Des Plaines, Illinois
United States
10
2021-08-26
7
2022-09-13
These are the the leading inventors for applications assigned to Cloud Packaging Solutions, LLC:
Cloud Packaging Solutions, LLC based in Des Plaines, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Patterned cut pouch forming machine, and method
#2 | 2021-07-01 ✅ Patent 11,590,673 granted on 2023-02-28Machine for cutting pouches with shaped perimeter edge, and method
#3 | 2019-11-28 ✅ Patent 11,273,570 granted on 2022-03-15Pouch registration monitoring and control system
#4 | 2019-07-18POLYMER PACKAGING SYSTEMS AND METHODS
#5 | 2018-05-17 ✅ Patent 10,974,412 granted on 2021-04-13Machine for cutting pouches with shaped perimeter edge, method and pouch
#6 | 2018-02-22 ✅ Patent 10,703,515 granted on 2020-07-07Pouch forming mold configuration, method and pouch
#7 | 2017-04-13System for Forming Packages From Film Material
#8 | 2017-04-13SYSTEM FOR FORMING PACKAGES FROM FILM MATERIAL
#9 | 2015-07-16 ✅ Patent 10,279,496 granted on 2019-05-07Polymer packaging systems and methods
#10 | 2015-03-05 ✅ Patent 9,162,413 granted on 2015-10-20Polymer packaging systems and methods
Also check out Cloud Packaging Solutions LLC's (Des Plaines, United States) applicant profile with 4 patent applications submitted.
121001 ⎘