ETCHING CONTROL DEVICE, ETCHING CONTROL METHOD, AND ETCHING CONTROL SYSTEM
#6302SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#6303COMPONENT PROCESSING APPARATUS, SUCH AS A PRESSURE SINTERING APPARATUS OR A COMPONENT ENCAPSULATION APPARATUS
#6304GAS BOX ASSEMBLY FOR HIGH PRESSURE PROCESSING APPARATUS
#6305HIGH PRESSURE PROCESSING APPARATUS
#6306WAFER HEATING APPARATUS AND WAFER PROCESSING APPARATUS USING THE SAME
#6307 ✅ Patent 12,237,186 granted on 2025-02-25On-board cleaning of tooling parts in hybrid bonding tool
#6308SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
#6309SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
#6310DEFECT INSPECTION DEVICE
#6311METHOD FOR PRODUCING AN INDIVIDUALIZATION ZONE OF AN INTEGRATED CIRCUIT
#6312SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#6313PERIMETER FRAME FOR SPACING RETICLE PODS
#6314SUBSTRATE CONTAINER SYSTEMS AND METHODS OF PURGING A SUBSTRATE CONTAINER
#6315SUBSTRATE TRANSPORT APPARATUS
#6316SUBSTRATE TREATING APPARATUS
#6317CONTAINER RELAY UNIT AND LOGISTICS TRANSPORT SYSTEM INCLUDING THE SAME
#6318SUBSTRATE FOR CARRYING WAFER
#6319Automatic Alignment Of Overhead Transport Vehicles To Load Ports Of Semiconductor Fabrication Tools
#6320 ✅ Patent 12,315,753 granted on 2025-05-27Wafer positioning method and apparatus
#6321 ✅ Patent 12,327,749 granted on 2025-06-10CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF
#6322SUBSTRATE LOADING DEVICE AND SUBSTRATE LOADING METHOD USING THE SAME
#6323 ✅ Patent 12,119,254 granted on 2024-10-15Electrostatic chuck assembly for plasma processing apparatus
#6324WAFER ASSEMBLY AND METHOD FOR PRODUCING A PLURALITY OF SEMICONDUCTOR CHIPS
#6325PROCESSING APPARATUS USING LASER, METHOD OF LASER LIFT-OFF AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#6326APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING THE SAME
#6327MICRO DEVICE ARRANGEMENT IN DONOR SUBSTRATE
#6328SUBSTRATE HANDLING DEVICE WITH ADJUSTABLE JOINTS
#6329FOCUS RING, APPARATUS AND METHOD FOR PROCESSING SEMICONDUCTOR WAFER
#6330 ✅ Patent 12,249,537 granted on 2025-03-11Substrate flipping in vacuum for dual sided PVD sputtering
#6331SINGLE WAFER PROCESSING ENVIRONMENTS WITH SPATIAL SEPARATION
#6332 ✅ Patent 12,308,279 granted on 2025-05-20Semiconductor device including an isolation region having an edge being covered and manufacturing method for the same
#6333SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#6334SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#6335HYBRID DAMASCENE INTERCONNECT STRUCTURE FOR SIGNAL AND POWER VIA CONNECTIONS
#6336 ✅ Patent 12,218,003 granted on 2025-02-04Selective ILD deposition for fully aligned via with airgap
#6337SEMICONDUCTOR DEVICE HAVING EDGE SEAL AND METHOD OF MAKING THEREOF WITHOUT METAL HARD MASK ARCING
#6338SEMICONDUCTOR DEVICE HAVING EDGE SEAL AND METHOD OF MAKING THEREOF WITHOUT METAL HARD MASK ARCING
#6339STRUCTURES WITH CONVEX CAVITY BOTTOMS
#6340CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE
#6341SELECTIVE TUNGSTEN CONTACT PLUGS ABOVE GATE AND SOURCE/DRAIN CONTACTS
#6342SELF-ALIGNED BACKSIDE CONTACT IN NANOSHEET WITHOUT BDI
#6343SEMICONDUCTOR STRUCTURE, PREPARATION METHOD THEREFOR AND MEMORY
#6344DEVICE WITH THROUGH VIA AND RELATED METHODS
#6345SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS
#6346WAFER DICING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES BY USING THE WAFER DICING METHOD
