GAP FILL ENHANCEMENT WITH THERMAL ETCH
#7802Interconnect Structures and Methods and Apparatuses for Forming the Same
#7803 ✅ Patent 11,955,340 granted on 2024-04-09Semiconductor device and method of manufacturing the same
#7804 ✅ Patent 12,300,500 granted on 2025-05-13Etching of polycrystalline semiconductors
#7805 ✅ Patent 12,131,913 granted on 2024-10-29Methods, systems, and apparatus for processing substrates using one or more amorphous carbon hardmask layers
#7806Surface Treatment Compositions and Methods
#7807 ✅ Patent 12,002,683 granted on 2024-06-04Lateral etching of silicon
#7808ETCHING METHOD AND PLASMA PROCESSING SYSTEM
#7809 ✅ Patent 12,205,825 granted on 2025-01-21Method of preparing semiconductor structure having low dielectric constant layer
#7810 ✅ Patent 12,293,922 granted on 2025-05-06Reworking process of a failed hard mask for fabricating a semiconductor device
#7811Semiconductor Device and Methods of Forming the Same
#7812 ✅ Patent 12,211,707 granted on 2025-01-28Integrated circuit package and method of forming thereof
#7813FLUID CONTROL SYSTEM
#7814SCANNING SYSTEM
#7815SYSTEM AND ASSEMBLY FOR REPLACING SOLDER BALLS OF AN ELECTRONIC PACKAGE
#7816 ✅ Patent 12,354,890 granted on 2025-07-08STAGE AND PLASMA PROCESSING APPARATUS
#7817PROCESSING APPARATUS AND TEMPERATURE CONTROL METHOD
#7818DIRECT INJECTION FILLING DEVICE, SYSTEM, AND METHOD FOR LIQUID METAL INTERCONNECTS
#7819SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#7820MODULAR MULTI-CHAMBER PROCESSING TOOL HAVING LINK CHAMBER FOR ULTRA HIGH VACCUM PROCESSES
#7821TRANSFER CHAMBER AND WAFER PROCESSING MODULE COMPRISING TRANSFER CHAMBER
#7822GATE VALVE APPARATUS AND SEMICONDUCTOR MANUFACTURING APPARATUS
#7823TEMPERATURE-BASED METROLOGY CALIBRATION AT A MANUFACTURING SYSTEM
#7824TEMPERATURE REGULATING APPARATUS FOR SEMICONDUCTOR-DEVICE MANUFACTURING EQUIPMENT, AND SEMICONDUCTOR-DEVICE MANUFACTURING SYSTEM
#7825DATA FUSION OF MULTIPLE SENSORS
#7826 ✅ Patent 11,823,930 granted on 2023-11-21Wafer storage container and cap assembly used therefor
#7827 ✅ Patent 12,159,799 granted on 2024-12-03Container for transporting semiconductor wafer
#7828 ✅ Patent 12,106,989 granted on 2024-10-01Equipment front end module
#7829APPARATUS FOR TRANSFERRING SEMICONDUCTOR CIRCUITS
#7830SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
#7831ADJUSTABLE CARRYING DEVICE
#7832 ✅ Patent 12,237,198 granted on 2025-02-25Area camera substrate pre-aligner
#7833 ✅ Patent 12,315,754 granted on 2025-05-27Apparatus and method for self-assembling semiconductor light emitting diodes
#7834DEPOSITION MASK STAGE, DISPLAY MANUFACTURING APPARATUS INCLUDING THE SAME, AND DISPLAY MANUFACTURING METHOD USING THE SAME
#7835 ✅ Patent 12,374,574 granted on 2025-07-29ELECTROSTATIC CHUCK
#7836 ✅ Patent 12,341,049 granted on 2025-06-24ELECTROSTATIC CHUCK
#7837 ✅ Patent 12,341,050 granted on 2025-06-24ELECTROSTATIC CHUCK
#7838CARRIER SUBSTRATE FOR SOI STRUCTURE AND ASSOCIATED MANUFACTURING METHOD
#7839DISPLAY APPARATUS
#7840LIGHT-EMITTING ELEMENT PANEL
#7841LIGHT-EMITTING DEVICE ARRAY SUBSTRATE AND METHOD FOR FABRICATING THE SAME
#7842HEAT-ASSISTED DIE EJECTION SYSTEM
