SURFACE TREATMENT APPARATUS AND MANUFACTURING APPARATUS FOR SEMICONDUCTOR DEVICE
#5702 ✅ Patent 12,266,549 granted on 2025-04-01Fluid supply nozzle for semiconductor substrate treatment and semiconductor substrate treatment apparatus having the same
#5703APPARATUS FOR PROCESSING SUBSTRATE AND SEMICONDUCTOR MANUFACTURING APPARATUS INCLUDING THE SAME
#5704Semiconductor System with an Integrated Wafer Humidity Control Device
#5705METHOD FOR OPERATING REACTOR SYSTEM
#5706LIQUID STORAGE FOR FACILITY CHEMICAL SUPPLY SYSTEM
#5707SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
#5708ANALYSIS APPARATUS AND ANALYSIS METHOD
#5709 ✅ Patent 12,354,897 granted on 2025-07-08SUBSTRATE CONTAINER WITH DOOR GASKET
#5710 ✅ Patent 12,217,992 granted on 2025-02-04Methods and systems for improving transfer efficiency of an automated material handling system
#5711 ✅ Patent 12,051,610 granted on 2024-07-30Micro assembler with fine angle control
#5712 ✅ Patent 12,211,724 granted on 2025-01-28Optical measurement tool containing chromatic aberration enhancement component and optical alignment method using the same
#5713HIGH TEMPERATURE PEDESTAL WITH EXTENDED ELECTROSTATIC CHUCK ELECTRODE
#5714 ✅ Patent 12,087,611 granted on 2024-09-10Semiconductor processing tool and methods of operation
#5715METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING FILM MATERIAL FOR TEMPORARY FIXING, AND FILM MATERIAL FOR TEMPORARY FIXING
#5716 ✅ Patent 12,266,559 granted on 2025-04-01Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece
#5717SUBSTRATE HOLDER AND METHOD FOR PRODUCING A SUBSTRATE HOLDER FOR BONDING
#5718 ✅ Patent 12,230,534 granted on 2025-02-18Semiconductor device and method of manufacture
#5719METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH MULTI-CARBON-CONCENTRATION DIELECTRICS
#5720SCALABLE PATTERNING THROUGH LAYER EXPANSION PROCESS AND RESULTING STRUCTURES
#5721 ✅ Patent 12,074,059 granted on 2024-08-27Semiconductor arrangement and method of making
#5722 ✅ Patent 12,255,093 granted on 2025-03-183D memory structure and method of forming the same
#5723SEMICONDUCTOR STRUCTURE HAVING AIR GAP DIELECTRIC AND METHOD OF PREPARING THE SAME
#5724SEMICONDUCTOR STRUCTURE
#5725SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER AND METHOD FOR FORMING THE SAME
#5726 ✅ Patent 12,278,142 granted on 2025-04-15Method for manfacturing semiconductor device for reducing partcle-induced defects
#5727 ✅ Patent 12,211,739 granted on 2025-01-28Method for manufacturing semiconductor device comprising contact void surrounding bit line
#5728 ✅ Patent 12,322,648 granted on 2025-06-03Interlayer dielectric layer
#5729CAVITY IN METAL INTERCONNECT STRUCTURE
#5730 ✅ Patent 12,362,231 granted on 2025-07-15SELF-ASSEMBLED DIELECTRIC ON METAL RIE LINES TO INCREASE RELIABILITY
#5731 ✅ Patent 12,020,981 granted on 2024-06-25Conductive feature formation and structure
#5732 ✅ Patent 12,300,538 granted on 2025-05-13Fin field effect transistor (FinFET) device structure with protection layer and method for forming the same
#5733INTEGRATED CIRCUIT DEVICES INCLUDING METAL STRUCTURES HAVING A CURVED INTERFACE AND METHODS OF FORMING THE SAME
#5734 ✅ Patent 12,131,948 granted on 2024-10-29Techniques for void-free material depositions
#5735METHODS FOR FORMING MULTI-TIER TUNGSTEN FEATURES
#5736 ✅ Patent 12,278,143 granted on 2025-04-15Method of providing a workpiece including low resistance interconnect low-resistance interconnect
#5737PACKAGE STRUCTURE WITH FAN-OUT FEATURE
#5738MANUFACTURING METHOD OF CHIPS
#5739METHOD OF PROCESSING WAFER AND LASER APPLYING APPARATUS
#5740 ✅ Patent 12,261,085 granted on 2025-03-25Semiconductor device with reduced loading effect
