Electrical switch gear assemblies with folding frames and methods of installing
#5102 ✅ Patent 11,699,560 granted on 2023-07-11Button deck with non-penetrating pushbutton
#5103 ✅ Patent 11,934,169 granted on 2024-03-19Configurable binary circuits for protection relays in electric power systems
#5104 ✅ Patent 11,610,752 granted on 2023-03-21Fast smart circuit breaker
#5105 ✅ Patent 11,651,923 granted on 2023-05-16Two-piece fuse endbell with pre-cast/pre-molded alignment slots and optional interface crush ribs
#5106 ✅ Patent 11,961,691 granted on 2024-04-16Fuse end cap having displaceable alignment pin
#5107 ✅ Patent 12,080,507 granted on 2024-09-03Electron gun, electron beam applicator, emission axis verification method for electron beam emitted from photocathode, and emission axis alignment method for electron beam emitted from photocathode
#5108 ✅ Patent 11,664,183 granted on 2023-05-30Extended cathode and repeller life by active management of halogen cycle
#5109 ✅ Patent 11,955,307 granted on 2024-04-09Electron emitter apparatus
#5110CHARGED PARTICLE BEAM DEVICE
#5111 ✅ Patent 12,205,790 granted on 2025-01-21Charged particle beam device
#5112 ✅ Patent 12,176,181 granted on 2024-12-24Pattern inspecting device
#5113 ✅ Patent 11,545,338 granted on 2023-01-03Charged particle beam apparatus and method of controlling sample charge
#5114 ✅ Patent 12,183,542 granted on 2024-12-31Transmission electron microscope and imaging method
#5115 ✅ Patent 11,935,722 granted on 2024-03-19Machine learning on wafer defect review
#5116 ✅ Patent 11,715,620 granted on 2023-08-01Tuning gas cluster ion beam systems
#5117MULTI CHARGED PARTICLE BEAM WRITING METHOD AND MULTI CHARGED PARTICLE BEAM WRITING APPARATUS
#5118SYSTEM AND PROCESS IMPLEMENTING A WIDE RIBBON BEAM ION SOURCE TO IMPLANT IONS IN MATERIAL TO MODIFY MATERIAL PROPERTIES
#5119 ✅ Patent 11,854,766 granted on 2023-12-26DC bias in plasma process
#5120 ✅ Patent 11,894,219 granted on 2024-02-06Method for processing substrate
#5121PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
#5122 ✅ Patent 12,020,901 granted on 2024-06-25RF impedance matching networks for substrate processing platform
#5123PLASMA PROCESSING APPARATUS
#5124 ✅ Patent 12,237,150 granted on 2025-02-25Plasma ion processing of substrates
#5125CANTILEVER WITH ETCH CHAMBER FLOW DESIGN
#5126DEVICES AND METHODS FOR CONTROLLING WAFER UNIFORMITY IN PLASMA-BASED PROCESS
#5127 ✅ Patent 12,154,765 granted on 2024-11-26Plasma processing apparatus and plasma processing method
#5128 ✅ Patent 12,368,027 granted on 2025-07-22SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
#5129BAFFLE PLATE FOR CONTROLLING WAFER UNIFORMITY AND METHODS FOR MAKING THE SAME
#5130APPARATUS FOR FABRICATING A SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING A SEMICONDUCTOR STRUCTURE
#5131 ✅ Patent 12,112,927 granted on 2024-10-08Substrate processing apparatus and method
#5132 ✅ Patent 12,368,028 granted on 2025-07-22APPARATUS FOR IMPROVED HIGH PRESSURE PLASMA PROCESSING
#5133 ✅ Patent 12,191,121 granted on 2025-01-07Plasma processing apparatus
#5134 ✅ Patent 12,249,495 granted on 2025-03-11Etching method of etching apparatus
#5135 ✅ Patent 12,014,912 granted on 2024-06-18Apparatus and method for physical vapor deposition
#5136ANALYZING METHOD
#5137 ✅ Patent 12,176,194 granted on 2024-12-24Analysis device
#5138 ✅ Patent 11,837,452 granted on 2023-12-05Charge detection mass spectrometry
#5139 ✅ Patent 12,112,934 granted on 2024-10-08Method for mass spectrometry
