DIATEX Co., Ltd.

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2026-02-26

Patent Grants:

Last grant date:

2024-10-08

Top Inventors for applications by DIATEX Co., Ltd.

These are the the leading inventors for applications assigned to DIATEX Co., Ltd.:

Ken ITOH 3 Toyama, Japan
Yohei TANABE 3 Toyama, Japan
Yoichi MIZUSHIMA 3 Toyama, Japan
Yuichiro SUGIMOTO 1 Toyama, Japan

Yoichi Mizushima 1 Kurobe, Japan
Yuchang Wang 1 Toyama, Japan
Takashi YOSHIOKA 1 Tokyo, Japan
Ken ITOH 1 Kurobe-shi, Japan

Ryo YOSHIOKA 1 Toyama, Japan
Yohei Tanabe 1 Kurobe, Japan
Ken Itoh 1 Kurobe, Japan
Yohei TANABE 1 Kurobe-shi, Japan

Yoichi MIZUSHIMA 1 Kurobe-shi, Japan

Recent patent applications by DIATEX Co., Ltd.

DIATEX Co., Ltd. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2026-02-26

US20260054472A1

Performing operations; transporting

MULTILAYER BODY AND ADHESIVE TAPE INCLUDING THE MULTILAYER BODY

#2 | 2024-03-21 ✅ Patent 12,109,795 granted on 2024-10-08

US20240092058A1

Performing operations; transporting

Layered sheet and method for molding layered sheet molded product

#3 | 2020-01-30 ✅ Patent 11,186,018 granted on 2021-11-30

US20200031035A1

Performing operations; transporting

Layered sheet, layered sheet pre-product, and method for producing layered sheet

#4 | 2019-03-21 ✅ Patent 10,806,216 granted on 2020-10-20

US20190082787A1

Human necessities

Shoe sole, insole of shoe, main sole of shoe, and shoe

#5 | 2017-01-12 ✅ Patent 10,111,491 granted on 2018-10-30

US20170006962A1

Human necessities

Shoe sole, insole of shoe, main sole of shoe, and shoe

#6 | 2010-02-04

US20100028672A1

Chemistry; metallurgy

Conductive Adhesive Composition, Conductive Adhesive Sheet and Conductive Adhesive Tape

Also check out DIATEX Co., Ltd.'s (Tokyo, Japan) applicant profile with 5 patent applications submitted.

AssigneeID:

117762 ⎘