#5741 ✅ Patent 12,255,103 granted on 2025-03-18Semiconductor structure with backside via contact and a protection liner layer
#5742 ✅ Patent 12,165,925 granted on 2024-12-10Fin field effect transistor having airgap and method for manufacturing the same
#5743 ✅ Patent 12,107,012 granted on 2024-10-01Method for forming fin field effect transistor device structure
#5744 ✅ Patent 12,136,571 granted on 2024-11-05Methods for fabricating FinFETs having different fin numbers and corresponding FinFETs thereof
#5745 ✅ Patent 12,033,897 granted on 2024-07-09Method for forming semiconductor structure
#5746Nanostructure Field-Effect Transistor Device and Method of Forming
#5747 ✅ Patent 12,165,926 granted on 2024-12-10FinFET device structure having dielectric features between a plurality of gate electrodes and methods of forming the same
#5748 ✅ Patent 12,112,987 granted on 2024-10-08Semiconductor device with fin end spacer plug and method of manufacturing the same
#5749 ✅ Patent 12,278,147 granted on 2025-04-15Semiconductor structure and method for forming the same
#5750 ✅ Patent 12,100,625 granted on 2024-09-24Semiconductor device with air gaps between metal gates and method of forming the same
#5751 ✅ Patent 12,310,091 granted on 2025-05-20Semiconductor device and method
#5752 ✅ Patent 12,218,012 granted on 2025-02-04Method of manufacturing semiconductor devices with multiple silicide regions
#5753 ✅ Patent 12,349,446 granted on 2025-07-01STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH EPITAXIAL STRUCTURES
#5754 ✅ Patent 12,176,251 granted on 2024-12-24Semiconductor device with profiled work-function metal gate electrode and method of making
#5755SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#5756 ✅ Patent 12,310,093 granted on 2025-05-20Semiconductor device and manufacturing method thereof
#5757 ✅ Patent 12,288,723 granted on 2025-04-29Semiconductor device and manufacturing method thereof
#5758BONDING SURFACE VALIDATION ON DICING TAPE
#5759 ✅ Patent 12,009,268 granted on 2024-06-11Semiconductor device and fabrication method for semiconductor device
#5760 ✅ Patent 11,990,379 granted on 2024-05-21Array substrate, manufacturing method thereof, and short circuit repair method
#5761 ✅ Patent 12,243,788 granted on 2025-03-04Method of testing semiconductor package
#5762SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
#5763SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#5764SEMICONDUCTOR DEVICE AND METHOD FOR DETERMINING DETERIORATION OF SEMICONDUCTOR DEVICE
#5765 ✅ Patent 11,996,338 granted on 2024-05-28Test structure and test method thereof
#5766 ✅ Patent 12,159,809 granted on 2024-12-03System and method for measuring device inside through-silicon via surroundings
#5767 ✅ Patent 12,142,539 granted on 2024-11-12Semiconductor structure
#5768TEST STRUCTURE AND METHODS OF FORMING THE SAME
#5769GALLIUM NITRIDE-BASED DEVICES AND METHODS OF TESTING THEREOF
#5770 ✅ Patent 12,341,071 granted on 2025-06-24Dummy Patterns in Redundant Region of Double Seal Ring
#5771 ✅ Patent 12,119,276 granted on 2024-10-15Package structure with protective lid
#5772 ✅ Patent 12,125,755 granted on 2024-10-22Chip package structure with cavity in interposer
#5773SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FABRICATING THE SAME
#5774 ✅ Patent 12,051,634 granted on 2024-07-30Package and package-on-package structure having elliptical columns and ellipsoid joint terminals
#5775PACKAGES WITH ENLARGED THROUGH-VIAS IN ENCAPSULANT
#5776 ✅ Patent 12,136,579 granted on 2024-11-05Package structure and method for manufacturing the same
#5777SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
