Keyboard with adjustable feedback
#6902 ✅ Patent 11,869,734 granted on 2024-01-09Switch for a medium voltage or high voltage switchgear
#6903 ✅ Patent 11,688,571 granted on 2023-06-27Electrical switch
#6904 ✅ Patent 11,373,824 granted on 2022-06-28Gas-insulated high or medium voltage circuit breaker
#6905 ✅ Patent 11,615,930 granted on 2023-03-28Current breaker, safety circuit and secondary battery pack
#6906CONTACT DEVICE, ELECTROMAGNETIC RELAY, AND ELECTRICAL DEVICE
#6907 ✅ Patent 11,251,008 granted on 2022-02-15High voltage cartridge fuse assembly
#6908 ✅ Patent 11,476,074 granted on 2022-10-18Vacuum channel field effect transistor, producing method thereof, and semiconductor device
#6909 ✅ Patent 11,527,378 granted on 2022-12-13Carbon-metal structure and method for manufacturing carbon-metal structure
#6910 ✅ Patent 12,106,924 granted on 2024-10-01Inverted cylindrical magnetron (ICM) system and methods of use
#6911 ✅ Patent 11,289,299 granted on 2022-03-29Duoplasmatron ion source with a partially ferromagnetic anode
#6912BREMSSTRAHLUNG TARGET FOR RADIATION THERAPY SYSTEM
#6913 ✅ Patent 11,574,790 granted on 2023-02-07X-ray beam generation system using a lead-bismuth alloy
#6914 ✅ Patent 11,798,774 granted on 2023-10-24Collision avoidance for particle beam instruments
#6915 ✅ Patent 11,417,494 granted on 2022-08-16Incident axis alignment method for electron gun equipped with photocathode, computer program, and electron gun equipped with photocathode
#6916 ✅ Patent 11,934,096 granted on 2024-03-19Frame member for electron beam lithography device and electron beam lithography device
#6917 ✅ Patent 11,694,870 granted on 2023-07-04Stage apparatus
#6918 ✅ Patent 11,875,966 granted on 2024-01-16Method and apparatus for inspection
#6919 ✅ Patent 11,195,693 granted on 2021-12-07Method and system for dynamic band contrast imaging
#6920 ✅ Patent 11,749,497 granted on 2023-09-05Charged particle beam apparatus
#6921 ✅ Patent 11,217,426 granted on 2022-01-04Ion source and method
#6922 ✅ Patent 11,664,192 granted on 2023-05-30Temperature control for insertable target holder for solid dopant materials
#6923AN ADVANCED CERAMIC LID WITH EMBEDDED HEATER ELEMENTS AND EMBEDDED RF COIL FOR HDP CVD AND INDUCTIVELY COUPLED PLASMA TREATMENT CHAMBERS
#6924 ✅ Patent 11,626,268 granted on 2023-04-11Induction coil assembly and reaction chamber
#6925PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
#6926 ✅ Patent 11,658,008 granted on 2023-05-23Film forming apparatus and film forming method
#6927 ✅ Patent 11,615,945 granted on 2023-03-28Plasma processing apparatus and techniques
#6928EDGE EXCLUSION CONTROL
#6929 ✅ Patent 11,699,573 granted on 2023-07-11Plasma processing method
#6930 ✅ Patent 11,875,974 granted on 2024-01-16Multi-channel plasma reaction cell
#6931APPARATUS AND METHOD FOR TEMPERATURE CONTROL, AND PLASMA EQUIPMENT
#6932 ✅ Patent 11,637,001 granted on 2023-04-25Deposition apparatus and deposition method using the same
#6933APPARATUS FOR TREATING SUBSTRATE
#6934 ✅ Patent 11,804,366 granted on 2023-10-31Plasma processing apparatus
#6935 ✅ Patent 12,106,944 granted on 2024-10-01Rotating substrate support
#6936ELECTRICAL CONNECTOR FOR COOLED SUBSTRATE SUPPORT ASSEMBLY
#6937 ✅ Patent 12,142,467 granted on 2024-11-12Self-assembled monolayer deposition from low vapor pressure organic molecules
#6938 ✅ Patent 11,355,325 granted on 2022-06-07Methods and systems for monitoring input power for process control in semiconductor process systems
#6939 ✅ Patent 11,862,441 granted on 2024-01-02Plasma processing method and plasma processing apparatus
#6940 ✅ Patent 11,594,402 granted on 2023-02-28Magnetron sputtering source and coating system arrangement
#6941 ✅ Patent 11,232,936 granted on 2022-01-25Absolute quantitation of a target analyte using a mass spectrometer
