High-frequency power supply system
#6602 ✅ Patent 11,784,028 granted on 2023-10-10Performing radio frequency matching control using a model-based digital twin
#6603 ✅ Patent 12,087,548 granted on 2024-09-10Plasma reactor
#6604PLASMA JET SOLID ABLATION-BASED DIRECT ANALYSIS APPARATUS
#6605 ✅ Patent 12,340,981 granted on 2025-06-24Workpiece Processing Apparatus with Outer Gas Channel Insert
#6606 ✅ Patent 12,261,024 granted on 2025-03-25Plasma processing apparatus and cleaning method
#6607 ✅ Patent 12,125,682 granted on 2024-10-22Substrate treating apparatus and substrate treating method
#6608PROCESS CHAMBER HAVING A TEMPERATURE MEASURING UNIT AND APPARATUS FOR PROCESSING A SUBSTRATE HAVING A TEMPERATURE MEASURING UNIT
#6609 ✅ Patent 12,159,770 granted on 2024-12-03Cooled shield for ICP source
#6610DEVICE FOR ADJUSTING PLASMA EDGE IN PROCESSING CHAMBER AND CONTROL METHOD THEREOF
#6611 ✅ Patent 12,334,312 granted on 2025-06-17Configurable Faraday Shield
#6612SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
#6613 ✅ Patent 11,705,312 granted on 2023-07-18Vertically adjustable plasma source
#6614 ✅ Patent 12,148,601 granted on 2024-11-19Method of plasma processing a substrate in a plasma chamber and plasma processing system
#6615 ✅ Patent 12,154,768 granted on 2024-11-26Surface processing equipment and surface processing method
#6616 ✅ Patent 12,002,667 granted on 2024-06-04Sputtering apparatus and method of controlling sputtering apparatus
#6617 ✅ Patent 11,670,494 granted on 2023-06-06Systems and methods for performing tandem mass spectrometry
#6618 ✅ Patent 11,756,779 granted on 2023-09-12Apparatus and method for transferring ions between two analytical systems
#6619 ✅ Patent 12,165,862 granted on 2024-12-10Aperture plate assembly
#6620INTEGRATED MICROFLUIDIC PROBE (IMFP) AND METHODS OF USE THEREOF
#6621METHOD AND APPARATUS FOR MASS SPECTROMETRY
#6622System for Identifying Structures of Molecular Compounds from Mass Spectrometry Data
#6623 ✅ Patent 11,830,724 granted on 2023-11-28Apparatus and method for manufacturing a wafer
#6624 ✅ Patent 11,830,732 granted on 2023-11-28Selective passivation and selective deposition
#6625 ✅ Patent 12,040,181 granted on 2024-07-16Modulated atomic layer deposition
#6626 ✅ Patent 12,288,683 granted on 2025-04-29Method of manufacturing semiconductor device, substrate processing method, non-transitory computer-readable recording medium and substrate processing apparatus
#6627 ✅ Patent 12,211,687 granted on 2025-01-28Substrate treatment apparatus and substrate treatment method
#6628SEMICONDUCTOR STRUCTRE AND METHOD
#6629 ✅ Patent 11,823,897 granted on 2023-11-21Method for forming insulating film, apparatus for processing substrate, and system for processing substrate
#6630 ✅ Patent 11,699,588 granted on 2023-07-11Vertical nanowire semiconductor device and manufacturing method therefor
#6631 ✅ Patent 12,217,967 granted on 2025-02-04Indium phosphide substrate
#6632 ✅ Patent 12,334,353 granted on 2025-06-17Method and Apparatus for Plasma Etching
#6633 ✅ Patent 11,551,938 granted on 2023-01-10Alternating etch and passivation process
#6634SEMICONDUCTOR PROCESS POLISHING COMPOSITION AND POLISHING METHOD OF SUBSTRATE APPLIED WITH POLISHING COMPOSITION
#6635 ✅ Patent 12,272,560 granted on 2025-04-08Selective removal of metal oxide hard masks
#6636ETCHING APPARATUS AND ETCHING METHOD
#6637 ✅ Patent 11,450,532 granted on 2022-09-20Deposition of self assembled monolayer for enabling selective deposition and etch
#6638 ✅ Patent 11,972,954 granted on 2024-04-30Method of making a three-dimensional memory device using composite hard masks for formation of deep via openings