#5778DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND FORMATION METHOD OF THE DIE STACKING STRUCTURE
#5779 ✅ Patent 12,308,298 granted on 2025-05-20Semiconductor die, manufacturing method thereof, and semiconductor package
#5780 ✅ Patent 12,087,654 granted on 2024-09-10Sensing die encapsulated by an encapsulant with a roughness surface having a hollow region
#5781SEMICONDUCTOR DEVICE
#5782Semiconductor Device Package Thermally Coupled to Passive Element
#5783Semiconductor Device and Method for Manufacturing the Same
#5784 ✅ Patent 12,021,006 granted on 2024-06-25Package structure and method and equipment for forming the same
#5785POWER MODULE PACKAGE
#5786HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE MATERIAL FILMS
#5787HEAT SPREADER FOR USE WITH A SEMICONDUCTOR DEVICE
#5788POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE SAME
#5789LIQUID CIRCULATING COOLING PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
#5790PACKAGE HAVING METAL SKELETON FRAME USING EMBEDDED GROUND PLANE
#5791OPTICAL DEVICE PACKAGE PREPARATION METHOD AND OPTICAL DEVICE PACKAGE
#5792 ✅ Patent 12,362,261 granted on 2025-07-15Semiconductor Device and Method of Manufacture
#5793COMPUTING DEVICE AND ELECTRONIC DEVICE GUARANTEEING BANDWIDTH PER COMPUTATIONAL PERFORMANCE
#5794PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#5795 ✅ Patent 12,230,554 granted on 2025-02-18Shield structure for backside through substrate vias (TSVs)
#5796SEMICONDUCTOR STRUCTURE
#5797POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE SAME
#5798 ✅ Patent 12,131,981 granted on 2024-10-29Power module package baseplate with step recess design
#5799 ✅ Patent 12,283,538 granted on 2025-04-22Molded semiconductor package having an embedded inlay
#5800SEMICONDUCTOR DEVICE
#5801SEMICONDUCTOR DEVICE
#5802WIRING SUBSTRATE AND ELECTRONIC DEVICE
#5803 ✅ Patent 12,249,561 granted on 2025-03-11Semiconductor device arrangement with compressible adhesive
#5804FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLICATIONS
#5805SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS
#5806SEMICONDUCTOR MODULE
#5807SEMICONDUCTOR DEVICE
#5808POWER MODULE PACKAGE
#5809POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE ARRANGEMENT
#5810SEMICONDUCTOR PACKAGE STRUCTURE
#5811 ✅ Patent 12,191,239 granted on 2025-01-07Stacked via structure disposed on a conductive pillar of a semiconductor die
#5812INTEGRATION PACKAGE WITH INSULATING BOARDS
#5813 ✅ Patent 12,191,243 granted on 2025-01-07Cantilevered power planes to provide a return current path for high-speed signals
#5814DUAL TRACE THICKNESS FOR SINGLE LAYER ROUTING
#5815 ✅ Patent 12,368,092 granted on 2025-07-22Package Substrate Insulation Opening Design
#5816 ✅ Patent 12,341,091 granted on 2025-06-24SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PATTERNS OF REDISTRIBUTION STRUCTURE HAVING ELLIPSE-LIKE SHAPE
#5817POWER MODULE AND METHOD FOR MANUFACTURING SAME
#5818 ✅ Patent 12,057,385 granted on 2024-08-06Integrated circuits with backside power rails
#5819OPTICAL ROUTING STRUCTURE ON BACKSIDE OF SUBSTRATE FOR PHOTONIC DEVICES
#5820INTEGRATED CIRCUIT (IC) DIE COMPRISING GALVANIC ISOLATION CAPACITOR
#5821 ✅ Patent 12,107,041 granted on 2024-10-01Metal plate corner structure on metal insulator metal
#5822VARIABLE GRADUATED CAPACITOR STRUCTURE AND METHODS FOR FORMING THE SAME
#5823 ✅ Patent 12,374,616 granted on 2025-07-29SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#5824 ✅ Patent 12,136,592 granted on 2024-11-05Method for manufacturing semiconductor structure having a porous structure
#5825 ✅ Patent 12,315,796 granted on 2025-05-27Method for preparing semiconductor device with composite passivation structure