#6347PROCESSING METHOD OF WAFER
#6348 ✅ Patent 12,230,545 granted on 2025-02-18Semiconductor devices including dummy gate dielectric layer and methods of manufacturing thereof
#6349SEMICONDUCTOR DEVICE INCLUDING THIN FILM TRANSISTOR AND METHOD FOR FORMING THE SAME
#6350Footing Removal in Cut-Metal Process
#6351HIGH PERFORMANCE 3D COMPACT TRANSISTOR ARCHITECTURE
#6352SEMICONDUCTOR DEVICE WITH SPACER AND C-SHAPED CHANNEL PORTION, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH SPACER AND C-SHAPED CHANNEL PORTION, AND ELECTRONIC APPARATUS
#6353INTEGRATED CIRCUIT DEVICE
#6354METHOD FOR FORMING A SEMICONDUCTOR DEVICE STRUCTURE AND RELATED SEMICONDUCTOR DEVICE STRUCTURES
#6355INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#6356MACHINE-LEARNING IN MULTI-STEP SEMICONDUCTOR FABRICATION PROCESSES
#6357SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#6358IN-SITU ETCH MATERIAL SELECTIVITY DETECTION SYSTEM
#6359 ✅ Patent 12,255,113 granted on 2025-03-18Alignment method and alignment device
#6360SEMICONDUCTOR PACKAGE
#6361TESTKEY STRUCTURE AND METHOD FOR FORMING THE SAME
#6362SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#6363Semiconductor module having a double-sided heat dissipation structure and A Method for fabricating the same
#6364ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#6365Fan-Out Stacked Package and Methods of Making the Same
#6366SEMICONDUCTOR DEVICE
#6367PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE, PACKAGING SUBSTRATE PREPARATION METHOD, AND SEMICONDUCTOR PACKAGE PREPARATION METHOD
#6368ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
#6369NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR OPERATING THE SAME
#6370Power Semiconductor Device
#6371SEMICONDUCTOR PACKAGES
#6372Packaged Device, Packaged Module, and Power Conversion Device
#6373Semiconductor Module Having Double Sided Heat Dissipation Structure and Method for Fabricating the Same
#6374 ✅ Patent 12,278,156 granted on 2025-04-15Semiconductor package
#6375SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING
#6376PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
#6377 ✅ Patent 12,278,158 granted on 2025-04-15Leadframe spacer for double-sided power module
#6378SEMICONDUCTOR DEVICE
#6379Semiconductor Device and Method of Forming Graphene-Coated Core Embedded Within TIM
#6380MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME
#6381 ✅ Patent 12,165,950 granted on 2024-12-10Power semiconductor component and method for producing a power semiconductor component
#6382HEAT SPREADER AND ELECTRONIC COMPONENT DEVICE
#6383 ✅ Patent 12,368,086 granted on 2025-07-22PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER
#6384COOLING SYSTEMS WITH MAIN AND REMOTE COOLING MASSES HAVING INTEGRATED FLEXIBILITY
#6385COOLING APPARATUS, SEMICONDUCTOR DEVICE INCLUDING THE APPARATUS, AND MANUFACTURING METHOD THEROF
#6386SEMICONDUCTOR DEVICE
#6387SEMICONDUCTOR DEVICE AND INVERTER UNIT
#6388STACKED SEMICONDUCTOR METHOD AND APPARATUS
#6389POWER SEMICONDUCTOR COMPONENT
#6390POWER MODULE THERMAL MANAGEMENT SYSTEM
#6391CHIP PROTECTION DEVICE
#6392POWER MODULE THERMAL MANAGEMENT SYSTEM
#6393SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION
#6394SELF-ALIGNED BACKSIDE CONTACT WITH DEEP TRENCH LAST FLOW
#6395VIA RESISTANCE TO BACKSIDE POWER RAIL
#6396SEMICONDUCTOR DEVICE INCLUDING INSULATING STRUCTURE SURROUNDING THROUGH VIA AND METHOD FOR FORMING THE SAME