#6639 ✅ Patent 12,170,206 granted on 2024-12-17Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus
#6640 ✅ Patent 12,057,323 granted on 2024-08-06Substrate processing method, micropattern forming method, and substrate processing apparatus
#6641METHOD AND APPARATUS FOR CHIP MANUFACTURING
#6642APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE
#6643SUPPORTING DEVICE AND APPARATUS FOR PROCESSING A SUBSTRATE INCLUDING A SUPPORTING DEVICE
#6644PRESSURE ADJUSTMENT APPARATUS FOR CONTROLLING PRESSURE IN CHAMBER AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
#6645 ✅ Patent 12,334,366 granted on 2025-06-17SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#6646 ✅ Patent 12,293,928 granted on 2025-05-06Apparatus and method for treating substrate
#6647 ✅ Patent 11,908,710 granted on 2024-02-20Apparatus and method for processing substrate
#6648 ✅ Patent 12,374,565 granted on 2025-07-29SUBSTRATE DRYING METHOD AND SUBSTRATE DRYING APPARATUS
#6649 ✅ Patent 12,283,495 granted on 2025-04-22Substrate processing apparatus and substrate processing method
#6650 ✅ Patent 11,887,870 granted on 2024-01-30Apparatus and method for supplying liquid
#6651APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE
#6652 ✅ Patent 11,915,957 granted on 2024-02-27Multiple semiconductor die container load port
#6653 ✅ Patent 11,676,829 granted on 2023-06-13Hyperbaric saw for sawing packaged devices
#6654 ✅ Patent 12,046,489 granted on 2024-07-23Workpiece processing apparatus with thermal processing systems
#6655 ✅ Patent 12,191,172 granted on 2025-01-07Tape mounter
#6656 ✅ Patent 11,948,816 granted on 2024-04-02Transfer apparatus
#6657 ✅ Patent 12,362,206 granted on 2025-07-15FORELINE ASSEMBLY FOR QUAD STATION PROCESS MODULE
#6658 ✅ Patent 12,080,572 granted on 2024-09-03Substrate processing apparatus
#6659MANIPULATOR FINGER, MANIPULATOR, AND METHOD OF OPERATING THE SAME
#6660 ✅ Patent 12,354,892 granted on 2025-07-08TEMPERATURE CONTROL UNIT
#6661SYNCHRONOUS SUBSTRATE TRANSPORT AND ELECTRICAL PROBING
#6662 ✅ Patent 12,131,929 granted on 2024-10-29Wafer inspection method
#6663 ✅ Patent 12,020,964 granted on 2024-06-25Contamination control in semiconductor manufacturing systems
#6664REMOTE OPTIMIZATION OF PURGE FLOW RATES IN A CONTAINER
#6665 ✅ Patent 12,087,607 granted on 2024-09-10Article transport vehicle
#6666WAFER TRANSFER METHOD AND MECHANICAL ARM
#6667X-Y Stage
#6668 ✅ Patent 12,278,130 granted on 2025-04-15Substrate storing and aligning apparatus in substrate bonding equipment for bonding substrates to each other
#6669SUBSTRATE COOLING UNIT, SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
#6670WAFER TRANSFER APPARATUS
#6671SUBSTRATE GRIPPING APPARATUS AND LIQUID PROCESSING APPARATUS, AND SUBSTRATE PROCESSING EQUIPMENT INCLUDING SAME
#6672 ✅ Patent 12,327,748 granted on 2025-06-10SEMICONDUCTOR PROCESSING APPARATUS AND METHOD
#6673 ✅ Patent 12,002,701 granted on 2024-06-04Electrostatic chuck assembly for plasma processing apparatus
#6674 ✅ Patent 12,322,634 granted on 2025-06-03Electrostatic chuck prepared by additive manufacturing, and related methods and structures
#6675ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE
#6676VARIOUS 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH MEMORY CELLS
#6677 ✅ Patent 11,990,363 granted on 2024-05-21Wafer support pin lifting device
#6678CHUCK PIN ASSEMBLY, AND SUBSTRATE HOLDING APPARATUS AND LIQUID PROCESSING APPARATUS INCLUDING SAME
#6679 ✅ Patent 12,014,948 granted on 2024-06-18Semiconductor heat treatment member and manufacturing method thereof