#5826 ✅ Patent 12,014,981 granted on 2024-06-18Active under shielding for coils and transformers
#5827 ✅ Patent 12,119,300 granted on 2024-10-15Transistor circuits with shielded reference transistors
#5828EMBEDDED ROUTING LAYER FOR INLINE CIRCUIT EDIT
#5829INLINE CIRCUIT EDIT
#5830 ✅ Patent 12,347,773 granted on 2025-07-01THREE-DIMENSIONAL MEMORY DEVICE CONTAINING VARIABLE THICKNESS WORD LINES WITH REDUCED LENGTH METAL NITRIDE DIFFUSION BARRIERS AND METHODS FOR FORMING THE SAME
#5831 ✅ Patent 12,278,183 granted on 2025-04-15Semiconductor device with multi-carbon-concentration dielectrics
#5832 ✅ Patent 12,347,730 granted on 2025-07-01METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING VIAS WITH DIFFERENT DIMENSIONS
#5833DESIGNS TO ENABLE INLINE CIRCUIT EDIT
#5834NONVOLATILE MEMORY DEVICE AND SYSTEM COMPRISING THE SAME
#5835CONTACT ARRANGEMENTS FOR DEEP TRENCH CAPACITORS
#5836SEMICONDUCTOR DEVICE INCLUDING DATA STORAGE LAYER
#5837 ✅ Patent 12,272,646 granted on 2025-04-08Semiconductor memory device
#5838 ✅ Patent 12,205,896 granted on 2025-01-21Contact via formation
#5839BURIED VIA-TO-BACKSIDE POWER RAIL (VBPR) FOR STACKED FIELD-EFFECT TRANSISTOR (FET)
#5840INTERLEVEL VIA FOR STACKED FIELD-EFFECT TRANSISTOR DEVICE
#5841BACKSIDE POWER PLANE
#5842VIA TO BACKSIDE POWER RAIL THROUGH ACTIVE REGION
#5843INLINE CIRCUIT EDIT FOR BACKSIDE POWER DELIVERY WITH DEEP VIA
#5844INLINE CIRCUIT EDIT FOR BACKSIDE POWER DELIVERY
#5845 ✅ Patent 12,266,606 granted on 2025-04-01Semiconductor device with backside spacer and methods of forming the same
#5846 ✅ Patent 12,315,809 granted on 2025-05-27Via for semiconductor device and method
#5847 ✅ Patent 12,113,021 granted on 2024-10-08Graphene-assisted low-resistance interconnect structures and methods of formation thereof
#5848 ✅ Patent 12,341,101 granted on 2025-06-24SEMICONDUCTOR DEVICE STRUCTURE WITH BARRIER LAYER AND METHOD FOR FORMING THE SAME
#5849 ✅ Patent 12,057,401 granted on 2024-08-06Semiconductor device having contact plug connected to gate structure on PMOS region
#5850 ✅ Patent 12,261,121 granted on 2025-03-25Structure and method for a low-k dielectric with pillar-type air-gaps
#5851ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#5852PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN METALLIZATION PORTIONS
#5853 ✅ Patent 12,125,795 granted on 2024-10-22Integrated chip with inter-wire cavities
#5854MOLDED INTERCONNECT MEMORY ON PACKAGE
#5855 ✅ Patent 12,087,698 granted on 2024-09-10Wiring substrate, array substrate and light emitting module having control regions arranged into control region rows and control region columns
#5856PACKAGE COMPRISING A SUBSTRATE AND AN INTERCONNECTION DIE CONFIGURED FOR HIGH DENSITY INTERCONNECTION
#5857Component With Dielectric Layer for Embedding in Component Carrier
#5858 ✅ Patent 12,300,626 granted on 2025-05-13Microelectronic assemblies
#5859SECURE CHIPS WITH SERIAL NUMBERS
#5860 ✅ Patent 12,249,580 granted on 2025-03-11Passivation scheme design for wafer singulation
#5861EMI SHIELDING WITH CONDUCTIVE EPOXY
#5862 ✅ Patent 12,272,655 granted on 2025-04-08Semiconductor devices and methods of manufacturing semiconductor devices
#5863 ✅ Patent 12,255,152 granted on 2025-03-18Semiconductor device and method of forming a slot in EMI shielding with improved removal depth
#5864 ✅ Patent 12,374,630 granted on 2025-07-29Stress-Reduced Silicon Photonics Semiconductor Wafer
#5865 ✅ Patent 12,362,290 granted on 2025-07-15SEMICONDUCTOR STRUCTURE WITH A POROUS STRUCTURE
#5866DEVICE FOR DETERMINING EXISTENCE OF DAMAGE IN SEMICONDUCTOR DEVICE AND METHOD RELATED THERETO