#7843TAPE STICKING SYSTEM, TAPE STICKING METHOD, TAPE PEELING SYSTEM, AND TAPE PEELING METHOD
#7844ELECTRONIC PACKAGE AND SUCTION DEVICE
#7845SUBSTRATE HOLDING HAND AND SUBSTRATE CONVEYING ROBOT
#7846ROBOTIC ARM AND APPARATUS FOR TREATING SUBSTRATE INCLUDING THE SAME
#7847SYSTEMS AND METHODS FOR AUTOMATED PROCESSING PORTS
#7848SUBSTRATE HOLDER
#7849SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
#7850 ✅ Patent 12,341,054 granted on 2025-06-24METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH PRE-CLEANING TREATMENT
#7851SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#7852METHOD FOR BONDING A FIRST SUBSTRATE AT A SURFACE HAVING AN ELASTIC NANOTOPOLOGY
#7853SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHOD FOR SMOOTHING SURFACES OF 3D STRUCTURES
#7854 ✅ Patent 12,191,194 granted on 2025-01-07Method for fabricating semiconductor device and reworking process
#7855FULLY ALIGNED VIA INTEGRATION WITH SELECTIVE CATALYZED VAPOR PHASE GROWN MATERIALS
#7856SEMICONDUCTOR DEVICE WITH COMPOSITE BARRIER STRUCTURE AND METHOD FOR FABRICATING THE SAME
#7857 ✅ Patent 11,978,660 granted on 2024-05-07Manufacturing method of original plate and semiconductor device
#7858Metal Surface Blocking Molecules for Selective Deposition
#7859INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH A METAL CHALCOGENIDE LINER
#7860 ✅ Patent 12,205,846 granted on 2025-01-21Methods of forming microelectronic devices, and related electronic systems
#7861 ✅ Patent 12,068,195 granted on 2024-08-20Metal loss prevention using implantation
#7862 ✅ Patent 12,119,261 granted on 2024-10-15Semiconductor structure and manufacturing method of the same
#7863 ✅ Patent 12,230,542 granted on 2025-02-18Method for dicing a semiconductor wafer structure
#7864 ✅ Patent 12,080,602 granted on 2024-09-03Semiconductor device with fin structures
#7865 ✅ Patent 12,336,273 granted on 2025-06-17SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
#7866 ✅ Patent 12,125,706 granted on 2024-10-22Semiconductor device and method of manufacture
#7867 ✅ Patent 12,154,831 granted on 2024-11-26Gate structure of a semiconductor device and method of forming same
#7868METHOD TO FORM SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE THEREOF
#7869WAFER TREATMENT METHOD
#7870Efficient Semiconductor Metrology Using Machine Learning
#7871METHOD OF TESTING STRUCTURES AND STACKING WAFERS
#7872ETCHING APPARATUS AND METHOD
#7873CHEMICAL-DOSE SUBSTRATE DEPOSITION MONITORING
#7874SEMICONDUCTOR DEVICE
#7875TECHNOLOGIES FOR LIQUID METAL MIXTURES FOR ELECTRICAL INTERCONNECTS
#7876SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE
#7877PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
#7878GROOVED PACKAGE
#7879POWER MODULE HAVING LEADFRAME-LESS SIGNAL CONNECTORS, IN PARTICULAR FOR AUTOMOTIVE APPLICATIONS, AND ASSEMBLING METHOD THEREOF
#7880ELECTRONIC COMPONENT AND METHOD FOR FORMING RESIN LAYER ON ELECTRONIC COMPONENT
#7881SEMICONDUCTOR PACKAGE
#7882ELECTRONIC CIRCUIT PACKAGE, ITS MANUFACTURING METHOD, AND ELECTRONIC DEVICE HAVING ELECTRONIC CIRCUIT PACKAGE
#7883 ✅ Patent 12,125,763 granted on 2024-10-22Trim wall protection method for multi-wafer stacking
#7884SEMICONDUCTOR DEVICE COMPRISING CONTACT PAD STRUCTURE