#6942 ✅ Patent 11,527,394 granted on 2022-12-13Methods and apparatus for determining interference in MS scan data, filtering ions and performing mass spectrometry analysis on a sample
#6943 ✅ Patent 12,080,535 granted on 2024-09-03Methods for transferring ions between trapping devices of variable internal pressure
#6944 ✅ Patent 11,410,842 granted on 2022-08-09Time-frequency analysis
#6945 ✅ Patent 11,670,496 granted on 2023-06-06Ionization sources and methods and systems using them
#6946 ✅ Patent 11,495,447 granted on 2022-11-08Ionizer and mass spectrometer
#6947 ✅ Patent 11,784,036 granted on 2023-10-10Electrospray ion source for spectrometry using inductively heated gas
#6948 ✅ Patent 11,610,768 granted on 2023-03-21Methods and apparatus for high speed mass spectrometry
#6949 ✅ Patent 11,545,353 granted on 2023-01-03Logical operations in mass spectrometry
#6950SiC WAFER MANUFACTURING METHOD
#6951NITRIDE SEMICONDUCTOR ELEMENT
#6952 ✅ Patent 11,923,198 granted on 2024-03-05Resistless patterning mask
#6953 ✅ Patent 11,984,317 granted on 2024-05-14EUV patterning methods, structures, and materials
#6954 ✅ Patent 11,257,668 granted on 2022-02-22Semiconductor structure and manufacturing method thereof
#6955 ✅ Patent 12,347,673 granted on 2025-07-01Method for Forming a Semiconductor Structure Having a Porous Semiconductor Layer in RF Devices
#6956 ✅ Patent 11,508,576 granted on 2022-11-22Method for producing transition metal dichalcogenidegraphene hetero junction composite using plasma
#6957 ✅ Patent 11,211,245 granted on 2021-12-28III-N multichip modules and methods of fabrication
#6958 ✅ Patent 11,854,801 granted on 2023-12-26Method and device for depositing a nano-object
#6959METHOD FOR DEPOSITING BORON AND GALLIUM CONTAINING SILICON GERMANIUM LAYERS
#6960 ✅ Patent 11,929,253 granted on 2024-03-12SAG nanowire growth with a planarization process
#6961 ✅ Patent 11,488,822 granted on 2022-11-01SAG nanowire growth with ion implantation
#6962 ✅ Patent 11,823,904 granted on 2023-11-21Semiconductor device using hard mask and method for fabricating the same
#6963TECHNIQUES AND APPARATUS FOR ELONGATION PATTERNING USING ANGLED ION BEAMS
#6964 ✅ Patent 11,688,605 granted on 2023-06-27Semiconductor device with two-dimensional materials
#6965MANUFACTURING METHOD FOR BONDED SUBSTRATE
#6966 ✅ Patent 11,784,052 granted on 2023-10-10Dipole-engineered high-k gate dielectric and method forming same
#6967 ✅ Patent 11,901,183 granted on 2024-02-13Fin field-effect transistor device and method of forming the same
#6968 ✅ Patent 11,862,470 granted on 2024-01-02Silica particle and production method therefor, silica sol, polishing composition, polishing method, method for producing semiconductor wafer and method for producing semiconductor device
#6969 ✅ Patent 11,651,968 granted on 2023-05-16Method for forming planarization layer and pattern forming method using the same
#6970 ✅ Patent 11,171,012 granted on 2021-11-09Method and apparatus for formation of protective sidewall layer for bow reduction
#6971 ✅ Patent 11,715,641 granted on 2023-08-01Method and device for etching silicon oxide
#6972 ✅ Patent 11,688,609 granted on 2023-06-27Etching method and plasma processing apparatus
#6973 ✅ Patent 11,658,041 granted on 2023-05-23Methods of modifying portions of layer stacks
#6974 ✅ Patent 12,142,487 granted on 2024-11-12Methods of modifying portions of layer stacks
#6975SEMICONDUCTOR SUBSTRATE AND METHOD OF FORMING THE SAME
#6976 ✅ Patent 11,651,972 granted on 2023-05-16Method of manufacturing semiconductor devices using directional process
#6977 ✅ Patent 12,040,197 granted on 2024-07-16Mechanical couplings designed to resolve process constraints