#5140 ✅ Patent 11,728,152 granted on 2023-08-15Predicting molecular collision cross-section using differential mobility spectrometry
#5141 ✅ Patent 12,094,702 granted on 2024-09-17Silicon nanowire chip and silicon nanowire chip-based mass spectrum detection method
#5142 ✅ Patent 12,191,132 granted on 2025-01-07Method for mass spectrometry
#5143 ✅ Patent 11,776,800 granted on 2023-10-03Substance analyzer and substance analysis method
#5144 ✅ Patent 11,631,577 granted on 2023-04-18Ion focusing
#5145ION BEAM IRRADIATION APPARATUS
#5146CHEMICAL IONISATION METHOD AND ION MOLECULE REACTOR
#5147 ✅ Patent 12,154,781 granted on 2024-11-26Ultraviolet irradiation device using excimer lamps
#5148CLEANING METHOD, SEMICONDUCTOR MANUFACTURING METHOD AND A SYSTEM THEREOF
#5149SYSTEMS AND METHODS FOR METALLIC DEIONIZATION
#5150 ✅ Patent 11,996,283 granted on 2024-05-28Method for metal gate surface clean
#5151 ✅ Patent 11,955,336 granted on 2024-04-09Method of manufacturing a semiconductor device
#5152 ✅ Patent 12,362,201 granted on 2025-07-15BEVEL EDGE REMOVAL METHODS, TOOLS, AND SYSTEMS
#5153 ✅ Patent 12,347,672 granted on 2025-07-01SILICON PRECURSOR COMPOUNDS AND METHOD FOR FORMING SILICON-CONTAINING FILMS
#5154 ✅ Patent 11,961,732 granted on 2024-04-16Controlling threshold voltages through blocking layers
#5155 ✅ Patent 11,881,397 granted on 2024-01-23Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device
#5156METHODS FOR FORMING AN EPITAXIAL WAFER
#5157METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE
#5158 ✅ Patent 12,148,615 granted on 2024-11-19Method and apparatus for laser annealing
#5159 ✅ Patent 11,942,321 granted on 2024-03-26Methods and systems for spot beam crystallization
#5160FIN STRUCTURE WITH REDUCED DEFECTS AND MANUFACTURING METHOD THEREOF
#5161METHODS FOR FABRICATING SEMICONDUCTOR DEVICES
#5162 ✅ Patent 12,211,693 granted on 2025-01-28Spacer patterning process with flat top profile
#5163METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
#5164 ✅ Patent 12,062,543 granted on 2024-08-13Line-end extension method and device
#5165System, Semiconductor Device and Method
#5166 ✅ Patent 12,009,214 granted on 2024-06-11Gate electrodes with notches and methods for forming the same
#5167 ✅ Patent 12,283,485 granted on 2025-04-22Cut metal gate refill with void
#5168 ✅ Patent 12,243,748 granted on 2025-03-04FinFET device having a gate with a tapering bottom portion and a gate fill material with a widening bottom portion
#5169PROCESS INTEGRATION TO REDUCE CONTACT RESISTANCE IN SEMICONDUCTOR DEVICE
#5170METHODS AND APPARATUS FOR ENHANCING SELECTIVITY OF TITANIUM AND TITANIUM SILICIDES DURING CHEMICAL VAPOR DEPOSITION
#5171 ✅ Patent 11,854,814 granted on 2023-12-26Semiconductor device and method
#5172 ✅ Patent 12,074,029 granted on 2024-08-27Molybdenum deposition
#5173 ✅ Patent 12,087,588 granted on 2024-09-10Substrate processing apparatus and substrate processing method
#5174METHOD FOR FABRICATING SEMICONDUCTOR CHIP STRUCTURES, SEMICONDUCTOR CARRIER AND SEMICONDUCTOR CHIP STRUCTURE
#5175 ✅ Patent 11,631,589 granted on 2023-04-18Metal etch in high aspect-ratio features
#5176AREA-SELECTIVE ETCHING
#5177DEVICE AND METHOD FOR PROCESSING AT LEAST ONE SEMICONDUCTOR SUBSTRATE
#5178 ✅ Patent 11,854,818 granted on 2023-12-26Angled etch for surface smoothing
#5179 ✅ Patent 11,735,428 granted on 2023-08-22Substrate processing method and substrate processing apparatus
#5180Chemical Mechanical Polishing With Die-Based Modification
