HFM PACKAGING, LTD.

City:

Pewaukee, Wisconsin

Country:

United States

Published Applications:

Last publication date:

2016-06-02

Patent Grants:

Last grant date:

2017-05-16

Top Inventors for applications by HFM PACKAGING, LTD.

These are the the leading inventors for applications assigned to HFM PACKAGING, LTD.:

Jon M. Riggs 1 Oconomowoc, WI United States
Scott Hetherton 1 Oconomowoc, WI United States

Recent patent applications by HFM PACKAGING, LTD.

HFM PACKAGING, LTD. based in Pewaukee, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2016-06-02 ✅ Patent 9,650,194 granted on 2017-05-16

US20160152393A1

Performing operations; transporting

Resealable label flap with tamper evident structure

#2 | 2012-09-06 ✅ Patent 9,072,414 granted on 2015-07-07

US20120223178A1

Human necessities

Standup pouch with dispensing fitment

Also check out HFM Packaging, Ltd.'s (Pewaukee, United States) applicant profile with 1 patent applications submitted.

AssigneeID:

108905 ⎘