#6397SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
#6398INTEGRATED CIRCUIT DEVICES
#6399 ✅ Patent 12,266,594 granted on 2025-04-01Method of making semiconductor device having self-aligned interconnect structure
#6400 ✅ Patent 12,308,303 granted on 2025-05-20Integrated circuit die with memory macro including through-silicon via and method of forming the same
#6401CHIP PACKAGE HAVING DIE PAD WITH PROTECTIVE LAYER
#6402 ✅ Patent 12,354,932 granted on 2025-07-08SMDS INTEGRATION ON QFN BY 3D STACKED SOLUTION
#6403SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#6404 ✅ Patent 12,237,247 granted on 2025-02-25Semiconductor package with top circuit and an IC with a gap over the IC
#6405SEMICONDUCTOR DEVICE
#6406PACKAGE STRUCTURE FOR ASYMMETRIC TRANSIENT VOLTAGE SUPPRESSOR
#6407SEMICONDUCTOR DEVICE
#6408REDUCED STRESS CLIP FOR SEMICONDUCTOR DIE
#6409SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#6410VERTICAL HIGH CURRENT HALL SENSOR WITH INTEGRATED HEAT SLUG CURRENT LOOP POWER PAD
#6411SEMICONDUCTOR PACKAGE HAVING REDUCED PARASITIC INDUCTANCE
#6412METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL AS A SEMICONDUCTOR PACKAGE ASSEMBLY OBTAINED WITH THIS METHOD
#6413 ✅ Patent 12,211,773 granted on 2025-01-28Integrated antenna-in-package structure
#6414WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE
#6415TERMINAL STRUCTURE AND ELECTRONIC COMPONENT
#6416SEMICONDUCTOR PACKAGE
#6417METHOD FOR PRODUCING LAYERED BODY, LAYERED BODY, AND MULTILAYERED BODY
#6418ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE
#6419PACKAGE SUBSTRATE
#6420SEMICONDUCTOR PACKAGE
#6421SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN
#6422FLEXIBLE PACKAGE
#6423MULTI-LEVEL STAGGERED TERMINAL STRUCTURE AND SEMICONDUCTOR PACKAGE AND ASSEMBLY USING THE SAME
#6424PACKAGE STRUCTURE
#6425PACKAGING DEVICE, PACKAGING MODULE, AND ELECTRONIC DEVICE
#6426FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION
#6427EXTENDED VIA CONNECT FOR PIXEL ARRAY
#6428INTEGRATED CIRCUIT (IC) DEVICE WITH HYBRID METAL LAYER
#6429SUBTRACTIVES LINES AND VIAS WITH WRAP-AROUND CONTACT
#6430SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS
#6431SEMICONDUCTOR DEVICE
#6432 ✅ Patent 12,300,603 granted on 2025-05-13Modified fuse structure and method of use
#6433PORT LANDING-FREE LOW-SKEW SIGNAL DISTRIBUTION WITH BACKSIDE METALLIZATION AND BURIED RAIL
#6434DEVICE LAYER INTERCONNECTS
#6435SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
#6436NON-PLANAR METAL-INSULATOR-METAL STRUCTURE
#6437VTFET CIRCUIT WITH OPTIMIZED OUTPUT
#6438SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#6439INTEGRATED CIRCUIT DEVICE
#6440SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#6441 ✅ Patent 12,021,028 granted on 2024-06-253D semiconductor devices and structures with electronic circuit units
#6442 ✅ Patent 12,199,039 granted on 2025-01-14Tapered connectors for superconductor circuits
#6443SEMICONDUCTOR DEVICE INCLUDING PARALLEL CONFIGURATION
#6444POWER DELIVERY NETWORK HAVING SUPER VIAS IN AN INTEGRATED CIRCUIT
#6445REVERSE EMBEDDED POWER STRUCTURE FOR GRAPHICAL PROCESSING UNIT CHIPS AND SYSTEM-ON-CHIP DEVICE PACKAGES
#6446DIAGONAL BACKSIDE POWER AND SIGNAL ROUTING FOR AN INTEGRATED CIRCUIT
#6447 ✅ Patent 12,272,649 granted on 2025-04-08Semiconductor device and method
#6448SEMICONDUCTOR DEVICES WITH BACKSIDE ROUTING AND METHOD OF FORMING SAME
