Substrate storage container
#7802 ✅ Patent 12,315,749 granted on 2025-05-27Methods of installing a purge fluid conditioning element into a semiconductor substrate carrying container
#7803 ✅ Patent 11,901,205 granted on 2024-02-13Membrane diffuser for a substrate container
#7804METHODS AND SYSTEMS HAVING CONDUCTIVE POLYMER COATING FOR ELECTROSTATIC DISCHARGE APPLICATIONS
#7805SUBSTRATE TRANSFER MODULE AND SEMICONDUCTOR MANUFACTURING EQUIPMENT
#7806 ✅ Patent 11,894,252 granted on 2024-02-06Substrate transport apparatus
#7807ARTICLE STORAGE EQUIPMENT IN SEMICONDUCTOR FABRICATION FACILITY AND LOGISTICS SYSTEM INCLUDING SAME
#7808 ✅ Patent 12,334,383 granted on 2025-06-17SUBSTRATE SUPPORT GAP PUMPING TO PREVENT GLOW DISCHARGE AND LIGHT-UP
#7809DIRECT BONDING AND DEBONDING OF ELEMENTS
#7810TRANSFER APPARATUS
#7811ELECTROSTATIC END EFFECTOR FOR MANUFACTURING SYSTEM ROBOT
#7812TOOL FOR HANDLING SUBSTRATES WITH OVERHEAD SCREEN AND RELEVANT HANDLING METHODS AND EPITAXIAL REACTOR
#7813WAFER PLACEMENT TABLE
#7814PLASMA PROCESSING APPARATUS
#7815MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS
#7816NARROWING SINGLE DIFFUSION BREAK
#7817METHOD FOR FORMING A SHALLOW TRENCH ISOLATION STRUCTURE WITH REDUCED ENCROACHMENT OF ACTIVE REGIONS AND A SEMICONDUCTOR STRUCTURE THEREFROM
#7818 ✅ Patent 12,334,391 granted on 2025-06-17Method for Patterning a Substrate Using Photolithography
#7819DECOUPLED INTERCONNECTS
#7820 ✅ Patent 12,094,767 granted on 2024-09-17Barrier layers for word line contacts in a three-dimensional NAND memory and fabrication methods thereof
#7821SELF-ASSEMBLED MONOLAYER FOR SELECTIVE DEPOSITION
#7822WET FUNCTIONALIZATION OF DIELECTRIC SURFACES
#7823HYBRID METAL INTERCONNECTS
#7824DOUBLE PATTERNING WITH SELECTIVELY DEPOSITED SPACER
#7825INTERCONNECT LINE STRUCTURES WITH METAL CHALCOGENIDE CAP MATERIALS
#7826SELF-ALIGNED CONTACT FOR EMBEDDED MEMORY
#7827Metallization Process for an Integrated Circuit
#7828VIA IN SEMICONDUCTOR DEVICE STRUCTURE
#7829Chip Package Based On Through-Silicon-Via Connector And Silicon Interconnection Bridge
#7830 ✅ Patent 11,948,838 granted on 2024-04-02Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the same
#7831SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
#7832MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#7833DUMMY DIE PLACEMENT WITHIN A DICING STREET OF A WAFER
#7834SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
#7835Method for Forming a Semiconductor Device
#7836 ✅ Patent 12,261,086 granted on 2025-03-25Method for integrating high-voltage (HV) device, medium-voltage (MV) device, and low-voltage (LV) device
#7837Semiconductor Device and Method of Manufacture
#7838Method for Forming a Semiconductor Device Structure
#7839REDUCED DIFFUSION BREAK STRUCTURE
#7840ISOLATION OF SEMICONDUCTOR DEVICES BY BURIED SEPARATION RAILS
#7841VIA FORMATION IN AN INTEGRATED CIRCUIT
#7842PROTECTION RING, METHOD FOR FORMING PROTECTION RING, AND SEMICONDUCTOR STRUCTURE
#7843SEMICONDUCTOR DEVICE HAVING REDUCED CONTACT RESISTANCE
#7844 ✅ Patent 11,876,023 granted on 2024-01-16Conformal film thickness determination using angled geometric features and vertices tracking
#7845PREDICTION OF WAFER FLATNESS
#7846METHOD FOR EVALUATING PERIPHERAL STRAIN OF WAFER
#7847Neural Network Based Prediction of Semiconductor Device Response
#7848 ✅ Patent 11,961,772 granted on 2024-04-16Method and apparatus for automatically processing wafers
