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Assignee profile:

Dynax Semiconductor, Inc.

City:

Kunshan

Country:

China

Published Applications:

Last publication date:

2024-02-29

Patent Grants:

Last grant date:

2026-04-28

Top Inventors for applications by Dynax Semiconductor, Inc.

These are the the leading inventors for applications assigned to Dynax Semiconductor, Inc.:

Naiqian ZHANG 11 Kunshan, China
Yi PEI 5 Kunshan, China
Xi SONG 4 Kunshan, China
Fengli PEI 3 Kunshan, China

Feihang LIU 2 Kunshan, China
Xinchuan ZHANG 2 Kunshan, China
Naiqian ZHANG 2 KUNSHAN, JIANGSU PROVINCE, China
Xingxing WU 2 KUNSHAN, JIANGSU PROVINCE, China

Xingxing Wu 2 Kunshan, China
Pan PAN 2 Kunshan, China
Huiqin WANG 1 Kunshan, China
Qingzhao GU 1 KUNSHAN, JIANGSU PROVINCE, China

Xin JIN 1 Kunshan, China
Pengyu HAN 1 Kunshan, China
Shuyu YAN 1 Kunshan, China
Qingzhao Gu 1 Kunshan, China

Xin LIU 1 Kunshan, China
Jianhua XU 1 Kunshan, China
Jian LIU 1 Kunshan, China
Mengjie ZHOU 1 Kunshan, China

Hui ZHANG 1 Kunshan, China
Shiqiang LI 1 Kunshan, China
Xi SONG 1 KUNSHAN, JIANGSU PROVINCE, China
Linlin SUN 1 Kunshan, China

Guochun Kang 1 Kunshan, China
Xinchuan ZHANG 1 KUNSHAN, JIANGSU PROVINCE, China
Gouchun KANG 1 Kunshan, China

Recent patent applications by Dynax Semiconductor, Inc.

Dynax Semiconductor, Inc. based in Kunshan, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2024-02-29 ✅ Patent 12,615,835 granted on 2026-04-28

US20240072141A1

Electricity

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

#2 | 2023-06-01 ✅ Patent 12,482,653 granted on 2025-11-25

US20230170214A1

Electricity

EPITAXIAL STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#3 | 2022-09-15 ✅ Patent 12,482,767 granted on 2025-11-25

US20220293536A1

Electricity

INTEGRATED PACKAGE ELECTRONIC DEVICE STRUCTURE

#4 | 2021-03-25 ✅ Patent 11,387,339 granted on 2022-07-12

US20210091199A1

Electricity

Semiconductor device and method for manufacturing the same

#5 | 2020-10-15 ✅ Patent 11,538,729 granted on 2022-12-27

US20200328133A1

Electricity

Semiconductor device, semiconductor chip and method of manufacturing semiconductor device

#6 | 2020-03-19 ✅ Patent 11,302,788 granted on 2022-04-12

US20200091301A1

Electricity

Semiconductor device and method of manufacturing the same

#7 | 2019-12-19 ✅ Patent 10,770,574 granted on 2020-09-08

US20190386126A1

Electricity

Semiconductor device and method for manufacturing the same

#8 | 2019-09-05 ✅ Patent 10,845,406 granted on 2020-11-24

US20190271737A1

Physics

Semiconductor device and method of manufacturing the same

#9 | 2018-06-28 ✅ Patent 10,985,050 granted on 2021-04-20

US20180182663A1

Electricity

Semiconductor chip, semiconductor wafer and method for manufacturing semiconductor wafer

#10 | 2018-01-25 ✅ Patent 10,566,429 granted on 2020-02-18

US20180026105A1

Electricity

Semiconductor device and method of manufacturing the same

#11 | 2016-12-29 ✅ Patent 10,847,627 granted on 2020-11-24

US20160380062A1

Electricity

Semiconductor device having source field plate and method of manufacturing the same

#12 | 2016-04-28 ✅ Patent 9,536,965 granted on 2017-01-03

US20160118460A1

Electricity

Heat spreader on GaN semiconductor device

#13 | 2016-02-11 ✅ Patent 9,812,534 granted on 2017-11-07

US20160043184A1

Electricity

Semiconductor device and method of manufacturing the same

#14 | 2015-10-29 ✅ Patent 9,941,400 granted on 2018-04-10

US20150311332A1

Electricity

Semiconductor device and method of manufacturing the same

Also check out Dynax Semiconductor Inc.'s (Kunshan, China) applicant profile with 17 patent applications submitted.

AssigneeID:

105198 ⎘