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Assignee profile:

CARSEM (M) SDN. BHD.

City:

Ipoh

Country:

Malaysia

Published Applications:

16

Last publication date:

2020-07-09

Patent Grants:

13

Last grant date:

2021-09-07

Top Inventors for applications by CARSEM (M) SDN. BHD.

These are the the leading inventors for applications assigned to CARSEM (M) SDN. BHD.:

Recent patent applications by CARSEM (M) SDN. BHD.

CARSEM (M) SDN. BHD. based in Ipoh, MY has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2020-07-09 ✅ Patent 11,114,367 granted on 2021-09-07
US20200219800A1
Electricity

Molded integrated circuit packages and methods of forming the same

 #2 | 2018-07-26
US20180211902A1
Electricity

PRE-MOLDED INTEGRATED CIRCUIT PACKAGES

 #3 | 2018-05-31 ✅ Patent 10,468,319 granted on 2019-11-05
US20180150673A1
Physics

Low-profile electronic package

 #4 | 2017-09-07 ✅ Patent 10,147,700 granted on 2018-12-04
US20170256518A1
Electricity

Flexible window clamp

 #5 | 2015-08-20 ✅ Patent 9,640,517 granted on 2017-05-02
US20150237721A1
Electricity

Stacked electronic packages

 #6 | 2015-06-25 ✅ Patent 9,935,039 granted on 2018-04-03
US20150179553A1
Electricity

Pre-molded integrated circuit packages

 #7 | 2014-01-23
US20140021491A1
Electricity

MULTI-COMPOUND MOLDING

 #8 | 2013-12-12 ✅ Patent 8,946,913 granted on 2015-02-03
US20130328194A1
Electricity

Short and low loop wire bonding

 #9 | 2013-11-21 ✅ Patent 8,941,249 granted on 2015-01-27
US20130307148A1
Electricity

Low loop wire bonding

 #10 | 2013-08-29 ✅ Patent 8,674,488 granted on 2014-03-18
US20130221382A1
Electricity

Light emitting diode (LED) packages

 #11 | 2013-08-08
US20130200503A1
Electricity

PROTECTIVE LAYERS IN SEMICONDUCTOR PACKAGING

 #12 | 2013-05-02 ✅ Patent 8,535,988 granted on 2013-09-17
US20130109137A1
Electricity

Large panel leadframe

 #13 | 2013-03-14 ✅ Patent 8,513,819 granted on 2013-08-20
US20130062765A1
Electricity

Low loop wire bonding

 #14 | 2012-05-03 ✅ Patent 8,394,675 granted on 2013-03-12
US20120107974A1
Electricity

Manufacturing light emitting diode (LED) packages

 #15 | 2012-05-03 ✅ Patent 8,314,479 granted on 2012-11-20
US20120104421A1
Electricity

Leadframe package with recessed cavity for LED

 #16 | 2008-11-20 ✅ Patent 7,741,161 granted on 2010-06-22
US20080286901A1
Electricity

Method of making integrated circuit package with transparent encapsulant

Also check out Carsem (M) SDN. BHD.'s (Ipoh, Malaysia) applicant profile with 7 patent applications submitted.

AssigneeID:

13454 ⎘