#5867 ✅ Patent 12,094,838 granted on 2024-09-17Crack stop ring trench to prevent epitaxy crack propagation
#5868 ✅ Patent 12,237,277 granted on 2025-02-25Package structure and methods of manufacturing the same
#5869 ✅ Patent 12,368,115 granted on 2025-07-22Supporting InFO Packages to Reduce Warpage
#5870SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
#5871 ✅ Patent 12,057,410 granted on 2024-08-06Semiconductor device and method of manufacture
#5872CHIP PACKAGE STRUCTURE WITH ANCHOR STRUCTURE
#5873 ✅ Patent 12,154,867 granted on 2024-11-26Multiplexer cell and semiconductor device having camouflage design, and method for forming multiplexer cell
#5874SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
#5875SEMICONDUCTOR DEVICE
#5876 ✅ Patent 12,199,051 granted on 2025-01-14Integrated circuit structure and method
#5877 ✅ Patent 12,142,582 granted on 2024-11-12Organic interposer including a dual-layer inductor structure and methods of forming the same
#5878Multi-Device Power Module Arrangement
#5879 ✅ Patent 12,278,198 granted on 2025-04-15Semiconductor device on wiring board having reference potential planes with openings
#5880 ✅ Patent 12,327,804 granted on 2025-06-10SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#5881 ✅ Patent 12,266,619 granted on 2025-04-01Integrated devices in semiconductor packages and methods of forming same
#5882 ✅ Patent 12,165,996 granted on 2024-12-10Bond pad with enhanced reliability
#5883PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN SUBSTRATES
#5884 ✅ Patent 12,205,911 granted on 2025-01-21Bonding structure and method of forming same
#5885SEMICONDUCTOR PACKAGE
#5886SEMICONDUCTOR STRUCTURE HAVING VIAS WITH DIFFERENT DIMENSIONS AND MANUFACTURING METHOD THEREOF
#5887FILM PACKAGE AND PACKAGE MODULE INCLUDING THE SAME
#5888WAFER-LEVEL CHIP SCALE PACKAGING WITH COPPER CORE BALL EMBEDDED INTO MOLD
#58893D Packaging Heterogeneous Area Array Interconnections
#5890ELECTRONIC PACKAGE AND ELECTRONIC STRUCTURE THEREOF
#5891HYBRID MICRO-BUMP INTEGRATION WITH REDISTRIBUTION LAYER
#5892 ✅ Patent 12,354,988 granted on 2025-07-08BUMP STRUCTURES FOR LOW TEMPERATURE CHIP BONDING
#5893DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
#5894 ✅ Patent 12,015,004 granted on 2024-06-18Hybrid device assemblies and method of fabrication
#5895PACKAGE STRUCTURE
#5896 ✅ Patent 12,243,843 granted on 2025-03-04Integrated circuit package and method of forming same
#5897 ✅ Patent 12,243,845 granted on 2025-03-04Method and structure to control the solder thickness for double sided cooling power module
#5898SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#5899LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR PACKAGES
#5900 ✅ Patent 12,374,647 granted on 2025-07-29SEMICONDUCTOR DEVICE
#5901METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE
#5902 ✅ Patent 12,341,123 granted on 2025-06-24SEMICONDUCTOR DEVICE WITH SUBSTRATE FOR ELECTRICAL CONNECTION
#5903 ✅ Patent 12,322,723 granted on 2025-06-03Self-aligned interconnect structure
#5904SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#5905 ✅ Patent 12,211,818 granted on 2025-01-28Manufacturing method of semiconductor package using jig
#5906CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION
#5907 ✅ Patent 12,230,603 granted on 2025-02-18Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layer
#5908 ✅ Patent 12,255,176 granted on 2025-03-18Scalable architecture for reduced cycles across SOC
#5909MULTI-CHIP PACKAGES AND METHODS OF FORMING THE SAME
#5910 ✅ Patent 12,293,988 granted on 2025-05-06Semiconductor package and method of forming the same
#5911DIE STACKING PACKAGE ARCHITECTURE FOR HIGH-SPEED INPUT/OUTPUT WITH THROUGH-DIELECTRIC VIAS
