EIDAI CO., LTD.

City:

Osaka-Shi

Country:

Japan

Published Applications:

Last publication date:

2017-12-28

Patent Grants:

Last grant date:

2020-03-03

Top Inventors for applications by EIDAI CO., LTD.

These are the the leading inventors for applications assigned to EIDAI CO., LTD.:

Masanobu KAWAZOE 1 Osaka-Shi, Japan
Jiro NISHIO 1 Osaka, Japan
Masanobu KAWAZOE 1 Osaka, Japan
Jiro NISHIO 1 Osaka-Shi, Japan

Recent patent applications by EIDAI CO., LTD.

EIDAI CO., LTD. based in Osaka-Shi, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2017-12-28

US20170370656A1

Mechanical engineering

HEAT RESERVOIR IMPREGNATED WITH LATENT HEAT STORAGE MATERIAL WITH EXCELLENT THERMOSTABILITY

#2 | 2017-03-30 ✅ Patent 10,578,372 granted on 2020-03-03

US20170089646A1

Mechanical engineering

Heat reservoir comprising porous substrate impregnated with latent heat storage material and method for producing the same

Also check out EIDAI CO., LTD.'s (Osaka-shi, Japan) applicant profile with 1 patent applications submitted.

AssigneeID:

130533 ⎘