#7849DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
#7850 ✅ Patent 12,362,241 granted on 2025-07-15Semiconductor Structure and Method for Forming a Semiconductor Structure
#7851HERMETIC SEAL FOR TRANSISTORS WITH METAL ON BOTH SIDES
#7852 ✅ Patent 11,908,756 granted on 2024-02-20Interposer chips and enclosures for quantum circuits
#7853ELECTRICAL TRACES ON GLASS CORES IN INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING THE SAME
#7854GLASS VIAS AND PLANES WITH REDUCED TAPERING
#7855Module with Gas Flow-Inhibiting Sealing at Module Interface to Mounting Base
#7856MICROELECTRONIC ASSEMBLIES WITH ADAPTIVE MULTI-LAYER ENCAPSULATION MATERIALS
#7857SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#7858 ✅ Patent 12,183,646 granted on 2024-12-31Semiconductor device with a dielectric between portions
#7859EDGE-ALIGNED TEMPLATE STRUCTURE FOR INTEGRATED CIRCUIT PACKAGES
#7860EDGE-ALIGNED TEMPLATE STRUCTURE FOR INTEGRATED CIRCUIT PACKAGES
#7861 ✅ Patent 12,125,760 granted on 2024-10-22Method for fabricating electronic package structure
#7862 ✅ Patent 12,002,726 granted on 2024-06-04Semiconductor package and method of manufacture
#7863PASSIVATION LAYER FOR A SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#7864FORMATION OF A RECONSTITUTED CIRCUIT DEVICE USING FLOW OF A MATERIAL BY CAPILLARY ACTION
#7865 ✅ Patent 11,887,908 granted on 2024-01-30Electronic package structure with offset stacked chips and top and bottom side cooling lid
#7866SEMICONDUCTOR PACKAGE
#7867 ✅ Patent 12,046,530 granted on 2024-07-23Thermal bridge interposer structure
#7868 ✅ Patent 12,154,839 granted on 2024-11-26Graphene-coated heat spreader for integrated circuit device assemblies
#7869COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT SUBSTRATE
#7870DOUBLE-SIDED HEAT DISSIPATION POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
#7871LIQUID METAL PASTE CONTAINING METAL PARTICLE ADDITIVE
#7872THERMOELECTRIC COOLING FOR DIE PACKAGES
#7873THERMOELECTRIC COOLING IN MICROELECTRONICS
#7874POWER SEMICONDUCTOR MODULE COMPRISING A SUBSTRATE, POWER SEMICONDUCTOR COMPONENTS AND COMPRISING A PRESSURE BODY
#7875CHIP DEVICE
#7876SEMICONDUCTOR CHIP DEVICE INTEGRATING THERMAL PIPES IN THREE-DIMENSIONAL PACKAGING
#7877HEAT DISSIPATION STRUCTURE AND ELECTRONIC APPARATUS
#7878REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS
#7879Semiconductor Die, Heat Spreader, Semiconductor Package, Semiconductor Device, and Methods
#7880APPARATUS AND METHODS FOR COOLING OF AN INTEGRATED CIRCUIT
#7881CONDUCTIVE FEATURES FORMED USING METAL ASSISTED ETCH
#7882FRONTSIDE AND BACKSIDE EPI CONTACT
#7883 ✅ Patent 11,901,267 granted on 2024-02-13Memory device having word lines with improved resistance
#7884INTEGRATED PLANAR TRANSISTORS AND MEMORY CELL ARRAY ARCHITECTURES
#7885THROUGH-SILICON-VIA STRUCTURE AND METHOD FOR PREPARING SAME, THROUGH-SILICON-VIA INTERCONNECTION STRUCTURE AND METHOD FOR PREPARING SAME, AND ELECTRONIC DEVICE
#7886 ✅ Patent 11,694,944 granted on 2023-07-043D semiconductor device and structure with metal layers and a connective path
#7887 ✅ Patent 12,159,813 granted on 2024-12-03Embedded bridge die with through-silicon vias
#7888DIE ATTACH ADHESIVE-READY LEAD FRAME DESIGN
#7889LEADFRAME STRIP WITH COMPLIMENTARY DESIGN
#7890Semiconductor Devices Including a Premolded Leadframe and a Semiconductor Package
#7891POWER SEMICONDUCTOR DEVICE
#7892NONLINEAR STRUCTURE FOR CONNECTING MULTIPLE DIE ATTACH PADS