#6680 ✅ Patent 12,094,755 granted on 2024-09-17Protection mechanism and method for protecting wafer and pin
#6681 ✅ Patent 11,823,948 granted on 2023-11-21Bulk wafer switch isolation
#6682 ✅ Patent 12,243,776 granted on 2025-03-04Method of making a three-dimensional memory device using composite hard masks for formation of deep via openings
#6683 ✅ Patent 11,791,198 granted on 2023-10-17Trench shield isolation layer
#6684 ✅ Patent 12,068,192 granted on 2024-08-20Architecture of three-dimensional memory device and methods regarding the same
#6685 ✅ Patent 11,848,231 granted on 2023-12-19Method for forming semiconductor device with multi-layer etch stop structure
#6686PROTECTION OF SEED LAYERS DURING ELECTRODEPOSITION OF METALS IN SEMICONDUCTOR DEVICE MANUFACTURING
#6687 ✅ Patent 11,482,452 granted on 2022-10-25Method of forming a contact plug in a semiconductor integrated circuit device
#6688 ✅ Patent 11,515,204 granted on 2022-11-29Methods for forming conductive vias, and associated devices and systems
#66893D Integrated Circuit and Methods of Forming the Same
#6690 ✅ Patent 11,791,210 granted on 2023-10-17Semiconductor device and manufacturing method of semiconductor device including a through electrode for connection of wirings
#6691 ✅ Patent 11,637,040 granted on 2023-04-25Systems and methods for mitigating crack propagation in semiconductor die manufacturing
#6692 ✅ Patent 11,854,892 granted on 2023-12-26Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by them
#6693 ✅ Patent 11,967,531 granted on 2024-04-23Semiconductor structure and forming method thereof
#6694 ✅ Patent 11,515,213 granted on 2022-11-29Method of forming a semiconductor device
#6695 ✅ Patent 11,830,772 granted on 2023-11-28FinFETs with epitaxy regions having mixed wavy and non-wavy portions
#6696 ✅ Patent 11,854,900 granted on 2023-12-26Semiconductor device and method of forming the same
#6697Dielectric Fins With Different Dielectric Constants and Sizes in Different Regions of a Semiconductor Device
#6698 ✅ Patent 11,830,775 granted on 2023-11-28Methods of manufacturing semiconductor devices by etching active fins using etching masks
#6699 ✅ Patent 12,107,016 granted on 2024-10-01Detection method of metal impurity in wafer
#6700 ✅ Patent 12,327,767 granted on 2025-06-10OPTICAL INSPECTION APPARATUS IN SEMICONDUCTOR PROCESS SYSTEM
#6701METHODS FOR IMPLANTING SEMICONDUCTOR SUBSTRATES
#6702 ✅ Patent 12,057,355 granted on 2024-08-06Semiconductor device manufacture with in-line hotspot detection
#6703 ✅ Patent 11,869,815 granted on 2024-01-09Asymmetry correction via oriented wafer loading
#6704 ✅ Patent 12,165,938 granted on 2024-12-10Semiconductor package, resin molded product, and method of molding resin molded product
#6705 ✅ Patent 11,862,525 granted on 2024-01-02Semiconductor device package and a method of manufacturing the same
#6706 ✅ Patent 11,908,758 granted on 2024-02-20Semiconductor package including dual stiffener
#6707 ✅ Patent 11,515,222 granted on 2022-11-29Semiconductor assemblies with flow controller to mitigate ingression of mold material
#6708MODULE
#6709 ✅ Patent 12,046,524 granted on 2024-07-23Assembly of stacked elements and method of producing the same
#6710CHIP PACKAGING STRUCTURE
#6711 ✅ Patent 11,948,849 granted on 2024-04-02Package-embedded board
#6712 ✅ Patent 11,764,120 granted on 2023-09-19Chip packaging structure and manufacturing method thereof
#6713 ✅ Patent 11,462,452 granted on 2022-10-04Chip package structure and manufacturing method thereof
#6714 ✅ Patent 12,080,616 granted on 2024-09-03Reinforced semiconductor device packaging and associated systems and methods
#6715 ✅ Patent 12,218,020 granted on 2025-02-04Semiconductor packages