#5181Etching Composition for Silicon Nitride Layer and Etching Method Using the Same
#5182 ✅ Patent 11,501,977 granted on 2022-11-15Semiconductor device and manufacturing method thereof
#5183 ✅ Patent 11,923,202 granted on 2024-03-05Double patterning method
#5184 ✅ Patent 11,854,826 granted on 2023-12-26Metal oxide layered structure and methods of forming the same
#5185 ✅ Patent 11,749,532 granted on 2023-09-05Methods and apparatus for processing a substrate
#5186 ✅ Patent 12,027,376 granted on 2024-07-02Method for cut metal gate etch dimensional control
#5187 ✅ Patent 12,334,360 granted on 2025-06-17Laser Fabrication of Lead Selenide Thin Film
#5188 ✅ Patent 11,574,817 granted on 2023-02-07Fabricating an interconnection using a sacrificial layer
#5189 ✅ Patent 11,742,218 granted on 2023-08-29Semiconductor device package having metal thermal interface material and method for forming the same
#5190SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE
#5191 ✅ Patent 11,955,345 granted on 2024-04-09Encapsulation warpage reduction for semiconductor die assemblies and associated methods and systems
#5192Integrated Circuit Package and Method
#5193 ✅ Patent 12,341,042 granted on 2025-06-24WAFER HOLDER FOR FILM DEPOSITION CHAMBER
#5194SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#5195 ✅ Patent 12,009,227 granted on 2024-06-11Electrostatic substrate cleaning system and method
#5196 ✅ Patent 11,817,330 granted on 2023-11-14Method for processing substrate
#5197 ✅ Patent 11,854,841 granted on 2023-12-26Space filling device for wet bench
#5198 ✅ Patent 12,080,567 granted on 2024-09-03Systems and methods for in-situ Marangoni cleaning
#5199 ✅ Patent 12,347,700 granted on 2025-07-01WET BENCH AND CHEMICAL TREATMENT METHOD USING THE SAME
#5200 ✅ Patent 12,368,063 granted on 2025-07-22WAFER TAPING APPARATUS AND METHOD
#5201MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#5202SUBSTRATE TREATMENT APPARATUS WITH FLEX-LL FUNCTION, AND SUBSTRATE TRANSFER METHOD
#5203TEMPERATURE CONTROL SYSTEM AND TEMPERATURE CONTROL METHOD
#5204SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND STORAGE MEDIUM
#5205 ✅ Patent 12,100,604 granted on 2024-09-24Method and system for recognizing and addressing plasma discharge during semiconductor processes
#5206 ✅ Patent 11,961,749 granted on 2024-04-16Wafer detection device and wafer detection method using the same
#5207SUBSTRATE TREATMENT APPARATUS WITH VIRTUAL DUMMY WAFER FUNCTION AND SUBSTRATE TREATMENT METHOD
#5208 ✅ Patent 11,798,827 granted on 2023-10-24Systems and methods for semiconductor adaptive testing using inline defect part average testing
#5209 ✅ Patent 11,721,572 granted on 2023-08-08Integrated semiconductor die vessel processing workstations
#5210 ✅ Patent 12,046,496 granted on 2024-07-23Device of mass transferring chips
#5211 ✅ Patent 11,984,336 granted on 2024-05-14Wafer storage container
#5212 ✅ Patent 12,119,253 granted on 2024-10-15Transport vehicle
#5213 ✅ Patent 11,848,221 granted on 2023-12-19Method of storing workpiece using workpiece storage system
#5214ELECTRONIC COMPONENT TRANSFERRING APPARATUS, ELECTRONIC COMPONENT TRANSFERRING METHOD AND MANUFACTURING METHOD OF LIGHT-EMITTING DIODE PANEL
#5215 ✅ Patent 12,261,071 granted on 2025-03-25Electronic component transfer apparatus, electronic component transfer method, and method of manufacturing a light-emitting diode panel
#5216 ✅ Patent 12,331,984 granted on 2025-06-17CRYOGENIC MICRO-ZONE ELECTROSTATIC CHUCK CONNECTOR ASSEMBLY
