China Chippacking Technology Co. Ltd.

City:

Shenzhen

Country:

China

Published Applications:

Last publication date:

2017-07-20

Patent Grants:

Last grant date:

2017-09-19

Top Inventors for applications by China Chippacking Technology Co. Ltd.

These are the the leading inventors for applications assigned to China Chippacking Technology Co. Ltd.:

Dazhong LIANG 1 Shenzhen, China

Recent patent applications by China Chippacking Technology Co. Ltd.

China Chippacking Technology Co. Ltd. based in Shenzhen, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2017-07-20 ✅ Patent 9,768,101 granted on 2017-09-19

US20170207149A1

Electricity

High density integrated circuit package structure and integrated circuit

AssigneeID:

124611 ⎘