#7885STRUCTURE, SYSTEM AND METHOD FOR A TEMPERATURE REGULATED ELECTRICAL DEVICE
#7886INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT AND HEAT PATH
#7887PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER
#7888DIE BACKSIDE FILM WITH OVERHANG FOR DIE SIDEWALL PROTECTION
#7889SEMICONDUCTOR DEVICE
#7890Structured Microchannel Cooling technology by utilizing a novel hard mask pattern transfer fabrication process
#7891POROUS MESH STRUCTURES FOR THE THERMAL MANAGEMENT OF INTEGRATED CIRCUIT DEVICES
#7892ELECTRONIC DEVICE
#7893HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS
#7894 ✅ Patent 12,100,640 granted on 2024-09-24High efficiency heat dissipation using thermal interface material film
#7895TRANSISTOR-SCALE THERMOELECTRIC DEVICES FOR REFRIGERATION OF INTEGRATED CIRCUITS
#7896EMBEDDED HEAT SLUG IN A SUBSTRATE
#7897COOLING PACKAGE STRUCTURE APPLIED TO INTEGRATED CIRCUIT AND METHOD OF ASSEMBLY THEREOF
#7898CHASSIS CUSTOMIZATION WITH HIGH THROUGHPUT ADDITIVE MANUFACTURED MODIFICATION STRUCTURES
#7899SINGLE CONDUCTIVITY TYPE DEVICES FOR LOW TEMPERATURE COMPUTATION
#7900MULTIPLE EPITAXIAL LAYER SOURCE AND DRAIN TRANSISTORS FOR LOW TEMPERATURE COMPUTATION
#7901SILICON-BASED FAN OUT PACKAGE STRUCTURE AND PREPARATION METHOD THEREFOR
#7902POWER SEMICONDUCTOR MODULE, SYSTEM INCLUDING A POWER SEMICONDUCTOR MODULE AND A COOLER AND METHOD FOR FABRICATING A SYSTEM
#7903SCALABLE ARCHITECTURE FOR MULTI-DIE SEMICONDUCTOR PACKAGES
#7904DUAL-SIDED TERMINAL DEVICE WITH SPLIT SIGNAL AND POWER ROUTING
#7905VIAS WITH VERTICALLY NON-UNIFORM OR DISCONTINUOUS STACK
#7906SEMICONDUCTOR PACKAGES
#7907ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#7908DEVICE WITH BACKSIDE POWER RAIL AND METHOD
#7909LEADFRAME
#7910ISOLATION PACKAGE WITH HIGH THERMAL CONDUCTIVITY
#7911 ✅ Patent 12,119,289 granted on 2024-10-15Semiconductor packages with roughened conductive components
#7912LEAD FRAME AND METHOD FOR MANUFACTURING LEAD FRAME
#7913LEAD FINGER WITH Z-DIRECTION OBSTRUCTION FEATURE
#7914LEAD FRAME OF SEMICONDUCTOR DEVICE, INTEGRATED-TYPE LEAD FRAME OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
#7915SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#7916SEMICONDUCTOR PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE SUBSTRATE
#7917ELECTRONIC DEVICE
#7918 ✅ Patent 11,984,388 granted on 2024-05-14Semiconductor package structures and methods of manufacture
#7919FINE PITCH CHIP INTERCONNECT STRUCTURE FOR BUMP BRIDGE AND HIGH TEMPERATURE STORAGE IMPROVEMENT AND METHODS FOR FORMING THE SAME
#7920SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#7921SEMICONDUCTOR PACKAGE WITH GUIDE PIN
#7922 ✅ Patent 12,165,961 granted on 2024-12-10Semiconductor package structure
#7923FLIP CHIP PACKAGE FOR SEMICONDUCTOR DEVICES
#7924GLASS CORE SUBSTRATE PRINTED CIRCUIT BOARD FOR WARPAGE REDUCTION
#7925MODIFICATION OF SINX THIN FILM FOR IMPROVED ADHESION OF METAL-DIELECTRICS FOR HSIO PACKAGING
#7926PLASMA-INDUCED SURFACE FUNCTIONALIZATION OF SINX THIN FILM FOR IMPROVED ADHESION OF METAL-DIELECTRIC FOR HSIO
#7927 ✅ Patent 12,334,424 granted on 2025-06-17PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#7928DIE SUBSTRATE TO OPTIMIZE SIGNAL ROUTING