#5217 ✅ Patent 11,908,726 granted on 2024-02-20Method of manufacturing electrostatic chuck having electrode layer made of heterogeneous composite material, and electrostatic chuck manufactured thereby
#5218SUBSTRATE FOR MANUFACTURING DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
#5219Method of Manufacturing and Passivating a Die
#5220 ✅ Patent 12,211,731 granted on 2025-01-28Wafer processing method
#5221 ✅ Patent 12,148,651 granted on 2024-11-19Chuck design and method for wafer
#5222 ✅ Patent 12,334,387 granted on 2025-06-17SUBSTRATE TRANSFER APPARATUS
#5223 ✅ Patent 12,165,909 granted on 2024-12-10Screwless semiconductor processing chambers
#5224 ✅ Patent 12,046,506 granted on 2024-07-23Devices with reduced capacitances
#5225 ✅ Patent 11,915,972 granted on 2024-02-27Methods of forming spacers for semiconductor devices including backside power rails
#5226 ✅ Patent 11,830,769 granted on 2023-11-28Semiconductor device with air gaps and method of fabrication thereof
#5227INTER-WIRE CAVITY FOR LOW CAPACITANCE
#5228 ✅ Patent 12,046,507 granted on 2024-07-23Semiconductor device structure and methods of forming the same
#5229THROUGH WAFER ISOLATION ELEMENT BACKSIDE PROCESSING
#5230 ✅ Patent 11,764,103 granted on 2023-09-19Semiconductor feature and method for manufacturing the same
#5231 ✅ Patent 12,027,412 granted on 2024-07-02Three-dimensional memory device and method
#5232 ✅ Patent 11,658,061 granted on 2023-05-23Semiconductor substrate and method of fabricating the same
#5233 ✅ Patent 12,119,258 granted on 2024-10-15Semiconductor structure comprising a buried porous layer for RF applications
#5234 ✅ Patent 11,830,764 granted on 2023-11-28Method for forming a semiconductor-on-insulator (SOI) substrate
#5235 ✅ Patent 12,341,057 granted on 2025-06-24Method and Apparatus for Back End of Line Semiconductor Device Processing
#5236 ✅ Patent 11,996,323 granted on 2024-05-28Semiconductor device with source/drain epitaxial layer
#5237 ✅ Patent 11,784,089 granted on 2023-10-10Semiconductor device with contact pad and method of making
#5238ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZATION
#5239 ✅ Patent 11,996,326 granted on 2024-05-28Barrier structure for semiconductor device
#5240METHODS OF FORMING VOID AND SEAM FREE METAL FEATURES
#5241TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION
#5242 ✅ Patent 11,869,806 granted on 2024-01-09Methods of forming molybdenum contacts
#5243 ✅ Patent 12,211,745 granted on 2025-01-28Methods of fabricating semiconductor devices
#5244 ✅ Patent 11,996,328 granted on 2024-05-28Cobalt fill for gate structures
#5245 ✅ Patent 12,142,524 granted on 2024-11-12Via for component electrode connection
#5246 ✅ Patent 12,125,747 granted on 2024-10-22Bottom-up formation of contact plugs
#5247 ✅ Patent 12,183,632 granted on 2024-12-31Bottom lateral expansion of contact plugs through implantation
#5248 ✅ Patent 12,107,007 granted on 2024-10-01Recessed contacts at line end and methods forming same
#5249 ✅ Patent 11,935,786 granted on 2024-03-19Contact features of semiconductor devices
#5250FULLY SELF-ALIGNED VIA
#5251SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
#5252 ✅ Patent 12,243,779 granted on 2025-03-04Semiconductor structure and method for manufacturing semiconductor structure
#5253 ✅ Patent 12,074,064 granted on 2024-08-27TSV structure and method forming same
#5254 ✅ Patent 12,087,631 granted on 2024-09-10Method for producing a composite structure comprising a thin monocristalline layer on a carrier substrate
#5255 ✅ Patent 12,218,011 granted on 2025-02-04Method of making 3D segmented devices for enhanced 3D circuit density
