Tokyo
Japan
48
2023-03-16
45
2025-01-28
These are the the leading inventors for applications assigned to Kaijo Corporation:
Kaijo Corporation based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Ultrasonic transducer having state monitoring function and ultrasonic cleaning device using the same
#2 | 2021-11-25 ✅ Patent 11,404,393 granted on 2022-08-02Wire bonding method and wire bonding device
#3 | 2021-11-18 ✅ Patent 11,791,304 granted on 2023-10-17Method for bonding insulated coating wire, connection structure, method for stripping insulated coating wire and bonding apparatus
#4 | 2021-11-11 ✅ Patent 11,901,329 granted on 2024-02-13Wire bonding method and wire bonding apparatus
#5 | 2021-10-28 ✅ Patent 11,618,060 granted on 2023-04-04Ultrasonic cleaning apparatus and ultrasonic cleaning system
#6 | 2021-05-27 ✅ Patent 11,458,442 granted on 2022-10-04Ultrasonic homogenizer
#7 | 2020-12-10 ✅ Patent 11,302,667 granted on 2022-04-12Method of vertically vibrating a bonding arm
#8 | 2020-03-19 ✅ Patent 11,127,709 granted on 2021-09-21Capillary transport device, capillary mounting device, capillary replacement device, capillary transport method, capillary mounting method, and capillary replacement method
#9 | 2020-02-27 ✅ Patent 11,154,914 granted on 2021-10-26Ultrasonic transducer and ultrasonic cleaning device using ultrasonic transducer
#10 | 2019-10-17 ✅ Patent 11,148,355 granted on 2021-10-19Three-dimensional shaped object production device and three-dimensional shaped object production method
#11 | 2019-05-30 ✅ Patent 10,600,754 granted on 2020-03-24Bonding method
#12 | 2018-11-01 ✅ Patent 10,529,684 granted on 2020-01-07Capillary transport device, capillary mounting device, capillary replacement device, capillary transport method, capillary mounting method, and capillary replacement method
#13 | 2018-03-01 ✅ Patent 10,262,969 granted on 2019-04-16Bonding device
#14 | 2017-11-16 ✅ Patent 10,629,563 granted on 2020-04-21Ball forming device for wire bonder
#15 | 2017-07-06 ✅ Patent 10,022,821 granted on 2018-07-17Bonding method and bonding device
#16 | 2017-01-05 ✅ Patent 9,865,562 granted on 2018-01-09Bonding device
#17 | 2017-01-05 ✅ Patent 9,935,078 granted on 2018-04-03Bonding device
#18 | 2016-06-16 ✅ Patent 9,772,012 granted on 2017-09-26Drive mechanism and manufacturing device
#19 | 2015-11-26 ✅ Patent 9,687,888 granted on 2017-06-27Ultrasonic cleaning apparatus and ultrasonic cleaning method
#20 | 2015-10-08 ✅ Patent 9,815,092 granted on 2017-11-14Ultrasonic cleaning apparatus
#21 | 2014-10-16 ✅ Patent 9,339,888 granted on 2016-05-17Bonding apparatus
#22 | 2014-01-09 ✅ Patent 8,680,747 granted on 2014-03-25Output adjustment circuit, ultrasonic transducer device component, and ultrasonic transducer device
#23 | 2013-11-28 ✅ Patent 9,901,962 granted on 2018-02-27Ultrasonic cleaning apparatus
#24 | 2013-10-03 ✅ Patent 8,651,355 granted on 2014-02-18Bonding apparatus
#25 | 2013-08-29 ✅ Patent 8,960,208 granted on 2015-02-24Ultrasonic cleaning device
#26 | 2013-05-23ULTRASONIC CLEANING DEVICE
#27 | 2013-02-28 ✅ Patent 8,652,262 granted on 2014-02-18Ultrasonic cleaning method for generating ultrasonic vibrations by a frequency modulated signal
#28 | 2012-02-02 ✅ Patent 8,677,892 granted on 2014-03-25Method and apparatus for controlling microorganisms in food materials by vacuum and resonant ultrasonication
#29 | 2011-10-20 ✅ Patent 8,830,003 granted on 2014-09-09Ultrasonic generator and program writing method
#30 | 2011-04-07 ✅ Patent 8,899,247 granted on 2014-12-02Ultrasonic cleaning apparatus
#31 | 2011-02-10 ✅ Patent 8,558,431 granted on 2013-10-15Output adjustment circuit, ultrasonic transducer device component, and ultrasonic transducer device
#32 | 2010-08-19 ✅ Patent 8,042,725 granted on 2011-10-25Wire bonding method, wire bonding apparatus, and wire bonding control program
#33 | 2010-08-05 ✅ Patent 8,087,418 granted on 2012-01-03Deaeration device and ultrasonic cleaning device using the same
#34 | 2010-07-01 ✅ Patent 8,448,655 granted on 2013-05-28Ultrasonic cleaning device
#35 | 2010-03-11 ✅ Patent 7,748,599 granted on 2010-07-06Wire bonding method, wire bonding apparatus, and wire bonding control program
#36 | 2009-05-28 ✅ Patent 7,975,899 granted on 2011-07-12Work clamp and wire bonding apparatus
#37 | 2008-07-01 ✅ Patent 7,392,812 granted on 2008-07-01Substrate processing apparatus and substrate transporting device mounted thereto
#38 | 2006-12-21 ✅ Patent 7,726,325 granted on 2010-06-01Deaeration device and ultrasonic cleaning device using the same
#39 | 2006-11-16 ✅ Patent 8,016,182 granted on 2011-09-13Wire loop, semiconductor device having same and wire bonding method
#40 | 2006-10-05Cleaning device and cleaning method
#41 | 2006-07-13 ✅ Patent 7,815,095 granted on 2010-10-19Wire loop, semiconductor device having same and wire bonding method
#42 | 2006-04-13 ✅ Patent 7,899,239 granted on 2011-03-01Inspection method of bonded status of ball in wire bonding
#43 | 2006-03-16 ✅ Patent 7,191,929 granted on 2007-03-20Method of measuring thickness of bonded ball in wire bonding
#44 | 2005-09-01 ✅ Patent 7,262,124 granted on 2007-08-28Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus
#45 | 2005-08-23 ✅ Patent 6,933,608 granted on 2005-08-23Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus
#46 | 2005-06-09Method for cleaning substrate and apparatus therefor
#47 | 2005-06-07 ✅ Patent 6,901,685 granted on 2005-06-07Method for drying washed objects
#48 | 2005-04-28 ✅ Patent 7,422,024 granted on 2008-09-09Ultrasonic shower cleaning apparatus of double-side cleaning type
Also check out KAIJO CORPORATION's (Tokyo, Japan) applicant profile with 20 patent applications submitted.
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