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Assignee profile:

PINK GMBH THERMOSYSTEME

City:

Wertheim

Country:

Germany

Published Applications:

Last publication date:

2025-08-14

Patent Grants:

Last grant date:

2026-06-16

Top Inventors for applications by PINK GMBH THERMOSYSTEME

These are the the leading inventors for applications assigned to PINK GMBH THERMOSYSTEME:

Christoph OETZEL 5 Freudenberg-Boxtal, Germany
Christoph Oetzel 3 Wertheim, Germany
Sebastian Clärding 2 Würzburg, Germany
Sebastian CLÄRDING 2 Würzburg, Germany

Aaron Hutzler 1 Nürnberg, Germany
Aaron Hutzler 1 Nuremberg, Germany
Stefan Müssig 1 Dorfprozelten, Germany
Thomas Krebs 1 Wertheim, Germany

Stefan Weber 1 Wertheim, Germany

Recent patent applications by PINK GMBH THERMOSYSTEME

PINK GMBH THERMOSYSTEME based in Wertheim, DE has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2025-08-14 ✅ Patent 12,654,414 granted on 2026-06-16

US20250256476A1

Performing operations; transporting

SINTERING DEVICE AND METHOD

#2 | 2024-10-10 ✅ Patent 12,318,858 granted on 2025-06-03

US20240335900A1

Performing operations; transporting

Diffusion soldering and/or sintering device, die and system, for connecting components of at least one electronic assembly

#3 | 2024-10-10 ✅ Patent 12,121,987 granted on 2024-10-22

US20240335896A1

Performing operations; transporting

Multifunctional sintering or diffusion soldering device and pressing tool

#4 | 2023-06-22 ✅ Patent 11,998,999 granted on 2024-06-04

US20230191518A1

Performing operations; transporting

Soldering or sintering system with plurality of modules and temperature control

#5 | 2022-10-27 ✅ Patent 11,676,843 granted on 2023-06-13

US20220344178A1

Electricity

System and method for connecting electronic assemblies

#6 | 2020-06-11 ✅ Patent 11,351,623 granted on 2022-06-07

US20200180058A1

Performing operations; transporting

Heat transfer device for producing a soldered connection of electrical components

#7 | 2020-04-02 ✅ Patent 11,491,567 granted on 2022-11-08

US20200101549A1

Performing operations; transporting

Soldering device and a method for producing a solder connection of components using adhesive material for temporary connection of the components

#8 | 2017-11-16 ✅ Patent 10,596,649 granted on 2020-03-24

US20170326665A1

Performing operations; transporting

Heat transfer device for producing a soldered connection of electrical components

#9 | 2009-07-09 ✅ Patent 7,878,386 granted on 2011-02-01

US20090173771A1

Performing operations; transporting

Method and device for heat treatment, especially connection by soldering

Also check out PINK GMBH THERMOSYSTEME's (Wertheim, Germany) applicant profile with 9 patent applications submitted.

AssigneeID:

128944 ⎘