#7929STRUCTURE OF PACKAGE SUBSTRATE
#7930STACKED VIA MODULATOR IN HIGH SPEED INTERCONNECT
#7931 ✅ Patent 12,033,934 granted on 2024-07-09Package structure, optical structure and method for manufacturing the same
#7932SEMICONDUCTOR PACKAGE
#7933 ✅ Patent 12,057,383 granted on 2024-08-06Bonded structures with integrated passive component
#7934SUBSTRATE WITH LOW-PERMITTIVITY CORE AND BUILDUP LAYERS
#7935 ✅ Patent 12,327,785 granted on 2025-06-10HIGH VOLTAGE PASSIVE DEVICE STRUCTURE
#7936DEVICE PERFORMANCE TUNING BY DEEP TRENCH VIA (DVB) PROXIMITY EFFECT IN ARCHITECTURE OF BACKSIDE POWER DELIVERY
#7937INTEGRATED CIRCUIT STRUCTURES WITH PRE-EPITAXIAL DEEP VIA STRUCTURE
#7938SEMICONDUCTOR DEVICE
#7939INTEGRATED CIRCUIT STRUCTURES WITH CONTOURED INTERCONNECTS
#7940SEMICONDUCTOR DEVICE USING ONE OR MORE SLOTS ADDED TO ISOLATION REGION SURROUNDING INDUCTOR FOR ISOLATION IMPROVEMENT
#7941SEMICONDUCTOR DEVICE
#7942 ✅ Patent 12,185,530 granted on 2024-12-31Anti-fuse sensing device and operation method thereof
#7943MICROELECTRONIC DEVICES WITH STAIRCASED STADIUMS AND BOTH THROUGH-STEP AND TO-STEP CONTACTS, AND RELATED SYSTEMS AND METHODS
#7944METAL ROUTING THAT OVERLAPS NMOS AND PMOS REGIONS OF A TRANSISTOR
#7945SEMICONDUCTOR MEMORY DEVICE WITH 3D STRUCTURE
#7946 ✅ Patent 12,374,619 granted on 2025-07-29MICROELECTRONIC DEVICES WITH DIFFERENT STAIRCASED STADIUMS HAVING CONSISTENT MULTI-TIER STEP RISER HEIGHT, AND RELATED SYSTEMS AND METHODS
#7947INTEGRATED CIRCUITS WITH NARROW WIDTH INTERCONNECTS AND REDUCED RC DELAY
#7948SEMICONDUCTOR DEVICE
#7949SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
#7950 ✅ Patent 12,374,622 granted on 2025-07-29SEMICONDUCTOR DEVICE
#7951 ✅ Patent 11,955,429 granted on 2024-04-09Three-dimensional memory device and manufacturing method thereof
#7952CELL OPTIMIZATION THROUGH SOURCE RESISTANCE IMPROVEMENT
#7953 ✅ Patent 12,278,184 granted on 2025-04-15Vertically-stacked field effect transistor cell
#7954BACKSIDE ELECTRICAL CONTACT FOR PMOS EPITAXIAL VOLTAGE SUPPLY
#7955SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
#7956SURFACE FUNCTIONALIZATION OF SINX THIN FILM BY WET ETCHING FOR IMPROVED ADHESION OF METAL-DIELECTRIC FOR HSIO
#7957HYBRID ETCH STOP LAYERS
#7958 ✅ Patent 12,224,243 granted on 2025-02-11Semiconductor memory device having word lines surrounded by memory layers and method of making the semiconductor memory device
#7959SPACER SELF-ALIGNED VIA STRUCTURES USING DIRECTED SELFASSEMBLY FOR GATE CONTACT OR TRENCH CONTACT
#7960GLASS BRIDGE FOR CONNECTING DIES
#7961MICROELECTRONIC STRUCTURE INCLUDING DIE BONDING FILM BETWEEN EMBEDDED DIE AND SURFACE OF SUBSTRATE CAVITY, AND METHOD OF MAKING SAME
#7962INTERPOSERS FOR SEMICONDUCTOR DEVICES
#7963GLASS SUBSTRATE PACKAGE WITH HYBRID BONDED DIE
#7964 ✅ Patent 11,908,801 granted on 2024-02-20Connecting component, display panel, and display device
#7965 ✅ Patent 12,170,249 granted on 2024-12-17Semiconductor package including interposer
#7966Microelectronic Package RDL Patterns to Reduce Stress in RDLs Across Components
#7967SEMICONDUCTOR PACKAGE
#7968 ✅ Patent 11,967,561 granted on 2024-04-23Fabric-based items with electrical component arrays
#7969DEVICE WITH AIRGAP STRUCTURE
