies a namespace, a first virtual network for the namespace, and a second virtual network for the namespace; sending, by the orchestrator to a network controller for the virtualized computing infrastructure, based on the namespace specification data, at least one request to create, for a virtual execution element to be deployed to the namespace and instantiated in a computing device of the virtualized computing infrastructure, respective virtual network interfaces for the first virtual network and the second virtual network; and send, by the network controller to the computing device, interface configuration data to configure a first virtual network interface for the first virtual network and a second virtual network interface for the second virtual network.

CONTROL METHOD OF MULTI VOICE ASSISTANTS

A control method of multi voice assistants includes steps of (a) providing an electronic device equipped with a plurality of voice assistants, (b) activating a plurality of recognition engines corresponded to the voice assistants for making the electronic device enter a listening mode to receive at least a voice object, (c) analyzing the voice object and selecting a corresponded recognition engine from the recognition engines according to an analysis result, (d) judging whether a conversation is over, (e) modifying a plurality of recognition thresholds corresponded to the recognition engines, and (f) turning off the non-corresponded recognition engines. When the judgment of the step (d) is TRUE, the step (b) is performed after the step (d). When the judgment of the step (d) is FALSE, the step (e) and the step (f) are sequentially performed after the step (d). Therefore, the user experiences are enhanced, and the wait time is reduced.

Integrated voltage regulator and passive components

It is highly desirable in electronic systems to conserve space on printed circuit boards (PCB). This disclosure describes voltage regulation in electronic systems, and more specifically to integrating voltage regulators and associated passive components into semiconductor packages with at least a portion of the circuits whose voltage(s) they are regulating.

Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes

Structures and techniques provide bond enhancement in microelectronics by trapping contaminants and byproducts during bonding processes, and arresting cracks. Example bonding surfaces are provided with recesses, sinks, traps, or cavities to capture small particles and gaseous byproducts of bonding that would otherwise create detrimental voids between microscale surfaces being joined, and to arrest cracks. Such random voids would compromise bond integrity and electrical conductivity of interconnects being bonded. In example systems, a predesigned recess space or predesigned pattern of recesses placed in the bonding interface captures particles and gases, reducing the formation of random voids, thereby improving and protecting the bond as it forms. The recess space or pattern of recesses may be placed where particles collect on the bonding surface, through example methods of determining where mobilized particles move during bond wave propagation. A recess may be repeated in a stepped reticule pattern at the wafer level, for example, or placed by an aligner or alignment process.

Methods and systems for sample processing or analysis

The present disclosure provides methods and systems for detecting nucleic acid sequences in a biological sample having a three-dimensional matrix. The present disclosure also provides methods and systems for processing a biological sample for use in nucleic acid sequence detection.

Control of multiple engines using one or more parameters associated with the multiple engines

An engine controller to control a plurality of engines is disclosed. The engine controller may identify a plurality of engines configured to provide power to a load, wherein the plurality of engines have a first set of priorities associated with providing the power to the load; receive a plurality of parameters from a plurality of monitoring devices monitoring the plurality of engines; calculate a plurality of metrics corresponding to the plurality of engines based on the plurality of parameters; determine, based on the plurality of metrics, that a switching condition is satisfied to switch from the first set of priorities to a second set of priorities for the plurality of engines; determine the second set of priorities for the plurality of engines based on the plurality of metrics; and cause the plurality of engines to provide respective amounts of power to the load based on the second set of priorities.