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Assignee profile:

Powertech Technology Inc.

City:

Hsinchu County

Country:

Taiwan

Published Applications:

164

Last publication date:

2026-05-07

Patent Grants:

114

Last grant date:

2026-05-26

Top Inventors for applications by Powertech Technology Inc.

These are the the leading inventors for applications assigned to Powertech Technology Inc.:

Recent patent applications by Powertech Technology Inc.

Powertech Technology Inc. based in Hsinchu County, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2026-05-07
US20260130280A1
Electricity

STACKED PACKAGE DEVICE WITH INTERMEDIATE SUBSTRATE

 #2 | 2026-05-07
US20260130270A1
Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #3 | 2026-05-07
US20260130241A1
Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #4 | 2026-02-26
US20260060141A1
Electricity

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #5 | 2026-02-12
US20260047432A1
Electricity

LOW WARPAGE CHIP

 #6 | 2026-01-15
US20260018567A1
Electricity

PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF

 #7 | 2026-01-08
US20260011651A1
Electricity

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #8 | 2025-12-18
US20250385210A1
Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #9 | 2025-12-11
US20250379154A1
Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #10 | 2025-06-26
US20250210593A1
Electricity

STACKED PACKAGE DEVICE WITH INTERCONNECTED SUBSTRATES

 #11 | 2025-06-26
US20250210482A1
Electricity

STACKED PACKAGE DEVICE WITH INTERCONNECTED CONDUCTIVE BUMPS

 #12 | 2024-11-07
US20240371785A1
Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #13 | 2024-10-17
US20240347438A1
Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #14 | 2024-10-17
US20240347348A1
Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #15 | 2024-10-10 ✅ Patent 12,642,146 granted on 2026-05-26
US20240339443A1
Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #16 | 2024-09-19
US20240313024A1
Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #17 | 2024-08-15
US20240274566A1
Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #18 | 2024-05-16
US20240162260A1
Electricity

IMAGE SENSOR AND MANUFACTURING METHOD THEREOF

 #19 | 2024-04-11 ✅ Patent 12,568,864 granted on 2026-03-03
US20240120325A1
Electricity

STACKED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #20 | 2024-01-25 ✅ Patent 12,538,847 granted on 2026-01-27
US20240030198A1
Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #21 | 2024-01-25 ✅ Patent 12,604,785 granted on 2026-04-14
US20240030121A1
Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #22 | 2024-01-18 ✅ Patent 12,469,833 granted on 2025-11-11
US20240021595A1
Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #23 | 2023-09-14
US20230290730A1
Electricity

PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF

 #24 | 2023-09-07 ✅ Patent 12,599,014 granted on 2026-04-07
US20230282587A1
Electricity

PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF

 #25 | 2023-06-22 ✅ Patent 12,400,979 granted on 2025-08-26
US20230197647A1
Electricity

INTEGRATED ANTENNA PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #26 | 2022-10-06 ✅ Patent 11,848,318 granted on 2023-12-19
US20220320063A1
Electricity

Package structure and manufacturing method thereof

 #27 | 2022-10-06 ✅ Patent 11,569,210 granted on 2023-01-31
US20220320052A1
Electricity

Package structure having a first connection circuit and manufacturing method thereof

 #28 | 2022-06-02 ✅ Patent 11,637,071 granted on 2023-04-25
US20220173051A1
Electricity

Package structure including multiple dies surrounded by conductive element and manufacturing method thereof

 #29 | 2022-05-26 ✅ Patent 11,973,037 granted on 2024-04-30
US20220165673A1
Electricity

Package structure and manufacturing method thereof

 #30 | 2022-02-10 ✅ Patent 11,990,494 granted on 2024-05-21
US20220045115A1
Electricity

Package structure and manufacturing method thereof

 #31 | 2022-02-10 ✅ Patent 11,769,763 granted on 2023-09-26
US20220045041A1
Electricity

Package structure and manufacturing method thereof

 #32 | 2022-02-10 ✅ Patent 11,916,035 granted on 2024-02-27
US20220045028A1
Electricity

Package structure and manufacturing method thereof

 #33 | 2021-11-04 ✅ Patent 11,437,336 granted on 2022-09-06
US20210343674A1
Electricity

Semiconductor package structure with landing pads and manufacturing method thereof

 #34 | 2021-11-02 ✅ Patent 11,164,771 granted on 2021-11-02
US17090843
Electricity

Wafer transferring device

 #35 | 2021-10-21
US20210327745A1
Electricity

PICKUP AND CONTACT DEVICE

 #36 | 2021-07-08 ✅ Patent 11,676,983 granted on 2023-06-13
US20210210539A1
Electricity

Sensor with dam structure and method for manufacturing the same

 #37 | 2021-07-01 ✅ Patent 11,211,321 granted on 2021-12-28
US20210202459A1
Electricity

