Ibaraki
Japan
6
2023-04-27
6
2025-09-02
These are the the leading inventors for applications assigned to HSP Technologies Inc.:
HSP Technologies Inc. based in Ibaraki, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
KNEADING APPARATUS WITH FIRST AND SECOND EXTRUDERS
#2 | 2021-10-14 ✅ Patent 11,820,062 granted on 2023-11-21Extrusion methods wherein material is guided through a passage crossing over between adjacent cylindrical bodies
#3 | 2021-05-27 ✅ Patent 11,752,682 granted on 2023-09-12Extruder screw having paths within the screw, extruder, and extrusion method
#4 | 2019-11-21 ✅ Patent 11,584,830 granted on 2023-02-21Production method for conductive composite material
#5 | 2017-04-27 ✅ Patent 10,967,554 granted on 2021-04-06Extruder screw having paths within the screw, extruder, and extrusion method
#6 | 2017-02-23 ✅ Patent 11,565,440 granted on 2023-01-31Kneading apparatus with first and second extruders
Also check out HSP Technologies Inc.'s (Ibaraki, Japan) applicant profile with 6 patent applications submitted.
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