#7893LEAD FRAME, METHOD OF MAKING LEAD FRAME, SEMICONDUCTOR APPARATUS, AND METHOD OF MAKING SEMICONDUCTOR APPARATUS
#7894POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
#7895 ✅ Patent 11,923,276 granted on 2024-03-05Semiconductor device including a bidirectional switch
#7896 ✅ Patent 12,176,273 granted on 2024-12-24Semiconductor device and method of forming substrate with 3-sided wettable flank
#7897MOUNTING STRUCTURE FOR SEMICONDUCTOR MODULE
#7898SEMICONDUCTOR PACKAGE INTERCONNECT AND POWER CONNECTION BY METALLIZED STRUCTURES ON PACKAGE BODY
#7899 ✅ Patent 12,278,171 granted on 2025-04-15Chip package and method of forming a chip package
#7900IPD COMPONENTS HAVING SIC SUBSTRATES AND DEVICES AND PROCESSES IMPLEMENTING THE SAME
#7901STRUCTURE TO TRANSITION BETWEEN A TRANSMISSION LINE CONDUCTOR AND A SOLDER BALL
#7902SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
#7903POWER MODULE AND MANUFACTURING METHOD THEREOF
#7904 ✅ Patent 12,113,004 granted on 2024-10-08Electronic package and manufacturing method thereof
#7905POWER DELIVERY TECHNIQUES FOR GLASS SUBSTRATE WITH HIGH DENSITY SIGNAL VIAS
#7906COUPLED FINS WITH BLIND TRENCH STRUCTURES
#7907LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERCONNECT SERVER ARCHITECTURE
#7908MULTI-CHIP HIGH MEMORY BANDWIDTH CONFIGURATION
#7909SEMICONDUCTOR PACKAGE DEVICE
#7910 ✅ Patent 12,183,669 granted on 2024-12-31Configurable metal—insulator—metal capacitor and devices
#7911INDUCTORS AND TRANSFORMERS FORMED BY BURIED POWER RAILS
#7912BURIED POWER RAILS INTEGRATED WITH DECOUPLING CAPACITANCE
#7913 ✅ Patent 11,887,928 granted on 2024-01-30Package structure with interposer encapsulated by an encapsulant
#7914FILL OF VIAS IN SINGLE AND DUAL DAMASCENE STRUCTURES USING SELF-ASSEMBLED MONOLAYER
#7915STAGGERED VERTICALLY SPACED INTEGRATED CIRCUIT LINE METALLIZATION WITH DIFFERENTIAL VIAS & METAL-SELECTIVE DEPOSITION
#7916 ✅ Patent 12,374,615 granted on 2025-07-29ELECTRONIC DEVICES WITH A LOW DIELECTRIC CONSTANT
#7917SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#7918 ✅ Patent 11,955,425 granted on 2024-04-09Interconnect structure for logic circuit
#7919BACK-END-OF-LINE THIN FILM RESISTOR
#7920LINE FORMATION WITH SMALL TIP SPACING
#7921MICROELECTRONIC DEVICES INCLUDING STAIR STEP STRUCTURES, AND RELATED ELECTRONIC SYSTEMS AND METHODS
#7922ISO-LEVEL VIAS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
#7923CONDUCTIVE LINE STRUCTURE HAVING CORRUGATED SURFACE
#7924 ✅ Patent 12,183,676 granted on 2024-12-31Semiconductor device for RF integrated circuit
#7925BACKSIDE POWER DELIVERY NETWORK AND SIGNAL ROUTING
#7926REPLACEMENT VIA AND BURIED OR BACKSIDE POWER RAIL
#7927REPLACEMENT DEEP VIA AND BURIED OR BACKSIDE POWER RAIL WITH BACKSIDE INTERCONNECT STRUCTURE
#7928TRANSFORMERS BASED ON BURIED POWER RAIL TECHNOLOGY
#7929 ✅ Patent 12,334,441 granted on 2025-06-17SEMICONDUCTOR DEVICE AND SEMICONDUCTOR LAYOUT STRUCTURE
#7930SEMICONDUCTOR STRUCTURE
#7931MULTILAYER GLASS SUBSTRATE
#7932 ✅ Patent 12,165,981 granted on 2024-12-103D semiconductor package with die-mounted voltage regulator
#7933METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE FOR INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH HIGH ASPECT RATIO THROUGH GLASS VIAS
#7934LIQUID METAL INTERCONNECT FOR MODULAR PACKAGE SERVER ARCHITECTURE
#7935LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERPOSER SERVER ARCHITECTURE
#7936ELECTRONIC DEVICE INCLUDING AN INTEGRATED CIRCUIT DIE AND A SUPPORT STRUCTURE