#5912METHOD OF MANUFACTURING A SEMICONDUCTOR CHIP INCLUDING A STRESS CONCENTRATION PORTION
#5913 ✅ Patent 12,293,992 granted on 2025-05-06Semiconductor assemblies with systems and methods for managing high die stack structures
#5914CHIP STACKING STRUCTURE AND PREPARATION METHOD THEREOF, CHIP STACKING PACKAGE, AND ELECTRONIC DEVICE
#5915 ✅ Patent 12,218,106 granted on 2025-02-04Backside contact to improve thermal dissipation away from semiconductor devices
#5916 ✅ Patent 12,224,268 granted on 2025-02-11Fan-out packages providing enhanced mechanical strength and methods for forming the same
#5917 ✅ Patent 12,272,678 granted on 2025-04-08Semiconductor package and manufacturing method thereof
#5918MAGNETIC LED DIE TRANSFERRING DEVICE AND MAGNETIC LED DIE TRANSFERRING METHOD
#5919DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
#5920ELECTRONIC DEVICE
#5921DISPLAY DEVICE AND DISPLAY APPARATUS
#5922LIGHT EMITTING ASSEMBLY WITH RAISED ADHESIVE LAYER
#5923 ✅ Patent 12,046,587 granted on 2024-07-23Light emitting device for display and display apparatus having the same
#5924 ✅ Patent 12,068,295 granted on 2024-08-20Deep partition power delivery with deep trench capacitor
#5925 ✅ Patent 12,368,141 granted on 2025-07-22IPD Modules with Flexible Connection Scheme in Packaging
#5926PIXEL DEVICE AND DISPLAY APPARATUS HAVING THE SAME
#5927PIXEL STRUCTURE FOR DISPLAYS
#5928 ✅ Patent 12,266,649 granted on 2025-04-01Method for manufacturing semiconductor device with substrate for electrical connection
#5929MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE
#5930 ✅ Patent 12,148,745 granted on 2024-11-19Integrated hybrid standard cell structure with gate-all-around device
#5931 ✅ Patent 12,183,729 granted on 2024-12-31Integrated circuit filler and method thereof
#5932 ✅ Patent 12,261,167 granted on 2025-03-25Structure and method of power supply routing in semiconductor device
#5933INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING THE SAME
#5934DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE DISPLAY APPARATUS
#5935ELECTROSTATIC DISCHARGE PREVENTION
#5936 ✅ Patent 12,191,300 granted on 2025-01-07Integrated circuit structure with resistive semiconductor material for back well
#5937PNP CONTROLLED ESD PROTECTION DEVICE WITH HIGH HOLDING VOLTAGE AND SNAPBACK
#5938 ✅ Patent 12,094,870 granted on 2024-09-17Electrostatic discharge circuits and methods for operating the same
#5939 ✅ Patent 12,057,448 granted on 2024-08-06Stacked semiconductor device having mirror-symmetric pattern
#5940THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHOD OF FORMING THE SAME
#5941SEMICONDUCTOR DEVICE
#5942LEAKAGE CURRENT REDUCTION FOR CONTINUOUS ACTIVE REGIONS
#5943 ✅ Patent 12,170,279 granted on 2024-12-17Hybrid semiconductor device
#5944 ✅ Patent 12,183,733 granted on 2024-12-31Semiconductor device structure and methods of forming the same
#5945METAL GATE STACKS AND METHODS OF FABRICATING THE SAME IN MULTI-GATE FIELD-EFFECT TRANSISTORS
#5946 ✅ Patent 12,080,713 granted on 2024-09-03Self-aligned etch in semiconductor devices
#5947TRANSISTOR SOURCE/DRAIN CONTACTS AND METHODS OF FORMING THE SAME
#5948 ✅ Patent 12,191,305 granted on 2025-01-07Integration of silicon channel nanostructures and silicon-germanium channel nanostructures
#5949METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES
#5950SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME
#5951SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
#5952SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#5953 ✅ Patent 12,249,604 granted on 2025-03-11Semiconductor device having doped work function metal layer
#5954SEMICONDUCTOR DEVICE