#5256 ✅ Patent 11,854,909 granted on 2023-12-26Semiconductor structure and method for manufacturing thereof
#5257 ✅ Patent 12,040,235 granted on 2024-07-16Semiconductor device and method of manufacture
#5258 ✅ Patent 11,551,977 granted on 2023-01-10Methods for improvement of photoresist patterning profile
#5259 ✅ Patent 11,705,371 granted on 2023-07-18Semiconductor devices having merged source/drain features and methods of fabrication thereof
#5260 ✅ Patent 12,027,423 granted on 2024-07-02Forming isolation regions for separating fins and gate stacks
#5261 ✅ Patent 12,020,986 granted on 2024-06-25Semiconductor structure and method of manufacturing the same
#5262Dual Dopant Source/Drain Regions and Methods of Forming Same
#5263 ✅ Patent 11,901,237 granted on 2024-02-13Semiconductor device having cut gate dielectric
#5264 ✅ Patent 12,243,781 granted on 2025-03-04Semiconductor device with L-shape conductive feature and methods of forming the same
#5265HIGH VOLTAGE DEVICES
#5266 ✅ Patent 11,854,902 granted on 2023-12-26Integrated circuits with buried interconnect conductors
#5267 ✅ Patent 12,170,229 granted on 2024-12-17Semiconductor devices and methods of manufacturing thereof
#5268 ✅ Patent 11,894,275 granted on 2024-02-06FinFET device having oxide region between vertical fin structures
#5269 ✅ Patent 12,112,989 granted on 2024-10-08Semiconductor device with tunable epitaxy structures and method of forming the same
#5270 ✅ Patent 11,854,905 granted on 2023-12-26Silicon and silicon germanium nanowire formation
#5271 ✅ Patent 12,369,386 granted on 2025-07-22Epitaxial Layers In Source/Drain Contacts And Methods Of Forming The Same
#5272 ✅ Patent 11,908,751 granted on 2024-02-20Transistor isolation regions and methods of forming the same
#5273 ✅ Patent 12,131,956 granted on 2024-10-29Ultra dense 3D routing for compact 3D designs
#5274 ✅ Patent 12,374,588 granted on 2025-07-29THIN-FILM NON-UNIFORM STRESS EVALUATION
#5275SEMICONDUCTOR DEVICE WITH TERMINATION STRUCTURE AND FIELD-FREE REGION
#5276 ✅ Patent 11,869,819 granted on 2024-01-09Integrated circuit component and package structure having the same
#5277METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
#5278STRESS MEASURING STRUCTURE AND STRESS MEASURING METHOD
#5279 ✅ Patent 12,322,665 granted on 2025-06-03Integrated circuit
#5280 ✅ Patent 11,699,625 granted on 2023-07-11Power semiconductor module arrangement
#5281 ✅ Patent 11,810,830 granted on 2023-11-07Chip package structure with cavity in interposer
#5282 ✅ Patent 11,581,233 granted on 2023-02-14Semiconductor device and method of forming electrical circuit pattern within encapsulant of SIP module
#5283 ✅ Patent 11,721,602 granted on 2023-08-08Semiconductor package with stiffener structure
#5284SEMICONDUCTOR PACKAGE
#5285 ✅ Patent 11,728,234 granted on 2023-08-15Electronic package comprising wire inside an electronic component and manufacturing method thereof
#5286 ✅ Patent 12,334,407 granted on 2025-06-17SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#5287 ✅ Patent 11,854,921 granted on 2023-12-26Integrated circuit package and method
#5288 ✅ Patent 12,165,941 granted on 2024-12-10Semiconductor device and method of manufacture
#5289 ✅ Patent 11,823,970 granted on 2023-11-21Radar package with optical lens for radar waves
#5290 ✅ Patent 11,810,831 granted on 2023-11-07Integrated circuit package and method of forming same
#5291 ✅ Patent 12,068,214 granted on 2024-08-20Display panel with grooves and manufacturing method thereof