#7970PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
#7971 ✅ Patent 12,218,074 granted on 2025-02-04DC and AC magnetic field protection for MRAM device using magnetic-field-shielding structure
#7972PACKAGE STRUCTURES WITH COLLAPSE CONTROL FEATURES
#7973PASSIVE DEVICE STRUCTURE STRESS REDUCTION
#7974SEMICONDUCTOR DEVICE
#7975SEMICONDUCTOR CHIP
#7976COATINGS WITH DIFFUSION BARRIERS FOR CORROSION AND CONTAMINATION PROTECTION
#7977RF CHIP, STRUCTURE AND METHOD FOR RF CHIP GUARD-RING ARRANGEMENT
#7978SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
#7979 ✅ Patent 12,125,808 granted on 2024-10-22Method for protecting data stored in a memory, and corresponding integrated circuit
#7980 ✅ Patent 12,300,635 granted on 2025-05-13Semiconductor device having functional patterns in redundant regions of double seal ring
#7981 ✅ Patent 11,791,292 granted on 2023-10-17Embedded touch panel display device
#7982SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE HAVING THE SAME
#7983MIMCAP CORNER STRUCTURES IN THE KEEP-OUT ZONES OF A SEMICONDUCTOR DIE AND METHODS OF FORMING THE SAME
#7984ELECTRONIC DEVICE SUBSTRATE HAVING A PASSIVE ELECTRONIC COMPONENT
#7985SEMICONDUCTOR DEVICE
#7986ROUTABLE MULTILEVEL PACKAGE WITH MULTIPLE INTEGRATED ANTENNAS
#7987PACKAGE STRUCTURE WITH ANTENNA ELEMENT
#7988HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
#7989 ✅ Patent 12,374,639 granted on 2025-07-29NON-DMSO STRIPPER FOR ADVANCE PACKAGE METAL PLATING PROCESS
#7990Semiconductor Devices and Methods of Manufacture
#7991SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
#7992CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE
#7993 ✅ Patent 12,183,697 granted on 2024-12-31Semiconductor device having a metal pad and a protective layer for corrosion prevention due to exposure to halogen
#7994 ✅ Patent 12,354,983 granted on 2025-07-08FINE-PITCH JOINING PAD STRUCTURE
#7995HYBRID BONDING A DIE TO A SUBSTRATE WITH VIAS CONNECTING METAL PADS ON BOTH SIDES OF THE DIE
#7996SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#7997 ✅ Patent 12,354,985 granted on 2025-07-08MEMORY DEVICE INCLUDING MEMORY CHIP AND PERIPHERAL MEMORY CHIP AND METHOD OF MANUFACTURING THE MEMORY DEVICE
#7998SEMICONDUCTOR DEVICE
#7999SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#8000 ✅ Patent 12,288,763 granted on 2025-04-29Flip chip package assembly having post connects with solder-based joints
#8001METHOD FOR REPLACING SOLDER BALLS OF AN ELECTRONIC PACKAGE
#8002PACKAGE STRUCTURES WITH NON-UNIFORM INTERCONNECT FEATURES
#8003Multi-Bump Connection to Interconnect Structure and Manufacturing Method Thereof
#8004ELECTRONIC DEVICE WITH SENSOR FACE STRESS PROTECTION
#8005 ✅ Patent 12,354,990 granted on 2025-07-08Semiconductor Device and Method of Forming an Embedded Redistribution Layer
#8006 ✅ Patent 12,009,331 granted on 2024-06-11Integrated circuit packages having adhesion layers for through vias
#8007BONDING CONTACTS HAVING CAPPING LAYER AND METHOD FOR FORMING THE SAME
#8008SEMICONDUCTOR DEVICE WITH METAL SILICIDE LAYER
#8009 ✅ Patent 12,300,654 granted on 2025-05-13Semiconductor device with metal silicide layer
#8010BARRIERS TO MODULATE UNDERFILL FLOW