#5955SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF FOR SELECTIVELY ETCHING DUMMY FINS
#5956 ✅ Patent 12,136,624 granted on 2024-11-05Fin Field-Effect Transistor and method of forming the same
#5957 ✅ Patent 12,328,938 granted on 2025-06-10GATE STRUCTURES FOR STACKED SEMICONDUCTOR DEVICES
#5958 ✅ Patent 12,324,235 granted on 2025-06-03Semiconductor device and method of forming the same
#5959NOISE REDUCTION IN SILICON-ON-INSULATOR DEVICES
#5960RADIO FREQUENCY INTERFERENCE MITIGATION FOR SILICON-ON-INSULATOR DEVICES
#5961 ✅ Patent 12,218,143 granted on 2025-02-04Array substrate and manufacturing method thereof
#5962CO-DOPING OF THIN FILM TRANSISTORS
#5963 ✅ Patent 11,978,742 granted on 2024-05-07Metal oxide film and method for forming metal oxide film
#5964Semiconductor Device
#5965THIN-FILM TRANSISTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#5966SEMICONDUCTOR DEVICE AND DISPLAY DEVICE
#5967DISPLAY DEVICE
#5968 ✅ Patent 11,948,946 granted on 2024-04-02Array substrate, method for manufacturing the same, and display panel
#5969ARRAY SUBSTRATE, METHOD FOR MANUFACTURING ARRAY SUBSTRATE AND DISPLAY DEVICE
#5970 ✅ Patent 12,158,679 granted on 2024-12-03Display device
#5971 ✅ Patent 11,984,454 granted on 2024-05-14Display device comprising a peripheral circuit having first and second transistors and a black matrix with a lattice area facing the peripheral circuit
#5972DISPLAY DEVICE
#5973 ✅ Patent 12,324,242 granted on 2025-06-03Array substrate, display panel, and display terminal
#5974 ✅ Patent 12,094,889 granted on 2024-09-17Display substrate and method for manufacturing the same, display device
#5975 ✅ Patent 12,176,355 granted on 2024-12-24Display panel and manufacturing method thereof
#5976 ✅ Patent 12,080,725 granted on 2024-09-03Hybrid high-K dielectric material film stacks comprising zirconium oxide utilized in display devices
#5977 ✅ Patent 12,237,346 granted on 2025-02-25Detection device with stacked photodiodes
#5978LIGHT SENSING PANEL, LIGHT SENSING DISPLAY PANEL, AND METHOD FOR OPERATING LIGHT SENSING PANEL
#5979IMAGE SENSORS
#5980IMAGING ELEMENT AND ELECTRONIC DEVICE
#5981 ✅ Patent 12,057,461 granted on 2024-08-06SPAD pixel
#5982 ✅ Patent 12,051,763 granted on 2024-07-30Germanium-containing photodetector and methods of forming the same
#5983FAST CHARGE TRANSFER FLOATING DIFFUSION REGION FOR A PHOTODETECTOR AND METHODS OF FORMING THE SAME
#5984CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
#5985 ✅ Patent 12,100,720 granted on 2024-09-24Wafer level image sensor package
#5986 ✅ Patent 12,211,869 granted on 2025-01-28Optical blocking structures for black level correction pixels in an image sensor
#5987LIGHT RECEIVING ELEMENT ARRAY AND MANUFACTURING METHOD THEREFOR
#5988ENHANCED DESIGN FOR IMAGE SENSING TECHNOLOGY
#5989PASSIVATION FOR A DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR
#5990COMPOSITE DEEP TRENCH ISOLATION STRUCTURE IN AN IMAGE SENSOR
#5991 ✅ Patent 12,243,894 granted on 2025-03-04Stacked image sensors and methods of formation
#5992PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#5993 ✅ Patent 12,272,712 granted on 2025-04-08Chip package and method for forming a chip package having first and second stack of dummy metal layers surround the sensing region
#5994DRIVER CHIP
#5995PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM, AND MOBILE BODY
#5996 ✅ Patent 12,294,012 granted on 2025-05-06Image sensor
#5997 ✅ Patent 12,324,256 granted on 2025-06-03Image sensor
#5998GERMANIUM-SILICON LIGHT SENSING APPARATUS II
#5999 ✅ Patent 12,369,413 granted on 2025-07-22METHOD FOR FORMING AN IMAGE SENSOR
#6000PHOTODIODE AND MANUFACTURING METHOD THEREOF