#6716SEMICONDUCTOR DEVICE
#6717 ✅ Patent 11,562,938 granted on 2023-01-24Spacer with pattern layout for dual side cooling power module
#6718 ✅ Patent 12,074,082 granted on 2024-08-27Semiconductor module and power conversion device
#6719 ✅ Patent 11,842,942 granted on 2023-12-12Structure and method related to a power module using a hybrid spacer
#6720 ✅ Patent 12,021,005 granted on 2024-06-25Semiconductor device including a thermal material
#6721 ✅ Patent 12,002,730 granted on 2024-06-04Semiconductor module
#6722 ✅ Patent 11,854,933 granted on 2023-12-26Thermally conductive wafer layer
#6723 ✅ Patent 11,508,642 granted on 2022-11-22Power module package structure
#6724 ✅ Patent 11,961,783 granted on 2024-04-16Semiconductor apparatus and electronic apparatus
#6725 ✅ Patent 11,756,857 granted on 2023-09-12Electronic circuit, power converter, and method for producing an electronic circuit
#6726 ✅ Patent 11,823,974 granted on 2023-11-21Cryogenic solid state heat pump
#6727SEMICONDUCTOR CHIP PACKAGE THERMO-MECHANICAL COOLING ASSEMBLY
#6728 ✅ Patent 11,581,241 granted on 2023-02-14Circuit modules with front-side interposer terminals and through-module thermal dissipation structures
#6729 ✅ Patent 11,791,240 granted on 2023-10-17High performance baseboard cooling architecture
#6730 ✅ Patent 11,764,128 granted on 2023-09-19Semiconductor chip including through electrode, and semiconductor package including the same
#6731SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#6732STRUCTURES WITH THROUGH-SUBSTRATE VIAS AND METHODS FOR FORMING THE SAME
#6733 ✅ Patent 11,756,862 granted on 2023-09-12Oversized via as through-substrate-via (TSV) stop layer
#6734 ✅ Patent 12,046,539 granted on 2024-07-23Semiconductor module comprising a resin case and an external connection terminal
#6735 ✅ Patent 11,646,249 granted on 2023-05-09Dual-side cooling semiconductor packages and related methods
#6736 ✅ Patent 11,652,030 granted on 2023-05-16Power module and related methods
#6737 ✅ Patent 11,631,632 granted on 2023-04-18Three dimensional package for semiconductor devices and external components
#6738 ✅ Patent 11,798,882 granted on 2023-10-24Semiconductor package having smart power stage and e-fuse solution
#6739 ✅ Patent 11,837,529 granted on 2023-12-05Semiconductor package with top circuit and an IC with a gap over the IC
#6740 ✅ Patent 11,532,539 granted on 2022-12-20Semiconductor package with wettable flank
#6741 ✅ Patent 11,715,678 granted on 2023-08-01Roughened conductive components
#6742 ✅ Patent 12,040,260 granted on 2024-07-16Electronic package with surface contact wire extensions
#6743QFN/QFP PACKAGE WITH INSULATED TOP-SIDE THERMAL PAD
#6744 ✅ Patent 11,404,360 granted on 2022-08-02Power module with enhanced heat dissipation
#6745 ✅ Patent 11,710,683 granted on 2023-07-25Heat conduction pattern for cooling a power module
#6746 ✅ Patent 12,062,600 granted on 2024-08-13Lead frame and semiconductor device
#6747 ✅ Patent 11,848,258 granted on 2023-12-19Semiconductor package with nickel-silver pre-plated leadframe
#6748 ✅ Patent 11,894,292 granted on 2024-02-06Power module
#6749 ✅ Patent 12,300,590 granted on 2025-05-13Package structure and method for forming same
#6750 ✅ Patent 11,742,272 granted on 2023-08-29Semiconductor device
#6751 ✅ Patent 12,125,776 granted on 2024-10-22Method for forming semiconductor package and semiconductor package
#6752 ✅ Patent 11,842,957 granted on 2023-12-12Amplifier modules and systems with ground terminals adjacent to power amplifier die
#6753SEMICONDUCTOR-MOUNTED PRODUCT