#6978 ✅ Patent 11,393,699 granted on 2022-07-19Packaging process for plating with selective molding
#6979SEMICONDUCTOR PACKAGE METHOD OF FABRICATING SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING RE-DISTRIBUTION STRUCTURE
#6980 ✅ Patent 11,721,560 granted on 2023-08-08Manufacturing method of semiconductor device
#6981PURGE NOZZLE ASSEMBLY AND SEMICONDUCTOR PROCESSING ASSEMBLY INCLUDING THE PURGE NOZZLE ASSEMBLY
#6982 ✅ Patent 11,817,329 granted on 2023-11-14Chemical dispensing system
#6983GAS INJECTOR FOR SEMICONDUCTOR MANUFACTURING CHAMBER
#6984 ✅ Patent 12,046,488 granted on 2024-07-23Semiconductor manufacturing apparatus and wafer holding table for semiconductor manufacturing apparatus
#6985 ✅ Patent 11,756,807 granted on 2023-09-12Power feeding mechanism and method for controlling temperature of a stage
#6986DYNAMIC RELEASE TAPES FOR ASSEMBLY OF DISCRETE COMPONENTS
#6987HIGH TEMPERATURE AND VACUUM ISOLATION PROCESSING MINI-ENVIRONMENTS
#6988Fleet Matching Of Semiconductor Metrology Tools Without Dedicated Quality Control Wafers
#6989 ✅ Patent 11,830,748 granted on 2023-11-28Method and apparatus for poling polymer thin films
#6990 ✅ Patent 11,508,596 granted on 2022-11-22Apparatus and methods for automatically handling die carriers
#6991 ✅ Patent 12,027,400 granted on 2024-07-02Automatic system calibration for wafer handling
#6992 ✅ Patent 11,569,112 granted on 2023-01-31Substrate processing apparatus and method of opening/closing lid of substrate accommodating vessel
#6993 ✅ Patent 11,728,195 granted on 2023-08-15Apparatuses for executing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate
#6994 ✅ Patent 11,764,093 granted on 2023-09-19Automatic wafer centering method and apparatus
#6995 ✅ Patent 12,198,967 granted on 2025-01-14Substrate support designs for a deposition chamber
#6996 ✅ Patent 11,942,354 granted on 2024-03-26Dynamic release tapes for assembly of discrete components
#6997 ✅ Patent 11,742,234 granted on 2023-08-29System for positioning a plate
#6998 ✅ Patent 12,020,975 granted on 2024-06-25Apparatus and method for processing wafer
#6999 ✅ Patent 11,769,686 granted on 2023-09-26Methods and apparatus for electroless plating dispense
#7000SUSCEPTOR
#7001 ✅ Patent 11,410,876 granted on 2022-08-09Semiconductor device with air gaps and method of fabrication thereof
#7002 ✅ Patent 11,631,612 granted on 2023-04-18Semiconductor device and manufacturing method thereof
#7003 ✅ Patent 11,398,403 granted on 2022-07-26Multiple thickness semiconductor-on-insulator field effect transistors and methods of forming the same
#7004 ✅ Patent 11,664,268 granted on 2023-05-30Dummy fin structures and methods of forming same
#7005METHOD FOR PRODUCING AN UNDERCUT IN A 300 MM SILICON-ON-INSULATOR PLATFORM
#7006SURFACE UNIFORMITY CONTROL IN PIXEL STRUCTURES OF IMAGE SENSORS
#7007 ✅ Patent 11,990,367 granted on 2024-05-21Apparatus and memory device including conductive lines and contacts, and methods of forming an apparatus including conductive lines and contacts
#7008 ✅ Patent 11,270,910 granted on 2022-03-08Interconnect structure with partial sidewall liner
#7009 ✅ Patent 12,051,622 granted on 2024-07-30Passivation layer and planarization layer and method of forming the same
#7010 ✅ Patent 11,978,667 granted on 2024-05-07Method for manufacturing wire layer
#7011 ✅ Patent 11,387,143 granted on 2022-07-12Redistribution lines with protection layers and method forming same
#7012 ✅ Patent 11,450,567 granted on 2022-09-20Package component with stepped passivation layer
#7013 ✅ Patent 12,009,255 granted on 2024-06-11Method of manufacturing semiconductor device including laser treatment for contact plug
#7014 ✅ Patent 11,195,752 granted on 2021-12-07Semiconductor device and method of forming same