#6449SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#6450Semiconductor Device and Method of Stacking Hybrid Substrates
#6451SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE, AND INTERPOSER GROUP
#6452MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES
#6453Systems And Methods For Coupling Integrated Circuit Dies
#6454SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#6455 ✅ Patent 12,354,969 granted on 2025-07-08Semiconductor Device and Method of Manufacture
#6456 ✅ Patent 12,265,335 granted on 2025-04-01Alignment-overlay mark and method using the same
#6457SEMICONDUCTOR PROCESSING FOR ALIGNMENT MARK
#6458SEMICONDUCTOR PACKAGE
#6459 ✅ Patent 12,249,581 granted on 2025-03-11Method of manufacture overlay mark using laser marking process for semiconductor device
#6460ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH THERMAL MITIGATION
#6461SHIELDING FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND MAGNETIC INTERFERENCE AND METHODS FOR FORMING THE SAME
#6462SEMICONDUCTOR PACKAGE
#6463METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF
#6464SEMICONDUCTOR STORAGE DEVICE
#6465PACKAGE STRUCTURE
#6466PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
#6467SEMICONDUCTOR DEVICE
#6468BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY
#6469APPARATUS AND METHODS FOR BONDING PAD REDISTRIBUTION LAYERS IN INTEGRATED CIRCUITS
#6470 ✅ Patent 12,368,120 granted on 2025-07-22SEMICONDUCTOR DEVICE AND METHOD
#6471SEMICONDUCTOR STRUCTURE HAVING DUMMY CONDUCTIVE MEMBER AND MANUFACTURING METHOD THEREOF
#6472SEMICONDUCTOR STRUCTURE HAVING DUMMY CONDUCTIVE MEMBER AND MANUFACTURING METHOD THEREOF
#6473Adding Sealing Material to Wafer edge for Wafer Bonding
#6474SEMICONDUCTOR PACKAGE
#6475CONNECTING PILLAR
#6476SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
#6477SYSTEM AND METHOD OF BUMP MAP DETERMINATION AND BUMP ARRAY FORMATION
#6478MANUFACTURING METHOD OF ELECTRONIC PACKAGE
#6479CHIP HIGH-DENSITY INTERCONNECTION PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#6480PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#6481COMPONENT-EMBEDDED PACKAGING STRUCTURE
#6482SEMICONDUCTOR PACKAGE
#6483SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#6484SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#6485Method for Fabricating a Power Semiconductor Device
#6486SEMICONDUCTOR DEVICE
#6487BONDED CONNECTION MEANS
#6488CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE
#6489BONDING APPARATUS AND BONDING METHOD
#6490 ✅ Patent 12,362,315 granted on 2025-07-15Heterogeneous Dielectric Bonding Scheme
#6491INTEGRATED CIRCUIT PACKAGE AND METHOD
#6492SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND MANUFACTURING METHOD THEREOF
#6493HIGH DENSITY SEMICONDUCTOR DEVICE INCLUDING INTEGRATED CONTROLLER, LOGIC CIRCUIT AND MEMORY DIES
#6494SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#6495STACKED MEMORY ROUTING TECHNIQUES
#6496SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
#6497PIXEL ISOLATION STRUCTURES AND METHODS OF MAKING THEM
#6498WAFER-LEVEL MANUFACTURE OF OPTICAL PACKAGES
#6499METHOD FORMING A MICRO LED DISPLAY DEVICE
#6500 ✅ Patent 12,183,721 granted on 2024-12-31Electronic device and manufacturing method thereof
#6501SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#6502Socket To Support High Performance Multi-die ASICs
#6503MULTI-DIE PACKAGE ON PACKAGE
#6504SEMICONDUCTOR PACKAGE ASSEMBLY
#6505SEMICONDUCTOR PACKAGE