#6754 ✅ Patent 11,488,904 granted on 2022-11-01System and method for reducing mutual coupling for noise reduction in semiconductor device packaging
#6755 ✅ Patent 12,354,943 granted on 2025-07-08SEMICONDUCTOR DEVICE
#6756INSULATING CHIP
#6757 ✅ Patent 11,742,283 granted on 2023-08-29Integrated thin film resistor and memory device
#6758 ✅ Patent 11,756,882 granted on 2023-09-12Semiconductor die with blast shielding
#6759 ✅ Patent 11,791,265 granted on 2023-10-17Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
#6760 ✅ Patent 11,652,050 granted on 2023-05-16Inset power post and strap architecture with reduced voltage droop
#6761 ✅ Patent 12,046,556 granted on 2024-07-23Semiconductor devices having highly integrated active and power distribution regions therein
#6762 ✅ Patent 12,300,618 granted on 2025-05-13Semiconductor device having a heat dissipation structure connected chip package
#6763 ✅ Patent 11,664,318 granted on 2023-05-30Stack of dies
#6764 ✅ Patent 12,009,308 granted on 2024-06-11Semiconductor chip including through electrodes, and semiconductor package including the same
#6765 ✅ Patent 11,756,891 granted on 2023-09-12Semiconductor device and method for manufacturing same
#6766 ✅ Patent 11,742,295 granted on 2023-08-29Interface of integrated circuit die and method for arranging interface thereof
#6767 ✅ Patent 11,721,633 granted on 2023-08-08Semiconductor device
#6768 ✅ Patent 12,293,972 granted on 2025-05-06Semiconductor device and method of forming leadframe with clip bond for electrical interconnect
#6769 ✅ Patent 12,308,317 granted on 2025-05-20Semiconductor device and method for fabricating the same
#6770 ✅ Patent 11,854,997 granted on 2023-12-26Method of forming semiconductor device
#6771 ✅ Patent 11,923,320 granted on 2024-03-05Semiconductor device having tapered metal coated sidewalls
#6772 ✅ Patent 12,113,030 granted on 2024-10-08Electronic component module comprising shield and sealing resin covering electronic components
#6773 ✅ Patent 11,626,371 granted on 2023-04-11Semiconductor structure with one or more support structures
#6774 ✅ Patent 11,658,130 granted on 2023-05-23Conductive plate stress reduction feature
#6775 ✅ Patent 11,545,444 granted on 2023-01-03Mitigating cooldown peeling stress during chip package assembly
#6776 ✅ Patent 12,205,905 granted on 2025-01-21Semiconductor structure
#6777 ✅ Patent 11,430,747 granted on 2022-08-30Strain-induced shift mitigation in semiconductor packages
#6778 ✅ Patent 12,046,565 granted on 2024-07-23Vertical memory device with metal and spacer support structure
#6779 ✅ Patent 12,183,689 granted on 2024-12-31Ceramic substrate and manufacturing method therefor
#6780SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
#6781 ✅ Patent 11,935,844 granted on 2024-03-19Semiconductor device and method of the same
#6782 ✅ Patent 11,495,551 granted on 2022-11-08Power semiconductor module with integrated surge arrester
#6783 ✅ Patent 12,230,594 granted on 2025-02-18Printed package and method of making the same
#6784 ✅ Patent 12,211,809 granted on 2025-01-28Structure with conductive feature and method of forming same
#6785 ✅ Patent 11,694,978 granted on 2023-07-04Semiconductor devices and semiconductor packages including the same
#6786 ✅ Patent 11,810,879 granted on 2023-11-07Semiconductor structure including buffer layer
#6787 ✅ Patent 12,033,966 granted on 2024-07-09Contact pads of three-dimensional memory device and fabrication method thereof
#6788 ✅ Patent 11,616,036 granted on 2023-03-28Semiconductor device and method of manufacturing the same
#6789 ✅ Patent 11,784,148 granted on 2023-10-10Semiconductor package