#7015 ✅ Patent 11,817,351 granted on 2023-11-14Method for fabricating semiconductor device
#7016 ✅ Patent 11,823,953 granted on 2023-11-21Semiconductor substrate processing methods
#7017 ✅ Patent 12,020,985 granted on 2024-06-25Transferring large-area group III-nitride semiconductor material and devices to arbitrary substrates
#7018 ✅ Patent 11,270,917 granted on 2022-03-08Scalable and flexible architectures for integrated circuit (IC) design and fabrication
#7019SPIN-CURRENT MAGNETIZATION REVERSAL ELEMENT, MAGNETORESISTANCE EFFECT ELEMENT, AND MAGNETIC MEMORY
#7020 ✅ Patent 11,264,283 granted on 2022-03-01Multi-channel devices and methods of manufacture
#7021 ✅ Patent 11,605,712 granted on 2023-03-14Fabrication process flow of dielectric layer for isolation of nano-sheet devices on bulk silicon substrate
#7022 ✅ Patent 11,295,983 granted on 2022-04-05Transistor having source or drain formation assistance regions with improved bottom isolation
#7023 ✅ Patent 11,600,528 granted on 2023-03-07Semiconductor structure and method for forming the same
#7024 ✅ Patent 11,935,793 granted on 2024-03-19Dual dopant source/drain regions and methods of forming same
#7025 ✅ Patent 11,232,988 granted on 2022-01-25Wavy profile mitigation
#7026 ✅ Patent 11,581,225 granted on 2023-02-14Method for manufacturing semiconductor device
#7027 ✅ Patent 11,710,665 granted on 2023-07-25Semiconductor device and method of manufacture
#7028 ✅ Patent 11,443,987 granted on 2022-09-13Semiconductor devices with backside air gap dielectric
#7029 ✅ Patent 11,798,850 granted on 2023-10-24Semiconductor device including contact structure
#7030 ✅ Patent 11,699,620 granted on 2023-07-11Shallow trench isolation structures having uniform step heights
#7031 ✅ Patent 11,676,867 granted on 2023-06-13Method for manufacturing semiconductor structure
#7032 ✅ Patent 11,289,383 granted on 2022-03-29Semiconductor device and method
#7033 ✅ Patent 11,495,502 granted on 2022-11-08Manufacturing method of Fin field-effect transistor
#7034 ✅ Patent 11,942,375 granted on 2024-03-26Structure and formation method of semiconductor device with fin structures
#7035 ✅ Patent 11,295,989 granted on 2022-04-05Gate structures for semiconductor devices
#7036 ✅ Patent 12,131,958 granted on 2024-10-29Sensor mounted wafer
#7037 ✅ Patent 12,198,989 granted on 2025-01-14Method for detecting resistance of side trace of display substrate and display substrate
#7038METHODS AND SYSTEMS FOR PROCESSING A SUBSTRATE
#7039 ✅ Patent 11,972,989 granted on 2024-04-30Display substrate and method for detecting broken fanout wire of display substrate
#7040 ✅ Patent 11,443,991 granted on 2022-09-13Semiconductor structure and method of manufacture
#7041 ✅ Patent 11,545,402 granted on 2023-01-03Semiconductor wafer, semiconductor chip, and dicing method
#7042 ✅ Patent 11,652,011 granted on 2023-05-16Method to manufacture semiconductor device
#7043 ✅ Patent 11,776,863 granted on 2023-10-03Semiconductor device package
#7044 ✅ Patent 11,605,571 granted on 2023-03-14Package comprising a substrate, an integrated device, and an encapsulation layer with undercut
#7045 ✅ Patent 11,508,633 granted on 2022-11-22Package structure having taper-shaped conductive pillar and method of forming thereof
#7046 ✅ Patent 11,424,172 granted on 2022-08-23Semiconductor package
#7047SEMICONDUCTOR ELEMENT INTERMEDIATE, AND METHOD OF PRODUCING SEMICONDUCTOR ELEMENT INTERMEDIATE
#7048 ✅ Patent 11,502,015 granted on 2022-11-15Semiconductor package and manufacturing method thereof
#7049 ✅ Patent 11,817,365 granted on 2023-11-14Thermal mitigation die using back side etch
#7050 ✅ Patent 12,027,437 granted on 2024-07-02Superconducting device having a plurality of thermal sink layers and a plurality of ground planes