#7937POWER CONVERTER ASSEMBLY
#7938 ✅ Patent 12,113,028 granted on 2024-10-08Semiconductor device with integrated decoupling and alignment features
#7939PACKAGE SUBSTRATES AND SEMICONDUCTOR PACKAGES HAVING THE SAME
#7940ELECTRONIC DEVICES COMPRISING OVERLAY MARKS
#7941METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR SUBSTRATE
#7942 ✅ Patent 11,948,893 granted on 2024-04-02Electronic component with lid to manage radiation feedback
#7943METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, RESIN COMPOSITION FOR TEMPORARY PROTECTION, AND RESIN FILM FOR TEMPORARY PROTECTION
#7944 ✅ Patent 11,830,822 granted on 2023-11-28Semiconductor device and method of making the same
#7945ELECTRONIC COMPONENT, MODULE, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
#7946 ✅ Patent 12,107,054 granted on 2024-10-01Semiconductor package, semiconductor device and shielding housing of semiconductor package
#7947DIELECTRIC CRACK SUPPRESSION FABRICATION AND SYSTEM
#7948STIFFENER RING FOR PACKAGES WITH MICRO-CABLE/OPTICAL CONNECTORS
#7949ELECTRONIC PACKAGE ASSEMBLY WITH STIFFENER
#7950MOISTURE SEAL COATING OF HYBRID BONDED STACKED DIE PACKAGE ASSEMBLY
#7951HERMETIC BARRIER SURROUNDING A PLURALITY OF DIES
#7952 ✅ Patent 12,183,691 granted on 2024-12-31Semiconductor structure and method of forming the same
#7953 ✅ Patent 12,205,907 granted on 2025-01-21Seal ring structures
#7954 ✅ Patent 12,132,013 granted on 2024-10-29Semiconductor device
#7955 ✅ Patent 11,881,460 granted on 2024-01-23Ceramic semiconductor package seal rings
#7956METAL INSULATOR METAL (MIM) CAPACITORS WITH PYROCHLORE-BASED INSULATORS FOR INTEGRATED CIRCUIT DIE & PACKAGES
#7957Semiconductor Package, Semiconductor Die and Method for Forming a Semiconductor Package or a Semiconductor Die
#7958 ✅ Patent 12,040,291 granted on 2024-07-16Radio frequency packages containing multilevel power substrates and associated fabrication methods
#7959LOW LOSS MICROSTRIP AND STRIPLINE ROUTING WITH BLIND TRENCH VIAS FOR HIGH SPEED SIGNALING ON A GLASS CORE
#7960INTEGRATED ANTENNA PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#7961DISPLAY PANEL AND DISPLAY APPARATUS
#7962SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND ELECTRIC POWER CONVERTER
#7963 ✅ Patent 12,068,268 granted on 2024-08-20Semiconductor device having a wire bonding pad structure connected through vias to lower wiring
#7964 ✅ Patent 12,087,716 granted on 2024-09-10Techniques for positioning bond pads of microelectronic devices and related microelectronic devices, methods, and systems
#7965PACKAGE STRUCTURE AND PACKAGING METHOD
#7966 ✅ Patent 11,996,375 granted on 2024-05-28Integrated circuit structure, and method for forming thereof
#7967IC'S WITH MULTPLE LEVELS OF EMBEDDED MEMORY
#7968LOW STRESS DIRECT HYBRID BONDING
#7969 ✅ Patent 11,942,444 granted on 2024-03-26Semiconductor interconnect structures with vertically offset bonding surfaces, and associated systems and methods
#7970 ✅ Patent 11,887,956 granted on 2024-01-30Temperature hierarchy solder bonding
#7971 ✅ Patent 12,183,702 granted on 2024-12-31Electronic package with varying interconnects
#7972SOLDER GRID ARRAY FOR ATTACHMENT OF A DIE PACKAGE
#7973SOLDER INTERCONNECT HIERARCHY FOR HETEROGENEOUS ELECTRONIC DEVICE PACKAGING
#7974MICROELECTRONIC ASSEMBLIES WITH SILICON NITRIDE MULTILAYER
#7975 ✅ Patent 12,068,273 granted on 2024-08-20Package
