CollTech (Dongguan) Bonding Technology Co., Ltd.

City:

Dongguan

Country:

China

Published Applications:

Last publication date:

2017-11-30

Patent Grants:

Last grant date:

2020-07-14

Top Inventors for applications by CollTech (Dongguan) Bonding Technology Co., Ltd.

These are the the leading inventors for applications assigned to CollTech (Dongguan) Bonding Technology Co., Ltd.:

Chengsheng Huang 1 Dongguan, China
Zongtao Zhou 1 Shanghai, China

Recent patent applications by CollTech (Dongguan) Bonding Technology Co., Ltd.

CollTech (Dongguan) Bonding Technology Co., Ltd. based in Dongguan, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2017-11-30 ✅ Patent 10,711,089 granted on 2020-07-14

US20170342195A1

Chemistry; metallurgy

UV epoxy resin instillation molding method and application thereof

Also check out CollTech (Dongguan) Bonding Technology Co., Ltd.'s (Dongguan, China) applicant profile with 1 patent applications submitted.

AssigneeID:

129544 ⎘