#7051 ✅ Patent 11,270,925 granted on 2022-03-08Heat distribution device with flow channels
#7052 ✅ Patent 11,600,548 granted on 2023-03-07Methods and heat distribution devices for thermal management of chip assemblies
#7053 ✅ Patent 12,087,658 granted on 2024-09-10Hybrid thermal interface material (TIM) with reduced 3D thermal resistance
#7054 ✅ Patent 11,749,584 granted on 2023-09-05Heat dissipation structures
#7055 ✅ Patent 11,626,345 granted on 2023-04-11Liquid cooled module with device heat spreader
#7056STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT
#7057 ✅ Patent 11,328,981 granted on 2022-05-10Memory device and method of manufacturing the same
#7058 ✅ Patent 11,621,214 granted on 2023-04-04Semiconductor package and method for manufacturing the same
#7059 ✅ Patent 11,380,607 granted on 2022-07-05Semiconductor device
#7060 ✅ Patent 11,616,002 granted on 2023-03-28Through-circuit vias in interconnect structures
#7061PACKAGE STRUCTURE
#7062 ✅ Patent 12,014,972 granted on 2024-06-18Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices
#7063 ✅ Patent 11,967,544 granted on 2024-04-23Method of manufacturing semiconductor products, corresponding substrate, semiconductor product and tool
#7064 ✅ Patent 11,387,174 granted on 2022-07-12Semiconductor device
#7065 ✅ Patent 11,894,291 granted on 2024-02-06Manufacturing method of semiconductor device and semiconductor device
#7066 ✅ Patent 11,694,947 granted on 2023-07-04Multi-pitch leads
#7067 ✅ Patent 11,574,855 granted on 2023-02-07Package with dies mounted on opposing surfaces of a leadframe
#7068 ✅ Patent 11,810,843 granted on 2023-11-07Integrated capacitor with extended head bump bond pillar
#7069PARTIAL COMPONENT EMBEDDING IN A SUBSTRATE
#7070 ✅ Patent 11,626,357 granted on 2023-04-113D electrical integration using component carrier edge connections to a 2D contact array
#7071 ✅ Patent 11,626,358 granted on 2023-04-11Semiconductor device
#7072 ✅ Patent 11,527,463 granted on 2022-12-13Hybrid ball grid array package for high speed interconnects
#7073MULTICORE SUBSTRATE
#7074 ✅ Patent 11,222,838 granted on 2022-01-11Embedded component substrate structure having bridge chip and method for manufacturing the same
#7075 ✅ Patent 11,670,578 granted on 2023-06-06Ball grid arrays and associated apparatuses and systems
#7076 ✅ Patent 11,810,848 granted on 2023-11-07Fan-out semiconductor package
#7077 ✅ Patent 11,791,253 granted on 2023-10-17Display device
#7078 ✅ Patent 11,456,245 granted on 2022-09-27Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same
#7079 ✅ Patent 11,380,613 granted on 2022-07-05Repurposed seed layer for high frequency noise control and electrostatic discharge connection
#7080 ✅ Patent 11,715,688 granted on 2023-08-01Variable dielectric constant materials in same layer of a package
#7081 ✅ Patent 11,227,831 granted on 2022-01-18Semiconductor device with alleviation feature
#7082 ✅ Patent 12,012,473 granted on 2024-06-18Directed self-assembly structures and techniques
#7083 ✅ Patent 12,255,130 granted on 2025-03-18Airgap structures for high speed signal integrity
#7084 ✅ Patent 11,244,895 granted on 2022-02-08Intertwined well connection and decoupling capacitor layout structure for integrated circuits
#7085 ✅ Patent 11,935,826 granted on 2024-03-19Capacitor between two passivation layers with different etching rates
#7086 ✅ Patent 11,404,366 granted on 2022-08-02Hybrid interconnect structure for self aligned via
#7087 ✅ Patent 11,189,562 granted on 2021-11-30Interconnection structure having increased conductive features and method of manufacturing the same
#7088 ✅ Patent 11,362,030 granted on 2022-06-14Sidewall spacer structure enclosing conductive wire sidewalls to increase reliability