#7976 ✅ Patent 12,205,919 granted on 2025-01-21Method of processing a semiconductor wafer, semiconductor die, and method of producing a semiconductor module
#7977SOLID COMPONENT COUPLED TO DIES IN MULTI-CHIP PACKAGE USING DIELECTRIC-TO-DIELECTRIC BONDING
#7978HEIGHT ADAPTABLE MULTILAYER SPACER
#7979CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING THE SAME, AND METHOD FOR PACKAGING SEMICONDUCTOR STRUCTURE
#7980SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#7981POWER SEMICONDUCTOR MODULE AND POWER CONVERSION APPARATUS
#7982 ✅ Patent 12,080,678 granted on 2024-09-03Methods and systems for manufacturing semiconductor devices
#7983BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD
#7984 ✅ Patent 12,176,319 granted on 2024-12-24Reflow method and system
#7985SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#7986SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
#7987 ✅ Patent 12,087,723 granted on 2024-09-10Diffusion soldering with contaminant protection
#7988PACKAGING ARCHITECTURE WITH INTEGRATED CIRCUIT DIES OVER INPUT/OUTPUT INTERFACES
#7989QUASI-MONOLITHIC INTEGRATED PACKAGING ARCHITECTURE WITH MID-DIE SERIALIZER/DESERIALIZER
#7990PACKAGING ARCHITECTURE FOR MODULAR DIE INTEROPERABILITY
#7991 ✅ Patent 12,347,807 granted on 2025-07-01INORGANIC FILL MATERIAL FOR STACKED DIE ASSEMBLY
#7992MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT SOLDER MATERIALS
#7993 ✅ Patent 12,009,341 granted on 2024-06-11Integrated antenna package structure
#7994 ✅ Patent 11,967,581 granted on 2024-04-23Package structures having underfills
#7995 ✅ Patent 12,205,924 granted on 2025-01-21Semiconductor packages with chiplets coupled to a memory device
#7996SEMICONDUCTOR PACKAGE
#7997 ✅ Patent 12,142,598 granted on 2024-11-12Semiconductor package structure having an annular frame with truncated corners
#7998 ✅ Patent 12,334,472 granted on 2025-06-17MULTIPLE WAFER STACK ARCHITECTURE TO ENABLE SINGULATION
#7999SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
#8000 ✅ Patent 12,015,015 granted on 2024-06-18Semiconductor package and semiconductor module including the same
#8001 ✅ Patent 12,136,608 granted on 2024-11-05Multi-chip package
#8002 ✅ Patent 11,973,062 granted on 2024-04-30High density pillar interconnect conversion with stack to substrate connection
#8003 ✅ Patent 12,087,738 granted on 2024-09-10Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#8004 ✅ Patent 12,374,662 granted on 2025-07-29SEMICONDUCTOR POWER MODULE AND POWER CONVERSION APPARATUS
#8005TERMINAL CONNECTION STRUCTURE, DISPLAY UNIT AND DISPLAY
#8006MICRO LED DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
#8007LED STRUCTURE HAVING ASYMMETRIC FACE, METHOD OF MANUFACTURING DIRECT-CURRENT-DRIVABLE LED ELECTRODE ASSEMBLY USING THE SAME, AND DIRECT-CURRENT-DRIVABLE LED ELECTRODE ASSEMBLY MANUFACTURED THEREBY
#8008LED ARRAY FOR IN-PLANE OPTICAL INTERCONNECTS
#8009 ✅ Patent 11,798,923 granted on 2023-10-24Staggered dual-side multi-chip interconnect
#8010MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND THIN FILM CAPACITORS
#8011 ✅ Patent 12,230,614 granted on 2025-02-18Multi-typed integrated passive device (IPD) components and devices and processes implementing the same
#8012INTERPOSER INTERCONNECTS AND ENCLOSURE FOR SILICON PHOTONICS LIDAR MODULE
#8013DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME
#8014FLASH LED PACKAGE WITH OPTICAL SENSORS
#8015SUNK-TYPE PACKAGE STRUCTURE