#8011DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND METHOD FOR MANUFACTURING SAME
#8012PACKAGED ELECTRONIC DEVICES HAVING TRANSIENT LIQUID PHASE SOLDER JOINTS AND METHODS OF FORMING SAME
#8013SUBSTRATE TRENCH FOR CONTROLLING UNDERFILL FILLET AREA AND METHODS OF FORMING THE SAME
#8014SEMICONDUCTOR DEVICE
#8015FAN OUT FLIP CHIP SEMICONDUCTOR PACKAGE
#8016SEMICONDUCTOR DEVICE AND METHOD HAVING HIGH-KAPPA BONDING LAYER
#8017NON-PLANAR PEDESTAL FOR THERMAL COMPRESSION BONDING
#8018BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING
#8019THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE EMPLOYING A REDISTRIBUTION LAYER (RDL) INTERPOSER FACILITATING SEMICONDUCTOR DIE STACKING, AND RELATED FABRICATION METHODS
#8020SEMICONDUCTOR PACKAGE
#8021WAFER LEVEL INTEGRATION OF TRANSUCER ELEMENTS, TECHNIQUES AND IMPLEMENTATIONS
#8022RIBBON SHIELD DEVICE AND METHOD
#8023THREE-DIMENSIONAL STACK COOLING WINGS
#8024 ✅ Patent 12,341,133 granted on 2025-06-24STACKED DIE RF CIRCUITS AND PACKAGE METHOD THEREOF
#8025 ✅ Patent 12,255,183 granted on 2025-03-18Semiconductor package including heat dissipation layer
#8026Power Semiconductor Module and Manufacturing Method
#8027PACKAGED ELECTRONIC DEVICE COMPRISING A PLURALITY OF POWER TRANSISTORS
#8028LIGHT-EMITTING DIODE PACKAGES WITH DIRECTIONAL EMISSION INTENSITY AND COLOR UNIFORMITY
#8029MICRO-LED DISPLAY ARCHITECTURE FOR HIGH VOLUME MANUFACTURING
#8030LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME
#8031Package-on-Package Assembly with Improved Thermal Management
#8032ELECTRONIC DEVICE
#8033ELECTRONIC DEVICE
#8034INTEGRATED DIAMOND SUBSTRATE FOR THERMAL MANAGEMENT
#8035DIE PACKAGE, IC PACKAGE AND MANUFACTURING PROCESS THEREOF
#8036ARCHITECTURE AND DEVICE USING OPTICAL ELEMENT AND COMPUTER CHIP FOR OPTICAL SIGNAL TRANSMISSION
#8037 ✅ Patent 11,817,441 granted on 2023-11-14Display panel and display device
#8038DISPLAY PANEL AND DISPLAY DEVICE
#8039DISPLAY PANEL AND DISPLAY DEVICE
#8040CHEMICAL SENSOR AND METHOD OF FORMING THE SAME
#8041DISPLAY AND METHOD FOR MANUFACTURING A DISPLAY
#8042 ✅ Patent 12,152,083 granted on 2024-11-26Cytotoxic and anti-mitotic compounds, and methods of using the same
#8043LIGHT EMITTING DISPLAY DEVICE
#8044Large-Scale Interleaved Transmitters and Receivers Heterogeneously Integrated on a Common Substrate
#8045 ✅ Patent 12,166,024 granted on 2024-12-10Direct-bonded LED arrays drivers
#8046DISPLAY PANEL AND DISPLAY DEVICE
#8047THIN CLIENT FORM FACTOR ASSEMBLY
#8048METAL PCB FOR TOPSIDE POWER DELIVERY
#8049INTEGRATED CIRCUIT SUBSTRATE DESIGN WITH INTEGRATED POWER CONVERTER MODULE AND METHOD OF MANUFACTURING THEREOF
#8050 ✅ Patent 12,249,599 granted on 2025-03-11Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring
#8051 ✅ Patent 12,132,040 granted on 2024-10-29Semiconductor storage device
#8052 ✅ Patent 12,015,024 granted on 2024-06-18Body bias voltage generator and semiconductor device including the same preliminary class
#8053ESD PROTECTION CIRCUIT, ESD PROTECTION METHOD, SEMICONDUCTOR MEMORY AND ESD PROTECTION SYSTEM
#8054ESD PROTECTION CIRCUIT AND SEMICONDUCTOR DEVICE
#8055 ✅ Patent 12,074,158 granted on 2024-08-27Semiconductor device
#8056SEMICONDUCTOR DEVICE AND METHOD
