COMMUNICATION USING DYNAMIC SPECTRUM ACCESS BASED ON CHANNEL SELECTION

The disclosure described herein configures a client device for communication using dynamic spectrum access within a frequency spectrum, such as television white space (TVWS), using a determined location of the client device based on location information, such as from a global positioning system. A dynamic spectrum access database of channels is accessed based on the location information. Available channels are determined for the client device from the channels based on the location information. A list of the available channels for use by the client device are transmitted to the client device, thereby allowing narrowband communication over the channels.

TRANSACTION PLATFORMS WHERE SYSTEMS INCLUDE SETS OF OTHER SYSTEMS

Systems and methods for transaction platforms include various systems interacting with each other and transacting in various ways. A method for configuring and launching a marketplace includes: identifying, by a processing system having one or more processors, an opportunity to facilitate configuration of a new marketplace; receiving marketplace opportunity data, wherein the marketplace opportunity data includes information related to a set of assets of one or more types; determining configuration parameters to be implemented in the new marketplace; determining the feasibility of implementing the configuration parameters in the new marketplace; determining data resources to support the new marketplace; determining an architecture of the new marketplace; determining the configuration of the data resources in a data model for the marketplace; configuring a marketplace object; connecting selected data resources to populate the marketplace object; and launching the new marketplace.

BONDED STRUCTURES WITH INTERCONNECT ASSEMBLIES

A bonded structure comprising a first semiconductor element, a second semiconductor element spaced apart from the first semiconductor element by a gap, and an interconnect assembly comprising an insulating substrate with conductive traces, the insulating substrate including a first section directly bonded to the first semiconductor element, a second section directly bonded to the second semiconductor element, and a flexible section disposed between the first and second sections, the flexible section at least partially bridging the gap.

APPARATUSES AND METHODS FOR DIE BOND CONTROL

A system for direct bonding can include a substrate support configured to hold a substrate for direct bonding and a die handling tool including an end effector configured to hold a die and bring the die into contact with the substrate supported on the substrate support, the end effector configured to initiate contact between the substrate and a bond initiation region of the die and to subsequently allow contact between the substrate and other regions of the die.

MULTI-CHANNEL DEVICE STACKING

A stacked electronic device is disclosed. The stacked electronic device can comprise a first stacked assembly including a first plurality of integrated device dies. The first plurality of integrated device dies can comprise a first integrated device die. A second stacked assembly is disposed over the first stacked assembly. The second stacked assembly includes a second plurality of device dies, and the second plurality of device dies can comprise a second integrated device die. A first channel can extend at least partially through the first stacked assembly. The first integrated device die can comprise a first circuit, and the first channel is connected to the first circuit. A second channel can extend through and bypass the first stacked assembly, the second channel extending at least partially through the second stacked assembly. The second integrated device die can comprise a second circuit, and the second channel is connected to the second circuit.

DIRECTLY BONDED FRAME WAFERS

A bonded structure comprises a frame element having a cavity formed through its thickness. The frame element is directly bonded to a first element at a first side and to a second element at a second side enclosing the cavity. The frame element may comprise a through substrate via (TSV). Redundant conductive contact pads may be formed in bonding layers for enhanced direct bonding quality and reliability.

SYSTEMS FOR PROVIDING COEXISTENCE BETWEEN CELLULAR AND WIRELESS COMMUNICATION TECHNOLOGIES

Embodiments of the present disclosure are directed to providing a comprehensive and effective solution for the concurrent coexistence of cellular communications with communications in various wireless communication formats. Other embodiments may be described or claimed.

DIAGNOSIS AND TREATMENT RECOMMENDATION USING QUANTUM COMPUTING

This disclosure describes techniques for providing diagnosis and treatment recommendations using quantum computing. For example, a quantum computing device encodes diagnosis-relevant information of a patient as one or more patient diagnosis qubits. The quantum computing device implements a first quantum search algorithm using the patient diagnosis qubits to determine a diagnosis likelihood for each condition of a plurality of conditions. The quantum computing device further encodes the diagnosis data and treatment-relevant information of the patient as one or more patient treatment qubits. The quantum computing device implements a second quantum search algorithm using the treatment-relevant information of the patient to determine one or more treatment recommendations for the patient.

Systems, methods, and devices for automatic signal detection with temporal feature extraction within a spectrum

Systems, methods and apparatus are disclosed for automatic signal detection in an RF environment. An apparatus comprises at least one receiver and at least one processor coupled with at least one memory. The apparatus is at the edge of a communication network. The apparatus sweeps and learns the RF environment in a predetermined period based on statistical learning techniques, thereby creating learning data. The apparatus forms a knowledge map based on the learning data, scrubs a real-time spectral sweep against the knowledge map, and creates impressions on the RF environment based on a machine learning algorithm. The apparatus is operable to detect at least one signal in the RF environment.

Systems and methods for predictive analysis of potential attack patterns based on contextual security information

Systems and methods for predictive analysis of potential attack patterns based on contextual security information are described. In one embodiment, a method includes generating a profile for an enterprise that indicates one or more software application stacks and a network architecture for the one or more software application stacks; determining one or more vulnerabilities of the one or more software application stacks and one or more vulnerabilities of the network architecture; providing the one or more vulnerabilities of the one or more software application stacks, the one or more vulnerabilities of the network architecture, and the profile as input to a machine learning model; generating an inference by the machine learning model that indicates one or more attack paths for an attacker in the one or more software application stacks and the network architecture; and transmitting the inference to a storage location or a security software application.