Package structure and manufacturing method thereof

 #38 | 2021-07-01 ✅ Patent 11,133,291 granted on 2021-09-28
US20210202444A1
Electricity

Chip package structure with multi-chip stack

 #39 | 2021-07-01 ✅ Patent 11,309,283 granted on 2022-04-19
US20210202440A1
Electricity

Packaging structure and manufacturing method thereof

 #40 | 2021-07-01 ✅ Patent 11,545,424 granted on 2023-01-03
US20210202437A1
Electricity

Package structure and manufacturing method thereof

 #41 | 2021-07-01 ✅ Patent 11,557,533 granted on 2023-01-17
US20210202390A1
Electricity

Package structure and manufacturing method thereof

 #42 | 2021-07-01 ✅ Patent 11,456,243 granted on 2022-09-27
US20210202368A1
Electricity

Semiconductor package structure and manufacturing method thereof

 #43 | 2021-07-01 ✅ Patent 11,367,678 granted on 2022-06-21
US20210202364A1
Electricity

Package structure and manufacturing method thereof

 #44 | 2021-07-01 ✅ Patent 11,545,423 granted on 2023-01-03
US20210202363A1
Electricity

Package structure and manufacturing method thereof

 #45 | 2021-04-01 ✅ Patent 11,522,000 granted on 2022-12-06
US20210098517A1
Electricity

Semiconductor package structure and manufacturing method thereof

 #46 | 2021-03-25 ✅ Patent 11,158,608 granted on 2021-10-26
US20210091043A1
Electricity

Semiconductor package including offset stack of semiconductor dies between first and second redistribution structures, and manufacturing method therefor

 #47 | 2021-03-11 ✅ Patent 11,171,106 granted on 2021-11-09
US20210074661A1
Electricity

Semiconductor package structure with circuit substrate and manufacturing method thereof

 #48 | 2021-03-11 ✅ Patent 11,088,080 granted on 2021-08-10
US20210074645A1
Electricity

Chip package structure using silicon interposer as interconnection bridge

 #49 | 2021-02-18
US20210050296A1
Electricity

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #50 | 2021-02-04 ✅ Patent 11,094,654 granted on 2021-08-17
US20210035936A1
Electricity

Package structure and method of manufacturing the same

 #51 | 2021-02-04
US20210035898A1
Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #52 | 2020-12-03 ✅ Patent 10,944,165 granted on 2021-03-09
US20200381812A1
Electricity

Integrated antenna package structure and manufacturing method thereof

 #53 | 2020-12-03 ✅ Patent 10,862,202 granted on 2020-12-08
US20200381811A1
Electricity

Integrated antenna package structure and manufacturing method thereof

 #54 | 2020-11-19 ✅ Patent 11,289,401 granted on 2022-03-29
US20200365486A1
Electricity

Semiconductor package

 #55 | 2020-11-12
US20200357770A1
Electricity

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

 #56 | 2020-10-29 ✅ Patent 11,251,170 granted on 2022-02-15
US20200343231A1
Electricity

Package structure and manufacturing method thereof

 #57 | 2020-10-29
US20200343184A1
Electricity

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

 #58 | 2020-10-22
US20200335456A1
Electricity

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

 #59 | 2020-10-15 ✅ Patent 11,532,575 granted on 2022-12-20
US20200328497A1
Electricity

Integrated antenna package structure and manufacturing method thereof

 #60 | 2020-10-15 ✅ Patent 11,296,041 granted on 2022-04-05
US20200328167A1
Electricity

Integrated antenna package structure and manufacturing method thereof

 #61 | 2020-10-15 ✅ Patent 11,127,699 granted on 2021-09-21
US20200328161A1
Electricity

Chip package structure and manufacturing method thereof

 #62 | 2020-10-15 ✅ Patent 11,257,747 granted on 2022-02-22
US20200328144A1
Electricity

Semiconductor package with conductive via in encapsulation connecting to conductive element

 #63 | 2020-10-08
US20200321259A1
Electricity

SEMICONDUCTOR PACKAGE STRUCTURE

 #64 | 2020-08-27 ✅ Patent 11,211,350 granted on 2021-12-28
US20200273829A1
Electricity

Semiconductor package and manufacturing method thereof

 #65 | 2020-08-27 ✅ Patent 11,088,100 granted on 2021-08-10
US20200273803A1
Electricity

Semiconductor package and manufacturing method thereof

 #66 | 2020-07-30
US20200243461A1
Electricity

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

 #67 | 2020-07-30
US20200243449A1
Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #68 | 2020-06-04 ✅ Patent 10,950,557 granted on 2021-03-16
US20200176395A1
Electricity