#5292 ✅ Patent 11,901,255 granted on 2024-02-13Semiconductor device and method of forming the same
#5293TEMPORARY PASSIVATION LAYER ON A SUBSTRATE
#5294Integrated Circuit Package and Method
#5295ENHANCED SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHODS THEREOF
#5296 ✅ Patent 12,148,678 granted on 2024-11-19Semiconductor package and manufacturing method thereof
#5297 ✅ Patent 12,094,798 granted on 2024-09-17Power semiconductor device including a deformable flow blocking member between a module unit and a cooling unit
#5298 ✅ Patent 11,948,853 granted on 2024-04-02High-power die heat sink
#5299 ✅ Patent 11,929,299 granted on 2024-03-12High-power die heat sink with vertical heat path
#5300Multi-TIM Packages and Method Forming Same
#5301COPPER/CERAMIC ASSEMBLY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC ASSEMBLY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
#5302 ✅ Patent 12,125,766 granted on 2024-10-22Thermoelectric cooling packages
#5303SECURING POWER SEMICONDUCTOR COMPONENTS TO CURVED SURFACES
#5304 ✅ Patent 11,749,582 granted on 2023-09-05Package structure
#5305 ✅ Patent 12,300,571 granted on 2025-05-13Integrated circuit package and method
#5306 ✅ Patent 11,973,005 granted on 2024-04-30Coplanar control for film-type thermal interface
#5307 ✅ Patent 12,046,537 granted on 2024-07-23Front-end-of-line (FEOL) through semiconductor-on-substrate via (TSV)
#5308MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
#5309 ✅ Patent 11,908,775 granted on 2024-02-20Semiconductor device
#5310 ✅ Patent 12,374,604 granted on 2025-07-29PACKAGED POWER SEMICONDUCTOR DEVICE AND POWER CONVERTER
#5311 ✅ Patent 11,676,885 granted on 2023-06-13Semiconductor device packaging leadframe assembly and method therefor
#5312 ✅ Patent 12,074,099 granted on 2024-08-27Microelectronics package assemblies and processes for making
#5313ELECTRONIC PACKAGE WITH CONCAVE LEAD END FACES
#5314PACKAGE WITH LASER LAPPED SURFACE AND METHOD OF MANUFACTURING SAME
#5315 ✅ Patent 12,021,014 granted on 2024-06-25Bump joint structure with distortion and method forming same
#5316 ✅ Patent 11,967,546 granted on 2024-04-23Giga interposer integration through Chip-On-Wafer-On-Substrate
#5317Fan-Out Packages and Methods of Forming the Same
#5318SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF
#5319 ✅ Patent 11,961,793 granted on 2024-04-16Semiconductor package including a redistribution substrate and a method of fabricating the same
#5320METHOD OF FORMING REDISTRIBUTION LAYER STRUCTURE
#5321MULTI-CHIP SYSTEM-IN-PACKAGE
#5322SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
#5323 ✅ Patent 11,776,887 granted on 2023-10-03Semiconductor package structure and method for manufacturing the same
#5324 ✅ Patent 11,881,448 granted on 2024-01-23Semiconductor package structure having substrate with embedded electronic component and conductive pillars
#5325PACKAGE SUBSTRATE, CHIP PACKAGE AND INTEGRATED CIRCUIT CHIP
#5326 ✅ Patent 11,978,700 granted on 2024-05-07Power semiconductor module arrangement
#5327 ✅ Patent 11,894,296 granted on 2024-02-06Integrated circuit package with heatsink
#5328 ✅ Patent 12,125,781 granted on 2024-10-22Cell having stacked pick-up region
#5329 ✅ Patent 11,756,884 granted on 2023-09-12Interconnection structure and methods of forming the same
#5330 ✅ Patent 11,990,404 granted on 2024-05-21Heat dissipation for semiconductor devices and methods of manufacture