#6790 ✅ Patent 12,159,850 granted on 2024-12-03Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly
#6791 ✅ Patent 12,218,090 granted on 2025-02-04Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly
#6792 ✅ Patent 12,002,781 granted on 2024-06-04Semiconductor device and method for manufacturing same
#6793 ✅ Patent 11,948,904 granted on 2024-04-02Die and package structure
#6794MULTI-LEVEL BRIDGE INTERCONNECTS
#6795 ✅ Patent 12,125,816 granted on 2024-10-22Semiconductor device assemblies and systems with one or more dies at least partially embedded in a redistribution layer (RDL) and methods for making the same
#6796INTEGRATED CIRCUIT PACKAGE STRUCTURE, INTEGRATED CIRCUIT PACKAGE UNIT AND ASSOCIATED PACKAGING METHOD
#6797Method for Fastening a Semiconductor Chip on a Substrate, and Electronic Component
#6798Semiconductor Device and Method of Forming Clip Bond Having Multiple Bond Line Thicknesses
#6799 ✅ Patent 11,842,977 granted on 2023-12-12Semiconductor package
#6800 ✅ Patent 12,255,170 granted on 2025-03-18Semiconductor package, electronic apparatus, and method for manufacturing semiconductor package
#6801 ✅ Patent 11,824,037 granted on 2023-11-21Assembly of a chip to a substrate
#6802SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
#6803WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
#6804 ✅ Patent 11,694,989 granted on 2023-07-04Die bonding method with corner or side contact without impact force
#6805DIRECTLY BONDED STRUCTURES
#6806 ✅ Patent 11,430,762 granted on 2022-08-30Method for semi-wafer level packaging
#6807 ✅ Patent 11,855,042 granted on 2023-12-26Method of manufacturing semiconductor structure
#6808 ✅ Patent 11,742,326 granted on 2023-08-29Stacked superconducting integrated circuits with three dimensional resonant clock networks
#6809 ✅ Patent 11,462,513 granted on 2022-10-04Chip bonding alignment structure, chip bonding structure and methods for fabricating the same
#6810 ✅ Patent 11,742,328 granted on 2023-08-29Thermally efficient semiconductor device assemblies including interposers carrying a subset of the external contacts of the assembly, and methods of making the same
#6811 ✅ Patent 11,862,608 granted on 2024-01-02Semiconductor package
#6812 ✅ Patent 11,948,919 granted on 2024-04-02Stacked semiconductor package
#6813 ✅ Patent 12,002,787 granted on 2024-06-04Multi-die package structure and multi-die co-packing method
#6814MULTI-DIE CO-PACKED MODULE AND MULTI-DIE CO-PACKING METHOD
#6815Chip Package and Method of Forming Chip Packages
#6816STACKED MEMORY ROUTING TECHNIQUES
#6817 ✅ Patent 11,855,046 granted on 2023-12-26Memory packages and methods of forming same
#6818 ✅ Patent 12,218,101 granted on 2025-02-04Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same
#6819STACK PACKAGES INCLUDING A HYBRID WIRE BONDING STRUCTURE
#6820OPTOELECTRONIC SOLID STATE ARRAY
#6821 ✅ Patent 12,349,508 granted on 2025-07-01MICRO-LED STRUCTURE AND MICRO-LED CHIP INCLUDING SAME
#6822 ✅ Patent 12,349,509 granted on 2025-07-01MICRO-LED STRUCTURE AND MICRO-LED CHIP INCLUDING SAME
#6823 ✅ Patent 12,183,850 granted on 2024-12-31Micro-LED structure and micro-LED chip including same
#6824LIGHT EMITTING DIODE CHIP AND DISPLAY APPARATUS INCLUDING THE SAME
#6825 ✅ Patent 11,784,171 granted on 2023-10-10Semiconductor device
#6826 ✅ Patent 11,942,460 granted on 2024-03-26Systems and methods for reducing the size of a semiconductor assembly
#6827 ✅ Patent 11,676,951 granted on 2023-06-13Package for power semiconductor devices
#6828 ✅ Patent 12,230,615 granted on 2025-02-18Semiconductor packages with vertical passive components
#6829 ✅ Patent 12,249,596 granted on 2025-03-11Display device and manufacturing method thereof