#7089 ✅ Patent 11,869,838 granted on 2024-01-09Semiconductor storage device
#7090 ✅ Patent 11,715,687 granted on 2023-08-01Contact structures for reducing electrical shorts and methods of forming the same
#7091 ✅ Patent 11,901,285 granted on 2024-02-13Microelectronic arrangement and method for manufacturing the same
#7092 ✅ Patent 11,848,265 granted on 2023-12-19Semiconductor package with improved interposer structure
#7093 ✅ Patent 11,967,552 granted on 2024-04-23Methods of forming interconnect structures in semiconductor fabrication
#7094 ✅ Patent 11,837,537 granted on 2023-12-05Fan-out semiconductor package
#7095 ✅ Patent 11,264,326 granted on 2022-03-01Contact via formation
#7096 ✅ Patent 11,616,018 granted on 2023-03-28Semiconductor devices including a thick metal layer
#7097 ✅ Patent 12,051,646 granted on 2024-07-30Metal line structure and method
#7098 ✅ Patent 11,862,561 granted on 2024-01-02Semiconductor devices with backside routing and method of forming same
#7099METHOD OF FABRICATING SEMICONDUCTOR DEVICES HAVING DIFFERENT ARCHITECTURES AND SEMICONDUCTOR DEVICES FABRICATED THEREBY
#7100 ✅ Patent 11,699,661 granted on 2023-07-11Method for fabricating semiconductor device
#7101 ✅ Patent 11,837,545 granted on 2023-12-05Semiconductor memory device
#7102 ✅ Patent 12,113,022 granted on 2024-10-08Semiconductor package and manufacturing method of semiconductor package
#7103 ✅ Patent 11,456,256 granted on 2022-09-27Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device
#7104 ✅ Patent 11,393,763 granted on 2022-07-19Integrated fan-out (info) package structure and method
#7105 ✅ Patent 11,296,032 granted on 2022-04-05Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same
#7106 ✅ Patent 11,923,310 granted on 2024-03-05Package structure including through via structures
#7107 ✅ Patent 12,040,281 granted on 2024-07-16Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof
#7108ELECTRONIC DEVICE
#7109 ✅ Patent 11,670,597 granted on 2023-06-06Method for forming package structure
#7110 ✅ Patent 11,515,262 granted on 2022-11-29Semiconductor package and method of fabricating the same
#7111 ✅ Patent 11,973,038 granted on 2024-04-30Package structure with improved antenna patterns performance
#7112 ✅ Patent 11,967,563 granted on 2024-04-23Fan-out package having a main die and a dummy die
#7113 ✅ Patent 11,450,609 granted on 2022-09-20Electro-migration reduction
#7114 ✅ Patent 11,721,627 granted on 2023-08-08Graphene layer for reduced contact resistance
#7115 ✅ Patent 11,658,121 granted on 2023-05-23Semiconductor device and method of forming the same
#7116 ✅ Patent 11,929,329 granted on 2024-03-12Damascene process using cap layer
#7117 ✅ Patent 11,721,637 granted on 2023-08-08Patterning a transparent wafer to form an alignment mark in the transparent wafer
#7118 ✅ Patent 11,362,038 granted on 2022-06-14Photolithography alignment process for bonded wafers
#7119 ✅ Patent 11,515,263 granted on 2022-11-29Method of producing laser-marked silicon wafer and laser-marked silicon wafer
#7120 ✅ Patent 11,532,568 granted on 2022-12-20Electronic package
#7121 ✅ Patent 11,380,628 granted on 2022-07-05Mother substrate for display substrates, manufacture method thereof, display substrate and display device
#7122 ✅ Patent 11,894,318 granted on 2024-02-06Semiconductor device and method of manufacture
#7123 ✅ Patent 11,410,941 granted on 2022-08-09Semiconductor module
#7124 ✅ Patent 11,756,899 granted on 2023-09-12Lead frame surface finishing
#7125 ✅ Patent 11,569,180 granted on 2023-01-31Corner structures for an optical fiber groove and manufacturing methods thereof
#7126 ✅ Patent 11,935,842 granted on 2024-03-19Methods of manufacturing an integrated circuit having stress tuning layer