#8016DIRECT-CURRENT-DRIVABLE FULL-COLOR LIGHT-EMITTING DIODE DISPLAY AND METHOD OF MANUFACTURING THE SAME
#8017 ✅ Patent 12,315,857 granted on 2025-05-27Electronic device comprising an electrostatic discharge protective unit
#8018 ✅ Patent 12,119,335 granted on 2024-10-15Interconnection structures for high bandwidth data transfer
#8019 ✅ Patent 11,791,328 granted on 2023-10-17Method for fabricating semiconductor device with integrated decoupling and alignment features
#8020 ✅ Patent 11,955,472 granted on 2024-04-09Semiconductor-controlled rectifier with low trigger voltage for electrostatic discharge protection
#8021Ultraviolet Lamp Bead Package Structure and Preparation Method Thereof
#8022ELECTROSTATIC DISCHARGE (ESD) CIRCUIT WITH DIODES IN METAL LAYERS OF A SUBSTRATE
#8023 ✅ Patent 12,068,309 granted on 2024-08-20Semiconductor device and method for fabricating the same
#8024AI CHIP
#8025SEMICONDUCTOR DEVICE
#8026GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING RAISED WALL STRUCTURES FOR EPITAXIAL SOURCE OR DRAIN REGION CONFINEMENT
#8027GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE CONTACT SELF-ALIGNED TO EPITAXIAL SOURCE
#8028 ✅ Patent 12,356,706 granted on 2025-07-08HIGH PERFORMANCE THREE DIMENSIONALLY STACKED TRANSISTORS
#8029TRANSISTORS WITH EPITAXIAL SOURCE/DRAIN LINER FOR IMPROVED CONTACT RESISTANCE
#8030GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING NEIGHBORING FIN-BASED DEVICES
#8031SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#8032 ✅ Patent 12,051,694 granted on 2024-07-30Semiconductor devices having different numbers of stacked channels in different regions
#8033 ✅ Patent 12,278,234 granted on 2025-04-15Multi-fin FINFET device including epitaxial growth barrier on outside surfaces of outermost fins and related methods
#8034WAFER BONDING FOR STACKED TRANSISTORS
#8035GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING EPITAXIAL SOURCE OR DRAIN REGION LATERAL ISOLATION
#8036 ✅ Patent 12,094,880 granted on 2024-09-17Integrated circuits and manufacturing methods thereof
#8037CO-INTEGRATION OF HIGH VOLTAGE (HV) AND LOW VOLTAGE (LV) TRANSISTOR STRUCTURES, USING CHANNEL HEIGHT AND SPACING MODULATION
#8038INTEGRATED STRUCTURE OF COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR DEVICES AND MANUFACTURING METHOD THEREOF
#8039Method for Forming a Stacked FET Device
#8040SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
#8041STACKED TRANSISTOR STRUCTURES WITH DIVERSE GATE MATERIALS
#8042 ✅ Patent 12,094,881 granted on 2024-09-17Arsenic-doped epitaxial source/drain regions for NMOS
#8043HIGH VOLTAGE CMOS DEVICE AND MANUFACTURING METHOD THEREOF
#8044 ✅ Patent 11,837,605 granted on 2023-12-05Structure including transistor using buried insulator layer as gate dielectric and trench isolations in source and drain
#8045INTEGRATED GROUP III-NITROGEN AND SILICON TRANSISTORS ON THE SAME DIE
#8046 ✅ Patent 12,369,400 granted on 2025-07-22ELECTRONIC DEVICE
#8047 ✅ Patent 11,916,085 granted on 2024-02-27Array substrate, method of manufacturing array substrate, and display panel
#8048DRIVING BACK PLATE, DISPLAY PANEL, AND PREPARATION METHOD THEREFOR
#8049 ✅ Patent 11,810,923 granted on 2023-11-07Pixel array substrate
#8050 ✅ Patent 11,876,103 granted on 2024-01-16Display panel
#8051 ✅ Patent 12,224,292 granted on 2025-02-11Array substrate, display panel, and manufacturing method of array substrate
#8052CAPACITOR AND INDUCTOR EMBEDDED STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND SUBSTRATE