#6506METHOD FOR MANUFACTURING LIGHT-EMITTING SUBSTRATE AND LIGHT-EMITTING SUBSTRATE
#6507 ✅ Patent 12,040,321 granted on 2024-07-16Optical device including an optical component an electrical component, assembly structure including an optical component an electrical component and method for manufacturing the same
#6508 ✅ Patent 12,176,338 granted on 2024-12-24Semiconductor device, method of and system for manufacturing semiconductor device
#6509 ✅ Patent 12,224,278 granted on 2025-02-11Active zones with offset in semiconductor cell
#6510 ✅ Patent 12,336,296 granted on 2025-06-17SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN CONTACT HAVING HEIGHT BELOW GATE STACK
#6511SILICON-CONTROLLED RECTIFIERS WITH A SEGMENTED FLOATING REGION
#6512TVS WITH ENHANCED REPETITIVE SURGE PERFORMANCE
#6513SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#6514PROTECTION DIODE TO PREVENT CHARGE DAMAGE DURING MOL
#6515METHOD OF MAKING HIGH POWER TVS WITH ENHANCED REPETITIVE SURGE PERFORMANCE
#6516 ✅ Patent 12,255,201 granted on 2025-03-18ESD structure
#6517TRIGGER SILICON CONTROLLED RECTIFIER
#6518 ✅ Patent 12,183,730 granted on 2024-12-31Silicon controlled rectifier
#6519SEMICONDUCTOR DEVICE
#6520SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#6521 ✅ Patent 12,205,945 granted on 2025-01-21Semiconductor device and manufacturing method thereof
#6522SEMICONDUCTOR DEVICE
#6523 ✅ Patent 12,148,750 granted on 2024-11-19Work function design to increase density of nanosheet devices
#6524INTEGRATED CIRCUIT STRUCTURES HAVING GATE CUT PLUG REMOVED FROM TRENCH CONTACT USING ANGLED DIRECTIONAL ETCH
#6525NANOSTRUCTURE WITH VARIOUS WIDTHS
#6526 ✅ Patent 12,170,280 granted on 2024-12-17Method of manufacturing gate structure and method of manufacturing fin-field effect transistor
#6527METHOD OF MAKING POLYSILICON STRUCTURE INCLUDING PROTECTIVE LAYER
#6528SEMICONDUCTOR DEVICE AND FABRICATING THE SAME
#6529HETEROGENEOUS GATE ALL AROUND DIELECTRIC THICKNESS
#6530MULTI-VT SOLUTION FOR REPLACEMENT METAL GATE BONDED STACKED FET
#6531SUPER-STEEP SWITCHING DEVICE AND INVERTER DEVICE USING THE SAME
#6532INTEGRATED CIRCUIT DEVICES INCLUDING STACKED TRANSISTORS AND METHODS OF FORMING THE SAME
#6533SEMICONDUCTOR DEVICE
#6534SELF-ALIGNED BACKSIDE CONTACT
#6535SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
#6536 ✅ Patent 12,364,003 granted on 2025-07-15SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
#6537 ✅ Patent 12,294,005 granted on 2025-05-06Semiconductor device having a plurality of channel layers and method of manufacturing the same
#6538UNIFORM GATE WIDTH FOR NANOSTRUCTURE DEVICES
#6539 ✅ Patent 12,302,632 granted on 2025-05-13Non-planar integrated circuit structures having mitigated source or drain etch from replacement gate process
#6540TRANSISTOR ISOLATION REGIONS AND METHODS OF FORMING THE SAME
#6541MOS TRANSISTOR ON SOI STRUCTURE
#6542DISPLAY PANELS
#6543 ✅ Patent 12,199,103 granted on 2025-01-14Display panel
#6544ARRAY SUBSTRATE AND DISPLAY PANEL
#6545 ✅ Patent 12,218,149 granted on 2025-02-04Dual gate array substrate and display panel
#6546DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
#6547CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
#6548DISPLAY PANEL AND TILED DISPLAY SCREEN
#6549DISPLAY DEVICE, PHOTOMASK, AND MANUFACTURING METHOD OF DISPLAY DEVICE
#6550ELECTRONIC DEVICE
#6551ARRAY SUBSTRATE