#7127 ✅ Patent 11,444,039 granted on 2022-09-13Semiconductor die including diffusion barrier layers embedding bonding pads and methods of forming the same
#7128 ✅ Patent 11,450,624 granted on 2022-09-20Semiconductor die including diffusion barrier layers embedding bonding pads and methods of forming the same
#7129 ✅ Patent 11,735,534 granted on 2023-08-22Chip package and method of forming a chip package
#7130 ✅ Patent 11,462,489 granted on 2022-10-04Integrated circuit device and fabrication method thereof
#7131 ✅ Patent 11,444,041 granted on 2022-09-13Process of realization of an area of individualization of an integrated circuit
#7132 ✅ Patent 11,670,603 granted on 2023-06-06Micro-component anti-stiction structures
#7133 ✅ Patent 11,670,604 granted on 2023-06-06Semiconductor arrangement and method of making
#7134 ✅ Patent 11,329,013 granted on 2022-05-10Interconnected substrate arrays containing electrostatic discharge protection grids and associated microelectronic packages
#7135 ✅ Patent 11,756,905 granted on 2023-09-12Package interface with improved impedance continuity
#7136LOW-LOSS MILLIMETER WAVE TRANSMISSION LINES ON SILICON SUBSTRATE
#7137 ✅ Patent 11,637,080 granted on 2023-04-25Method for fabricating an integrated circuit device
#7138 ✅ Patent 11,527,497 granted on 2022-12-13Electrical component with component interconnection element
#7139 ✅ Patent 11,817,404 granted on 2023-11-14Post passivation interconnect
#7140 ✅ Patent 11,309,266 granted on 2022-04-19Semiconductor device structure with air gap and method for forming the same
#7141 ✅ Patent 12,080,662 granted on 2024-09-03Display device and method of manufacturing the same
#7142 ✅ Patent 11,594,505 granted on 2023-02-28Semiconductor package substrate and method of manufacturing semiconductor package using the same
#7143 ✅ Patent 11,948,901 granted on 2024-04-02Vertical memory devices
#7144 ✅ Patent 12,278,204 granted on 2025-04-15Pattern decomposition lithography techniques
#7145 ✅ Patent 12,027,483 granted on 2024-07-02Packaged semiconductor device with electroplated pillars
#7146 ✅ Patent 11,515,274 granted on 2022-11-29Semiconductor package and manufacturing method thereof
#7147 ✅ Patent 12,068,270 granted on 2024-08-20Semiconductor package
#7148PIN-GRID-ARRAY-TYPE SEMICONDUCTOR PACKAGE
#7149 ✅ Patent 11,756,914 granted on 2023-09-12Microelectronic device with pillars having flared ends
#7150 ✅ Patent 11,398,445 granted on 2022-07-26Mechanical punched via formation in electronics package and electronics package formed thereby
#7151INTEGRATED CIRCUIT MODULE STRUCTURE AND METHOD FOR MANUFACTURING SAME
#7152 ✅ Patent 11,594,508 granted on 2023-02-28Redistribution lines having nano columns and method forming same
#7153 ✅ Patent 12,261,141 granted on 2025-03-25IC device with chip to package interconnects from a copper metal interconnect level
#7154 ✅ Patent 11,647,890 granted on 2023-05-16Solid-state image pickup element, electronic equipment, and semiconductor apparatus
#7155 ✅ Patent 11,735,560 granted on 2023-08-22Electronic-component-embedded substrate and method of making the same
#7156 ✅ Patent 11,721,663 granted on 2023-08-08Multi-level stacking of wafers and chips
#7157 ✅ Patent 12,040,307 granted on 2024-07-16Magnetic induced heating for solder interconnects
#7158 ✅ Patent 11,545,463 granted on 2023-01-03Chip package structure with ring-like structure
#7159 ✅ Patent 11,810,894 granted on 2023-11-07Solderless interconnect for semiconductor device assembly
#7160 ✅ Patent 11,362,062 granted on 2022-06-14Semiconductor package
#7161ELECTRONIC DEVICE HAVING A SOLDERED JOINT BETWEEN A METAL REGION OF A SEMICONDUCTOR DIE AND A METAL REGION OF A SUBSTRATE
#7162FUNCTIONALLY REDUNDANT SEMICONDUCTOR DIES AND PACKAGE
#7163 ✅ Patent 11,264,362 granted on 2022-03-01Semiconductor structure and method of fabricating the same
