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Assignee profile:

LPKF LASER & ELECTRONICS AG

City:

Garbsen

Country:

Germany

Published Applications:

19

Last publication date:

2017-09-07

Patent Grants:

9

Last grant date:

2023-03-21

Top Inventors for applications by LPKF LASER & ELECTRONICS AG

These are the the leading inventors for applications assigned to LPKF LASER & ELECTRONICS AG:

Recent patent applications by LPKF LASER & ELECTRONICS AG

LPKF LASER & ELECTRONICS AG based in Garbsen, DE has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2017-09-07 ✅ Patent 11,610,784 granted on 2023-03-21
US20170256422A1
Electricity

Method for introducing at least one cutout or aperture into a sheetlike workpiece

 #2 | 2015-01-22
US20150021841A1
Performing operations; transporting

BEAM-SUPPORTED JOINING MACHINE, IN PARTICULAR LASER TRANSMISSION WELDING DEVICE

 #3 | 2014-08-07
US20140216648A1
Performing operations; transporting

METHOD AND APPARATUS FOR LASER WELDING OF TWO JOINING MEMBERS OF PLASTIC MATERIAL

 #4 | 2014-06-05 ✅ Patent 9,610,729 granted on 2017-04-04
US20140150953A1
Performing operations; transporting

Device and method for performing and monitoring a plastic laser transmission welding process

 #5 | 2013-03-07 ✅ Patent 9,021,691 granted on 2015-05-05
US20130055566A1
Electricity

Method for introducing electrical insulations in printed circuit boards

 #6 | 2013-02-28 ✅ Patent 9,414,499 granted on 2016-08-09
US20130048618A1
Electricity

Method for partially stripping a defined area of a conductive layer

 #7 | 2012-11-08
US20120279867A1
Chemistry; metallurgy

METHOD FOR PRODUCING METAL COATINGS ON PLASTICS MATERIAL PARTS

 #8 | 2012-08-09
US20120198977A1
Performing operations; transporting

METHOD FOR MAKING AN OPENING IN A SUBSTRATE

 #9 | 2012-07-19
US20120183793A1
Chemistry; metallurgy

METHOD FOR SELECTIVELY METALLIZING A SUBSTRATE AND INTERCONNECT DEVICE PRODUCED BY THIS METHOD

 #10 | 2011-09-15
US20110222572A1
Electricity

LASER ARRANGEMENT

 #11 | 2010-12-23 ✅ Patent 8,314,362 granted on 2012-11-20
US20100320178A1
Performing operations; transporting

Device for machining a workpiece by means of parallel laser beams

 #12 | 2010-06-10 ✅ Patent 8,415,583 granted on 2013-04-09
US20100140232A1
Performing operations; transporting

Clamping apparatus for clamping at least two component parts

 #13 | 2007-10-25
US20070247822A1
Electricity

METHOD FOR THE PRODUCTION OF A PRINTED CIRCUIT STRUCTURE AS WELL AS A PRINTED CIRCUIT STRUCTURE THUS PRODUCED

 #14 | 2007-10-04
US20070228106A1
Performing operations; transporting

PROCESS AND DEVICE FOR FORM LOCKED JOINING OF TWO COMPONENTS

 #15 | 2007-09-06 ✅ Patent 8,759,710 granted on 2014-06-24
US20070204954A1
Performing operations; transporting

Process and device for form locked joining of two components

 #16 | 2006-09-14
US20060204652A1
Electricity

Method for contacting circuit board conductors of a printed circuit board

 #17 | 2006-08-24 ✅ Patent 7,559,152 granted on 2009-07-14
US20060185144A1
Performing operations; transporting

Method for determining the position of a milling tool and a machining head designed for carrying out the method

 #18 | 2006-02-02 ✅ Patent 7,415,927 granted on 2008-08-26
US20060021528A1
Electricity

Procedure for positioning a through-hole in a substrate

 #19 | 2005-07-07
US20050147740A1
Performing operations; transporting

Method of applying a cover layer to a structured base layer
AssigneeID:

11073 ⎘