#8057 ✅ Patent 12,261,169 granted on 2025-03-25Semiconductor device and method for fabricating the same
#8058SEMICONDUCTOR DEVICE
#8059Multi-Device Stack Structure
#8060JUNCTION FIELD EFFECT TRANSISTORS FOR LOW VOLTAGE AND LOW TEMPERATURE OPERATION
#8061THREE-DIMENSIONAL BIPOLAR-CMOS-DMOS (BCD) STRUCTURE WITH INTEGRATED BACK-SIDE CAPACITOR
#8062 ✅ Patent 12,205,947 granted on 2025-01-21Planar buried channel structure integrated with non-planar structures
#8063 ✅ Patent 12,132,045 granted on 2024-10-29Semiconductor capacitor array layout capable of generating parasitic capacitance toward edge of layout
#8064 ✅ Patent 12,230,629 granted on 2025-02-18Size-efficient mitigation of latchup and latchup propagation
#8065Semiconductor Structures and Methods of Forming the Same
#8066 ✅ Patent 12,034,004 granted on 2024-07-09Method (and related apparatus) for forming a semiconductor device with reduced spacing between nanostructure field-effect transistors
#8067 ✅ Patent 12,119,347 granted on 2024-10-15Method of manufacturing a horizontal-nanosheet field-effect transistor
#8068 ✅ Patent 12,205,950 granted on 2025-01-21Guard region for an integrated circuit
#8069 ✅ Patent 12,274,089 granted on 2025-04-08Stacked FET sidewall strap connections between gates
#8070 ✅ Patent 12,027,524 granted on 2024-07-02Semiconductor device
#8071VERTICAL BIT DATA PATHS FOR INTEGRATED CIRCUITS
#8072INTEGRATED CIRCUIT
#8073INTEGRATED CIRCUIT STRUCTURES HAVING CONDUCTIVE STRUCTURES IN FIN ISOLATION REGIONS
#8074OXIDE SEMICONDUCTOR THIN-FILM TRANSISTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#8075 ✅ Patent 11,935,897 granted on 2024-03-19Display device and electronic device
#8076DISPLAY DEVICE
#8077DISPLAY DEVICE
#8078ELECTRONIC DEVICE
#8079DISPLAY DEVICE
#8080 ✅ Patent 11,961,847 granted on 2024-04-16Display device
#8081ACTIVE MATRIX SUBSTRATE AND MANUFACTURING METHOD THEREOF
#8082ARRAY SUBSTRATE AND MANUFACTURING METHOD FOR THE SAME, DISPLAY PANEL
#8083 ✅ Patent 12,176,356 granted on 2024-12-24Semiconductor device including transistor and light-emitting element
#8084IMAGE SENSOR
#8085SEMICONDUCTOR DEVICE
#8086PHOTODIODE AND FABRICATION METHOD OF A PHOTODIODE
#8087OPTICAL SENSOR AND METHOD FOR FABRICATING AN OPTICAL SENSOR
#8088 ✅ Patent 12,046,607 granted on 2024-07-23Imaging device
#8089 ✅ Patent 12,119,361 granted on 2024-10-15Circuit board assembly with photosensitive element mounted to back side of circuit board
#8090IMAGING DEVICE
#8091PHOTOELECTRIC CONVERSION DEVICE AND EQUIPMENT
#8092IMAGING ELEMENT, STACKED IMAGING ELEMENT, AND SOLID-STATE IMAGING APPARATUS
#8093IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME
#8094METHOD AND SYSTEMS OF IMAGE SENSORS WITH PIXELS HAVING CIRCULAR POLARIZERS
#8095 ✅ Patent 12,376,401 granted on 2025-07-29Methods Of Forming Optical Modules
#8096 ✅ Patent 12,342,650 granted on 2025-06-24NEAR INFRARED TO FAR INFRARED POLARIZATION SENSITIVE IMAGE SENSOR
#8097 ✅ Patent 11,830,901 granted on 2023-11-28Optical system including a microlens array
#8098IMAGE SENSOR
#8099 ✅ Patent 12,310,137 granted on 2025-05-20Isolation structure to increase image sensor performance
#8100ISOLATION STRUCTURES IN IMAGE SENSORS