#5331 ✅ Patent 12,218,051 granted on 2025-02-04Method of manufacturing a semiconductor device including a plurality of circuit components and array of conductive contacts
#5332 ✅ Patent 11,784,124 granted on 2023-10-10Plurality of different size metal layers for a pad structure
#5333 ✅ Patent 12,199,036 granted on 2025-01-14Low resistance interconnect structure for semiconductor device
#5334 ✅ Patent 11,776,895 granted on 2023-10-03Semiconductor structure and method for manufacturing the same
#5335 ✅ Patent 11,776,897 granted on 2023-10-03Electronic module, manufacturing method thereof and electronic package having the same
#5336 ✅ Patent 11,837,535 granted on 2023-12-05Semiconductor devices including decoupling capacitors
#5337 ✅ Patent 12,278,176 granted on 2025-04-15Integrated circuit structure and method for forming the same
#5338 ✅ Patent 11,961,800 granted on 2024-04-16Via for semiconductor device connection and methods of forming the same
#5339 ✅ Patent 12,300,599 granted on 2025-05-13Method for forming semiconductor structure
#5340 ✅ Patent 11,764,149 granted on 2023-09-19Semiconductor device
#5341 ✅ Patent 12,300,600 granted on 2025-05-13Semiconductor device with self-aligned conductive features
#5342 ✅ Patent 12,051,645 granted on 2024-07-30Two 2D capping layers on interconnect conductive structure to increase interconnect structure reliability
#5343 ✅ Patent 12,021,024 granted on 2024-06-25Semiconductor device including a semiconductor die and a plurality of antenna patterns
#5344 ✅ Patent 11,929,322 granted on 2024-03-12Method of forming device and package structure
#5345 ✅ Patent 12,183,670 granted on 2024-12-31Semiconductor device including capacitor and resistor
#5346INTERCONNECT STRUCTURE
#5347 ✅ Patent 11,699,655 granted on 2023-07-11Transistor and fabrication method thereof
#5348 ✅ Patent 12,074,107 granted on 2024-08-27Structure and method of forming a semiconductor device with resistive elements
#5349Semiconductor Device Structure Having a Multi-Layer Conductive Feature and Method Making the Same
#5350 ✅ Patent 11,837,540 granted on 2023-12-05Surface-mount thin-film fuse having compliant terminals
#5351 ✅ Patent 11,942,426 granted on 2024-03-26Semiconductor structure having alternating selective metal and dielectric layers
#5352 ✅ Patent 11,688,689 granted on 2023-06-27Electronic devices including stair step structures, and related memory devices, systems, and methods
#5353 ✅ Patent 11,854,973 granted on 2023-12-26Semiconductor device with reduced resistance and method for manufacturing the same
#5354 ✅ Patent 12,154,856 granted on 2024-11-26Methods of manufacturing via structures on source/drain contacts
#5355 ✅ Patent 12,243,819 granted on 2025-03-04Single-mask alternating line deposition
#5356 ✅ Patent 12,009,302 granted on 2024-06-11Method of testing wafer
#5357 ✅ Patent 11,984,402 granted on 2024-05-14Semiconductor device and method
#5358 ✅ Patent 12,347,775 granted on 2025-07-01SEMICONDUCTOR DEVICES WITH BACKSIDE POWER RAIL AND METHODS OF FABRICATION THEREOF
#5359 ✅ Patent 12,040,274 granted on 2024-07-16Microelectronic devices including differently sized conductive contact structures, and related memory devices, electronic systems, and methods
#5360 ✅ Patent 12,142,565 granted on 2024-11-12Different via configurations for different via interface requirements
#5361SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#5362 ✅ Patent 11,791,270 granted on 2023-10-17Direct bonded heterogeneous integration silicon bridge
#5363 ✅ Patent 12,062,620 granted on 2024-08-13Array substrate, light-emitting substrate and display device
