Patents-Review.com
🔗 Permalink
Assignee profile:

EO TECHNICS CO., LTD.

City:

Gyeonggi-do

Country:

South Korea

Published Applications:

16

Last publication date:

2026-05-07

Patent Grants:

14

Last grant date:

2025-07-29

Top Inventors for applications by EO TECHNICS CO., LTD.

These are the the leading inventors for applications assigned to EO TECHNICS CO., LTD.:

Recent patent applications by EO TECHNICS CO., LTD.

EO TECHNICS CO., LTD. based in Gyeonggi-do, KR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2026-05-07
US20260124702A1
Performing operations; transporting

GROOVE FORMING APPARATUS

 #2 | 2025-10-30
US20250332661A1
Performing operations; transporting

VARIABLE-PULSE-WIDTH FLAT-TOP LASER DEVICE AND OPERATING METHOD THEREFOR

 #3 | 2023-03-09 ✅ Patent 12,370,625 granted on 2025-07-29
US20230069985A1
Performing operations; transporting

VARIABLE-PULSE-WIDTH FLAT-TOP LASER DEVICE AND OPERATING METHOD THEREFOR

 #4 | 2020-07-02 ✅ Patent 10,861,725 granted on 2020-12-08
US20200211875A1
Electricity

Laser marking device and laser marking method

 #5 | 2020-06-04 ✅ Patent 11,065,805 granted on 2021-07-20
US20200171738A1
Performing operations; transporting

Warpage reduction device and warpage reduction method

 #6 | 2019-08-22 ✅ Patent 10,867,828 granted on 2020-12-15
US20190259645A1
Electricity

Marking position correcting apparatus and method

 #7 | 2018-11-29 ✅ Patent 10,286,485 granted on 2019-05-14
US20180339363A1
Performing operations; transporting

Laser processing device and laser processing method

 #8 | 2018-10-11 ✅ Patent 11,478,828 granted on 2022-10-25
US20180290182A1
Performing operations; transporting

Adhesive removing device and method

 #9 | 2018-08-30 ✅ Patent 10,770,298 granted on 2020-09-08
US20180247818A1
Electricity

Automatic inspection device and method of laser processing equipment

 #10 | 2017-07-13 ✅ Patent 10,304,778 granted on 2019-05-28
US20170200680A1
Electricity

Wafer marking method

 #11 | 2017-06-08 ✅ Patent 10,290,525 granted on 2019-05-14
US20170162410A1
Electricity

Marking method for wafer dice

 #12 | 2017-03-23 ✅ Patent 10,134,681 granted on 2018-11-20
US20170084546A1
Electricity

Laser processing method for cutting semiconductor wafer having metal layer formed thereon and laser processing device

 #13 | 2010-07-29 ✅ Patent 8,329,560 granted on 2012-12-11
US20100187207A1
Performing operations; transporting

Laser processing apparatus and method using beam split

 #14 | 2008-04-17 ✅ Patent 7,688,492 granted on 2010-03-30
US20080088900A1
Performing operations; transporting

Laser processing apparatus

 #15 | 2008-03-27 ✅ Patent 7,713,780 granted on 2010-05-11
US20080076234A1
Performing operations; transporting

Method of multi-processing object using polygon mirror

 #16 | 2006-02-23 ✅ Patent 7,164,519 granted on 2007-01-16
US20060039057A1
Performing operations; transporting

Laser processing apparatus and method using polygon mirror

Also check out EO TECHNICS CO., LTD.'s (Gyeonggi-do, South Korea) applicant profile with 4 patent applications submitted.

AssigneeID:

120533 ⎘