Belfast
United Kingdom
25
2016-09-15
23
2016-10-04
These are the the leading inventors for applications assigned to ICEMOS TECHNOLOGY LTD.:
ICEMOS TECHNOLOGY LTD. based in Belfast, GB has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Method of forming superjunction high voltage devices using wafer bonding
#2 | 2016-08-04 ✅ Patent 9,576,842 granted on 2017-02-21Grass removal in patterned cavity etching
#3 | 2015-04-23 ✅ Patent 9,147,751 granted on 2015-09-29Methods of manufacturing superjunction devices
#4 | 2014-09-18 ✅ Patent 9,349,725 granted on 2016-05-24Stripe orientation for trenches and contact windows
#5 | 2014-09-18 ✅ Patent 8,963,239 granted on 2015-02-24800 V superjunction device
#6 | 2013-11-14 ✅ Patent 8,946,814 granted on 2015-02-03Superjunction devices having narrow surface layout of terminal structures, buried contact regions and trench gates
#7 | 2012-07-19 ✅ Patent 8,895,369 granted on 2014-11-25Methods for manufacturing superjunction semiconductor device having a dielectric termination
#8 | 2011-11-03 ✅ Patent 8,148,203 granted on 2012-04-03Technique for stable processing of thin/fragile substrates
#9 | 2011-08-11 ✅ Patent 8,736,019 granted on 2014-05-27Semiconductor devices with sealed, unlined trenches and methods of forming same
#10 | 2011-08-11 ✅ Patent 8,716,829 granted on 2014-05-06Semiconductor devices with sealed, unlined trenches and methods of forming same
#11 | 2011-03-24 ✅ Patent 8,114,751 granted on 2012-02-14Multi-angle rotation for ion implantation of trenches in superjunction devices
#12 | 2011-02-24DIRECT WAFER-BONDED THROUGH-HOLE PHOTODIODE
#13 | 2010-03-18 ✅ Patent 8,030,133 granted on 2011-10-04Method of fabricating a bonded wafer substrate for use in MEMS structures
#14 | 2009-10-08Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric Shape
#15 | 2009-09-17 ✅ Patent 8,129,252 granted on 2012-03-06Semiconductor devices with sealed, unlined trenches and methods of forming same
#16 | 2009-09-10 ✅ Patent 7,910,479 granted on 2011-03-22Method of manufacturing a photodiode array with through-wafer vias
#17 | 2009-08-13 ✅ Patent 7,846,821 granted on 2010-12-07Multi-angle rotation for ion implantation of trenches in superjunction devices
#18 | 2009-08-13 ✅ Patent 7,795,045 granted on 2010-09-14Trench depth monitor for semiconductor manufacturing
#19 | 2009-07-16 ✅ Patent 8,159,039 granted on 2012-04-17Superjunction device having a dielectric termination and methods for manufacturing the device
#20 | 2009-07-09 ✅ Patent 7,741,141 granted on 2010-06-22Photodiode having increased proportion of light-sensitive area to light-insensitive area
#21 | 2008-12-25 ✅ Patent 7,709,950 granted on 2010-05-04Silicon wafer having through-wafer vias
#22 | 2008-10-23 ✅ Patent 7,723,172 granted on 2010-05-25Methods for manufacturing a trench type semiconductor device having a thermally sensitive refill material
#23 | 2008-10-09 ✅ Patent 7,972,934 granted on 2011-07-05Photodetector array using isolation diffusions as crosstalk inhibitors between adjacent photodiodes
#24 | 2008-02-14 ✅ Patent 7,944,018 granted on 2011-05-17Semiconductor devices with sealed, unlined trenches and methods of forming same
#25 | 2007-09-06 ✅ Patent 7,528,458 granted on 2009-05-05Photodiode having increased proportion of light-sensitive area to light-insensitive area
Also check out Icemos Technology Ltd.'s (Belfast, United Kingdom) applicant profile with 7 patent applications submitted.
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