#6552CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
#6553 ✅ Patent 12,237,344 granted on 2025-02-25Method of fabricating array substrate, array substrate and display device
#6554LASER CRYSTALLIZATION APPARATUS AND LASER CRYSTALLIZATION METHOD USING THE SAME
#6555LIGHT RECEIVING DEVICE AND METHOD OF MANUFACTURING THE SAME
#6556SOLID-STATE IMAGING ELEMENT AND METHOD OF MANUFACTURING SAME
#6557 ✅ Patent 12,324,262 granted on 2025-06-03Imaging element, stacked-type imaging element and solid-state imaging apparatus
#6558SOLID-STATE IMAGE PICKUP APPARATUS AND ELECTRONIC EQUIPMENT
#6559 ✅ Patent 12,132,067 granted on 2024-10-29Image sensor
#6560IMAGE SENSOR STRUCTURE AND METHOD FOR FORMING THE SAME
#6561IMAGE SENSOR PACKAGING AND METHODS FOR FORMING THE SAME
#6562SEMICONDUCTOR DEVICE, IMAGING DEVICE, AND MANUFACTURING METHOD
#6563SENSOR ASSEMBLY AND METHOD FOR FORMING THE SAME
#6564SEMICONDUCTOR DEVICE HAVING STACKED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#6565SOLID-STATE IMAGING DEVICE HAVING THROUGH ELECTRODE PROVIDED THEREIN AND ELECTRONIC APPARATUS INCORPORATING THE SOLID-STATE IMAGING DEVICE
#6566IMAGE SENSING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#6567 ✅ Patent 12,300,711 granted on 2025-05-13Integrated sensor for lifetime characterization
#6568SEMICONDUCTOR DEVICE, SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
#6569MOUNTING STRUCTURE FOR CHIP COMPONENT
#6570SILICON CAPACITOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#6571 ✅ Patent 12,302,592 granted on 2025-05-13Metal insulator metal (MIM) structure and manufacturing method thereof
#6572METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING METAL INSULATOR METAL CAPACITOR
#6573TRENCH CAPACITOR STRUCTURE AND METHODS OF MANUFACTURING
#6574CAPACITOR STRUCTURE, METHOD OF FORMING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE CAPACITOR STRUCTURE
#6575SEMICONDUCTOR ELEMENTS WITH FIELD SHIELDING BY POLARIZATION DOPING
#6576SEMICONDUCTOR POWER DEVICE WITH IMPROVED RUGGEDNESS
#6577SEMICONDUCTOR DEVICE WITH GATE STRUCTURE AND CURRENT SPREAD REGION
#6578SEMICONDUCTOR ELEMENT WITH SHIELDING
#6579SYSTEMS AND METHODS FOR PILLAR EXTENSION IN TERMINATION AREAS OF WIDE BAND GAP SUPER-JUNCTION POWER DEVICES
#6580POWER SEMICONDUCTOR DEVICE AND A METHOD FOR PRODUCING A POWER SEMICONDUCTOR DEVICE
#6581SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, INVERTER CIRCUIT, DRIVE DEVICE, VEHICLE, AND ELEVATOR
#6582SUPER JUNCTION SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#6583 ✅ Patent 12,154,945 granted on 2024-11-26Backside CMOS trench epi with close N2P space
#6584SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF
#6585SEMICONDUCTOR DEVICE STRUCTURE
#6586REDUCING PARASITIC CAPACITANCE IN SEMICONDUCTOR DEVICES
#6587POWER DEVICE AND METHOD OF MANUFACTURING THE SAME
#6588INTEGRATED CIRCUIT DEVICE
#6589DUAL DIELECTRIC STRESSORS
#6590COMPOSITE NANOSHEET TUNNEL TRANSISTORS
#6591STRUCTURE HAVING ENHANCED GATE RESISTANCE
#6592DIODES IN NANOSHEET TECHNOLOGY
#6593RESISTIVE PRESSURE-SENSITIVE COMPOSITE AND METHOD OF MAKING THE SAME
#6594STACKED FETS WITH CONTACT PLACEHOLDER STRUCTURES
#6595NANOSHEET STACKS WITH DIELECTRIC ISOLATION LAYERS
#6596INTEGRATED CIRCUIT DEVICE
#6597SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#6598INTEGRATED CIRCUIT DEVICE INCLUDING MULTI-CHANNEL TRANSISTOR
#6599INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE
#6600SEMICONDUCTOR DEVICE