#5364 ✅ Patent 12,057,405 granted on 2024-08-06Packages with thick RDLs and thin RDLs stacked alternatingly
#5365 ✅ Patent 12,211,797 granted on 2025-01-28Flexible substrate
#5366 ✅ Patent 11,955,433 granted on 2024-04-09Package-on-package device
#5367 ✅ Patent 11,894,312 granted on 2024-02-06Semiconductor packages and method of manufacture
#5368 ✅ Patent 11,901,303 granted on 2024-02-13Integrated fan-out package
#5369 ✅ Patent 12,046,561 granted on 2024-07-23Package structure and method of fabricating the same
#5370 ✅ Patent 12,051,653 granted on 2024-07-30Reconstituted substrate for radio frequency applications
#5371Semiconductor Devices and Methods of Manufacture
#5372 ✅ Patent 12,014,987 granted on 2024-06-18Electro-migration reduction
#5373 ✅ Patent 12,062,613 granted on 2024-08-13Semiconductor device having an extra low-k dielectric layer and method of forming the same
#5374 ✅ Patent 12,218,060 granted on 2025-02-04Integrated chip with graphene based interconnect
#5375 ✅ Patent 11,640,940 granted on 2023-05-02Methods of forming interconnection structure including conductive graphene layers
#5376SUPERCONDUCTING THROUGH SUBSTRATE VIAS
#5377 ✅ Patent 12,033,951 granted on 2024-07-09Alignment mark structure and method for making
#5378 ✅ Patent 11,640,944 granted on 2023-05-02Semiconductor device and method of forming a slot in EMI shielding layer using a plurality of slot lines to guide a laser
#5379 ✅ Patent 11,652,065 granted on 2023-05-16Semiconductor device and method of embedding circuit pattern in encapsulant for SIP module
#5380 ✅ Patent 11,756,897 granted on 2023-09-12Semiconductor device and method of forming a slot in EMI shielding with improved removal depth
#5381 ✅ Patent 11,610,847 granted on 2023-03-21Laser-based redistribution and multi-stacked packages
#5382 ✅ Patent 12,191,261 granted on 2025-01-07Semiconductor device including electromagnetic interference (EMI) shielding and method of manufacture
#5383 ✅ Patent 11,764,168 granted on 2023-09-19Chip package structure with anchor structure and method for forming the same
#5384SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#5385SEMICONDUCTOR DEVICE
#5386 ✅ Patent 12,374,631 granted on 2025-07-29SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
#5387POWER DEVICE INCLUDING METAL LAYER
#5388 ✅ Patent 11,784,140 granted on 2023-10-10Semiconductor device and method of manufacture
#5389Method for Processing a Semiconductor Wafer and Semiconductor Composite Structure
#5390 ✅ Patent 12,283,552 granted on 2025-04-22Extended seal ring structure on wafer-stacking
#5391 ✅ Patent 11,948,896 granted on 2024-04-02Package structure
#5392 ✅ Patent 11,862,580 granted on 2024-01-02Semiconductor package
#5393SEMICONDUCTOR PACKAGE WITH A SCRATCH PROTECTION LAYER AND METHOD OF FABRICATION
#5394 ✅ Patent 12,148,719 granted on 2024-11-19Forming large chips through stitching
#5395 ✅ Patent 12,132,014 granted on 2024-10-29Power semiconductor apparatus
#5396 ✅ Patent 12,293,981 granted on 2025-05-06Electronic circuit comprising a RF switches having reduced parasitic capacitances
#5397Connector Formation Methods and Packaged Semiconductor Devices
#5398 ✅ Patent 12,148,721 granted on 2024-11-19Iterative formation of damascene interconnects
#5399 ✅ Patent 12,057,419 granted on 2024-08-06Method for forming chip structure with conductive structure
#5400 ✅ Patent 12,272,661 granted on 2025-04-08Semiconductor package including semiconductor chips stacked via conductive bumps