#7164 ✅ Patent 11,233,035 granted on 2022-01-25Package structure and method of manufacturing the same
#7165 ✅ Patent 11,557,570 granted on 2023-01-17Methods for forming three-dimensional memory devices
#7166 ✅ Patent 11,621,249 granted on 2023-04-043D semiconductor device and structure
#7167 ✅ Patent 11,749,649 granted on 2023-09-05Composite IC chips including a chiplet embedded within metallization layers of a host IC chip
#7168 ✅ Patent 11,742,329 granted on 2023-08-29Semiconductor package
#7169 ✅ Patent 11,855,049 granted on 2023-12-26Semiconductor device
#7170 ✅ Patent 11,658,162 granted on 2023-05-23Micro-LED display and manufacturing method therefor
#7171 ✅ Patent 12,062,643 granted on 2024-08-13Electronic device
#7172NON-PLANAR DISPLAY APPARATUS AND ELECTRONIC DEVICE
#7173 ✅ Patent 11,756,938 granted on 2023-09-12Display device having light emitting element on pair of electrodes
#7174 ✅ Patent 11,462,519 granted on 2022-10-04Semiconductor device with active interposer and method for fabricating the same
#7175 ✅ Patent 11,574,898 granted on 2023-02-07Radio-frequency module and communication device
#7176 ✅ Patent 11,569,211 granted on 2023-01-31Semiconductor die with improved thermal insulation between a power portion and a peripheral portion, method of manufacturing, and package housing the die
#7177 ✅ Patent 11,798,925 granted on 2023-10-24IPD modules with flexible connection scheme in packaging
#7178 ✅ Patent 11,552,020 granted on 2023-01-10Semiconductor composite device and package board used therein
#7179 ✅ Patent 11,715,727 granted on 2023-08-01Packages and methods of forming packages
#7180 ✅ Patent 11,569,213 granted on 2023-01-31Optoelectronic device and manufacturing method thereof
#7181METHOD AND DEVICE FOR MANUFACTURING FLEXIBLE LIGHT EMISSION DEVICE
#7182PACKAGE CAVITY FOR ENHANCED DEVICE PERFORMANCE WITH AN INTEGRATED PASSIVE DEVICE
#7183 ✅ Patent 11,404,404 granted on 2022-08-02Semiconductor structure having photonic die and electronic die
#7184 ✅ Patent 11,335,671 granted on 2022-05-17Stacked die assembly including double-sided inter-die bonding connections and methods of forming the same
#7185 ✅ Patent 11,309,301 granted on 2022-04-19Stacked die assembly including double-sided inter-die bonding connections and methods of forming the same
#7186 ✅ Patent 11,901,347 granted on 2024-02-13Microelectronic package with three-dimensional (3D) monolithic memory die
#7187 ✅ Patent 11,855,064 granted on 2023-12-26Techniques for processing devices
#7188 ✅ Patent 11,784,179 granted on 2023-10-10Structure and method of power supply routing in semiconductor device
#7189 ✅ Patent 11,424,237 granted on 2022-08-23Memory device
#7190 ✅ Patent 11,676,957 granted on 2023-06-13Integrated circuit device, system and method
#7191 ✅ Patent 11,935,882 granted on 2024-03-19Static random access memory device
#7192 ✅ Patent 11,282,946 granted on 2022-03-22Semiconductor device
#7193 ✅ Patent 11,646,310 granted on 2023-05-09Methods for pillar connection on frontside and passive device integration on backside of die
#7194 ✅ Patent 11,637,101 granted on 2023-04-25Semiconductor device and manufacturing method thereof
#7195 ✅ Patent 11,637,102 granted on 2023-04-25Gate isolation for multigate device
#7196 ✅ Patent 11,302,580 granted on 2022-04-12Nanosheet thickness
#7197 ✅ Patent 11,527,533 granted on 2022-12-13FinFET pitch scaling
#7198 ✅ Patent 11,664,374 granted on 2023-05-30Backside interconnect structures for semiconductor devices and methods of forming the same
#7199 ✅ Patent 11,646,312 granted on 2023-05-09Buried channel semiconductor device and method for manufacturing the same
#7200 ✅ Patent 12,119,349 granted on 2024-10-15Semiconductor integrated circuit device