Automated end effector component reloading system for use with a robotic system

A surgical instrument. The surgical instrument includes an end effector that comprises a staple channel and an anvil that is movably translatable relative to the staple channel. A tool mounting portion is configured to interface with a robotic system and operably communicate with the end effector. The instrument further includes a first sensor that has an output that represents a first condition of a portion of the robotic system. A second sensor has an output that represents a position of the anvil. A third sensor has an output that represents a position of a reciprocating knife within the end effector. An externally accessible memory device communicates with the first, second and third sensors.

Surgical anvil arrangements

A surgical stapling anvil is disclosed comprising an anvil body including a tissue-facing surface, a plurality of staple forming pockets, and a longitudinal slot. The longitudinal slot comprises a first portion configured to receive a cutting edge of a firing member therethrough and a second portion configured to receive an anvil-camming portion of the firing member therethrough. The anvil further comprises an anvil cap welded to the anvil body, wherein the anvil cap comprises a welded portion and a non-welded portion, wherein the non-welded portion comprises a non-welded width, and wherein the non-welded width is less than or equal to about 105% of the width of the second portion.

Method of operating redundant staggered disease management systems

A system which provides closed loop insulin administration is disclosed. The system includes redundant glucose sensors which may be interleaved in order to provide monitoring when one of the glucose sensors is in a settling period. The system may include a disease management unit which includes both a glucose sensor and an insulin pump. A closed loop disease management system which bases insulin administration on accurate glucose measurements may improve a patient's quality of life.

Method of depositing tungsten and other metals in 3D NAND structures

Provided herein are methods and apparatuses for filling features metal-containing materials. One aspect of the disclosure relates to a method for filling structures with a metal-containing material, the method including: providing a structure to be filled with a metal-containing material, exposing the structure to multiple deposition cycles, with each deposition cycle including exposure to one or more alternating reducing agent (e.g. hydrogen (H2)) dose/inert gas purge pulses pulse followed by exposure to one or more alternating metal precursor dose pulses and inert gas purge pulses. The metal may be tungsten (W) or molybdenum (Mo) in some embodiments. In some embodiments, the structure is a partially fabricated (3-D) NAND structure. Apparatuses to perform the methods are also provided.

METHOD OF FORMING A STRUCTURE INCLUDING CARBON MATERIAL, STRUCTURE FORMED USING THE METHOD, AND SYSTEM FOR FORMING THE STRUCTURE

Methods and systems for forming a structure including carbon material and structures formed using the method or system are disclosed. Exemplary methods include providing an inert gas to the reaction chamber for plasma ignition, providing a carbon precursor to the reaction chamber, forming a plasma within the reaction chamber to form an initially viscous carbon material on a surface of the substrate, wherein the initially viscous carbon material becomes carbon material, and treating the carbon material with activated species to form treated carbon material.

Method of forming structures including a vanadium or indium layer

Methods and systems for depositing vanadium and/or indium layers onto a surface of a substrate and structures and devices formed using the methods are disclosed. An exemplary method includes using a cyclical deposition process, depositing a vanadium and/or indium layer onto the surface of the substrate. The cyclical deposition process can include providing a vanadium and/or indium precursor to the reaction chamber and separately providing a reactant to the reaction chamber. The cyclical deposition process may desirably be a thermal cyclical deposition process. Exemplary structures can include field effect transistor structures, such as gate all around structures. The vanadium and/or indium layers can be used, for example, as barrier layers or liners, as work function layers, as dipole shifter layers, or the like.

Method and apparatus for transmittance measurements of large articles

Methods and apparatus for measuring light intensity are disclosed. The methods and apparatus can be used to verify an article, such as a reaction chamber. Exemplary apparatus include a first arm, a light source coupled to the first arm, a second arm, and a sensor coupled to the second arm. The sensor can receive light from the light source that is transmitted through at least a portion of the article.

Augmented reality session creation using skeleton tracking

Methods and systems are disclosed for creating a shared augmented reality (AR) session. The methods and systems perform operations comprising: receiving, by a second device, a request to join an AR session initialized by a first device; in response to receiving the request, detecting a body corresponding to a user of the first device in one or more images captured by a camera of the second device; identifying a body part of the detected body corresponding to the user of the first device; determining, by the second device, a transformation in the AR session between the first device and the second device using the identified body part; and causing the AR session to be displayed by the second device based on the determined transformation.

SELECTIVE ALTERATION OF INTERCONNECT PADS FOR DIRECT BONDING

A bonded structure and a method of forming such a bonded structure are disclosed. The bonded structure can include a first element and a second element. The first element has a first bonding surface including a first nonconductive material and a plurality of first contact pads. The first contact pads are electrically connected to one or more first microelectronic devices in the first element. The second element has a second bonding surface including a second nonconductive material and a plurality of second contact pads. The second contact pads are electrically connected to one or more second microelectronic devices in the second element. The second bonding surface is directly bonded to the first bonding surface without an intervening adhesive to form a bonding interface, and one or more first contact pads is omitted from the first microelectronic element to alter the functionality of the bonded structure.

Data stripping method to interrogate patient records and create anonymized record

Various surgical hubs and data stripping methods are disclosed. The surgical hub comprises a processor and a memory coupled to the processor. The memory stores instructions executable by the processor to interrogate a modular device coupled to the processor via a modular communication hub. The modular device is a source of data sets that include patient identity data and surgical procedure data. The processor also executes instructions to: receive a data set from the modular device; discard the patient identity data and any portion of the surgical procedure data that identifies the patient from the data set; extract anonymous data from the data set and create an anonymized data set; and configure operation of the surgical hub or the modular device based on the anonymized data set.