#8053IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME
#8054 ✅ Patent 12,094,892 granted on 2024-09-173D micro display device and structure
#8055IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME
#8056SENSOR PACKAGE STRUCTURE
#8057 ✅ Patent 12,376,399 granted on 2025-07-29SENSOR PACKAGE STRUCTURE
#8058 ✅ Patent 11,804,502 granted on 2023-10-31Solid-state imaging element and imaging device
#8059IMAGE SENSOR
#8060 ✅ Patent 12,261,181 granted on 2025-03-25Semiconductor package including image sensor chip, transparent substrate, and joining structure
#8061SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE
#8062LIGHT DIFFUSER, IMAGE SENSOR PACKAGE HAVING THE SAME, AND MANUFACTURING METHOD THEREOF
#8063SINGLE-PHOTON AVALANCHE DIODE COVERED BY MULTIPLE MICROLENSES
#8064 ✅ Patent 12,170,302 granted on 2024-12-17Increased optical path for long wavelength light by grating structure
#8065IMAGE SENSOR AND ELECTRONIC DEVICE
#8066SOLID-STATE IMAGE ELEMENT AND ELECTRONIC DEVICE
#8067IMAGE SENSOR
#8068IMAGE SENSOR
#8069IMAGE SENSOR INCLUDING STACKED CHIPS
#8070Vertical Pump-Gate Charge Transfer for High-Conversion-Gain CMOS Image Sensor Pixels
#8071 ✅ Patent 12,183,765 granted on 2024-12-31Photodetecting device with enhanced collection efficiency
#8072 ✅ Patent 12,211,881 granted on 2025-01-28Pixel circuit and method of operating the same in an always-on mode
#8073STACKED IMAGE SENSOR DEVICE AND METHOD OF FORMING SAME
#8074Method for Producing a Multipixel Detector
#8075 ✅ Patent 12,183,767 granted on 2024-12-31Complementary metal-oxide-semiconductor image sensor and method of making
#8076DISPLAY DEVICE
#8077DISPLAY DEVICE
#8078DISPLAY DEVICE
#8079ULTRA-SMOOTH SIDEWALL PIXELATED ARRAY LEDS
#8080HYBRID BONDED CAPACITORS
#8081 ✅ Patent 11,948,968 granted on 2024-04-02Method for preparing semiconductor device structure with bottom capacitor electrode having crown-shaped structure and interconnect portion
#8082SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#8083ELECTRICALLY COUPLED TRENCH CAPACITORS WITHIN A SUBSTRATE
#8084MEMORY DEVICE HAVING WORD LINES WITH REDUCED LEAKAGE
#8085SEMICONDUCTOR DEVICE
#8086 ✅ Patent 11,862,676 granted on 2024-01-02Semiconductor device and preparation method thereof
#8087SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#8088SEMICONDUCTOR DEVICE HAVING A SUPER JUNCTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#8089 ✅ Patent 11,791,379 granted on 2023-10-17Galvanic isolation using isolation break between redistribution layer electrodes
#8090SOURCE OR DRAIN METALLIZATION PRIOR TO CONTACT FORMATION IN STACKED TRANSISTORS
#8091EXTENDED LOWER SOURCE/DRAIN FOR STACKED FIELD-EFFECT TRANSISTOR
#8092INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY
#8093SEMICONDUCTOR STRUCTURE FOR NANORIBBON ARCHITECTURES
#8094 ✅ Patent 12,369,367 granted on 2025-07-22Bulk Nanosheet with Dielectric Isolation
#8095SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#8096 ✅ Patent 11,810,951 granted on 2023-11-07Semiconductor-on-insulator field effect transistor with performance-enhancing source/drain shapes and/or materials
#8097 ✅ Patent 11,888,027 granted on 2024-01-30Monolithic integration of high and low-side GaN FETs with screening back gating effect
#8098 ✅ Patent 12,027,585 granted on 2024-07-02Source or drain structures with low resistivity
#8099SiC SEMICONDUCTOR DEVICE
#8100 ✅ Patent 12,107,124 granted on 2024-10-01Bipolar transistors