#6830 ✅ Patent 11,676,954 granted on 2023-06-13Bonded three-dimensional memory devices with backside source power supply mesh and methods of making the same
#6831SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF
#6832 ✅ Patent 12,211,834 granted on 2025-01-28Low capacitance transient voltage suppressor with high holding voltage
#6833 ✅ Patent 12,349,470 granted on 2025-07-01SEMICONDUCTOR DEVICE HAVING MULTIPLE ELECTROSTATIC DISCHARGE (ESD) PATHS
#6834 ✅ Patent 11,961,834 granted on 2024-04-16Semiconductor device having multiple electrostatic discharge (ESD) paths
#6835 ✅ Patent 11,929,363 granted on 2024-03-12Semiconductor device having multiple electrostatic discharge (ESD) paths
#6836 ✅ Patent 11,721,688 granted on 2023-08-08Electrostatic protection circuit, integrated circuit and electrostatic discharge method
#6837 ✅ Patent 12,113,062 granted on 2024-10-08Fringe capacitor, integrated circuit and manufacturing process for the fringe capacitor
#6838 ✅ Patent 12,094,873 granted on 2024-09-17SiGe HBT with graphene extrinsic base and methods
#6839INTEGRATED CIRCUIT DEVICES
#6840 ✅ Patent 11,842,997 granted on 2023-12-12Methods for pillar connection on frontside and passive device integration on backside of die
#6841 ✅ Patent 12,336,275 granted on 2025-06-17SEMICONDUCTOR DEVICE
#6842 ✅ Patent 11,735,586 granted on 2023-08-22Semiconductor structure
#6843 ✅ Patent 12,046,667 granted on 2024-07-23III-V semiconductor device with integrated protection functions
#6844 ✅ Patent 11,855,082 granted on 2023-12-26Integrated circuits with FinFET gate structures
#6845 ✅ Patent 12,191,307 granted on 2025-01-07Multi-gate device and related methods
#6846 ✅ Patent 12,114,482 granted on 2024-10-08Fabrication method of a memory and the memory
#6847MULTI-BITS STORAGE IN POWER MOS (AND IGBT) AND SIMULTANEOUS READ METHODS
#6848 ✅ Patent 11,832,434 granted on 2023-11-28Memory cell and memory device
#6849DOPED TITANIUM NITRIDE MATERIALS FOR DRAM CAPACITORS, AND RELATED SEMICONDUCTOR DEVICES
#6850 ✅ Patent 12,302,550 granted on 2025-05-13Semiconductor memory device including capacitor with a dielectric film on an upper plate region, a lower plate region, and a side surface of a connecting region therebetween
#6851 ✅ Patent 11,488,959 granted on 2022-11-01Gate-all-around semiconductor device with dielectric-all-around capacitor and method for fabricating the same
#6852 ✅ Patent 11,758,711 granted on 2023-09-12Thin-film transistor embedded dynamic random-access memory with shallow bitline
#6853 ✅ Patent 12,279,409 granted on 2025-04-15Array of capacitors and method used in forming an array of capacitors
#6854 ✅ Patent 11,871,562 granted on 2024-01-09Method for forming storage node contact structure and semiconductor structure
#6855METHOD FOR FORMING STORAGE NODE CONTACT STRUCTURE AND SEMICONDUCTOR STRUCTURE
#6856 ✅ Patent 11,683,924 granted on 2023-06-20Memory device and manufacturing method
#6857 ✅ Patent 11,871,573 granted on 2024-01-09Three-dimensional memory device having source-select-gate cut structures and methods for forming the same
#6858 ✅ Patent 12,245,434 granted on 2025-03-04Method of making a three-dimensional memory device using composite hard masks for formation of deep via openings
#6859METAL REPLACEMENT PLATE LINE PROCESS FOR 3D-FERROELECTRIC RANDOM (3D-FRAM)
#68603D-FERROELECTRIC RANDOM (3D-FRAM) WITH BURIED TRENCH CAPACITORS
#6861 ✅ Patent 12,279,426 granted on 2025-04-15Semiconductor device, including element isolation layer and nonvolatile memory device including the same