Stacked chip package structure and manufacturing method thereof

 #69 | 2020-05-14 ✅ Patent 10,756,065 granted on 2020-08-25
US20200152609A1
Electricity

Method thereof of package structure

 #70 | 2020-04-23 ✅ Patent 10,796,931 granted on 2020-10-06
US20200126815A1
Electricity

Manufacturing method of package structure

 #71 | 2020-03-19 ✅ Patent 11,309,296 granted on 2022-04-19
US20200091126A1
Electricity

Semiconductor package and manufacturing method thereof

 #72 | 2020-03-19 ✅ Patent 10,629,559 granted on 2020-04-21
US20200091103A1
Electricity

Semiconductor package and manufacturing method thereof

 #73 | 2020-03-05
US20200075510A1
Electricity

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

 #74 | 2020-01-30
US20200035614A1
Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #75 | 2020-01-09 ✅ Patent 10,593,629 granted on 2020-03-17
US20200013721A1
Electricity

Semiconductor package with a conductive casing for heat dissipation and electromagnetic interference (EMI) shield and manufacturing method thereof

 #76 | 2020-01-02 ✅ Patent 10,593,647 granted on 2020-03-17
US20200006290A1
Electricity

Package structure and manufacturing method thereof

 #77 | 2020-01-02
US20200006274A1
Electricity

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

 #78 | 2020-01-02
US20200003802A1
Physics

TESTING SOCKET AND TESTING APPARATUS

 #79 | 2019-12-26 ✅ Patent 10,515,936 granted on 2019-12-24
US20190393200A1
Electricity

Package structure and manufacturing method thereof

 #80 | 2019-12-12 ✅ Patent 10,978,408 granted on 2021-04-13
US20190378803A1
Electricity

Semiconductor package and manufacturing method thereof

 #81 | 2019-11-07 ✅ Patent 10,522,512 granted on 2019-12-31
US20190341369A1
Electricity

Semiconductor package and manufacturing method thereof

 #82 | 2019-10-17 ✅ Patent 10,629,554 granted on 2020-04-21
US20190319000A1
Electricity

Package structure and manufacturing method thereof

 #83 | 2019-09-19 ✅ Patent 10,460,959 granted on 2019-10-29
US20190287820A1
Electricity

Package structure and manufacturing method thereof

 #84 | 2019-08-20 ✅ Patent 10,388,535 granted on 2019-08-20
US15989203
Electricity

Wafer processing method with full edge trimming

 #85 | 2019-08-15
US20190252325A1
Electricity

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #86 | 2019-08-08
US20190244943A1
Electricity

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

 #87 | 2019-08-08 ✅ Patent 11,024,603 granted on 2021-06-01
US20190244934A1
Electricity

Manufacturing method and a related stackable chip package

 #88 | 2019-07-11 ✅ Patent 10,431,549 granted on 2019-10-01
US20190214347A1
Electricity

Semiconductor package and manufacturing method thereof

 #89 | 2019-06-20 ✅ Patent 10,304,716 granted on 2019-05-28
US20190189494A1
Electricity

Package structure and manufacturing method thereof

 #90 | 2019-05-30
US20190164948A1
Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #91 | 2019-05-30 ✅ Patent 10,950,593 granted on 2021-03-16
US20190164909A1
Electricity

Package structure including at least one connecting module and manufacturing method thereof

 #92 | 2019-05-30
US20190164888A1
Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #93 | 2019-04-30 ✅ Patent 10,276,545 granted on 2019-04-30
US15936444
Electricity

Semiconductor package and manufacturing method thereof

 #94 | 2019-03-28
US20190096866A1
Electricity

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

 #95 | 2019-03-28 ✅ Patent 10,276,510 granted on 2019-04-30
US20190096821A1
Electricity

Manufacturing method of package structure having conductive shield

 #96 | 2019-03-28 ✅ Patent 10,607,860 granted on 2020-03-31
US20190096699A1
Electricity

Package structure and chip structure

 #97 | 2019-03-14 ✅ Patent 10,381,278 granted on 2019-08-13
US20190080971A1
Electricity

Testing method of packaging process and packaging structure

 #98 | 2019-02-14
US20190052489A1
Electricity

COMMUNICATION INTERFACE AND INTERFACING METHOD THEREOF

 #99 | 2019-02-14 ✅ Patent 10,840,200 granted on 2020-11-17
US20190051626A1
Electricity

Manufacturing method of chip package structure comprising encapsulant having concave surface

 #100 | 2019-02-14 ✅ Patent 10,276,526 granted on 2019-04-30
US20190051625A1
Electricity

Semiconductor package structure and manufacturing method thereof

Also check out Powertech Technology Inc.'s (Hsinchu County, Taiwan) applicant profile with 130 patent applications submitted.

AssigneeID:

119262 ⎘