#6862 ✅ Patent 12,048,149 granted on 2024-07-23Three-dimensional memory device having source-select-gate cut structures and methods for forming the same
#6863INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM INCLUDING SAME
#6864 ✅ Patent 12,127,404 granted on 2024-10-22Semiconductor storage device with wall protions for isolatioing blocks
#6865 ✅ Patent 12,238,931 granted on 2025-02-25Semiconductor device and electronic system including the same
#6866 ✅ Patent 11,723,208 granted on 2023-08-08Memory device
#6867 ✅ Patent 12,010,841 granted on 2024-06-11Method of making a three-dimensional memory device using composite hard masks for formation of deep via openings
#6868 ✅ Patent 12,349,347 granted on 2025-07-01SEMICONDUCTOR STORAGE DEVICE
#6869 ✅ Patent 12,010,846 granted on 2024-06-11Semiconductor device and electronic system including the same
#6870 ✅ Patent 12,250,817 granted on 2025-03-11Method of making a three-dimensional memory device using composite hard masks for formation of deep via openings
#6871 ✅ Patent 12,160,991 granted on 2024-12-03Semiconductor device and data storage system including the same
#6872 ✅ Patent 11,973,082 granted on 2024-04-30Integrated circuit devices
#6873METHOD FOR DESIGNING AN ARRAY SUBSTRATE, ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE
#6874 ✅ Patent 11,837,606 granted on 2023-12-05Display panel and display device
#6875 ✅ Patent 11,791,345 granted on 2023-10-17Active matrix substrate and method for manufacturing same
#6876SEMICONDUCTOR DEVICE
#6877 ✅ Patent 11,791,346 granted on 2023-10-17Method for manufacturing a display device
#6878TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME
#6879 ✅ Patent 11,830,882 granted on 2023-11-28Display panel and display device
#6880THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY APPARATUS COMPRISING THE SAME
#6881ARRAY SUBSTRATE, FABRICATING METHOD THEREOF, AND DISPLAY DEVICE
#6882 ✅ Patent 11,894,395 granted on 2024-02-06Display device
#6883ARRAY SUBSTRATE, DISPLAY PANEL, AND DISPLAY DEVICE
#6884 ✅ Patent 12,218,153 granted on 2025-02-04Display device and manufacturing method thereof
#6885 ✅ Patent 11,935,904 granted on 2024-03-19Display device
#6886Light Emitting Display Panel
#6887 ✅ Patent 12,062,668 granted on 2024-08-13Crystallization process of oxide semiconductor, and method of manufacturing thin film transistor, a thin film transistor, a display panel, and an electronic device
#6888 ✅ Patent 12,009,372 granted on 2024-06-11Display device including hydrogen diffusion barrier film, and method for manufacturing same
#6889 ✅ Patent 11,682,680 granted on 2023-06-20Crystalline oxide semiconductor thin film, and method of forming the same and thin film transistor and method of manufacturing the same and display panel and electronic device
#6890IMAGE SENSING DEVICE
#6891 ✅ Patent 11,862,659 granted on 2024-01-02Backside incident-type imaging element
#6892 ✅ Patent 12,149,848 granted on 2024-11-19Photoelectric conversion apparatus, photoelectric conversion system, moving body, and semiconductor substrate
#6893 ✅ Patent 12,376,391 granted on 2025-07-29IMAGING DEVICE
#6894 ✅ Patent 11,374,042 granted on 2022-06-283D micro display semiconductor device and structure
#6895 ✅ Patent 11,961,854 granted on 2024-04-16Semiconductor device
#6896 ✅ Patent 12,002,822 granted on 2024-06-04Metal-oxide-semiconductor capacitor based passive amplifier
#6897IMAGE SENSING DEVICE
#6898 ✅ Patent 12,342,643 granted on 2025-06-24IMAGING APPARATUS
#6899 ✅ Patent 12,170,298 granted on 2024-12-17Image sensor including a photodiode
#6900 ✅ Patent 12,191,332 granted on 2025-01-07Image sensor and semiconductor device including asymmetric active region